From chris.detrick at global-fab.com  Thu Jan  4 00:58:03 2007
From: chris.detrick at global-fab.com (Chris Detrick & David Lee)
Date: Thu, 4 Jan 2007 03:58:03 -0500 (EST)
Subject: G-Fab Equipment list & newsletter for January
Message-ID: <1101501333189.1101401002153.9044.6.120355E7@scheduler>

Global Fab Surplus
Semiconductor Equipment Sale
January 2007


Happy New Year!

Global Fab Surplus (G-Fab) provides New, Used,
Rebuilt and Refurbished Semiconductor
Process Equipment to Integrated Device
Manufacturers, Wafer Foundries, Research and
Development Sites and to the semiconductor
refurbishing community. We buy and
sell used semiconductor equipment of all types
including backend, front end and special application
tools and toolsets saving our clients millions in
capital equipment costs.

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~


Available Equipment listing
To help kick off the new year we are offering some
of our lowest pricing ever on our equipment. We
curriently have the following key equipment
available for immediate sale along with many other
tools. We always work with our customers to give you
the best price possible. Please visit our website
for a complete
listing. www.global-fab.com (http://rs6.net/tn.jsp?t=fw4qj8bab.0.vsd6mybab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fwww.global-fab.com)





* ASML PAS 5000/45 (LIKE NEW
CONDITION) This is the best one we have seen in a
long time.

* Speedfam/IPEC 676 CMP (This one is priced to
sell FAST)

* IPEC/Speedfam 372 CMP with Novascan (4
available)

* Rudolph METAPULSE 200

* Advantest T666AF ESD Tester

* AMAT 8330 Metal

* SVG 90S Track

* Teradyne 973ST Tester

* eMxP+ Centura (refurbished not install yet) 

* Endura (refurbished not install yet)

* Ultima + (refurbished not install yet)

* Gasonic PEP 3510,  2 units (New from Novellus)

* Novellus C2, 2 units (New from Novellus)

* Strasbaugh 	6DS-SP 	Rotational CMP

* TEL Alpha 8SE

* GSI Lumonics WLI 4100

* Nikon NSR 2205-i9, i10C, i11, i12 and i14

* LAM Research TCP9608SE

* FSI Mercury MP

* KLA-Tencor 2132

* Fein Focus FXS100.23S Wafer Inspection

* Teradyne Standalone AOI 5539Ci Tester



If any of these tools or anything from our website
are of interest please contact
us for complete details or to set up an inspection.
We also offer a complete line
of new bellows, Ferrofluidic Seals, Spindles and
Subassemblies, and complete Clean - Repair and
Refurbishment services on ASTEX/MKS Remote Plasma
Source and the WJ heated box.

<font color=blue>For a complete list of equipment click here</font> - http://rs6.net/tn.jsp?t=fw4qj8bab.0.cqtvuzbab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fwww.global-fab.com%2FusedsemiconductorequipmentGlobalFabSurplus.html

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Equipment Wanted
G-Fab is always looking for equipment that our
customers have a need for.  We would be happy to
help you dispose of your surplus equipment. Please
send us a listing of any equipment you have or are
considering to dispose of.


Curriently we have open RFQ's for the following
equipment. 





* ASML 5500/100

* Applied Materials Endura's

* Microscope with camera

* TEL IW 6C

* DNS SS-W80A - dual sided scrubber

* TEL Unity M, 85TD




Thank you for your time. I hope you find our
services and support beneficial. Please feel free to
forward this email to whom ever you feel would
benefit. Just click on the forward link below.

Sincerely,

Chris Detrick... chris.detrick at global-fab.com
David Lee... support at global-fab.com
G-Fab
------------------------------------------------------------
email: chris.detrick at global-fab.com
phone: Chris Detrick (805) 215-9188
David Lee (719) 686-0128
web: http://www.global-fab.com
------------------------------------------------------------

Forward email
http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat%40snf.stanford.edu&a=1101501333189





This email was sent to specmat at snf.stanford.edu,
by chris.detrick at global-fab.com

Update Profile/Email Address
http://ui.constantcontact.com/d.jsp?p=oo&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101501333189&lang=en&reason=F

Instant removal with SafeUnsubscribe(TM)
http://ui.constantcontact.com/d.jsp?p=un&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101501333189&lang=en&reason=F

Privacy Policy:
http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp








Global Fab Surplus | 1344 Ironbark Street | San Luis Obispo | CA | 93401








-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070104/9cf4eff6/attachment.html>

From support at global-fab.com  Thu Jan  4 01:24:58 2007
From: support at global-fab.com (Chris Detrick & David Lee)
Date: Thu, 4 Jan 2007 04:24:58 -0500 (EST)
Subject: G-Fab Equipment list & newsletter for January
Message-ID: <1101501963679.1101401002153.9044.6.12042084@scheduler>

Global Fab Surplus
Semiconductor Equipment Sale
January 2007


Happy New Year!

Global Fab Surplus (G-Fab) provides New, Used,
Rebuilt and Refurbished Semiconductor
Process Equipment to Integrated Device
Manufacturers, Wafer Foundries, Research and
Development Sites and to the semiconductor
refurbishing community. We buy and
sell used semiconductor equipment of all types
including backend, front end and special application
tools and toolsets saving our clients millions in
capital equipment costs.

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~


Available Equipment listing
To help kick off the new year we are offering some
of our lowest pricing ever on our equipment to help
move it out quickly and provide a nice margin for
everyone. We curriently have the following key equipment
available for immediate sale along with many other
tools. We always work with our customers to give you
the best price possible. Please visit our website
for a complete
listing. www.global-fab.com (http://rs6.net/tn.jsp?t=4mhek8bab.0.vsd6mybab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fwww.global-fab.com)





* ASML PAS 5000/45 (LIKE NEW
CONDITION) This is the best one we have seen in a
long time.

* Speedfam/IPEC 676 CMP (This one is priced to
sell FAST)

* IPEC/Speedfam 372 CMP with Novascan 302 endpoint
detection (4
available)

* Rudolph METAPULSE 200

* Advantest T666AF ESD Tester

* AMAT 8330 Metal

* SVG 90S Track

* Teradyne 973ST Tester

* eMxP+ Centura (refurbished not install yet) 

* Endura (refurbished not install yet)

* Ultima + (refurbished not install yet)

* Gasonic PEP 3510,  2 units (New from Novellus)

* Novellus C2, 2 units (New from Novellus)

* Strasbaugh 	6DS-SP 	Rotational CMP

* TEL Alpha 8SE

* GSI Lumonics WLI 4100

* Nikon NSR 2205-i9, i10C, i11, i12 and i14

* LAM Research TCP9608SE

* FSI Mercury MP

* KLA-Tencor 2132

* Fein Focus FXS100.23S Wafer Inspection

* Teradyne Standalone AOI 5539Ci Tester



If any of these tools or anything from our website
are of interest please contact
us for complete details or to set up an inspection.
We also offer a complete line
of new bellows, Ferrofluidic Seals, Spindles and
Subassemblies, and complete Clean - Repair and
Refurbishment services on ASTEX/MKS Remote Plasma
Source and the WJ heated box.

<font color=blue>For a complete list of equipment click here</font> - http://rs6.net/tn.jsp?t=4mhek8bab.0.cqtvuzbab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fwww.global-fab.com%2FusedsemiconductorequipmentGlobalFabSurplus.html

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Equipment Wanted
G-Fab is always looking for equipment that our
customers have a need for. 


Curriently we have open RFQ's for the following
equipment. 





* ASML 5500/100

* ASML 5000/50 or 55

* Applied Materials Endura

* Microscope with camera

* TEL IW 6C

* DNS SS-W80A - dual sided scrubber

* TEL Unity M, 85TD

* AMAT 9500XR implanter

* Nova 6200 medium current implanter




Thank you for your time. Please feel free to
forward this email to whom ever you feel would
benefit. Just click on the forward link below.

Sincerely,

David Lee... support at global-fab.com
Chris Detrick... chris.detrick at global-fab.com
G-Fab
------------------------------------------------------------
email: support at global-fab.com
phone: David Lee (719) 686-0128
Chris Detrick (805) 215-9188
web: http://www.global-fab.com
------------------------------------------------------------

Forward email
http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat%40snf.stanford.edu&a=1101501963679





This email was sent to specmat at snf.stanford.edu,
by support at global-fab.com

Update Profile/Email Address
http://ui.constantcontact.com/d.jsp?p=oo&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101501963679&lang=en&reason=F

Instant removal with SafeUnsubscribe(TM)
http://ui.constantcontact.com/d.jsp?p=un&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101501963679&lang=en&reason=F

Privacy Policy:
http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp








Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906








-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070104/c108dfc4/attachment.html>

From nag at soltaix.com  Mon Jan  8 00:55:36 2007
From: nag at soltaix.com (Somnath Nag)
Date: Mon, 08 Jan 2007 00:55:36 -0800
Subject: Process Flow Approval
Message-ID: <20070108085536.799F7EE5CF@ws6-1.us4.outblaze.com>

Hello,
Soltaix is a recent SNF labmember and we are planning our first test lot starting this week. I've reviewed the process flow with a number of SNF staff and have been advised to obtain approval for one process step where the lot moves from STS deep etch to LPTEOS dep. Since this is a necessary process sequence to fab our product, I'm interested in getting your recommendation on how best to handle this. One option suggested to me was to run a dummy TEOS deposition after our product lot has been run to fix any furnace variation that may result from running our lot. Please advise. Thank you. The process flow is below

Step	Tool
-----          ------
Pre-diff clean    Diff Wet bench
LPTEOS	TEOS2
HMDS	SVGCoat (YES?) Oven
PR coat	SVGCoat
Post bake	SVG Track1
Expose	Karl Suss - 2 tools
Develop	SVG PR Develop Tracks 1/2
PEB	May not need for SPR220 PR
Bosch etch 	STS2
PR strip, Polymer C/U	Gasonics + H2SO4, wbnonmetal
LP furnace preclean	wbnonmetal
LPTEOS	TEOS2

Regards
Somnath Nag, Ph.D.
Executive VP, Engineering&Technology
Soltaix LLC
956 Stanley Ave.
Los Altos, CA 94024-5067
(408)621-6485
nag at soltaix.com

Please treat this email as CONFIDENTIAL and release on a need-to-know-basis only


From rissman at stanford.edu  Mon Jan  8 11:19:18 2007
From: rissman at stanford.edu (Paul Rissman)
Date: Mon, 08 Jan 2007 11:19:18 -0800
Subject: Fusion contamination classification
Message-ID: <7.0.1.0.2.20070108111226.032fd610@stanford.edu>

Hi All,

We need to create a classification for the Fusion tool.  Since it is 
in the lithography area and the temperature on the system will be a 
maximum of 200 degrees, should it be considered un-classed as with 
other litho tools?  It could potentially be used for cure for front 
end implants.  Other likely uses are for harsh etches, e.g. stsetch.

Paul



From mtang at stanford.edu  Mon Jan  8 12:06:35 2007
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 08 Jan 2007 12:06:35 -0800
Subject: Fusion contamination classification
In-Reply-To: <7.0.1.0.2.20070108111226.032fd610@stanford.edu>
References: <7.0.1.0.2.20070108111226.032fd610@stanford.edu>
Message-ID: <45A2A44B.4090804@stanford.edu>

Hi all --

My two cents'...  taking a conservative approach, I would suggest 
considering a rinse step before the Fusion step.  The reason is that if 
there is alkali metal (or other mobile ion) contaminant on the backside, 
even 120 C can be sufficient for driving in something deep enough to 
cause voltage shifts later in the process.  There might also be 
accumulated contaminants on the chuck/wafer handling tools which could 
transfer to wafers as they are processed on the system.

Taking a less conservative approach, we do not seem to have complaints 
about mobile ion contamination in our baseline now -- and we are 
vulnerable at the Gasonics, since temperatures can be quite high there 
-- and I'd suspect the Fusion would render wafers as susceptible as the 
Gasonics would.

Mary


Paul Rissman wrote:
> Hi All,
>
> We need to create a classification for the Fusion tool.  Since it is 
> in the lithography area and the temperature on the system will be a 
> maximum of 200 degrees, should it be considered un-classed as with 
> other litho tools?  It could potentially be used for cure for front 
> end implants.  Other likely uses are for harsh etches, e.g. stsetch.
>
> Paul
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From mcvittie at cis.Stanford.EDU  Mon Jan  8 12:25:22 2007
From: mcvittie at cis.Stanford.EDU (Jim McVittie)
Date: Mon, 8 Jan 2007 12:25:22 -0800 (PST)
Subject: Proposal to Test Addition of N2 to Improve AMT Polymer Etching
Message-ID: <Pine.LNX.4.44.0701081222540.9518-100000@cis.Stanford.EDU>

Hi, 

Presently, N2 is not a process gas on the AMT Etcher. We currently use
pure O2 for a patterning etch for polymers on this etcher. This is not a
great choice since it tends to cause undercut. By adding N2, the undercut
is reduced because it forms a sidewall passivent. I propose we do a quick
test using the Ar MFC and the house N2 already pumped to the chamber to
see how well the N2/O2 etch works.  This will involve adding a manual
3-way valve at the point where the Ar stainless steel (SS) flexline
attaches to the ridge SS line going into the tool. The plastic house N2
feed line attaches to the tool near this same point. If the results are
good, I propose we add a clean SS line with hi purity N2 to this point. It
might also be good if we switched to using hi purity N2 for chamber
venting at that time.

	Jim 

-- 
--------------------------------------------------------------
Jim McVittie, Ph.D.    			Senior Research Scientist 
Allen Center for Integrated Systems     Electrical Engineering
Stanford University             	jmcvittie at stanford.edu
Rm. 336, 330 Serra Mall			Fax: (650) 723-4659
Stanford, CA 94305-4075			Tel: (650) 725-3640




From nag at soltaix.com  Mon Jan  8 14:38:33 2007
From: nag at soltaix.com (Somnath Nag)
Date: Mon, 08 Jan 2007 14:38:33 -0800
Subject: Poly Dep
Message-ID: <20070108223833.91F8413CBB6@ws6-8.us4.outblaze.com>

Hello,
We will need to deposit 15 Um of undoped poly-Si in Tylan Poly tube. Maurice recommends that I get SpecMat approval to get this done. Thanks
-Somnath Nag


From service at bankofamerica.com  Mon Jan  8 14:43:51 2007
From: service at bankofamerica.com (service at bankofamerica.com)
Date: Mon,  8 Jan 2007 23:43:51 +0100 (CET)
Subject: Bank of America Notice
Message-ID: <20070108224351.CA4953E305E@nepuweb5.net-publics.de>

An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070108/c086c0fb/attachment.html>

From crichter at collinear.com  Tue Jan  9 10:23:33 2007
From: crichter at collinear.com (Richter, Claudia)
Date: Tue, 9 Jan 2007 13:23:33 -0500
Subject: Request For Bringing in DUV112-6 Anti-Reflective Coating To SNF
Message-ID: <FC2F1D9357F1834EA12E400B7E66586D01475F75@ms08.mse3.exchange.ms>

Dear Specmat Committee,

 

We would like to request to bring in an anti-reflective coating to SNF.
The coating is the DUV112-6 from Brewer Science and we plan to use this
together with the resists you have in-house (PMMA, UVN-30) for DUV
lithography (holography). 

 

We will need this coating since our substrates (Li NO3) will have a
metal layer (Cu) and reflection will be an issue during exposure. We
would also like to use the Blue M oven (either the small or larger
programmable one) to cure the resist. It's likely that a temperature of
175C will do. However, we plan on doing a matrix of bake times to find
the optimal temperature/s that will work depending how the resist
profiles will appear. Our substrates cannot tolerate the hotplate bake
at these temperatures. The headway or laurel spin coaters would be used
to dispense a very thin coating.

 

We would like to use this coating as early as next week. Please contact
me or Lan (lzhang at snf.stanford.edu) if you have any questions or require
more information on this product. 

 

Best regards,

Claudia

 

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070109/0e6083fc/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: DUV112_6_MSDS.pdf
Type: application/octet-stream
Size: 100547 bytes
Desc: DUV112_6_MSDS.pdf
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070109/0e6083fc/attachment.obj>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: DUV_112_Data_Sheet.pdf
Type: application/octet-stream
Size: 922192 bytes
Desc: DUV_112_Data_Sheet.pdf
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070109/0e6083fc/attachment-0001.obj>

From mahnaz at stanford.edu  Tue Jan  9 14:11:36 2007
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Tue, 09 Jan 2007 14:11:36 -0800
Subject: Request For Bringing in DUV112-6 Anti-Reflective Coating To SNF
In-Reply-To: <FC2F1D9357F1834EA12E400B7E66586D01475F75@ms08.mse3.exchange.ms>
References: <FC2F1D9357F1834EA12E400B7E66586D01475F75@ms08.mse3.exchange.ms>
Message-ID: <45A41318.7090004@stanford.edu>

Hi Claudia,

I am writing to let you know that your chemical has been ok'd to be used 
in our lab.
Let me know how much of this chemical is coming and I trust that you 
know the routine of getting the yellow labels and the bar code better 
than any body else.
The chemical can be spun on either the headway or Laurell spinner coater.
If you are using the small Oven( mahnaz's oven) I like to review the 
procedure of running wafers in there with you.


mahnaz

Richter, Claudia wrote:

> Dear Specmat Committee,
>
>  
>
> We would like to request to bring in an anti-reflective coating to 
> SNF. The coating is the DUV112-6 from Brewer Science and we plan to 
> use this together with the resists you have in-house (PMMA, UVN-30) 
> for DUV lithography (holography).
>
>  
>
> We will need this coating since our substrates (Li NO3) will have a 
> metal layer (Cu) and reflection will be an issue during exposure. We 
> would also like to use the Blue M oven (either the small or larger 
> programmable one) to cure the resist. It's likely that a temperature 
> of 175C will do. However, we plan on doing a matrix of bake times to 
> find the optimal temperature/s that will work depending how the resist 
> profiles will appear. Our substrates cannot tolerate the hotplate bake 
> at these temperatures. The headway or laurel spin coaters would be 
> used to dispense a very thin coating.
>
>  
>
> We would like to use this coating as early as next week. Please 
> contact me or Lan (lzhang at snf.stanford.edu 
> <mailto:lzhang at snf.stanford.edu>) if you have any questions or require 
> more information on this product.
>
>  
>
> Best regards,
>
> Claudia
>
>  
>

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070109/f26e1b73/attachment.html>

From onlinebanking at alert.bankofamerica.com  Mon Jan 15 06:41:14 2007
From: onlinebanking at alert.bankofamerica.com (onlinebanking at alert.bankofamerica.com)
Date: Mon, 15 Jan 2007 09:41:14 -0500 (EST)
Subject: Bank of America Alert: Online Account Locked
Message-ID: <20070115144114.26E484B4D35@monitor.proteksystems.net>

An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070115/d5c91cac/attachment.html>

From ollie.dunne at fabsurplus.com  Mon Jan 15 09:13:36 2007
From: ollie.dunne at fabsurplus.com (SDI Semiconductor Instruments)
Date: Mon, 15 Jan 2007 18:13:36 +0100 (CET)
Subject: SDI Semiconductor Instruments - Saleslist
Message-ID: <4120360.1168882878956.JavaMail.root@server1.sdi-fabsurplus.com>


Dear Customers and Friends,
We wish you all a Happy and successful 2007 

EQUIPMENT FOR SALE
We are currently accepting offers on the following Tool set Disco DAD 3350 Qty 2; Dicing saws Disco DFG 850 Back side Grinder; EVG 150 Spin spray Coating system; EVG 640 IQ proximity Aligner; STS ICP HR CVD ASE/PECVD cluster Tool ; STS Multiplex Advanced oxide Etch; Zeiss Axitron microscope (layer thickness measurement); Disco DAD 341 Dicing Saw

FOUNDRY EQUIPMENT FOR SALE
We now have a large volume of Foundry Tools available for sale, Here is a brief summary of just some of the tools, for further details or full list contact Randall Copeland in our Oregon office.

Daifuku          F-300,F-200,F-100 Parts stocker
Daifuku          CLS-40A parts storage and movement 
Saito Seiki      Y-130 200mm Ingot Band Saw
Semicon Create   Automated wet bench
Semicon Create   First clean (dewax) 
Tokyo Microtec   AWE-850L Acid Etch
Saito Seiki      Y-128 200mm Auto outside grinding machine
Yamaguichi       Y-5009 Ingot cut off crop Saw  
Toyo		     TXG470-A8 Ingot Mounting Machine	    
Toyo             T-DM 470-8 Auto Demount Machine
Sankyo           Semi auto wet bench (Post lapping clean)
Daitron          CZD-10 Liquid Hone/Back Side Damage Machine
Daitron          Manual Demount machine
Spec             SBXAT18.70 Quartz Crucible Cleaner
Spec             SBX15-62 OSF Etching Draft
Spec             SBX10-56 Hoeizontal Quartz Tube Cleaning
Spec             SPHAT16-30 Rotary Etch Bench
Spec             ABX11-40 Tube & Chamber Cleaning machine
Spec             SBXID-56 Quartz Tube Cleaning
Spec             SBX10-36 OSFEtching Draft Chamber
Spec             SBX4-36  Quartz & Maetal Parts Cleaning Machine
Ultracision      OCR Stand Alone Dual Camera Wafer ID
Ultracision      VWP-8 Sorter
Hytek plastics   Beveling wafer bath manual wafer rinse bath
Coulter          LS230 optical Bench
SAES pure Gas Inc Oxygen Purifier



EQUIPMENT WE NEED TO BUY:
ADE     9500 or 9700, dual cassette       
Agilent HP        HP94000           
Applied Materials         Mirra 3400         
Applied Materials         Mirra Mesa oxide           
Applied Materials         Centura 5200 EPI with HTF         
Applied Materials         Endura 1995 or Newer
Applied Materials         Endura with 2~3 Ultima or Ultima + chambers   
ASECO S130 TRI-TEMPERATURE HANDLER FOR 28 LEAD SSOP                    
ASML             PAS 5500 1100 or 1150 B OR C 
ASML  I-line steppers (Models like 150, 200 etc.) ATCOR Box washer, any model
AXCELIS / Eaton GSD 200 Implanter                  
AXCELIS / FUSION Gemini        
CANON EX5 OR EX6
Complete line 5 inch
Complete line 6 inch
Complete line 8 inch
Credence Personal Kalos
Despatch - Ovens      
Disco DAD321
Disco DFG841  
DMS     1500 Reticle stocker, 6 inch Nikon boxes            
DNS     AS2000 
Eichorn + Hausmann MX204 Wafer Geometry Gauge
Electroglas       4090     
Electroglas EG2001X
EMTEC DENP-250 Edge Grinder
FSI       mercury mp       
Gasonics L3510 ashers.  We also have refurbished L3510s for sale.
Hitachi  S-9260  
Hitachi  S-9260 WITH DUAL SMIF           
KARL SUSS      ACS 300           
KARL SUSS      MA 300 
KARL SUSS METAL LIFT-OFF PROCESSOR
Kalos Personal Computer 96 I/O  
KLA RS75 Resistivity mapping Tool               
KLA      2365     
KLA-Tencor M-GAGE 300
KLA     SP1-TBI with 4 load ports          
KLA     UV1280 WITH DUAL SMIF 8 inch
KLA     SL3-UV Reticle inspection
KME     CM202D
Kokusai Apogee  
LAM 4520i          
Leica INS300
Leica INS3000
Lumonics GSI   WaferMark Sigma DSC 100-200 MM       
Mattson Aspen 2 for rebuild    
MRC 943 6" Sputtering tool                                       
Nicolet  ECO 1000                    
Oxford 80 Plus RIE for rebuild 
Rigaku 3640 Wafer Disk Analyser              
RION LPD any model                
SEMIGEAR       GENEVA STP300 300MM          
SEMITOOL        4400 300 MM SRD        
SEMITOOL SAT, 6 INCH     
Speedfam 20B Double sided Lapping Machine
Speedfam 20D-S Double sided polisher                                 
Thermo Scientific          KeyTek ZapMaster         
Watkins-Johnson           WJ 999R APCVD

Items we have for sale can be found via our website www.fabsurplus.com or by click on the following links.

Equipment Owned by SDI:-
http://www.sdi-fabsurplus.com/equip_owned.html


Complete Equipment list in Alphabetical order http://www.sdi-fabsurplus.com/Equipment_List.html



Best Regards,
Ollie

Oliver Dunne
SDI Semiconductor Instruments Ireland Limited
Tel: Ireland (353) 4694 38804
Mobile: Ireland (353) 872 985 561
Fax: Ireland (353) 4694 86893
Ollie.Dunne at fabsurplus.com
Skype: sdiireland

Mike Murehead
SDI Fabsurplus LLC
Tel. 512-635-8027
E-mail Mike at fabsurplus.com
Skype ID: sditexas
Fax 801-217-6104
www.fabsurplus.com

Randall Copeland
SDI Fabsurplus LLC
Beaverton, Oregon
Phone: 503-523-7027
Fax: 801-217-6104
support at fabsurplus.com

Stephen Howe
SDI Semiconductor Instruments Srl
Napoli 80123, Italy
Mobile: Italy (39) 335 710 7756
(Note from Steve: I am in Japan until 12th December.
Please contact me via mobile phone +81-80-3468-1843 Fax Italy (39) 066 051 33 44 info at fabsurplus.com
Skype: stephencshowe


Michael Fortune
SDI Semiconductor Instruments Ireland Ltd
Phone: +353469431951
Cell:  +3530879150198
Email: michael.fortune at fabsurplus.com 


Important Notice: This message is intended for the attention of the person or organization to which it has been addressed. It may contain information that is confidential, proprietary and/or exempt from disclosure by law.
If
you have received this message in error please be aware that the sender does not waive any confidentiality, ownership rights or privilege applicable to it. You are therefore strictly prohibited to disseminate, distribute or copy this message in any way.
This message may be considered an advertisement or solicitation under U.S.
law.

If you would like to opt-out of receiving future commercial e-mail marketing messages from the sender,  please send a message to the following e-mail address with the word "unsubscribe" in the subject
line:
ollie.dunne at fabsurplus.com
-------------- next part --------------
A non-text attachment was scrubbed...
Name: saleslist_15012007.xls
Type: application/octet-stream
Size: 1241088 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070115/aec5ec7e/attachment.obj>

From chris.detrick at global-fab.com  Wed Jan 17 01:48:19 2007
From: chris.detrick at global-fab.com (Chris Detrick & David Lee)
Date: Wed, 17 Jan 2007 04:48:19 -0500 (EST)
Subject: Global Fab Surplus
Message-ID: <1101513523380.1101401002153.9044.6.2104451B@scheduler>

G-Fab Hot Deals

Greetings!

Global Fab Surplus is announcing our annual winter
fire sale. We hope to sell the following equipment
quickly to make room for new inventory in the
warehouse. These will sell to the first company to
place an acceptable PO. Sale ends January 31.
Inspections can be scheduled. Call or email us
quickly with any questions. We have lowered our
prices to move each system quickly.
When viewing the web links ignore the prices on the
web.

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
ASML 5000/45 Stepper

This system is in like new condition. It was
de-installed by ASML. Located in San Jose, California

Our Price: $279K
Learn More - http://rs6.net/tn.jsp?t=ufafv8bab.0.lqapw8bab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fcgi.ebay.com%2FASML-PAS-5000-45-Stepper_W0QQitemZ230044559572QQihZ013QQcategoryZ45045QQcmdZViewItem

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
IPEC 372m CMP

Two available, all in excellent condition and
include the Novascan endpoint detector.

Our Price: MAKE OFFER
Learn More - http://rs6.net/tn.jsp?t=ufafv8bab.0.mqapw8bab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fcgi.ebay.com%2FNovellus-Novascan-372-ILD-CMP_W0QQitemZ230044545004QQihZ013QQcategoryZ45044QQcmdZViewItem

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Teradyne 973ST DRAM Structural Tester

Teradyne 973ST DRAM Structural Tester in excellent
conditionOur Price:

$22K 
Learn More - http://rs6.net/tn.jsp?t=ufafv8bab.0.nqapw8bab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fcgi.ebay.com%2FTeradyne-973ST-DRAM-Structural-Tester_W0QQitemZ230044560702QQihZ013QQcategoryZ45045QQcmdZViewItem

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Also available at extremly low prices are the
following tools: DO NOT hestitate to contact us as
soon as possible if you are interested. Each tool
will be sold to the first acceptable PO placed.





* Teradyne Standalone AOI 5539Ci Tester   
$8,900

* Advantest EDS Test T666AF ESD   $5K

* Ecosys Exhaust scrubber   $4K

* SVG 90S Track   $35K

* AMAT 8330 Metal Etcher    $7K


Click
here for complete details and pictures. If you are
interested in any of these please contact us right
away. It will be the first acceptable PO that wins
the equipment. (http://rs6.net/tn.jsp?t=ufafv8bab.0.oqapw8bab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fstores.ebay.com%2FGFab-Global-Fab-Surplus-Semi-Eqpt_W0QQssPageNameZstrkQ3amefsQ3amesstQQtZkm) 

You can visit our website for
more equipmet at any time. 

www.global-fab.com (http://rs6.net/tn.jsp?t=ufafv8bab.0.vsd6mybab.jfe8jybab.9044&ts=S0216&p=http%3A%2F%2Fwww.global-fab.com)

Sincerely,

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Chris Detrick
David Lee
Global Fab Surplus

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
email: chris.detrick at global-fab.com
phone: Chris at: (805) 215-9188  
or       David at: (719) 229-6066
web: http://www.global-fab.com

Sale prices are valid until January 31. Prices are
subject to change at any time. For complete details,
questions or comments contact us immediatly. All
equipment is sold as-is where-is unless otherwise
stated.
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~


Forward email
http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat%40snf.stanford.edu&a=1101513523380





This email was sent to specmat at snf.stanford.edu,
by chris.detrick at global-fab.com

Update Profile/Email Address
http://ui.constantcontact.com/d.jsp?p=oo&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101513523380&lang=en&reason=F

Instant removal with SafeUnsubscribe(TM)
http://ui.constantcontact.com/d.jsp?p=un&m=1101401002153&ea=specmat%40snf.stanford.edu&se=9044&t=1101513523380&lang=en&reason=F

Privacy Policy:
http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp








Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906








-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070117/b7a5f9e2/attachment.html>

From aeonia at gmail.com  Thu Jan 18 14:00:13 2007
From: aeonia at gmail.com (Hyeun-Su Kim)
Date: Thu, 18 Jan 2007 14:00:13 -0800
Subject: Using Unity 4411 in snf
Message-ID: <a308718c0701181400i64bb233ct2fbb46b0fc650760@mail.gmail.com>

Dear SpecMat committee,

I am thinking about using Unity 4411 for the sacrificial layer. It is
thermally decomposable polymer.

For the process,
1. Start with clean silicon wafer
2. Spin coated at headway2
3. Solvent removal at 100C hotplate 5mins
4. cured at blueM oven at 200C for 2hrs (<100ppm O2)
5. Sputtering metal for the mask -Metalica (need to know the temperature the
wafer can experience)
6. Pattern the metal mask (svgcoat/evaling/svgdev/wbgen)
7. Dry etch at MRC or drytek1
8. Remove metal mask at wbgen
9. Sputtering Cr/Au in Metalica for the metal suspended structure
10. Pattern the Cr/Au (svgcoat/evaling/svgdev/wbgen)
11.polymer decomposition in BlueM upto 405C (<1ppm O2)

Do you think this process feasible in snf? Please let me know if you need
more information. Thank you.


MSDS, process guide, and data sheet are attached.


Hyeun-Su
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070118/8385ef19/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: unit4411_Universal 7-22-04.pdf
Type: application/pdf
Size: 108589 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070118/8385ef19/attachment.pdf>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: Unity 4411 Data Sheet.pdf
Type: application/pdf
Size: 76951 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070118/8385ef19/attachment-0001.pdf>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: Unity 4000 process guide.pdf
Type: application/pdf
Size: 178760 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070118/8385ef19/attachment-0002.pdf>

From mtang at stanford.edu  Thu Jan 18 16:49:42 2007
From: mtang at stanford.edu (Mary Tang)
Date: Thu, 18 Jan 2007 16:49:42 -0800
Subject: Using Unity 4411 in snf
In-Reply-To: <a308718c0701181400i64bb233ct2fbb46b0fc650760@mail.gmail.com>
References: <a308718c0701181400i64bb233ct2fbb46b0fc650760@mail.gmail.com>
Message-ID: <45B015A6.8030308@stanford.edu>

Hi all --

I don't think the Blue M goes that high (I think Mahnaz says it maxes 
out around 375 C).  And I seriously doubt there is less than 1 ppm of O2 
in there.  Basically, what he wants to do at +400 C is pyrolysis (I 
think).  I think this may require a properly purged quartz muffle 
furnace.  (The BlueM is purged with house N2, but also has enormous 
surface area inside (that foam-like ceramic interior) so I'm sure 
there's lots of O2 in there.)

Would this be acceptable to run in fga2, by any chance?  (I didn't think 
tylan4 would be acceptable...)

If not, I think there may be another furnace on campus somewhere, maybe 
in the RPL -- somewhere where they do sintering of ceramics...  What do 
you all think?

Mary

Hyeun-Su Kim wrote:
> Dear SpecMat committee,
>
> I am thinking about using Unity 4411 for the sacrificial layer. It is 
> thermally decomposable polymer.
>
> For the process,
> 1. Start with clean silicon wafer
> 2. Spin coated at headway2
> 3. Solvent removal at 100C hotplate 5mins
> 4. cured at blueM oven at 200C for 2hrs (<100ppm O2)
> 5. Sputtering metal for the mask - Metalica (need to know the 
> temperature the wafer can experience)
> 6. Pattern the metal mask (svgcoat/evaling/svgdev/wbgen)
> 7. Dry etch at MRC or drytek1
> 8. Remove metal mask at wbgen
> 9. Sputtering Cr/Au in Metalica for the metal suspended structure
> 10. Pattern the Cr/Au (svgcoat/evaling/svgdev/wbgen)
> 11.polymer decomposition in BlueM upto 405C (<1ppm O2)
>
> Do you think this process feasible in snf? Please let me know if you 
> need more information. Thank you.
>
>
> MSDS, process guide, and data sheet are attached.
>
>
> Hyeun-Su 


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From edmyers at stanford.edu  Fri Jan 19 10:38:19 2007
From: edmyers at stanford.edu (Ed Myers)
Date: Fri, 19 Jan 2007 10:38:19 -0800
Subject: A Lot of SpecMat Items
Message-ID: <6.2.5.6.2.20070119083125.03b4ad18@stanford.edu>

All,

Here is the latest SpecMat Logsheet.  The official meeting was last 
Tuesday (1/16), but I was running behind.  Please let me know if 
there are any objections to the open items by Monday evening, 1/22.

OPEN ITEMS:

Item 220: The GST film will first be etched using an approved etch 
tool.  I would like to use either the MRC or a gold-contaminated etch 
system plumbed with Cl chemistry.
Comments:  I know we have been processing GST in the facility.  I 
thought this request would be a natural extension until I started 
looking some MSDS sheets for the chlorides.  I am very concerned 
about the hazards we may be subjecting to our users and 
maintenance.  If we do allow this, it should have a high 
barrier.  This would include limited, pre-approved equipment usage 
followed by a maintenance clean.

Item 221:  1)  Why is no matter (metal?) allowed in the KOH 
decontamination process?  Is it because KOH usually attacks 
metal?  What if the metals are capped by oxide, will this be allowed 
to go through the decontamination procedure? 2) Tystar used to be a 
semi-clean poly deposition tool but I heard it's no longer in the fab.
Recommendation (response):  I will explain the KOH concerns.  We have 
approved clean metals in tylan poly if the user does a coat following 
deposition.  Do we want to expand this to semi-clean wafers?  I 
believe we need to do this, under Maurice's guidance and pre-clean 
requirements.  This will include wafers which come from a number 
processing steps including dry etching.
Recommendation:  I will push back with health concerns and see if the 
user has a different way of patterning.

Item 237: 15 um of undoped poly-Si in Tylan Poly tube
Comments: It is not noted, these wafers will come from an 
STSetcher.  Kris indicated 1.5um per pass was the limit on new boats 
(narrow slots) or 2um per pass for the wide slot boats.  This is for 
test wafers and the process will ultimately move to an epi system.
Recommendations:  Approve 1 run with breaks at every 1.5um, unless we 
can find the wide sloted boats where we can use a 2um 
deposition.  Cleans prior to deposition should be 1)photoresist 
removal, 2) Standard Pre-LPCVD cleans in Wbsilicide, 3) Standard 
pre-diffusion clean.

Item 329: Unity 4411 for the sacrificial layer.  Start with clean 
silicon wafer,  2. Spin coated at headway2,  3. Solvent removal at 
100C hotplate 5mins ,  4. cured at blueM oven at 200C for 2hrs 
(<100ppm O2),  5. Sputtering metal for the mask - Metalica (need to 
know the temperature the wafer can experience),  6. Pattern the metal 
mask (svgcoat/evaling/svgdev/wbgen),  7. Dry etch at MRC or 
drytek1,  8. Remove metal mask at wbgen,  9. Sputtering Cr/Au in 
Metalica for the metal suspended structure,  10. Pattern the Cr/Au 
(svgcoat/evaling/svgdev/wbgen),  11.polymer decomposition in BlueM 
upto 405C (<1ppm O2)
Recommendations:  Approved processing sequence, but need to work with 
requester in finding correct furnaces for the anneals.

RESOLVED:

Item 218: Use Ammonium dichromate as a photosensitizer in litho process.
Recommendation: Approved.  Either needs a pre-made solutions of this, 
or order, store, and make up solutions outside the lab.  PVA is an 
approved chemical which needs to should be collected locally and 
labelled as hazardous waste.

Item 224: PVP is cured at 175 or 200 C and is reported in the 
literature as OK for high vacuum evaportion of electrodes.  I can't 
believe it would be worse than photoresist as used for lift-off.  I 
will add a de-hydration bake (110 C, 20 minutes) just before Innotec.
Recommendation:  Approved, as long as spin coating is done outside the fab.

Item 226: Bismuth/Antimony Telluride.  Initially I will be doing SEM 
work.  Later I will be depositing metals, thereby encapsulating the 
Bi/Sb-Te, and patterning the metals.  I do not know the specifics of 
the equipment that would be used but they would be the 'contaminated' 
class of tools.
Recommendation:  Approve for metal deposition in gold contaminated 
equipment.  Need to see if they will be patterning the top metal by 
RIE and make sure they are in the correct etcher.  Need to keep an 
eye on the user to make sure his not only using SNL.

Item 227: 1. application of polycarbonate plastic film in Innotech. 
2. Bring in outside wafer after CMP. The surface at this stage 
surface contains SiO2 and carbon. 3. SiO2 etch in drytek 4 of a wafer 
having both SiO2 and carbon on the surface. 4. PECVD SiO2 dep on a 
wafer that has carbon nanotube exposed.  My process flow is the 
following: 1. Silicon Nitride deposition on Si wafer (clean) 2. Litho 
to pattern the nitride 3. Ni (10nm) and Fe (3nm) deposition through 
an polycarbonate membrane and SS shadow mask in Innotech. (cont) 4. 
PECVD SiO2 depoosition (cont) 5. CMP (outside lab) 6. Drytek 4 etch 
of SiO2 (cont) 7. PECVD SiO2 dep (cont) 8. Cr dep (cont)
Recommendation: Approved

Item 228: I would like to get approval for using HBr -liquid form - 
for etching InP wafers.
Recommendation:  Approved with the stipulation to have a minimal 
amount of concentrated HBr solution stored at SNF and a suggestion 
that it be kept in a larger, labeled, enclosed, secondary container 
(like one of those single chemical bottle carriers.)  and keep as 
little of this stuff on-site as possible.

Item 229: Can the XeF2 be ran a both a gold contaminated and semiclean tool?
Recommendation: Yes, We will manufacture and dedicate the sample 
platen for each material classification.

Item 230: Protek from Brewer Scientific
Recommendation:  Approved previously

Item 231: I would like to bring a PZT sol-gel solution into 
SNF....Solvent system is 2-methoxyethanol.
Comments: The process flow looks compatible with the gold 
contaminated equipment set, however the iconic "glycol ether" that 
we've been trying to phase out.  We can approve this experiment with 
restrictions on handling and make a request to change the solvent 
system for future use.

Item 232: two chemicals for surface passivation of GaAs wafers: 1- 
ammonium sulfide. Formula: (NH4)2Sx, 2- Thioacetamide. Formula:CH3CSNH2
Recommendation: Approve with limitations.  We would need a detailed 
procedure for what she plans to do (concentrations, mixtures, 
etc.)  Both are crystals, so it would be easier to bring in solutions 
directly into the lab than solids that she'd have to mix up.  Both 
are actually flammable and react with acids to form toxic H2S gas, so 
any work with these chemicals would need to be done in a solvent 
bench, NOT wbgaas.

Item 233: HSQ XR-1542 negative ebeam resist.
Recommendation: Previously approved for Headway only.

Item 234: process step where the lot moves from STS deep etch to 
LPTEOS dep. Comments: The wafers can go through multi-levels of 
chemical cleans following STS etch.
Recommendations: Approve with the following clean sequence: 
1)photoresist removal, 2) Standard Pre-LPCVD cleans in Wbsilicide, 3) 
Follow wafer deposition with 0.5um furnace coating.

Item 235: Clean classification for the Fusion tool.
Recommendation: Use the Litho, All classification.

Item 236: Adding N2 to the AMT Etcher for a O2 for a patterning etch 
for polymers.
Recommendation:  Approve temporary installation by the maintenance group.

Item 238: DUV112-6 from Brewer Science and we plan to use this 
together with the resists you have in-house (PMMA, UVN-30) for DUV lithography.
Recommendations: Approved




-------------- next part --------------
A non-text attachment was scrubbed...
Name: SpecMat Logsheet.xls
Type: application/octet-stream
Size: 226304 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20070119/ef8efc2f/attachment.obj>

From rissman at stanford.edu  Fri Jan 19 14:35:01 2007
From: rissman at stanford.edu (Paul Rissman)
Date: Fri, 19 Jan 2007 14:35:01 -0800
Subject: Fusion
Message-ID: <200701192235.l0JMZ5Dr011120@smtp-roam.Stanford.EDU>

Item 235: Clean classification for the Fusion tool.
Recommendation: Use the Litho, All classification.


Mary wanted a post svg develop track rinse.  The thought is that 
there maybe backside contamination which would transfer via the system chuck.

I will require this in the future if all agree, although I need to 
know which wet bench.



From cox at akronhardware.com  Thu Jan 11 01:12:19 2007
From: cox at akronhardware.com (Darrin Walls)
Date: Thu, 11 Jan 2007 02:12:19 -0700
Subject: fondly jeffrey man mulct duration copywriter bounce roster voracity fungible hal maxwellian opaque decibel morrow ttl commiserate melodramatic align pullover cluj embassy decade grip stevenson protease migrant somewhere eastward bamberger cheryl behalf committable galbreath surf dolores inflate fairfield fortress spice 
Message-ID: <176304271814.8814237@oscsunb.osc.edu>


Hi,

check out this replica watch site.  They got

rolex's that look like the real deal for the 

portion of the price. what u got to lose?

http://www.spokefresh.com