From mao at nilt.com Thu May 3 03:54:48 2007 From: mao at nilt.com (Michael A. Olson - NIL Technology) Date: Thu, 3 May 2007 12:54:48 +0200 Subject: NIL Tech to attend NSTI Nanotech (May) 2007 Conference in Santa Clara Message-ID: <022e01c78d71$78636830$2101a8c0@MAONL> Dear Sir/Madam, We of NIL Technology noticed your research activities at the Stanford Nanofabrication Facility and introduced ourselves via e-mail a few months ago. We?re a Danish company that provides state-of-the-art nanoimprint lithography (NIL) solutions, and we invited you to receive, for free, our weekly Nano Newsletter ? which, if you?re not a subscriber already, you can still sign up for at http://www.nilt.com/Default.asp?Action=Newsletters. (A sample past issue is attached, to remind you of the comprehensive coverage of nanotech developments that it provides.) We have a couple new announcements this time: - Firstly: We?d like to bring you and a friend to visit us in Copenhagen ? all expenses paid! All you need to do to participate in our ?Win a trip to Wonderful Copenhagen!? contest is sign up other nanotech-relevant recipients to receive our free weekly newsletter. See: http://www.nilt.com/default.asp?Action=Details &Item=239 - Secondly, we?ll soon be visiting your neighborhood again, namely Santa Clara, to attend the NSTI Nanotech 2007 Conference on 22-23 May (see http://www.nsti.org/nanotech2007). NSTI Nanotech 2007 Santa Clara Convention Center 5001 Great America Parkway Santa Clara, CA 95054 We?ll be at Booth # 1106 ? we hope to see you there! Best Regards, Michael A. Olson Academic/Research Sector Outreach NIL Technology ApS ?rsteds Plads DTU - Building 347 DK-2800 Kongens Lyngby Denmark Phone: +45 4525 5828 Fax: +45 3927 2722 E-mail: mao at nilt.com -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Newsletter.pdf Type: application/pdf Size: 74060 bytes Desc: not available URL: From crichter at completegenomics.com Thu May 3 11:19:54 2007 From: crichter at completegenomics.com (Claudia Richter) Date: Thu, 3 May 2007 11:19:54 -0700 Subject: Request To Bring A Silane To SNF Message-ID: <2B0B7A468F25AC4DA1CCA13B50E58CF50F44AA@crick.completegenomics.com> Dear Specmat Committee, I'd like to request to bring in to SNF 3-aminopropyldimethylethoxysilane. The amine part of this silane is important for further derivatization of the surface of our substrates. The process plan is to use this silane to coat silicon wafers (with oxide). This silane is diluted down to a solution that is 1% in isopropanol (99.98%) or DI water. The solution poured into a dish/beaker large enough to accommodate the wafers. The wafers are dipped in this solution and rinsed with isopropanol and water; then dried with an air gun. The proposed plan is to do this in the solvent bench in the lithography room and use the existing carboy that is provided to collect the waste or have our own waste bottle to collect this waste. Attached is the MSDS sheet. We would like to begin this process within the next week. Please contact me for any questions or further information. Sincerely, Claudia ____________________________________ Claudia M. Richter Sr. Process Engineer Complete Genomics 750 N. Pastoria Ave. Sunnyvale, CA. 94085 P: 408.730.5700 F: 408.769.2258 www.completegenomics.com -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: APDMESmsds.pdf Type: application/octet-stream Size: 19837 bytes Desc: APDMESmsds.pdf URL: From mtang at stanford.edu Thu May 3 17:23:04 2007 From: mtang at stanford.edu (Mary Tang) Date: Thu, 03 May 2007 17:23:04 -0700 Subject: Request To Bring A Silane To SNF In-Reply-To: <2B0B7A468F25AC4DA1CCA13B50E58CF50F44AA@crick.completegenomics.com> References: <2B0B7A468F25AC4DA1CCA13B50E58CF50F44AA@crick.completegenomics.com> Message-ID: <463A7CE8.6080908@stanford.edu> Hi Claudia -- This chemical (or very similar compound) has been OKed to use in the lab with certain caveats. But, I have a number of questions (and maybe the other SpecMat'ers may have more): - Will you be storing the chemical here? - I would strongly suggest that you use your own dedicated labware for this. - Is there any reason this needs to be done in the litho area? If not, wbsolvent would be a better place (surface modification processing is generally a bad idea in the litho area - cross-contamination, such as with used glassware, can drastically affect surface properties of other people's substrates.) - If you are using IPA, dispose of waste in the solvent carboy. If you are using water, please process at wbgeneral and aspirate waste or collect locally. - What kind of processing in the lab will be done subsequent to your surface modification and where? Mary Claudia Richter wrote: > > Dear Specmat Committee, > > I?d like to request to bring in to SNF > 3-aminopropyldimethylethoxysilane. The amine part of this silane is > important for further derivatization of the surface of our substrates. > > The process plan is to use this silane to coat silicon wafers (with > oxide). This silane is diluted down to a solution that is 1% in > isopropanol (99.98%) or DI water. The solution poured into a > dish/beaker large enough to accommodate the wafers. The wafers are > dipped in this solution and rinsed with isopropanol and water; then > dried with an air gun. The proposed plan is to do this in the solvent > bench in the lithography room and use the existing carboy that is > provided to collect the waste or have our own waste bottle to collect > this waste. > > Attached is the MSDS sheet. We would like to begin this process within > the next week. Please contact me for any questions or further information. > > Sincerely, > > Claudia > > ____________________________________ > > Claudia M. Richter > > Sr. Process Engineer > > Complete Genomics > > 750 N. Pastoria Ave. > > Sunnyvale, CA. 94085 > > P: 408.730.5700 > > F: 408.769.2258 > > www.completegenomics.com > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From crichter at completegenomics.com Fri May 4 12:46:50 2007 From: crichter at completegenomics.com (Claudia Richter) Date: Fri, 4 May 2007 12:46:50 -0700 Subject: Request To Bring A Silane To SNF In-Reply-To: <463A7CE8.6080908@stanford.edu> References: <2B0B7A468F25AC4DA1CCA13B50E58CF50F44AA@crick.completegenomics.com> <463A7CE8.6080908@stanford.edu> Message-ID: <2B0B7A468F25AC4DA1CCA13B50E58CF50F4540@crick.completegenomics.com> Hi Mary, Ideally, we'd like the chemical to be stored at SNF. Would the chemical be ok to store in the flammable cabinet behind the furnaces? We plan on getting our own designated labware(Pyrex or polypropylene) for this process on these test wafers. We can most certainly use the solvent bench in the wbsolvent. This process does not require being in the litho room. All further processing on these substrates will be brought back in-house (the company) for testing and/or processing. Claudia - Will you be storing the chemical here? Ideally - I would strongly suggest that you use your own dedicated labware for this. - Is there any reason this needs to be done in the litho area? If not, wbsolvent would be a better place (surface modification processing is generally a bad idea in the litho area - cross-contamination, such as with used glassware, can drastically affect surface properties of other people's substrates.) - If you are using IPA, dispose of waste in the solvent carboy. If you are using water, please process at wbgeneral and aspirate waste or collect locally. - What kind of processing in the lab will be done subsequent to your surface modification and where? Mary Claudia Richter wrote: > > Dear Specmat Committee, > > I'd like to request to bring in to SNF > 3-aminopropyldimethylethoxysilane. The amine part of this silane is > important for further derivatization of the surface of our substrates. > > The process plan is to use this silane to coat silicon wafers (with > oxide). This silane is diluted down to a solution that is 1% in > isopropanol (99.98%) or DI water. The solution poured into a > dish/beaker large enough to accommodate the wafers. The wafers are > dipped in this solution and rinsed with isopropanol and water; then > dried with an air gun. The proposed plan is to do this in the solvent > bench in the lithography room and use the existing carboy that is > provided to collect the waste or have our own waste bottle to collect > this waste. > > Attached is the MSDS sheet. We would like to begin this process within > the next week. Please contact me for any questions or further information. > > Sincerely, > > Claudia > > ____________________________________ > > Claudia M. Richter > > Sr. Process Engineer > > Complete Genomics > > 750 N. Pastoria Ave. > > Sunnyvale, CA. 94085 > > P: 408.730.5700 > > F: 408.769.2258 > > www.completegenomics.com > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From newsletter at discount-educational-software.com Sun May 6 03:34:54 2007 From: newsletter at discount-educational-software.com (Academic Software News) Date: Sun, 6 May 2007 06:34:54 -0400 Subject: Academic Software News - May 2007 Message-ID: <34a86c7564e58ed5d35d58ce5105ec@bmw> Computer Products for Eduation is pleased to provide Educational Software News to qualified students, faculty, staff, and schools for current news on pricing and availability of Academic Edition Software from Microsoft, Adobe, Autodesk, Corel, Quark, EndNote, FileMaker, and many other major software manufacturers. Adobe has now released the entire new line of Creative Suite CS3 products! 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From crichter at completegenomics.com Tue May 8 17:51:29 2007 From: crichter at completegenomics.com (Claudia Richter) Date: Tue, 8 May 2007 17:51:29 -0700 Subject: Request To Bring A Silane To SNF References: <2B0B7A468F25AC4DA1CCA13B50E58CF50F44AA@crick.completegenomics.com> <463A7CE8.6080908@stanford.edu> Message-ID: <2B0B7A468F25AC4DA1CCA13B50E58CF50F46BF@crick.completegenomics.com> Dear Specmat, We plan on using water as the solvent for aminosilane process. We'll use the wbgen as the location where the processing will take place. -Claudia -----Original Message----- From: Claudia Richter Sent: Friday, May 04, 2007 12:47 PM To: 'Mary Tang' Cc: specmat at snf.stanford.edu; Andres Fernandez; Bryan Staker Subject: RE: Request To Bring A Silane To SNF Hi Mary, Ideally, we'd like the chemical to be stored at SNF. Would the chemical be ok to store in the flammable cabinet behind the furnaces? We plan on getting our own designated labware(Pyrex or polypropylene) for this process on these test wafers. We can most certainly use the solvent bench in the wbsolvent. This process does not require being in the litho room. All further processing on these substrates will be brought back in-house (the company) for testing and/or processing. Claudia - Will you be storing the chemical here? Ideally - I would strongly suggest that you use your own dedicated labware for this. - Is there any reason this needs to be done in the litho area? If not, wbsolvent would be a better place (surface modification processing is generally a bad idea in the litho area - cross-contamination, such as with used glassware, can drastically affect surface properties of other people's substrates.) - If you are using IPA, dispose of waste in the solvent carboy. If you are using water, please process at wbgeneral and aspirate waste or collect locally. - What kind of processing in the lab will be done subsequent to your surface modification and where? Mary Claudia Richter wrote: > > Dear Specmat Committee, > > I'd like to request to bring in to SNF > 3-aminopropyldimethylethoxysilane. The amine part of this silane is > important for further derivatization of the surface of our substrates. > > The process plan is to use this silane to coat silicon wafers (with > oxide). This silane is diluted down to a solution that is 1% in > isopropanol (99.98%) or DI water. The solution poured into a > dish/beaker large enough to accommodate the wafers. The wafers are > dipped in this solution and rinsed with isopropanol and water; then > dried with an air gun. The proposed plan is to do this in the solvent > bench in the lithography room and use the existing carboy that is > provided to collect the waste or have our own waste bottle to collect > this waste. > > Attached is the MSDS sheet. We would like to begin this process within > the next week. Please contact me for any questions or further information. > > Sincerely, > > Claudia > > ____________________________________ > > Claudia M. Richter > > Sr. Process Engineer > > Complete Genomics > > 750 N. Pastoria Ave. > > Sunnyvale, CA. 94085 > > P: 408.730.5700 > > F: 408.769.2258 > > www.completegenomics.com > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Tue May 8 18:16:32 2007 From: mtang at stanford.edu (Mary Tang) Date: Tue, 08 May 2007 18:16:32 -0700 Subject: Request To Bring A Silane To SNF In-Reply-To: <2B0B7A468F25AC4DA1CCA13B50E58CF50F46BF@crick.completegenomics.com> References: <2B0B7A468F25AC4DA1CCA13B50E58CF50F44AA@crick.completegenomics.com> <463A7CE8.6080908@stanford.edu> <2B0B7A468F25AC4DA1CCA13B50E58CF50F46BF@crick.completegenomics.com> Message-ID: <464120F0.3010002@stanford.edu> Hi SpecMat'rs -- I spoke with Claudia on the phone. I think this is fine. She's agreed to keep this out of litho, use her own labware, and use wbsolvent if using IPA and wbgeneral if using water. There is such a small amount of the aminosilane -- and it turns pretty much to silicate over time -- that disposal should not be a problem. She's not bringing the materials back into the lab for further process, so there should be no concerns about downstream contamination. Mary Claudia Richter wrote: > Dear Specmat, > > We plan on using water as the solvent for aminosilane process. We'll use > the wbgen as the location where the processing will take place. > > > -Claudia > > > -----Original Message----- > From: Claudia Richter > Sent: Friday, May 04, 2007 12:47 PM > To: 'Mary Tang' > Cc: specmat at snf.stanford.edu; Andres Fernandez; Bryan Staker > Subject: RE: Request To Bring A Silane To SNF > > Hi Mary, > > Ideally, we'd like the chemical to be stored at SNF. Would the chemical > be ok to store in the flammable cabinet behind the furnaces? We plan on > getting our own designated labware(Pyrex or polypropylene) for this > process on these test wafers. We can most certainly use the solvent > bench in the wbsolvent. This process does not require being in the litho > room. > > All further processing on these substrates will be brought back in-house > (the company) for testing and/or processing. > > > Claudia > > > > - Will you be storing the chemical here? > > Ideally > - I would strongly suggest that you use your own dedicated labware for > this. > - Is there any reason this needs to be done in the litho area? If not, > wbsolvent would be a better place (surface modification processing is > generally a bad idea in the litho area - cross-contamination, such as > with used glassware, can drastically affect surface properties of other > people's substrates.) > - If you are using IPA, dispose of waste in the solvent carboy. If you > are using water, please process at wbgeneral and aspirate waste or > collect locally. > - What kind of processing in the lab will be done subsequent to your > surface modification and where? > > Mary > > Claudia Richter wrote: > >> Dear Specmat Committee, >> >> I'd like to request to bring in to SNF >> 3-aminopropyldimethylethoxysilane. The amine part of this silane is >> important for further derivatization of the surface of our substrates. >> >> The process plan is to use this silane to coat silicon wafers (with >> oxide). This silane is diluted down to a solution that is 1% in >> isopropanol (99.98%) or DI water. The solution poured into a >> dish/beaker large enough to accommodate the wafers. The wafers are >> dipped in this solution and rinsed with isopropanol and water; then >> dried with an air gun. The proposed plan is to do this in the solvent >> bench in the lithography room and use the existing carboy that is >> provided to collect the waste or have our own waste bottle to collect >> this waste. >> >> Attached is the MSDS sheet. We would like to begin this process within >> > > >> the next week. Please contact me for any questions or further >> > information. > >> Sincerely, >> >> Claudia >> >> ____________________________________ >> >> Claudia M. Richter >> >> Sr. Process Engineer >> >> Complete Genomics >> >> 750 N. Pastoria Ave. >> >> Sunnyvale, CA. 94085 >> >> P: 408.730.5700 >> >> F: 408.769.2258 >> >> www.completegenomics.com >> >> > > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Wed May 9 14:26:45 2007 From: mtang at stanford.edu (Mary Tang) Date: Wed, 09 May 2007 14:26:45 -0700 Subject: [Fwd: Re: Lampoly] Message-ID: <46423C95.8000805@stanford.edu> Hi all -- What do you think? I take it that Pt is needed as a conductive layer for FIB. It seems to me that if it is stripped and decontaminated as per standard procedures (5:1:1 H2O:HCl:H2O2, followed by wbnonmetal, followed by wbdiff clean) this should be OK for lampoly. Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- An embedded message was scrubbed... From: "David Elata" Subject: Re: Lampoly Date: Wed, 9 May 2007 14:22:49 -0700 Size: 14463 URL: From mcvittie at cis.Stanford.EDU Wed May 9 15:36:06 2007 From: mcvittie at cis.Stanford.EDU (Jim McVittie) Date: Wed, 9 May 2007 15:36:06 -0700 (PDT) Subject: [Fwd: Re: Lampoly] In-Reply-To: <46423C95.8000805@stanford.edu> Message-ID: Mary, Since they want to go 2 um deep, I would have probably suggested using the P5000. Which tool to use actually depends on the structure they want. I think the P5000 HBr/NF3 process tends to be better for deeper structures. As for metal contamination, what is proposed is probably ok. Jim On Wed, 9 May 2007, Mary Tang wrote: > Hi all -- > > What do you think? I take it that Pt is needed as a conductive layer > for FIB. It seems to me that if it is stripped and decontaminated as > per standard procedures (5:1:1 H2O:HCl:H2O2, followed by wbnonmetal, > followed by wbdiff clean) this should be OK for lampoly. > > Mary > > > -- -------------------------------------------------------------- Jim McVittie, Ph.D. Senior Research Scientist Allen Center for Integrated Systems Electrical Engineering Stanford University jmcvittie at stanford.edu Rm. 336, 330 Serra Mall Fax: (650) 723-4659 Stanford, CA 94305-4075 Tel: (650) 725-3640 From mtang at stanford.edu Wed May 9 16:07:36 2007 From: mtang at stanford.edu (Mary Tang) Date: Wed, 09 May 2007 16:07:36 -0700 Subject: HBr? Message-ID: <46425438.6020700@stanford.edu> Hi -- Does anyone happen to have John Choi's procedure for mixing HBr etchant for anisotropic etching of InP or GaAs? As I recall, it was very detailed and he had worked with a chemist to ensure that no Br2 would be generated... (Angie Lin from the Harris lab wants to do this -- her protocol is very vague -- she plans to do this in the Harris lab, not SNF.) Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From service at visa.com Fri May 18 09:37:12 2007 From: service at visa.com (service at visa.com) Date: Fri, 18 May 2007 18:37:12 +0200 (CEST) Subject: VISA Credit Cards Fraud Warning Message-ID: <20070518163712.E9363C9EDCD@www.cro-stuttgart.de> An HTML attachment was scrubbed... URL: From artyjamo at comcast.net Fri May 18 11:19:24 2007 From: artyjamo at comcast.net (artyjamo at comcast.net) Date: Fri, 18 May 2007 18:19:24 +0000 Subject: Request for New Negative photoresist Message-ID: <051820071819.2587.464DEE2C000E02F200000A1B220075078401030E06979B9D0E@comcast.net> Hello Spec-Mat Committee, I would like to bring in a new negative photoresist made by Micro Chem called KMPR. This is a high viscosity positive photoresist for 15-80 um thick coatings. I would like to bring in an 8oz bottle (like those that are issued in the SNF stockroom) and keep it in the small flammables cabinet, along with the other SNF members resist samples. I would be using these resists to coat my substrates on the Headway spinner (15 to 80 um thick) and softbaking them on the hotplates that are immediately to the right of the Headway spinner. I would like to expose the coated substrates on the Karl Suss aligners, and develop the patterns in LDD-26W at the develop bench in the litho area. Used developer would go down the drain in the develop bench. Any waste of these resists would be put in the solvent waste carboy in the Solvent bench. Any clean roomwipes contaminated with this resist, empty bottles with resist resid ues would be bagged and put in the solid chemical waste bin in the Litho area. I am attaching a soft copy of the MSDS sheet Please let me know ASAP if I can bring this sample in for use. > Much Thanks, > > Aleta Jamora (ajamo) -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: KMPR SERIES MSDS rev2[1].DOC Type: application/msword Size: 71168 bytes Desc: not available URL: From eap at gloworm.Stanford.EDU Mon May 21 15:33:22 2007 From: eap at gloworm.Stanford.EDU (Eric Perozziello) Date: Mon, 21 May 2007 15:33:22 -0700 (PDT) Subject: Hf in P5000 Ch.A Message-ID: ERICP Hf deposited in SCT or Sematech Vendor will either be SNF's SCT or Sematech's CMOS fab. (these films were previously introduced by Intel in ~2003). Process flow is roughly: clean SiO2 or HfSixOy, followed by Hf, followed by Al (gate stack used by Sematech, and others) litho P5000 etch (Ch.A Metal chamber, Cl2/BCl3 chemistry) strip (All materials will be in the form of thin film on Si wafer only. ) It would be best for us to know if we can put Hf in the P5000 ChA in a one week timeframe if possible. Thanks, -Eric From mcvittie at cis.Stanford.EDU Mon May 21 19:14:29 2007 From: mcvittie at cis.Stanford.EDU (Jim McVittie) Date: Mon, 21 May 2007 19:14:29 -0700 (PDT) Subject: Hf in P5000 Ch.A In-Reply-To: Message-ID: Hi Eric, Hf is very similar to Zr. Some years back we did a detailed study of Zr etching is the P5000 where we focused on contamiation issues. We found Cl2 is very effective in removing Zr. I beleve Hf has been etched by several students over the year in the P-5000. I can check on this last point when I get back. Jim On Mon, 21 May 2007, Eric Perozziello wrote: > > ERICP > > Hf deposited in SCT or Sematech > > Vendor will either be SNF's SCT or Sematech's CMOS fab. > (these films were previously introduced by Intel in ~2003). > > Process flow is roughly: > clean SiO2 or HfSixOy, followed by Hf, followed by Al > (gate stack used by Sematech, and others) > litho > P5000 etch (Ch.A Metal chamber, Cl2/BCl3 chemistry) > strip > > (All materials will be in the form of thin film > on Si wafer only. ) > > It would be best for us to know if we can put Hf > in the P5000 ChA in a one week timeframe if possible. > > Thanks, > -Eric > > > -- -------------------------------------------------------------- Jim McVittie, Ph.D. Senior Research Scientist Allen Center for Integrated Systems Electrical Engineering Stanford University jmcvittie at stanford.edu Rm. 336, 330 Serra Mall Fax: (650) 723-4659 Stanford, CA 94305-4075 Tel: (650) 725-3640 From mahnaz at stanford.edu Wed May 23 11:39:13 2007 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Wed, 23 May 2007 11:39:13 -0700 Subject: MSDS for KMPR In-Reply-To: <052320070109.14243.46539446000917C3000037A3220076018001030E06979B9D0E@comcast.net> References: <052320070109.14243.46539446000917C3000037A3220076018001030E06979B9D0E@comcast.net> Message-ID: <46548A51.3090202@stanford.edu> Hello Aleta, I have been out of computer and still not set up properly so sorry for the delay. Your chemical has been ok, we have done this many times and you know the drill. Come and get the proper labels and do the paper work. mahnaz yjamo at comcast.net wrote > > > Hi Mahnaz, > > Did you get a chance to look at the MSDS for the KMPR Micro Chem > resists? > > Thanks! > > -Aleta From do-hyeon823.kim at samsung.com Thu May 24 14:32:47 2007 From: do-hyeon823.kim at samsung.com (=?euc-kr?B?sei1tcf2?=) Date: Thu, 24 May 2007 21:32:47 +0000 (GMT) Subject: New Si Materials and Related Process Message-ID: <0JIK00G5DEINGH@ms5.samsung.com> An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS SJ-ERAC-R06054-21-1.doc Type: application/octet-stream Size: 104448 bytes Desc: not available URL: From mike at fabsurplus.com Thu May 31 16:08:49 2007 From: mike at fabsurplus.com (SDI Semiconductor Instruments) Date: Fri, 1 Jun 2007 01:08:49 +0200 (CEST) Subject: SDI Fabsurplus Equipment Owned June 2007 Message-ID: <32533291.1180653619140.JavaMail.root@server1.sdi-fabsurplus.com> Dear Friends and Customers, SDI Fabsurplus Group brokers and supports Semiconductor Fab/Assembly/SMT equipment from its offices in Italy, Ireland and the USA. We are committed to providing accurate and professional help to clients looking to buy and sell used I.C. making equipment. These are highlighted items we are selling: **************************************************** KLA SP1 TBI, can be inspected and demo?d VARIAN E500HP IMPLANTER Applied Materials 5500 Endura 200mm CANON FPA 3000 EX3 GASONICS L3510 SINGLE CHAMBER ASHER KAIROS T7210 NEW SINGLE CHAMBER ASHER, 1 YEAR WARRANTY & INSTALLATION HITACHI S4500 HITACHI HI TECH 6780 CD SEM KLA-TENCOR AIT 1 Can be inspected in our cleanroom. KLA-TENCOR 2132 KLA-TENCOR 7700 SURFSCAN LAM 4728 W-ETCHER LAM 4528 OXIDE ETCHER LAM 9600 PTX ALLIANCE NIKON NSR S305B NIKON NSR1755i7A NOVELLUS 676 W-POLISH RUDOLPH FE3 ELLIPSOMETER VARIAN 3190 WATKINS-JOHNSON WJ-999R TEOS Wanted Equipment List ********************************* SDI is looking to purchase immediately the following items of equipment: Complete Lines of Semiconductor production equipment- 4, 5, 6 and 8-inch lines (many requests.). Complete line for wafer level packaging, 6? or 8? Complete line for GaAs, 5 inch Agilent HP4062UX Applied Materials Endura, Centura and Producer Applied Materials Mirra Mesa CMP Tools Applied Materials 9500XR, 8? AMAT 0010-13304 budget 10K USD Asyst ST8260 Smart Tags qty 200 ASM E2000 ASM Epsilon EPI ASML AT-1250 (or other DUV scanner at 193 nm node, better than model 1100B) ASML PAS5500- 40 ASML PAS5500-100 steppers ASML PAS5500-250 steppers AST SHS2800 FOR 150MM WAFERS Axcelis GSD 200, 8 or 6 inch, high current application DISCO Dicing Saws- any late model Axcelis/Eaton Implanters - any model esp. GSD HE EBARA EPO 222D CMP Electroglas 4080 and 4090 probers FSI EXCALIBUR 2000 , through the wall, at least 2000 vintage, 2 modules, 200 mm FSI Mercury Acid Spray Processor Gasonics Aura 3010 Hitachi S4700 or S4800 FE Inspection SEM HORIBA UT300 KLA-Tencor 6420 KLA-Tencor AIT II KLA-Tencor F5x KLA-Tencor SP1, TBI KLA-Tencor P1, P2 Pxx series KLA-Tencor UV1280SE, w/ SMIF Karl Suss MA 200 Mask Aligner Karl Suss MA6/BA6 KOYO VF5300B Polyimide bake LAM DSM Lam 9400 PTX Lam 4520 and 4420 Leica INS3000 Matrix Bobcat 208 Mattson Aspen Micrion 9500 FIB Nidek IM-11 Nikon NSR 2205-i14E2 Stepper for 8 inch wafers Nikon NSR 2005-i12D with NA going to 0.63 (standard lens) for 6 inch wafer, 5 inch reticle Nitto- Tapers and Detapers Novellus C1 and C2 especially Sequel, HDP CVD Triple Speed and Shrink platforms ORTHODYNE 360c-HD PANASONIC BP-20CS Rudolph FE VII Shinkawa UTC 300 or newer bonders SEMITOOL MAGNUM SUSS MA1300 TEL ACT 8 Tracks TEL Alpha 8S Vertical furnaces TEL Unity IIE 85DD Contact/Via etch process TEL Unity IIE 85 DPE Oxide etch TSK UF3000 ULTRATECH AP300 Varian 3290 Varian Ion Implanters especially Viision 200 and EHP 500 Vision Systems Mantis Inspection Microscopes Varian Viision Westbond 7200CR, 7400 or 7700 SDI Group is exhibiting at SEMICON WEST, San Francisco, July 17-19 North Hall Booth 5174. Contact us now to book your meeting with our sales team. Please keep us updated on items you'd like to buy and also let us know what used equipment you have to sell. Yours sincerely, Mike Murehead SDI Fabsurplus LLC Georgetown, Texas Tel: 512-635-8027 Fax: 801-217-6104 mike at fabsurplus.com Oliver Dunne SDI Semiconductor Instruments Ireland Limited Tel: Ireland (353) 4694 38804 Mobile: Ireland (353) 872 985 561 Ollie.Dunne at fabsurplus.com Michael Fortune SDI Semiconductor Instruments Ireland Limited Phone: (353) 4694 31951 Cell: (353) 0879 150 198 michael.fortune at fabsurplus.com Vito Vigliotto SDI Semiconductor Instruments Srl Napoli, Italy Tel: Italy (39) 081 575 0506 Stephen Howe SDI Semiconductor Instruments Srl Napoli, Italy Tel: Italy (39) 081 575 0506 Mobile: Italy (39) 335 710 7756 info at fabsurplus.com www.fabsurplus.com A Member of SEMI (Semiconductor Equipment and Materials International Important Notice: This message is intended for the attention of the person or organization to which it has been addressed. It may contain information that is confidential, proprietary and/or exempt from disclosure by law. If you have received this message in error please be aware that the sender does not waive any confidentiality, ownership rights or privilege applicable to it. You are therefore strictly prohibited to disseminate, distribute or copy this message in any way. This message may be considered an advertisement or solicitation under U.S. law. If you would like to opt-out of receiving future commercial e-mail marketing messages from SDI Semiconductor Instruments, please send a message to the following e-mail address with the word "unsubscribe" in the subject line: info at fabsurplus.com -------------- next part -------------- A non-text attachment was scrubbed... Name: SDI Fabsurplus Equipment owned June 2007.xls Type: application/octet-stream Size: 89088 bytes Desc: not available URL: