plasma ashing of plastic
mcvittie at cis.Stanford.EDU
Tue Feb 13 13:39:41 PST 2007
I am not too keen on doing package decapsulation in our etch tools. I
would expect Exponent Failure Analysis Associates to have dedicated
decapsulation tools for this purpose. What can't he use his own tools for
this operation or go back to where the initial decapsulation was done. We
are in the wafer business not in the package business.
On Tue, 13 Feb 2007, Mary Tang wrote:
> Hi Jason --
> I'm forwarding your request to SpecMat, just to be sure. I'm sure
> someone else has tried to clean packaged parts, but am not sure drytek4
> is the best option...
> Jason Fu wrote:
> > Hi, Jeannie,
> > I have a partially packaged (partially decapsulated) chip with some
> > molding material (glass filler epoxy) debris on the top of the chip.
> > I am wondering if I am allowed to use Dretek 4 for plasma ashing and
> > clean the chip surface.
> > Thanks,
> > Jason
> > Junxian (Jason) Fu, PhD
> > Senior Engineer, Electrical and Semiconductors Practice
> > Exponent Failure Analysis Associates, Inc.
> > 149 Commonwealth Drive
> > Menlo Park, CA 94025
> > jfu at exponent.com <mailto:jfu at exponent.com>
> > (Office) 650-688-6911
> > (Mobile) 650-305-9140
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Jim McVittie, Ph.D. Senior Research Scientist
Allen Center for Integrated Systems Electrical Engineering
Stanford University jmcvittie at stanford.edu
Rm. 336, 330 Serra Mall Fax: (650) 723-4659
Stanford, CA 94305-4075 Tel: (650) 725-3640
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