Using Unity 4411 in snf

Mary Tang mtang at
Thu Jan 18 16:49:42 PST 2007

Hi all --

I don't think the Blue M goes that high (I think Mahnaz says it maxes 
out around 375 C).  And I seriously doubt there is less than 1 ppm of O2 
in there.  Basically, what he wants to do at +400 C is pyrolysis (I 
think).  I think this may require a properly purged quartz muffle 
furnace.  (The BlueM is purged with house N2, but also has enormous 
surface area inside (that foam-like ceramic interior) so I'm sure 
there's lots of O2 in there.)

Would this be acceptable to run in fga2, by any chance?  (I didn't think 
tylan4 would be acceptable...)

If not, I think there may be another furnace on campus somewhere, maybe 
in the RPL -- somewhere where they do sintering of ceramics...  What do 
you all think?


Hyeun-Su Kim wrote:
> Dear SpecMat committee,
> I am thinking about using Unity 4411 for the sacrificial layer. It is 
> thermally decomposable polymer.
> For the process,
> 1. Start with clean silicon wafer
> 2. Spin coated at headway2
> 3. Solvent removal at 100C hotplate 5mins
> 4. cured at blueM oven at 200C for 2hrs (<100ppm O2)
> 5. Sputtering metal for the mask - Metalica (need to know the 
> temperature the wafer can experience)
> 6. Pattern the metal mask (svgcoat/evaling/svgdev/wbgen)
> 7. Dry etch at MRC or drytek1
> 8. Remove metal mask at wbgen
> 9. Sputtering Cr/Au in Metalica for the metal suspended structure
> 10. Pattern the Cr/Au (svgcoat/evaling/svgdev/wbgen)
> 11.polymer decomposition in BlueM upto 405C (<1ppm O2)
> Do you think this process feasible in snf? Please let me know if you 
> need more information. Thank you.
> MSDS, process guide, and data sheet are attached.
> Hyeun-Su 

Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at

More information about the specmat mailing list