plasma ashing of plastic

Mary Tang mtang at stanford.edu
Tue Feb 13 13:32:34 PST 2007


Hi Jason --

I'm forwarding your request to SpecMat, just to be sure.  I'm sure 
someone else has tried to clean packaged parts, but am not sure drytek4 
is the best option...

Thanks,

Mary

Jason Fu wrote:
> Hi, Jeannie,
> I have a partially packaged (partially decapsulated) chip with some 
> molding material (glass filler epoxy) debris on the top of the chip. 
> I am wondering if I am allowed to use Dretek 4 for plasma ashing and 
> clean the chip surface.
> Thanks,
> Jason
>  
> Junxian (Jason) Fu, PhD
> Senior Engineer, Electrical and Semiconductors Practice
> Exponent Failure Analysis Associates, Inc.
> 149 Commonwealth Drive
> Menlo Park, CA 94025
> jfu at exponent.com <mailto:jfu at exponent.com>
> (Office) 650-688-6911
> (Mobile) 650-305-9140
>  
>
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-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu





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