Using Unity 4411 in snf

Hyeun-Su Kim aeonia at gmail.com
Thu Jan 18 14:00:13 PST 2007


Dear SpecMat committee,

I am thinking about using Unity 4411 for the sacrificial layer. It is
thermally decomposable polymer.

For the process,
1. Start with clean silicon wafer
2. Spin coated at headway2
3. Solvent removal at 100C hotplate 5mins
4. cured at blueM oven at 200C for 2hrs (<100ppm O2)
5. Sputtering metal for the mask -Metalica (need to know the temperature the
wafer can experience)
6. Pattern the metal mask (svgcoat/evaling/svgdev/wbgen)
7. Dry etch at MRC or drytek1
8. Remove metal mask at wbgen
9. Sputtering Cr/Au in Metalica for the metal suspended structure
10. Pattern the Cr/Au (svgcoat/evaling/svgdev/wbgen)
11.polymer decomposition in BlueM upto 405C (<1ppm O2)

Do you think this process feasible in snf? Please let me know if you need
more information. Thank you.


MSDS, process guide, and data sheet are attached.


Hyeun-Su
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