plasma ashing of plastic
Jfu at exponent.com
Tue Feb 13 14:22:47 PST 2007
Thanks a lot for the prompt response. Please do let me know if there is
a better solution.
From: Mary Tang [mailto:mtang at stanford.edu]
Sent: Tuesday, February 13, 2007 1:33 PM
To: Jason Fu
Cc: jperez at snf.stanford.edu; mtang at snf.stanford.edu;
specmat at snf.stanford.edu
Subject: Re: plasma ashing of plastic
Hi Jason --
I'm forwarding your request to SpecMat, just to be sure. I'm sure
someone else has tried to clean packaged parts, but am not sure drytek4
is the best option...
Jason Fu wrote:
> Hi, Jeannie,
> I have a partially packaged (partially decapsulated) chip with some
> molding material (glass filler epoxy) debris on the top of the chip.
> I am wondering if I am allowed to use Dretek 4 for plasma ashing and
> clean the chip surface.
> Junxian (Jason) Fu, PhD
> Senior Engineer, Electrical and Semiconductors Practice Exponent
> Failure Analysis Associates, Inc.
> 149 Commonwealth Drive
> Menlo Park, CA 94025
> jfu at exponent.com <mailto:jfu at exponent.com>
> (Office) 650-688-6911
> (Mobile) 650-305-9140
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Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
mtang at stanford.edu
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