From equipment at fabsurplus.com Thu Nov 1 05:12:25 2007 From: equipment at fabsurplus.com (SDI Semiconductor Instruments) Date: Thu, 1 Nov 2007 13:12:25 +0100 (CET) Subject: Fabsurplus.com Used Equipment Newsletter November 2007 Message-ID: <2958751.1193920200368.JavaMail.root@server1.fabsurplus.com> Fabsurplus.com Used Equipment Newsletter November 2007 ****************************************************** Fabsurplus.com purchases AMAT Producer ************************************** Fabsurplus.com is pleased to offer from stock the following for immediate resale:- SDI ID: 16433 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16433 Manufacturer: Applied Materials Model: Producer Type: PECVD (Plasma Enhanced) TWIN F-Teos Process Version: 200 MM Vintage: Jun 2001 Sales price: 1,500,000 USD Comments: -GUARENTEED NO COPPER PROCESS -Process :TEOS / FTEOS -CE Marked -Loadports: qty 4 SYST INX 2000 -ROBOT: BROOKS 405-1 with track Astex RPS NF3 Clean -HSMS Ready Positions A,B,C: XT PE TEOS Twin, Process: (14) DELTA MF OXIDE - FSG Included process startup CPS: Delta MF Oxide USG Gas feed Bottom System Cabinet Exhaust BOTTOM MFCs AERA 7800 5 RA, Valves FUJIKIN 5 RA MAX RF Generators AE RFG 2000/ENI QUANTA For Details contact: showe at fabsurplus.com Fabsurplus.com offers 0.5 um capable Nikon stepper ************************************************** Fabsurplus.com is currently offering from stock a Nikon i7A "wide-field" stepper with lens upgrades making it the equivalent of a Nikon i9 or i10 stepper. The tool also has a computer system upgraded to a PC type. The tool can be offered either "as is" or refurbished. The tool is stored in our temperature- controlled storage facility at Avezzano, near Rome Italy. The tool can be demonstrated running to OEM specs in our advanced cleanroom facility by prior appointment. To obtain a quote or book a demonstration, contact Stephen Howe showe at fabsurplus.com Fabsurplus.com consigns advanced implanter to client **************************************************** Fabsurplus.com has completed consignment of a Varian E500HP implanter to our client. This follows our new strategy of making strategic investment in high-value capital equipment. Fabsurplus.com can now offer refurbished or "as is" used implanter products from Varian, Eaton/ Axcelis and AMAT. Contact: Stephen Howe showe at fabsurplus.com Fabsurplus.com offers refurbished KLA inspection tools ****************************************************** Fabsurplus.com can offer a wide range of refurbished KLA-Tencor products. Refurbishment to OEM specs is carried out at our Avezzano facility near Rome, Italy. To obtain a quote or book a demonstration, contact Stephen Howe showe at fabsurplus.com CLEANROOM AND STORAGE SPACE AVAILABLE ************************************* SDI now has available class 10 cleanroom space for rent and storage space for your used equipment. Contact: Stephen Howe showe at fabsurplus.com NOVEMBER'S FEATURED SALES ITEMS ******************************* http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16889 KLA-Tencor Surfscan SP1 Classic - Price: 280k USD - SDI Item # 16889 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16890 Varian EHPi 500 200mm - Price: 1.3M USD- SDI Item # 16890 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16891 ASML PAS 5000/50 - Price: 220k USD - SDI Item # 16891 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16892 AMAT Centura Ultima 2006 VINTAGE - Price: 1.9M USD - SDI Item # 16892 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16893 HP/Agilent 93000 P1000 - Price: 375k USD - SDI # 16893 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16894 Applied Materials Centura DPS R1 Metal Etch - Price: 1.6M USD - SDI item # 16894 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16895 Joel JWS 7550 SEM - Price: 60k USD - SDI Item # 16895 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16896 ADE 9500 UltraGage - Price: 115k USD - SDI Item # 16896 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16897 Novellus C1-150 CVD System - Price: 270k USD - SDI Item # 16897 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16898 Novellus C2 Triple Speed - Price: 1.7M USD - SDI Item # 16898 For additional Information on any of the items listed above please contact: Randall Copeland (SDI Oregon) at: Support at fabsurplus.com Systemation RVSI ST495 Tape and reel Micro Vu M302 Video Microscope Measuring System Leitz wafer inspection Microscopes ( Ergolux and Secolux 6x6 ) For additional Information on any of the items listed above please contact: Ollie Dunne (SDI Ireland) at: ollie.dunne at fabsurplus.com http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16556 AXCELIS / Eaton NV 10-160 Medium Current Implanter 150 MM Jun 1986 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16570 Ultratech 1500B STEPPER 1 X, Jun 1990, 120,000 EUR SDI ID: 16570 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16571 NOVELLUS CONCEPT 1 CVD SYSTEM, Mar 1998 Price: 370,000 EUR SDI ID: 16571 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16402 Watkins Johnson WJ999R 120,000 EUR SDI ID: 16402 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=15871 TEL ACT 8 Clean track 200 mm Two Tools available Vintage 12/1999 and 11/2000 Single Block 2 Coaters 2 Developers SDI ID: 15871 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16417 Oxford ISIS EDX probe for SEM Jun 2004 30,000 USD SDI ID: 16417 Partial 12 inch line available for sale.Tools vintage 2003-2006 For additional Information on any of the items listed above please contact: Stephen Howe (SDI Italy) at: showe at fabsurplus.com http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16926 Fuji CP6-4000 ? SDI Item # 16926 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16927 AMAT Endura ? SDI Item # 16927 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16928 AMAT Centura SHP PVD ? SDI Item # 16928 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16929 Delta Design RFS 2040 ? SDI Item # 16929 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16930 Credence 9000 IX ? SDI Item # 16930 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16931 Teradyne A540 ? SDI Item # 16931 http://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=16932 Veeco Dektak SXM320 ? SDI Item # 16932 For additional information on any of the items listed above please contact: Jerry Weathers (SDI Austin TX) at: jerry at fabsurplus.com NOVEMBERS HOT WANTED ITEMS ************************** ASM EPSILON 2000 FOR 4, 6 OR 8 INCH WAFERS AMAT Mirra Mesa and Mirra Mesa Cu Hitachi S3000 with EDX SECASI goniometer, to measure crystal lattice direction in silicon ingots must include manual. Asyst Smart Tags (model ST8260) QTY 200 DPN- single Chamber for AMAT Centura or complete AMAT Centura system with 2x RTP Chamber + 1x DPN Chamber; High Temperature Vacuum Bake Oven -Lumina 450 PB IMID-Cure YES Oven Canon FPA-3000EX5 Stepper or 1x Canon FPA-5000ES3 Stepper KLA-Tencor SFX100 Rigaku 3630 P10 / Rigaku XRF or alternative PW2830 XRF Wafer Analyzer or PW2400, 2600, supplier PANalytical, former Philips Biorad QS-2200 AFM UVx210 or Vx210 model (important automatic tip change, Lasercentering, PC, etc.) or alternative D 9000 KLA 2365 Escape or KLA 2367 Axcelis Summit XT tool for 200 mm wafers Applied Materials ENDURA SIP Copper NOVELLUS SABRE Copper Electroplatting Applied Materials CMP Mirra/Mesa copper SEZ 203 FEI Accura 800 Nextest Maverick GT2 TEL P12XL KLA 6420 KLA UV1280SE ALCATEl GIR 260/263 6? ETCHER DISCO DAD321 DISCO DICING SAW 83H/6 SEMITOOL ST260D STACK OF TWO RINSE DRYER CHAMBERS ORTHODYNE BONDER 360CH Olympus Wafer Loader with front side macro inspection VARIAN 80XR OR 300XP MEDIUM CURRENT IMPLANTER Varian Visiion 200 Implanter Varian 3290 Sincerely Stephen Howe SDI Semiconductor Instruments Napoli 80123 Italy Office: (Naples) Italy (39) 081 575 0506 Office: (Avezzano) Italy (39) 0863 50 90 50 Mobile: Italy (39) 335 710 7756 Fax: Italy (39) 066 051 3344 showe at fabsurplus.com Skype: Stephencshowe http://www.fabsurplus.com Michael Fortune SDI Semiconductor Instruments Meath, Ireland Tel: Ireland (353) 4694 31951 Mobile: Ireland (353) 879150198 michael.fortune at fabsurplus.com Oliver Dunne SDI Semiconductor Instruments Co. Meath, Ireland Tel: Ireland (353) 4694 38804 Mobile: Ireland (353) 872 985 561 Fax: Ireland (353) 4694 86893 ollie.dunne at fabsurplus.com Skype: sdiireland Mike Murehead SDI Semiconductor Instruments Georgetown, TX 78628 Tel: 512-635-8027 Fax: 801-217-6104 mike at fabsurplus.com Skype: sditexas Randall Copeland SDI Semiconductor Instruments Beaverton, Oregon Tel: (503) 523-7027 Fax: (801) 217-6104 support at fabsurplus.com Jerry Weathers SDI Semiconductor Instruments P.O. Box 1131 Liberty Hill - TX 78642 - U.S.A. jerry at fabsurplus.com Phone: +1 512 695 3312 Fax: +1 512 515 5990 Vito Vigliotti via R. Galdieri, 6 Napoli - 80123 - Italy VAT ID / PI: 03944861214 vito at fabsurplus.com Phone: +39 331 576 3012 Fax: +39 066 051 33 44 Important Notice: This message is intended for the attention of the person or organization to which it has been addressed. It may contain information that is confidential, proprietary and/or exempt from disclosure by law. If you have received this message in error please be aware that the sender does not waive any confidentiality, ownership rights or privilege applicable to it. You are therefore strictly prohibited to disseminate, distribute or copy this message in any way. This message may be considered an advertisement or solicitation under U.S.law. If you would like to opt-out of receiving future commercial e-mail marketing messages from the sender, please send a message to the following e-mail address with the word "REMOVE" in the subject line: equipment at fabsurplus.com -------------- next part -------------- A non-text attachment was scrubbed... Name: Fabsurplus_Sales_Nov_07.xls Type: application/octet-stream Size: 532992 bytes Desc: not available URL: From mtang at stanford.edu Thu Nov 1 17:41:34 2007 From: mtang at stanford.edu (Mary Tang) Date: Thu, 01 Nov 2007 17:41:34 -0700 Subject: Lead Sulfide Message-ID: <472A723E.9040603@stanford.edu> Hi all -- Rick Clayton is with a company that will be working with Jim Kruger to try to process lead sulfide. As I understand the scope: 1. They propose to spin coat their lead sulfide nanoparticles in our utility room, using the solvent hood there. The chemicals consist of lead sulfide particulate which is suspended in a variety of solvents, as indicated on their original SpecMat request. They plan to either use the laurell coater there or they may acquire another -- and will allow other labmembers to use if this is the case. I think that with the possible exception of chloroform, the solvents are fine. Even chloroform would be OK, with limited use. 2. They plan to etch lead sulfide in the MRC. They would like to etch in the pquest using CHF4/H2 plasma, but would be satisfied with Ar sputtering in the MRC. They plan to etch a number of wafers with lead sulfide thicknesses on the order of 400 nm. Jim proposes to either cover exposed areas of the MRC with a high temperature inert plastic (such mylar) or acquire dedicated tooling which would be removed with each use. Lead sulfide has very low vapor pressure and is insoluble in water. The would like to also do some additional processing (involving lithography) but want to limit the scope of this request to these two steps. Rick Clayton has joined the lab and would like to start working with Jim this month. He is waiting for our approval. What do you all say? Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From i.am.not.kevin.osullivan at gmail.com Thu Nov 1 18:26:50 2007 From: i.am.not.kevin.osullivan at gmail.com (Kevin O'Sullivan) Date: Thu, 1 Nov 2007 18:26:50 -0700 Subject: PI-2525 Message-ID: <7995e0770711011826l488336ai93eabdf35d7dd29c@mail.gmail.com> I am looking check whether a particular polyimide, PI-2525, produced by HD Microsystems is currently an approved material for use in SNF. From the websites all I could find was that polyimides in general were ok, but there was no information was given on specifically which were ok. If PI-2525 is not already approved for use, I may or may not attempt to get it approved depending on timing issues. Also if you could direct me to a list of approved polyimides, that would be greatly helpful. Thanks, Kevin O'Sullivan coral login: kosok -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Thu Nov 1 18:28:50 2007 From: mtang at stanford.edu (Mary Tang) Date: Thu, 01 Nov 2007 18:28:50 -0700 Subject: PI-2525 In-Reply-To: <7995e0770711011826l488336ai93eabdf35d7dd29c@mail.gmail.com> References: <7995e0770711011826l488336ai93eabdf35d7dd29c@mail.gmail.com> Message-ID: <472A7D52.6090501@stanford.edu> Hi Kevin -- I am not sure if this is officially on an approved list. Polyimides are OK in general, but the difference is primarily in the solvents used. If you have an MSDS describing the major components, this would be all we would need, unless there are any other unusual properties of this polyimide. Mary Kevin O'Sullivan wrote: > I am looking check whether a particular polyimide, PI-2525, produced > by HD Microsystems is currently an approved material for use in SNF. > From the websites all I could find was that polyimides in general were > ok, but there was no information was given on specifically which were > ok. If PI-2525 is not already approved for use, I may or may not > attempt to get it approved depending on timing issues. Also if you > could direct me to a list of approved polyimides, that would be > greatly helpful. > > Thanks, > > Kevin O'Sullivan > coral login: kosok -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mihuhou at stanford.edu Thu Nov 1 21:26:23 2007 From: mihuhou at stanford.edu (Ying Chen) Date: Thu, 1 Nov 2007 20:26:23 -0800 Subject: Polyethylene Glycol (PEG). Message-ID: <00e501c81d08$88af8fd0$0100000a@ZHUBAOBAO> Dear Sir or Madam, I would like to submit a request to use polyethylene glycol (PEG) 8000 in Headway2 and solvent bench. My contact information: Name: Ying Chen Coral login: mihuhou Phone number: (650) 725-0417 (office), (650)497-6133 (home) Email address: mihuhou at stanford.edu My PI: Yoshio Nishi The chemical or material: Common name: Polyethylene Glycol (PEG) Tradename: Fisher Chemical CAS numbers: 25322-68-3 MSDS: Please see the attachment. Storage Group Identifier: G (No special precautions indicated. Store at room temperature. ) Main Hazard Class: Not regulated as a hazardous material (US DOT) Vendor/manufacturer info: Manufacturer name: Fisher Scientific Address: 1 Reagent Lane, Fair Lawn, NJ 07410 For information, call: 201-796-7100 Emergency Number: 201-796-7100 For CHEMTREC assistance, call: 800-424-9300 For International CHEMTREC assistance, call: 703-527-3887 URL: www.fishersci.com Reason for request: I plan to use a polyethylene glycol (PEG) and water mixture to disperse the polystyrene submicron spheres in the hope that the spin coated spheres would be more evenly distrubuted instead of clustering together. Process Flow: (1) Outside of SNF: The Polyethylene glycol (PEG) is mixed in different ratios with water (with the polystyrene submicron spheres already inside) to achieve different viscosities. (2) Outside of SNF: The mixture is ultrasonically agitated to disperse the spheres. (3) In SNF: The agitated mixture is spin coated on a Si wafer in headway2. (4) In SNF: The coated wafer is dried on the hot plates on the headway2 bench. Amount and form: I can bring in either PEG powder or PEG/water mixture depending on which one is more welcome by SpecMat. If in powder form, it should be no more than 1g. If in water mixture form, a few mls of it would most possibly be needed. Storage: I won't store the PEG in SNF. Disposal: Since PEG is not considered hazardous by US DOT, the most concern is about the polystyrene submicron spheres. There have been personnels in SNF using this kind of spheres, e.g., nanoimprint people and a student Jason Parker. I will dispose the material according to their processes. Please Let me know if you need any more information! Thank you! Regards, Ying Chen -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: PEG-MSDS.pdf Type: application/pdf Size: 79973 bytes Desc: not available URL: From newsletter at nilt.com Fri Nov 2 01:40:07 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 2 Nov 2007 09:40:07 +0100 Subject: =?windows-1252?Q?NILT_nanonews_Nov._2:__Nanotube_pressure_sensor,_tomorrow's_nanofactories,_new_magnetic_separation_technique?= Message-ID: <59b741132e3f8b3f6fd80434001d6539@nilt.com> An HTML attachment was scrubbed... URL: From nppatil at stanford.edu Fri Nov 2 16:32:09 2007 From: nppatil at stanford.edu (Nishant Patil) Date: Fri, 2 Nov 2007 16:32:09 -0700 Subject: Polyethylene Imine Message-ID: <20071102233008.0BEF54F800@smtp1.stanford.edu> Hi, I would like to use polyethylene imine (PEI - 50% w/v in water) in the SNF. I will coat it at the headway. I have attached the MSDS for PEI. Thanks, Nishant -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: PEI_doping.pdf Type: application/pdf Size: 46336 bytes Desc: not available URL: From mtang at stanford.edu Mon Nov 5 09:32:28 2007 From: mtang at stanford.edu (Mary Tang) Date: Mon, 05 Nov 2007 09:32:28 -0800 Subject: ordering more protek In-Reply-To: <20071105074147.0cpef3iy8os0ws4w@webmail.stanford.edu> References: <20071105074147.0cpef3iy8os0ws4w@webmail.stanford.edu> Message-ID: <472F53AC.3040709@stanford.edu> Hi Dave -- Protek B plus associated primer and remover chemicals are approved for use in the lab at limited locations. (Spin coating at headway only, etching at wbgeneral, wbgen2, etc.) We do not currently supply Protek B -- primarily because there are few users and it has a limited shelf life (6 months) -- not enough demand to justify the cost. You are welcome to order material and use it in the lab. Brewer Science has been generous and has sent samples to the previous two requesters of this material (Harold Ackler and Debbie Gunning), so I would suggest you contact Brewer directly. They will ask a lot of questions about your specific application and require that you supply data on the results in exchange for a sample. Yves -- you've spoken with them before, correct? So you have their contact info? Let me know if you don't -- I think I have it somewhere.... By the way, please still provide an outline of your process flow to SpecMat. This will be helpful to us to try to establish some sort of baseline process flow to facilitate future requests. Thanks! Mary David Paul Bernstein wrote: > Hi Mary, > > We're interested in using a chemical called protek for our process. > There's currently two bottles but another user, Debbie Gunning, needs > a fair amount of it as well. Would it be possible to order more? We'd > be happy to pay for it, but it might be faster to go through snf since > you already have it than it would to order it through SLAC. Thanks! > > -Dave Bernstein -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mahnaz at stanford.edu Mon Nov 5 10:27:10 2007 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Mon, 05 Nov 2007 10:27:10 -0800 Subject: yellow label request References: <4728DCEB.60703@alcestech.com> Message-ID: <472F607E.6020004@stanford.edu> Hello Richard , This is to inform you that your request has been approved and I have checked with Nancy as well. When using the bench with your chemical please label it and make note that has surfactants. mahnaz Richard Yeh wrote: > Hi Mahnaz, > > How are you doing? Thanks for training me on the ASML last week. > I would like to request a yellow label so I can bring in an Aluminum > wet etchant (1 gal bottle) into SNF. The etchant is chemically > similar to the Cyantek AL-11 etchant used at wbmetal with the > exception that it has surfactants. The MSDS is attached and the key > chemicals are phosphoric acid, acetic acid and nitric acid. > > Thanks for your help. > > Richard > yeh at snf > From edmyers at stanford.edu Mon Nov 5 14:35:50 2007 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 05 Nov 2007 14:35:50 -0800 Subject: Tweezer Cleaning Process Generates Lots of Particles In-Reply-To: References: Message-ID: <6.2.5.6.2.20071105142707.03d9d280@stanford.edu> I've looked over a number of web sites related to chemical resistance of plastics. Jim is right, Delrin does not fit with our cleaning procedure. It has low chemical resistance to most acids, but is fine with our solvents. Looking for an alternative, the leading candidates come from the fluorocarbon plastics such as CTFE. It so happens we stock a CTFE tweezers. 567 Fluorocarbon (CTFE) for use in Chemical Processing of semiconductors. Withstands Hydrofluoric and other acid,. Resists radiation. 6-3/8"x15/32" body tapering down to .009" by 3/32" at Tweezer Tips Extra long with line-up pin guide. [] We should review the cost of these tweezers and decide if we want to stock CTFE exclusively or make not of appropriate cleans and applications for the different wafer types. At the very least we need to stop the mentioned cleaning procedure on the Delrin version. Regards, Ed At 02:50 PM 9/10/2007, Jim McVittie wrote: >Hi, > >I have a problem with our recommended cleaning procedure for Delrin >tweezers. It attacks the Delrin surface and causes the tweezers to leave >particles on the wafers. Today, I was helping a student do a TEL plasma >oxidation. When he loaded his wafer, we spotted particles. We traced the >particles to his Delrin tweezers. On quizzing him, I found that he had >followed the cleaning procedure on our website. > >Here is the procedure in question: >Delrin (plastic) Tweezers: > >1. Remove trace metals for 5 min in unheated 5:1:1 H2O:H2O2:HCl. > >2. Rinse for 4 min in DI water. > >3. Remove organics for 5 min in unheated 5:1:1 H2O:H2O2 :NH4OH > >4. Rinse for 4 min in DI water. > >5. Blow dry using N2 gun at the wetbench. > >6. Place tweezers in a clean storage box with the tips oriented toward the >end of the box marked TIPS. This will insure that comtaminates from gloved >hands and fingers will not transfer to the ends of the tweezers which will >be in contact with the wafers. > >There are a number of problems with this clean. For one a standard clean >should always start with an organic clean step to expose the metal >contamination so the following HCl step can remove the metal. Another >problem is that it dose not address the issue that Delrin is an organic >and is attacked by the H2O2 and most acids. Although it can stand up to >bases, such as NaOH and KOH, it does not hold up well to NH4OH. > >Since Delvin is compatible with most solvents, I suggest we limit our >Delrin cleaning to solvent rinses. In addition, I suggest we look for >plastic tweezers which are compatible with some of our standard acid, such >as HF and HCl. > >The chemical compatibility of Delvin can be found at: >http://www.ronningen-petter.com/images/Literature/Chemical-Compatability-MCF-Filter-Diagram.pdf > > > Jim >-------------------------------------------------------------- >Jim McVittie, Ph.D. Senior Research Scientist >Allen Center for Integrated Systems Electrical Engineering >Stanford University jmcvittie at stanford.edu >Rm. 336, 330 Serra Mall Fax: (650) 723-4659 >Stanford, CA 94305-4075 Tel: (650) 725-3640 -------------- next part -------------- A non-text attachment was scrubbed... Name: 1894c92.jpg Type: image/jpeg Size: 7328 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: PEEK Chemical_Resistance.pdf Type: application/pdf Size: 54229 bytes Desc: not available URL: From edmyers at stanford.edu Mon Nov 5 14:40:28 2007 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 05 Nov 2007 14:40:28 -0800 Subject: Tweezer Cleaning Process Generates Lots of Particles In-Reply-To: <6.2.5.6.2.20071105142707.03d9d280@stanford.edu> References: <6.2.5.6.2.20071105142707.03d9d280@stanford.edu> Message-ID: <6.2.5.6.2.20071105143956.03d9cff0@stanford.edu> Whoops, here is the CTFE resistance. At 02:35 PM 11/5/2007, Ed Myers wrote: >I've looked over a number of web sites related to chemical >resistance of plastics. Jim is right, Delrin does not fit with our >cleaning procedure. It has low chemical resistance to most acids, >but is fine with our solvents. Looking for an alternative, the >leading candidates come from the fluorocarbon plastics such as >CTFE. It so happens we stock a CTFE tweezers. > >567 Fluorocarbon (CTFE) for use in Chemical Processing of >semiconductors. Withstands Hydrofluoric and other acid,. >Resists radiation. 6-3/8"x15/32" body >tapering down to .009" by 3/32" at Tweezer Tips Extra long with >line-up pin guide. > >We should review the cost of these tweezers and decide if we want to >stock CTFE exclusively or make not of appropriate cleans and >applications for the different wafer types. At the very least we >need to stop the mentioned cleaning procedure on the Delrin version. > >Regards, >Ed > > > >At 02:50 PM 9/10/2007, Jim McVittie wrote: >>Hi, >> >>I have a problem with our recommended cleaning procedure for Delrin >>tweezers. It attacks the Delrin surface and causes the tweezers to leave >>particles on the wafers. Today, I was helping a student do a TEL plasma >>oxidation. When he loaded his wafer, we spotted particles. We traced the >>particles to his Delrin tweezers. On quizzing him, I found that he had >>followed the cleaning procedure on our website. >> >>Here is the procedure in question: >>Delrin (plastic) Tweezers: >> >>1. Remove trace metals for 5 min in unheated 5:1:1 H2O:H2O2:HCl. >> >>2. Rinse for 4 min in DI water. >> >>3. Remove organics for 5 min in unheated 5:1:1 H2O:H2O2 :NH4OH >> >>4. Rinse for 4 min in DI water. >> >>5. Blow dry using N2 gun at the wetbench. >> >>6. Place tweezers in a clean storage box with the tips oriented toward the >>end of the box marked TIPS. This will insure that comtaminates from gloved >>hands and fingers will not transfer to the ends of the tweezers which will >>be in contact with the wafers. >> >>There are a number of problems with this clean. For one a standard clean >>should always start with an organic clean step to expose the metal >>contamination so the following HCl step can remove the metal. Another >>problem is that it dose not address the issue that Delrin is an organic >>and is attacked by the H2O2 and most acids. Although it can stand up to >>bases, such as NaOH and KOH, it does not hold up well to NH4OH. >> >>Since Delvin is compatible with most solvents, I suggest we limit our >>Delrin cleaning to solvent rinses. In addition, I suggest we look for >>plastic tweezers which are compatible with some of our standard acid, such >>as HF and HCl. >> >>The chemical compatibility of Delvin can be found at: >>http://www.ronningen-petter.com/images/Literature/Chemical-Compatability-MCF-Filter-Diagram.pdf >> >> >> Jim >>-------------------------------------------------------------- >>Jim McVittie, Ph.D. Senior Research Scientist >>Allen Center for Integrated Systems Electrical Engineering >>Stanford University jmcvittie at stanford.edu >>Rm. 336, 330 Serra Mall Fax: (650) 723-4659 >>Stanford, CA 94305-4075 Tel: (650) 725-3640 -------------- next part -------------- A non-text attachment was scrubbed... Name: CTFE Chemical Resistance.pdf Type: application/pdf Size: 45583 bytes Desc: not available URL: From mtang at stanford.edu Mon Nov 5 15:04:03 2007 From: mtang at stanford.edu (Mary Tang) Date: Mon, 05 Nov 2007 15:04:03 -0800 Subject: Tweezer Cleaning Process Generates Lots of Particles In-Reply-To: <6.2.5.6.2.20071105143956.03d9cff0@stanford.edu> References: <6.2.5.6.2.20071105142707.03d9d280@stanford.edu> <6.2.5.6.2.20071105143956.03d9cff0@stanford.edu> Message-ID: <472FA163.9010903@stanford.edu> Yes, we ought to get rid of the Delrin tweezer clean. I understand that we use Delrin because they are inexpensive. What is the cost of the CTFE tweezers? Also, I've heard some people complain that teflon tweezers are "slippery". It would be helpful to get a few samples. Mary Ed Myers wrote: > Whoops, here is the CTFE resistance. > > At 02:35 PM 11/5/2007, Ed Myers wrote: >> I've looked over a number of web sites related to chemical resistance >> of plastics. Jim is right, Delrin does not fit with our cleaning >> procedure. It has low chemical resistance to most acids, but is fine >> with our solvents. Looking for an alternative, the leading >> candidates come from the fluorocarbon plastics such as CTFE. It so >> happens we stock a CTFE tweezers. >> >> 567 Fluorocarbon (CTFE) for use in Chemical Processing of >> semiconductors. Withstands Hydrofluoric and other acid,. >> Resists radiation. 6-3/8"x15/32" body >> tapering down to .009" by 3/32" at Tweezer Tips Extra long with >> line-up pin guide. >> >> We should review the cost of these tweezers and decide if we want to >> stock CTFE exclusively or make not of appropriate cleans and >> applications for the different wafer types. At the very least we >> need to stop the mentioned cleaning procedure on the Delrin version. >> >> Regards, >> Ed >> >> >> >> At 02:50 PM 9/10/2007, Jim McVittie wrote: >>> Hi, >>> >>> I have a problem with our recommended cleaning procedure for Delrin >>> tweezers. It attacks the Delrin surface and causes the tweezers to >>> leave >>> particles on the wafers. Today, I was helping a student do a TEL >>> plasma >>> oxidation. When he loaded his wafer, we spotted particles. We traced >>> the >>> particles to his Delrin tweezers. On quizzing him, I found that he had >>> followed the cleaning procedure on our website. >>> >>> Here is the procedure in question: >>> Delrin (plastic) Tweezers: >>> >>> 1. Remove trace metals for 5 min in unheated 5:1:1 H2O:H2O2:HCl. >>> >>> 2. Rinse for 4 min in DI water. >>> >>> 3. Remove organics for 5 min in unheated 5:1:1 H2O:H2O2 :NH4OH >>> >>> 4. Rinse for 4 min in DI water. >>> >>> 5. Blow dry using N2 gun at the wetbench. >>> >>> 6. Place tweezers in a clean storage box with the tips oriented >>> toward the >>> end of the box marked TIPS. This will insure that comtaminates from >>> gloved >>> hands and fingers will not transfer to the ends of the tweezers >>> which will >>> be in contact with the wafers. >>> >>> There are a number of problems with this clean. For one a standard >>> clean >>> should always start with an organic clean step to expose the metal >>> contamination so the following HCl step can remove the metal. Another >>> problem is that it dose not address the issue that Delrin is an organic >>> and is attacked by the H2O2 and most acids. Although it can stand up to >>> bases, such as NaOH and KOH, it does not hold up well to NH4OH. >>> >>> Since Delvin is compatible with most solvents, I suggest we limit our >>> Delrin cleaning to solvent rinses. In addition, I suggest we look for >>> plastic tweezers which are compatible with some of our standard >>> acid, such >>> as HF and HCl. >>> >>> The chemical compatibility of Delvin can be found at: >>> http://www.ronningen-petter.com/images/Literature/Chemical-Compatability-MCF-Filter-Diagram.pdf >>> >>> >>> >>> Jim >>> -------------------------------------------------------------- >>> Jim McVittie, Ph.D. Senior Research Scientist >>> Allen Center for Integrated Systems Electrical Engineering >>> Stanford University jmcvittie at stanford.edu >>> Rm. 336, 330 Serra Mall Fax: (650) 723-4659 >>> Stanford, CA 94305-4075 Tel: (650) 725-3640 -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Tue Nov 6 11:13:48 2007 From: mtang at stanford.edu (Mary Tang) Date: Tue, 06 Nov 2007 11:13:48 -0800 Subject: [Fwd: Re: PI-2525] Message-ID: <4730BCEC.3020103@stanford.edu> Hi all -- This should be fine to use, as the solvent is NMP. However, we should make sure use is restricted, like other polyimides, as follows: 1. Spin coating only on headway2. Fresh polyimide can be cleaned up with NMP or excess acetone. Spin chuck and parts should be cleaned up as soon as possible after coating. Personal or dedicated wafer handling tools must be used (do NOT used the general, shared litho cassettes.) 2. Blue M oven can be used for curing the resin. Do NOT use the singe or YES ovens. Do not use the hot plates for curing resins at temperatures above 200C. 3. Only cured polyimide is allowed in tools in the white area of the lab. A specmat request must be submitted to process wafers with cured polyimide in tools other than gold-contaminated equipment. Does that just about cover it all? Mahnaz, what do you think? (It would be good to post an established set of rules for polyimides.) Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- An embedded message was scrubbed... From: "Kevin O'Sullivan" Subject: Re: PI-2525 Date: Tue, 6 Nov 2007 09:44:27 -0800 Size: 30116 URL: From nlatta at stanford.edu Tue Nov 6 15:06:35 2007 From: nlatta at stanford.edu (Nancy Latta) Date: Tue, 06 Nov 2007 15:06:35 -0800 Subject: Tweezer Cleaning Process Generates Lots of Particles In-Reply-To: <472FA163.9010903@stanford.edu> References: <6.2.5.6.2.20071105142707.03d9d280@stanford.edu> <6.2.5.6.2.20071105143956.03d9cff0@stanford.edu> <472FA163.9010903@stanford.edu> Message-ID: <4730F37B.2000600@stanford.edu> Hi All, I am all over getting tweezers that are compatible with both the cleaning procedure and ultra-clean cleanliness level, but did anyone mention that the tweezers used in the original complaint were over a year old? A bit disturbing for two reasons- they should probably been throw out just for being old and certainly should have recleaned in a years time..... Mary Tang wrote: > Yes, we ought to get rid of the Delrin tweezer clean. I understand > that we use Delrin because they are inexpensive. What is the cost of > the CTFE tweezers? Also, I've heard some people complain that teflon > tweezers are "slippery". It would be helpful to get a few samples. > > Mary > > Ed Myers wrote: > >> Whoops, here is the CTFE resistance. >> >> At 02:35 PM 11/5/2007, Ed Myers wrote: >> >>> I've looked over a number of web sites related to chemical >>> resistance of plastics. Jim is right, Delrin does not fit with our >>> cleaning procedure. It has low chemical resistance to most acids, >>> but is fine with our solvents. Looking for an alternative, the >>> leading candidates come from the fluorocarbon plastics such as >>> CTFE. It so happens we stock a CTFE tweezers. >>> >>> 567 Fluorocarbon (CTFE) for use in Chemical Processing of >>> semiconductors. Withstands Hydrofluoric and other acid,. >>> Resists radiation. 6-3/8"x15/32" body >>> tapering down to .009" by 3/32" at Tweezer Tips Extra long with >>> line-up pin guide. >>> >>> We should review the cost of these tweezers and decide if we want to >>> stock CTFE exclusively or make not of appropriate cleans and >>> applications for the different wafer types. At the very least we >>> need to stop the mentioned cleaning procedure on the Delrin version. >>> >>> Regards, >>> Ed >>> >>> >>> >>> At 02:50 PM 9/10/2007, Jim McVittie wrote: >>> >>>> Hi, >>>> >>>> I have a problem with our recommended cleaning procedure for Delrin >>>> tweezers. It attacks the Delrin surface and causes the tweezers to >>>> leave >>>> particles on the wafers. Today, I was helping a student do a TEL >>>> plasma >>>> oxidation. When he loaded his wafer, we spotted particles. We >>>> traced the >>>> particles to his Delrin tweezers. On quizzing him, I found that he had >>>> followed the cleaning procedure on our website. >>>> >>>> Here is the procedure in question: >>>> Delrin (plastic) Tweezers: >>>> >>>> 1. Remove trace metals for 5 min in unheated 5:1:1 H2O:H2O2:HCl. >>>> >>>> 2. Rinse for 4 min in DI water. >>>> >>>> 3. Remove organics for 5 min in unheated 5:1:1 H2O:H2O2 :NH4OH >>>> >>>> 4. Rinse for 4 min in DI water. >>>> >>>> 5. Blow dry using N2 gun at the wetbench. >>>> >>>> 6. Place tweezers in a clean storage box with the tips oriented >>>> toward the >>>> end of the box marked TIPS. This will insure that comtaminates from >>>> gloved >>>> hands and fingers will not transfer to the ends of the tweezers >>>> which will >>>> be in contact with the wafers. >>>> >>>> There are a number of problems with this clean. For one a standard >>>> clean >>>> should always start with an organic clean step to expose the metal >>>> contamination so the following HCl step can remove the metal. Another >>>> problem is that it dose not address the issue that Delrin is an >>>> organic >>>> and is attacked by the H2O2 and most acids. Although it can stand >>>> up to >>>> bases, such as NaOH and KOH, it does not hold up well to NH4OH. >>>> >>>> Since Delvin is compatible with most solvents, I suggest we limit our >>>> Delrin cleaning to solvent rinses. In addition, I suggest we look for >>>> plastic tweezers which are compatible with some of our standard >>>> acid, such >>>> as HF and HCl. >>>> >>>> The chemical compatibility of Delvin can be found at: >>>> http://www.ronningen-petter.com/images/Literature/Chemical-Compatability-MCF-Filter-Diagram.pdf >>>> >>>> >>>> >>>> Jim >>>> -------------------------------------------------------------- >>>> Jim McVittie, Ph.D. Senior Research Scientist >>>> Allen Center for Integrated Systems Electrical Engineering >>>> Stanford University jmcvittie at stanford.edu >>>> Rm. 336, 330 Serra Mall Fax: (650) 723-4659 >>>> Stanford, CA 94305-4075 Tel: (650) 725-3640 >>> > > From edmyers at stanford.edu Wed Nov 7 11:26:29 2007 From: edmyers at stanford.edu (Ed Myers) Date: Wed, 07 Nov 2007 11:26:29 -0800 Subject: Initial discussion on working with SNF for processing PbS In-Reply-To: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exc h015.msoutlookonline.net> References: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> Message-ID: <6.2.5.6.2.20071107105618.03d7cdd8@stanford.edu> Rick, Sorry for the delay in providing you with the final decision on your request. Our aim is to support all of the processing needs of our lab members, however some are more challenging than others. Unfortunately, yours is a challenging one. I believe we are OK with the spin casting, outside of using Chloroform. The other listed solvents we can devise a protocol for safe handling of the materials. The biggest concern is the etching of PbS. Our MRC system is a diffusion pumped system and we have to be conscience of what elements that can be picked up in the oil. This is a safety issue for staff who will be servicing the tool. The protocol for etching of the PbS needs to be established. This will include how to do routine service the tool and how to minimize any Pb deposition on the tool during processing. This will take a longer to resolve and require help from whoever is doing your processing. The proposed process outline is too vague to accept in full. It will be important to work with the SNF staff as you continue to refine your process. For example lead has a tendency to volatilize, so thermal processing will need to be addressed, including your encapsulation step. Regards, Ed Myers At 12:25 PM 10/12/2007, Rick Clayton wrote: >Hello; >My name is Rick Clayton, and I am VP of Advanced Materials for >InVisage Technologies, an early stage (still stealth mode) >technology company working on advanced electronics. >We wish to do work within the SNF, and I want to start the process >of material approval prior to full engagement. > >Many of the detailed questions below are more applicable once we are >more familiar with your facility, but I will provide a top level >description here as a first step in the process of getting our >material approved. > >Core material: PbS >associated other materials: Thiols (Mercaptans): Ethane Thiol, >Ethane DiThiol, Benzene Thiol (may include other thiols in the future) >process chemicals: toluene, chloroform, acetonitrile, acetone, hexane > >Incoming material: >The PbS would be in either powder or solution (toluene, chloroform, >hexane, or other non-polar solvent). >Typically we would use about 50-100 ml of our material per day. > >a rough process flow: >Our device involves spinning films of PbS onto a substrate (usually >a Si wafer), doing some solution processing of the wafer with the >thiols, depositing masking materials, etching the PbS film, and then >depositing encapsulation materials. Once the wafer is finished we >may either die saw or test at wafer level. >We will be developing solvent systems and spin profiles to optimize our films. >We will be developing masking and etch processes >We will be developing encapsulation processes > >---------------------------------------------- >Please provide as much information as you can about your chemical or >material. It may very well be the first time anyone on the SpecMat >committee has heard of this chemical/material, so it will be your >responsibility to educate us. We also have a large archive of >chemicals and materials that have been approved, so we may also be >able to help you in selecting a chemical or process > > * Your contact information: Name, Coral login, phone number, > email address and who you work for (your PI or company.) > * The chemical or material. Please provide all common names, > trade names, and CAS numbers where appropriate. Include an MSDS, if > available; or provide the reason, if not. Make sure to include > information for any new secondary chemicals (such as a developer > for a new resist). Read the MSDSs as well as the > Stanford > Chemical Storage Groups and the > Stanford > Chemical Safety Data Base sections on this website to determine the > Storage Group > Identifier and > Main Hazard > Class of your chemical/material. > * Vendor/manufacturer info: address and phone number, website URL. > * Reason for request: Please give serious thought to this. If > you have any process information (application notes from the > vendor, protocol from another lab, experimental methods section of > an article), please include it, preferably as attachments. Ask > yourself these questions: Is this the latest procedure? Are there > newer/safer alternatives that will also work for my project? Will > any of the current SNF approved chemicals and materials work for me? > * Process Flow: Please provide a detailed process flow > description on how and where you proposed to use this chemical. > This should include all > Lab equipment > to be used for processing your wafers once your new chemical or > material has been used (even if your new material is a film that is > removed, it may still pose potential contamination concerns.) Make > sure to include wet benches. Please note that f the > chemical/material is to be used in any the > "clean" > equipment, purity specifications will be needed. This is most > important for chemicals/material that are not normally used for > VLSI device fabrication. To be allowed into a > "clean" > tool, the material should MOS grade or better. > * Amount and form. How much will you bring in? Is it solid, > powder or liquid? > (Note: as a general rule, > powders are not > permitted in the cleanroom.) Do you need to mix it to use it? > * Storage: Will you be storing your chemical/material at SNF? If > so, please note any potential reactivities (this should be on the > MSDS). Storage > groups A,B,D and L are stored in the yellow solvent cabinet in the > furnace support area, while > storage groups > C, E, F and G are stored on top of one of the Pass-through Carts. > Ensure your chemical container or material is > properly > labeled. If there is no available room, it must be stored by in the > bulk storage area. You will then need to obtain it from receiving > area personnel each time you want to use it and return it to them > when you are finished using it (or each time you leave the lab). > Note that there is no storage of chemicals/materials in the > processing lab or at any wet bench. > * DIsposal: How will you dispose of any waste or excess chemical > or material? In your discussions with experts and vendors, try to > determine the best way to dispose of your spent chemicals and > by-products. Please refer to the > SNF Labmembers > Safety Manual for the different methods of waste disposal that are > available in the lab. >---------------------------------------------- > >Please get in touch about next steps. > >Thanks, >Rick >------------------------------------- >Rick Clayton >VP Advanced Materials >InVisage Technologies >mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, M5G 1L7 >Office: 416 673 6520 >mobile: 613 291 6578 >email: rick.clayton at invisageinc.com >This email contains information that is confidential. The >information is intended to be for the recipient named in the body of >the message. If you are not the intended recipient please destroy >this email and be aware that any disclosure, copying, distribution >or use of the contents of this information is prohibited. If you >have received this email in error, kindly notify the sender of this >email immediately. > > > From rick.clayton at invisageinc.com Wed Nov 7 11:35:14 2007 From: rick.clayton at invisageinc.com (Rick Clayton) Date: Wed, 7 Nov 2007 11:35:14 -0800 Subject: Initial discussion on working with SNF for processing PbS In-Reply-To: <6.2.5.6.2.20071107105618.03d7cdd8@stanford.edu> References: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> <6.2.5.6.2.20071107105618.03d7cdd8@stanford.edu> Message-ID: <0B282E3770D15C45AC895C3E63A2A0D83B33821620@EXVMBX015-2.exch015.msoutlookonline.net> Thanks Ed; I understand. I'll submit a refined and specific flow today for a key subset of activities. With whom should I work to come up with the maintenance plan as quickly as possible? Rick ------------------------------------- Rick Clayton VP Advanced Materials InVisage Technologies mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, M5G 1L7 Office: 416 673 6520 mobile: 613 291 6578 email: rick.clayton at invisageinc.com This email contains information that is confidential. The information is intended to be for the recipient named in the body of the message. If you are not the intended recipient please destroy this email and be aware that any disclosure, copying, distribution or use of the contents of this information is prohibited. If you have received this email in error, kindly notify the sender of this email immediately. -----Original Message----- From: Ed Myers [mailto:edmyers at stanford.edu] Sent: Wednesday, November 07, 2007 2:26 PM To: Rick Clayton; SpecMat at snf.stanford.edu Cc: Jess Lee; jimkruger at snf.stanford.edu; cbaxter at snf.stanford.edu Subject: Re: Initial discussion on working with SNF for processing PbS Rick, Sorry for the delay in providing you with the final decision on your request. Our aim is to support all of the processing needs of our lab members, however some are more challenging than others. Unfortunately, yours is a challenging one. I believe we are OK with the spin casting, outside of using Chloroform. The other listed solvents we can devise a protocol for safe handling of the materials. The biggest concern is the etching of PbS. Our MRC system is a diffusion pumped system and we have to be conscience of what elements that can be picked up in the oil. This is a safety issue for staff who will be servicing the tool. The protocol for etching of the PbS needs to be established. This will include how to do routine service the tool and how to minimize any Pb deposition on the tool during processing. This will take a longer to resolve and require help from whoever is doing your processing. The proposed process outline is too vague to accept in full. It will be important to work with the SNF staff as you continue to refine your process. For example lead has a tendency to volatilize, so thermal processing will need to be addressed, including your encapsulation step. Regards, Ed Myers At 12:25 PM 10/12/2007, Rick Clayton wrote: >Hello; >My name is Rick Clayton, and I am VP of Advanced Materials for InVisage >Technologies, an early stage (still stealth mode) technology company >working on advanced electronics. >We wish to do work within the SNF, and I want to start the process of >material approval prior to full engagement. > >Many of the detailed questions below are more applicable once we are >more familiar with your facility, but I will provide a top level >description here as a first step in the process of getting our material >approved. > >Core material: PbS >associated other materials: Thiols (Mercaptans): Ethane Thiol, Ethane >DiThiol, Benzene Thiol (may include other thiols in the future) process >chemicals: toluene, chloroform, acetonitrile, acetone, hexane > >Incoming material: >The PbS would be in either powder or solution (toluene, chloroform, >hexane, or other non-polar solvent). >Typically we would use about 50-100 ml of our material per day. > >a rough process flow: >Our device involves spinning films of PbS onto a substrate (usually a >Si wafer), doing some solution processing of the wafer with the thiols, >depositing masking materials, etching the PbS film, and then depositing >encapsulation materials. Once the wafer is finished we may either die >saw or test at wafer level. >We will be developing solvent systems and spin profiles to optimize our films. >We will be developing masking and etch processes We will be developing >encapsulation processes > >---------------------------------------------- >Please provide as much information as you can about your chemical or >material. It may very well be the first time anyone on the SpecMat >committee has heard of this chemical/material, so it will be your >responsibility to educate us. We also have a large archive of chemicals >and materials that have been approved, so we may also be able to help >you in selecting a chemical or process > > * Your contact information: Name, Coral login, phone number, email >address and who you work for (your PI or company.) > * The chemical or material. Please provide all common names, trade >names, and CAS numbers where appropriate. Include an MSDS, if >available; or provide the reason, if not. Make sure to include >information for any new secondary chemicals (such as a developer for a >new resist). Read the MSDSs as well as the >Stanford > Chemical Storage Groups and the > Stanford > Chemical Safety Data Base sections on this website to determine the >Storage Group >Identifier and >Main Hazard >Class of your chemical/material. > * Vendor/manufacturer info: address and phone number, website URL. > * Reason for request: Please give serious thought to this. If you >have any process information (application notes from the vendor, >protocol from another lab, experimental methods section of an >article), please include it, preferably as attachments. Ask yourself >these questions: Is this the latest procedure? Are there newer/safer >alternatives that will also work for my project? Will any of the >current SNF approved chemicals and materials work for me? > * Process Flow: Please provide a detailed process flow description >on how and where you proposed to use this chemical. > This should include all > Lab equipment to >be used for processing your wafers once your new chemical or material >has been used (even if your new material is a film that is removed, it >may still pose potential contamination concerns.) Make sure to include >wet benches. Please note that f the chemical/material is to be used in >any the >"clean" > equipment, purity specifications will be needed. This is most >important for chemicals/material that are not normally used for VLSI >device fabrication. To be allowed into a >"clean" > tool, the material should MOS grade or better. > * Amount and form. How much will you bring in? Is it solid, >powder or liquid? > (Note: as a general rule, > powders are not >permitted in the cleanroom.) Do you need to mix it to use it? > * Storage: Will you be storing your chemical/material at SNF? If >so, please note any potential reactivities (this should be on the >MSDS). Storage > groups A,B,D and L are stored in the yellow solvent cabinet in the >furnace support area, while >storage groups C, >E, F and G are stored on top of one of the Pass-through Carts. > Ensure your chemical container or material is >properly > labeled. If there is no available room, it must be stored by in the >bulk storage area. You will then need to obtain it from receiving area >personnel each time you want to use it and return it to them when you >are finished using it (or each time you leave the lab). > Note that there is no storage of chemicals/materials in the >processing lab or at any wet bench. > * DIsposal: How will you dispose of any waste or excess chemical >or material? In your discussions with experts and vendors, try to >determine the best way to dispose of your spent chemicals and >by-products. Please refer to the >SNF Labmembers >Safety Manual for the different methods of waste disposal that are >available in the lab. >---------------------------------------------- > >Please get in touch about next steps. > >Thanks, >Rick >------------------------------------- >Rick Clayton >VP Advanced Materials >InVisage Technologies >mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, >M5G 1L7 >Office: 416 673 6520 >mobile: 613 291 6578 >email: >rick.clayton at invisageinc.com >This email contains information that is confidential. The information >is intended to be for the recipient named in the body of the message. >If you are not the intended recipient please destroy this email and be >aware that any disclosure, copying, distribution or use of the contents >of this information is prohibited. If you have received this email in >error, kindly notify the sender of this email immediately. > > > From rick.clayton at invisageinc.com Thu Nov 8 07:05:03 2007 From: rick.clayton at invisageinc.com (Rick Clayton) Date: Thu, 8 Nov 2007 07:05:03 -0800 Subject: Initial discussion on working with SNF for processing PbS In-Reply-To: <6.2.5.6.2.20071107105618.03d7cdd8@stanford.edu> References: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> <6.2.5.6.2.20071107105618.03d7cdd8@stanford.edu> Message-ID: <0B282E3770D15C45AC895C3E63A2A0D83B3382180B@EXVMBX015-2.exch015.msoutlookonline.net> Hi Ed; How does this sound as a starting point for a more detailed process flow? I will add the details you require once we get the basic sorted out. Work package 1: (I'm most interested in seeing how to advance this quickly) InVisage supplies pre-coated samples of our PbS film on oxidized silicon (starting point), fused silica with Au metal patterns, and pieces of processed Si wafers with TiN/Al plus process oxide top surface Jim cleaves the blank silicon wafers with PbS film to the sizes he wants in the dirty room fume hood. Jim trys various etch recipes in the MRC, using InVisage owned and managed glassware fixtures masking is done by placing pieces of Si on the surface of the samples as contact shadow masks use SNF surface profilometer and ellipsometer to determine the efficacy of the etch take etched electrical samples to InVisage labs for characterization. Work package 2 will involve etching samples as above, but which are encapsulated with a dielectric (TBD). We can go over those details next week. Currently we don't have an alternative identified to replace chloroform, so we will not be able to do spin processing at SNF. As for the MRC service etc., Jim is our point person there. I understand you and he are talking to determine approaches to cleaning and servicing. Rick ------------------------------------- Rick Clayton VP Advanced Materials InVisage Technologies mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, M5G 1L7 Office: 416 673 6520 mobile: 613 291 6578 email: rick.clayton at invisageinc.com This email contains information that is confidential. The information is intended to be for the recipient named in the body of the message. If you are not the intended recipient please destroy this email and be aware that any disclosure, copying, distribution or use of the contents of this information is prohibited. If you have received this email in error, kindly notify the sender of this email immediately. -----Original Message----- From: Ed Myers [mailto:edmyers at stanford.edu] Sent: Wednesday, November 07, 2007 2:26 PM To: Rick Clayton; SpecMat at snf.stanford.edu Cc: Jess Lee; jimkruger at snf.stanford.edu; cbaxter at snf.stanford.edu Subject: Re: Initial discussion on working with SNF for processing PbS Rick, Sorry for the delay in providing you with the final decision on your request. Our aim is to support all of the processing needs of our lab members, however some are more challenging than others. Unfortunately, yours is a challenging one. I believe we are OK with the spin casting, outside of using Chloroform. The other listed solvents we can devise a protocol for safe handling of the materials. The biggest concern is the etching of PbS. Our MRC system is a diffusion pumped system and we have to be conscience of what elements that can be picked up in the oil. This is a safety issue for staff who will be servicing the tool. The protocol for etching of the PbS needs to be established. This will include how to do routine service the tool and how to minimize any Pb deposition on the tool during processing. This will take a longer to resolve and require help from whoever is doing your processing. The proposed process outline is too vague to accept in full. It will be important to work with the SNF staff as you continue to refine your process. For example lead has a tendency to volatilize, so thermal processing will need to be addressed, including your encapsulation step. Regards, Ed Myers At 12:25 PM 10/12/2007, Rick Clayton wrote: >Hello; >My name is Rick Clayton, and I am VP of Advanced Materials for InVisage >Technologies, an early stage (still stealth mode) technology company >working on advanced electronics. >We wish to do work within the SNF, and I want to start the process of >material approval prior to full engagement. > >Many of the detailed questions below are more applicable once we are >more familiar with your facility, but I will provide a top level >description here as a first step in the process of getting our material >approved. > >Core material: PbS >associated other materials: Thiols (Mercaptans): Ethane Thiol, Ethane >DiThiol, Benzene Thiol (may include other thiols in the future) process >chemicals: toluene, chloroform, acetonitrile, acetone, hexane > >Incoming material: >The PbS would be in either powder or solution (toluene, chloroform, >hexane, or other non-polar solvent). >Typically we would use about 50-100 ml of our material per day. > >a rough process flow: >Our device involves spinning films of PbS onto a substrate (usually a >Si wafer), doing some solution processing of the wafer with the thiols, >depositing masking materials, etching the PbS film, and then depositing >encapsulation materials. Once the wafer is finished we may either die >saw or test at wafer level. >We will be developing solvent systems and spin profiles to optimize our films. >We will be developing masking and etch processes We will be developing >encapsulation processes > >---------------------------------------------- >Please provide as much information as you can about your chemical or >material. It may very well be the first time anyone on the SpecMat >committee has heard of this chemical/material, so it will be your >responsibility to educate us. We also have a large archive of chemicals >and materials that have been approved, so we may also be able to help >you in selecting a chemical or process > > * Your contact information: Name, Coral login, phone number, email >address and who you work for (your PI or company.) > * The chemical or material. Please provide all common names, trade >names, and CAS numbers where appropriate. Include an MSDS, if >available; or provide the reason, if not. Make sure to include >information for any new secondary chemicals (such as a developer for a >new resist). Read the MSDSs as well as the >Stanford > Chemical Storage Groups and the > Stanford > Chemical Safety Data Base sections on this website to determine the >Storage Group >Identifier and >Main Hazard >Class of your chemical/material. > * Vendor/manufacturer info: address and phone number, website URL. > * Reason for request: Please give serious thought to this. If you >have any process information (application notes from the vendor, >protocol from another lab, experimental methods section of an >article), please include it, preferably as attachments. Ask yourself >these questions: Is this the latest procedure? Are there newer/safer >alternatives that will also work for my project? Will any of the >current SNF approved chemicals and materials work for me? > * Process Flow: Please provide a detailed process flow description >on how and where you proposed to use this chemical. > This should include all > Lab equipment to >be used for processing your wafers once your new chemical or material >has been used (even if your new material is a film that is removed, it >may still pose potential contamination concerns.) Make sure to include >wet benches. Please note that f the chemical/material is to be used in >any the >"clean" > equipment, purity specifications will be needed. This is most >important for chemicals/material that are not normally used for VLSI >device fabrication. To be allowed into a >"clean" > tool, the material should MOS grade or better. > * Amount and form. How much will you bring in? Is it solid, >powder or liquid? > (Note: as a general rule, > powders are not >permitted in the cleanroom.) Do you need to mix it to use it? > * Storage: Will you be storing your chemical/material at SNF? If >so, please note any potential reactivities (this should be on the >MSDS). Storage > groups A,B,D and L are stored in the yellow solvent cabinet in the >furnace support area, while >storage groups C, >E, F and G are stored on top of one of the Pass-through Carts. > Ensure your chemical container or material is >properly > labeled. If there is no available room, it must be stored by in the >bulk storage area. You will then need to obtain it from receiving area >personnel each time you want to use it and return it to them when you >are finished using it (or each time you leave the lab). > Note that there is no storage of chemicals/materials in the >processing lab or at any wet bench. > * DIsposal: How will you dispose of any waste or excess chemical >or material? In your discussions with experts and vendors, try to >determine the best way to dispose of your spent chemicals and >by-products. Please refer to the >SNF Labmembers >Safety Manual for the different methods of waste disposal that are >available in the lab. >---------------------------------------------- > >Please get in touch about next steps. > >Thanks, >Rick >------------------------------------- >Rick Clayton >VP Advanced Materials >InVisage Technologies >mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, >M5G 1L7 >Office: 416 673 6520 >mobile: 613 291 6578 >email: >rick.clayton at invisageinc.com >This email contains information that is confidential. The information >is intended to be for the recipient named in the body of the message. >If you are not the intended recipient please destroy this email and be >aware that any disclosure, copying, distribution or use of the contents >of this information is prohibited. If you have received this email in >error, kindly notify the sender of this email immediately. > > > From newsletter at nilt.com Fri Nov 9 00:41:47 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 9 Nov 2007 09:41:47 +0100 Subject: NILT nanonews nov. 9: Creating a radio out of a nanotube, nanotubes zap cancer, nanotech could help the natural gas industry Message-ID: An HTML attachment was scrubbed... URL: From mbuynoski at nanosysinc.com Fri Nov 9 09:18:39 2007 From: mbuynoski at nanosysinc.com (Matthew Buynoski) Date: Fri, 09 Nov 2007 10:18:39 -0700 Subject: Electronic MSDS for polyimide and adhesion promoter Message-ID: These are the MSDS provided by the vendor (HD Microsystems) for polyimide PI-2610 and adhesion promoter VM-652 that we (Nanosys) are proposing to use in the SNF. -------------- next part -------------- A non-text attachment was scrubbed... Name: VM-652 MSDS.pdf Type: application/octet-stream Size: 48891 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: PI-2610 MSDS.pdf Type: application/octet-stream Size: 44570 bytes Desc: not available URL: From news at discount-educational-software.net Fri Nov 9 10:56:31 2007 From: news at discount-educational-software.net (Educational Software Newsletter) Date: Fri, 9 Nov 2007 13:56:31 -0500 Subject: Educational Software News - November 2007 Message-ID: Computer Products for Education is pleased to provide Educational Software News to qualified students, faculty, staff, and schools for current news on pricing and availability of Academic Edition Software from Microsoft, Adobe, Corel, Autodesk, Quark, EndNote, FileMaker, and many other major software manufacturers. Please visit our website for more information: http://www.discount-educational-software.net or call 800-679-7007. Educational software is exclusively available to Qualified Students, Faculty, Staff and Schools of K-12 and Higher Education institutions. (see below for details) ------ Education Prices for November 2007 -------- ---------------------- Education Standard You AUTODESK Price Retail Save! ---------------------- --------- ------ ----- Architecture 2008 $379.95 $4995 92% AutoCAD 2008 $379.95 $3750 90% AutoCAD LT 2008 $148.95 $899 83% Civil 3D 2008 $469.95 $4995 91% Inventor Professional 2008 $479.95 $4995 90% Map 3D 2008 $469.95 $4995 91% Raster Design 2008 $148.95 $2095 93% Revit Architecture Suite 2008 $469.95 $4995 91% Revit MEP Suite 2008 $469.95 $4995 91% Revit Structure Suite 2008 $469.95 $4995 91% Viz 2008 $289.95 $1995 85% http://www.discount-educational-software.net/autodesk.html These Autodesk prices are for Students, Faculty, & Staff for personal use - pricing for schools for institutional/class-room lab use is different. Please call 800-679-7007 for more information. ---------------------- Education Standard You ADOBE Price Retail Save! ---------------------- --------- ------ ----- Acrobat 8.0 Professional $148.95 $500 70% Acrobat 8.0 Standard $96.95 $300 68% After Effects CS3 $348.95 $999 65% Contribute CS3 $84.95 $149 43% CS3 Design Premium (1) $589.95 $1799 67% CS3 Design Standard (2) $389.95 $1199 67% CS3 Master Collection(3) $989.95 $2499 60% CS3 Production Premium (4) $589.95 $1699 65% CS3 Web Premium (5) $489.95 $1599 69% CS3 Web Standard (6) $389.95 $999 61% Dreamweaver CS3 $198.95 $399 50% Fireworks CS3 $98.95 $299 67% Flash Pro CS3 $248.95 $699 64% Flex Builder 2.0 $92.95 $749 88% Illustrator CS3 $198.95 $699 72% InDesign CS3 $198.95 $699 72% PageMaker 7.0.2 $339.95 $499 32% Photoshop Elements 6.0 $68.95 $150 54% Photoshop Extended CS3 $298.95 $999 70% Premiere Pro CS3 $348.95 $799 56% http://www.discount-educational-software.net/adobe.html (1) CS3 Design Premium includes: InDesign, Photoshop Extended, Illustrator, Flash Pro, Dreamweaver, and Acrobat 8 Pro (2) CS3 Design Standard includes: InDesign, Photoshop, Illustrator, and Acrobat 8 Pro (3) CS3 Master Collection includes: InDesign, Photoshop Extended, Illustrator, Flash Pro, Dreamweaver, Contribute, Fireworks, After Effects Pro, Premiere Pro, Soundbooth, Encore, OnLocation, Ultra, and Acrobat 8 Pro (4) CS3 Production Premium includes: Photoshop Extended, Illustrator, Flash Pro, After Effects Pro, Premiere Pro, Encore, OnLocation, and Ultra (5) CS3 Web Pemium includes: Photoshop Extended, Illustrator, Acrobat 8 Pro, Flash Pro, Dreamweaver, Contribute, and Fireworks (6) CS3 Web Standard includes: Flash Pro, Dreamweaver, Contribute, and Fireworks ---------------------- Education Standard You MICROSOFT Price Retail Save! ---------------------- --------- ------ ----- Excel 2007 $115.95 $229 49% Expressions Web 1.0 $59.95 $299 80% Office 2004 Macintosh $148.95 $500 70% Office 2007 Professional(2) $189.95 $499 62% Office 2007 Standard(1) $148.95 $399 63% Office 2007 Ultimate(3) $259.95 $679 62% Office Accounting Pro 2007 $89.95 $229 61% OneNote 2007 $48.95 $100 51% Powerpoint 2007 $118.95 $229 48% Project 2007 Professional $198.95 $999 80% Project 2007 Standard $69.95 $349 80% Publisher 2007 $98.95 $169 41% Visio 2007 Professional $159.95 $559 71% Visio 2007 Standard $84.95 $259 67% Visual Studio 2005 Professional $109.95 $809 86% Visual Studio 2005 Standard $59.95 $299 80% Windows Vista Home Premium Upg $69.95 $160 56% Windows XP Professional Upgrade $94.95 $200 53% http://www.discount-educational-software.net/microsoft.html (1)Office 2007 Standard includes: Word, Excel, PowerPoint, Outlook. (2)Office 2007 Professional includes: Word, Excel, PowerPoint, Outlook, Access, Publisher. (3)Office 2007 Ultimate includes: Word, Excel, PowerPoint, Outlook, Access, Publisher, Groove, InfoPath. ---------------------- Education Standard You QUARK Price Retail Save! ---------------------- --------- ------ ----- Quark QuarkXPress 7.0 $198.95 $945 79% Quark QuarkXPress 7.0 Upgrade $98.95 - - ---------------------- Education Standard You INTUIT Price Retail Save! ---------------------- --------- ------ ----- Quickbooks Pro 2007 $99.95 $299 67% ---------------------- Education Standard You AVID Price Retail Save! ---------------------- --------- ------ ----- Mojo $994.95 $1695 41% SDI Mojo $1669.95 $2495 33% Xpress Pro 5.5 HD $291.95 $1695 83% For more information, visit our website at: http://www.discount-educational-software.net or call 800-679-7007. School purchase orders may be faxed to: 800-679-6996. Educational Software has the exact same features and functionality as Commercial Full-Versions of the software. Visit our website to view thousands of other items and accessories available from CPE at similar discounts. All software products from CPE are authentic original software from the manufacturer. These are not pirated software copies. All software comes in original manufacturer's packaging and contains a valid verifiable license. ------------------------- Volume Licensing: ------------------------- For volume licensing information for schools for quantities of five to ten (5-10) or more units of software, depending on the product(s), please call 800-679-7007 for more information. ---------------------------------------- Qualified Educational Buyers: ---------------------------------------- The following are defined as Qualified Education Buyers. Qualified Educational Buyers must provide the below verification upon making any purchase. 1. Students of Higher Education - All enrolled college, junior college, community college, technical school, vocational school, and university students. 2. K-12 Students - K-12 students are eligible for most, but not all, academic-edition software products. 3. Teachers - All K-12 school and Higher Education institution teachers. 4. K-12 school and Higher Education institution faculty. 5. Staff - All K-12 school and Higher Education institution staff. 6. Schools - All elementary, middle and high schools (K-12 schools); vocational and technical schools; correspondence schools, including Internet correspondence schools, and all colleges, including junior and community colleges, and universities. 7. Home Schools - Home schools are now eligible to purchase most Academic Edition software. Home schools must be approved on a case by case basis. Please call for more details. ------------------------- Verification: ------------------------- Purchasers must provide fax-verification of status as being a current faculty, staff, or student. After placing your order, you simply fax to CPE either: (a) a copy of a current picture School I.D. Card; or, (b) a current paycheck stub with an alternative picture I.D. (drivers license, etc.) Sensitive information may be blacked out; or (c) Schools may purchase by faxing a valid school purchase order. For more details, call us or visit our website. ------------------------- CPE is an Authorized Education Reseller for Microsoft, Adobe, Macromedia, AutoDesk, Corel, Sony, Avid, Pinnacle, Symantec and many other major software manufacturers. CPE is a national software distributor committed to providing the best prices and the best customer service to the Education Community!! Prices generally remain unchanged until the end of the month. However, all prices and availability are subject to change without notice, due to factors outside our control. __________________________ We hope you have found this message valuable. However, if you do not wish to receive any more newsletters from CPE, please use the following link: http://www.discount-educational-software.net/rem.asp?a=remv&e=specmat at snf.stanford.edu Or call 800-679-7007 for additional options. __________________________ Sincerely, Computer Products for Education 5325 140th Avenue North Clearwater, Florida 33760 Tel: 800-679-7007 Fax: 800-679-6996 support at discount-educational-software.net ___________________ THANK YOU!!! From mtang at stanford.edu Fri Nov 9 11:09:04 2007 From: mtang at stanford.edu (Mary Tang) Date: Fri, 09 Nov 2007 11:09:04 -0800 Subject: Electronic MSDS for polyimide and adhesion promoter In-Reply-To: References: Message-ID: <4734B050.9080301@stanford.edu> Hi Matt -- Thanks for the MSDS's! One more thing... If your use of the polyimide and adhesion promoter extend beyond what is listed below for the "standard" process, please provide a general process flow, listing the equipment and specific steps in which your polyimide-containing substrates will be processed. Mary ***************************************** 1. Please provide an MSDS for the specific formulation you plan to use. Send it, preferably in electronic format, to specmat at snf.stanford.edu. If there are any associated adhesion or anti-adhesion coatings, developers, or removers that are not lab-standard, we also require MSDS's for these. 2. Please include a process flow for how you plan to use your polyimide (if there are any deviations from the standard process), where you plan to use it (which equipment and wet stations), and how you plan to dispose of any waste or excess materials/chemicals. Generic polyimide process: 1. Spin coating may be done ONLY on headway2 (NOT svgcoat or laurell stations). Fresh polyimide can be cleaned up with NMP or excess acetone. Spin chuck and parts should be cleaned up as soon as possible after coating. Personal or dedicated wafer handling tools must be used (do NOT used the general, shared litho cassettes.) 2. Blue M oven can be used for curing the resin (programmable up to about 350 C). Do NOT use the singe or YES ovens. Hot plates may be used for curing or partial curing of resins ONLY at temperatures BELOW 200C. 3. Only cured polyimide is allowed in tools in the white area of the lab. A specmat request must be submitted to process wafers with cured polyimide in tools other than gold-contaminated equipment. Matthew Buynoski wrote: > These are the MSDS provided by the vendor (HD Microsystems) for polyimide > PI-2610 and adhesion promoter VM-652 that we (Nanosys) are proposing to use > in the SNF. > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Fri Nov 9 11:11:04 2007 From: mtang at stanford.edu (Mary Tang) Date: Fri, 09 Nov 2007 11:11:04 -0800 Subject: Electronic MSDS for polyimide and adhesion promoter In-Reply-To: References: Message-ID: <4734B0C8.7050100@stanford.edu> These should be OK for use in the lab, with the usual resist chemical handling precautions. The polyimide uses the standard NMP solvent (they mispelled it on the MSDS, but the CAS number matches.) The adhesion promoter is primarily based on PGME, which is considered to be not one of the bad ethyl ethers. Mary Matthew Buynoski wrote: > These are the MSDS provided by the vendor (HD Microsystems) for polyimide > PI-2610 and adhesion promoter VM-652 that we (Nanosys) are proposing to use > in the SNF. > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Fri Nov 9 15:02:21 2007 From: mtang at stanford.edu (Mary Tang) Date: Fri, 09 Nov 2007 15:02:21 -0800 Subject: Request from Nanosys Message-ID: <4734E6FD.1020801@stanford.edu> Matthew Buynoski from Nanosys is working with Josephine Suarez and Eric P on a new process flow. One of the odd things he is asking for is to put a few thousand angstroms of STS PECVD oxide on 1-2 microns of polyimide that has been cured at 350 C or higher. Does anyone anticipate a problem with this? Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From ehe at stanford.edu Wed Nov 14 11:27:21 2007 From: ehe at stanford.edu (Elizabeth Edwards) Date: Wed, 14 Nov 2007 11:27:21 -0800 Subject: chemical approval Message-ID: Hi, I don't know who to send these MSDS forms to for approval. I would like to purchase at least the PI-2610 to use in the Stanford NanoFacility (in CIS). If you are the right person - can you please let me know which of these chemicals (I've attached the MSDS sheets) I can purchase? Thanks, Liz ---------- Forwarded message ---------- From: Elizabeth Edwards Date: Nov 5, 2007 3:32 PM Subject: HD Microsystems polyimide MSDS To: Mary Tang Hi Mary, I wanted to check with you before purchasing these 4 chemicals that they are permitted inside SNF. MSDS attached for HD Microsystems products: PI-2610 polyimide T-9039 polyimide thinner VM-651 and VM-652 (one is concentrated) adhesion promoters -Liz -------------- next part -------------- A non-text attachment was scrubbed... Name: PI-2610 MSDS.pdf Type: application/pdf Size: 44569 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: T-9039 MSDS.pdf Type: application/pdf Size: 49139 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: VM-651 MSDS.pdf Type: application/pdf Size: 38173 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: VM-652 MSDS.pdf Type: application/pdf Size: 48890 bytes Desc: not available URL: From edmyers at stanford.edu Wed Nov 14 13:24:39 2007 From: edmyers at stanford.edu (Ed Myers) Date: Wed, 14 Nov 2007 13:24:39 -0800 Subject: chemical approval In-Reply-To: References: Message-ID: <6.2.5.6.2.20071114132113.0433c5d0@stanford.edu> All, The P!-2610 and T-9036 might be OK (NMP based, if I understand the language). The MSDS for both the VM-651 and VM-652 seem more concerning. The VM-652 is 1-Methoxy-2-Propanol. This reads pretty bad, but I don't know if anyone has any experience. There is no information on the VM-651 as what are it's components. The MSDS also reads pretty bad, so I think we should say no to this chemical. Comments, Ed At 11:27 AM 11/14/2007, Elizabeth Edwards wrote: >Hi, > >I don't know who to send these MSDS forms to for approval. I would >like to purchase at least the PI-2610 to use in the Stanford >NanoFacility (in CIS). If you are the right person - can you please >let me know which of these chemicals (I've attached the MSDS sheets) I >can purchase? > >Thanks, >Liz > > >---------- Forwarded message ---------- >From: Elizabeth Edwards >Date: Nov 5, 2007 3:32 PM >Subject: HD Microsystems polyimide MSDS >To: Mary Tang > > >Hi Mary, > >I wanted to check with you before purchasing these 4 chemicals that >they are permitted inside SNF. > >MSDS attached for HD Microsystems products: >PI-2610 polyimide >T-9039 polyimide thinner >VM-651 and VM-652 (one is concentrated) adhesion promoters > >-Liz > >Content-Type: application/pdf; name="PI-2610 MSDS.pdf" >X-Attachment-Id: 0.2 >Content-Disposition: attachment; filename="PI-2610 MSDS.pdf" > >Content-Type: application/pdf; name="T-9039 MSDS.pdf" >X-Attachment-Id: 0.3 >Content-Disposition: attachment; filename="T-9039 MSDS.pdf" > >Content-Type: application/pdf; name="VM-651 MSDS.pdf" >X-Attachment-Id: 0.4 >Content-Disposition: attachment; filename="VM-651 MSDS.pdf" > >Content-Type: application/pdf; name="VM-652 MSDS.pdf" >X-Attachment-Id: 0.5 >Content-Disposition: attachment; filename="VM-652 MSDS.pdf" From mtang at stanford.edu Wed Nov 14 13:59:30 2007 From: mtang at stanford.edu (Mary Tang) Date: Wed, 14 Nov 2007 13:59:30 -0800 Subject: chemical approval In-Reply-To: <6.2.5.6.2.20071114132113.0433c5d0@stanford.edu> References: <6.2.5.6.2.20071114132113.0433c5d0@stanford.edu> Message-ID: <473B6FC2.6040703@stanford.edu> Hi all -- I agree, we should not allow VM-651 if we cannot be told what it is. I suspect, however, that it's a CYA sort of approach that HD Micro is taking. 1-methoxy-2-propanol is a propylene glycol ether similar to PGMEA (propylene glycol monomethyl ether acetate -- same as the previous, but with the acetate group added.) Both are considered "safe" alternatives to the older ethylene glycol ethers linked to reproductive problems in the semiconductor industry. PGMEA is the dominant solvent (along with ethyl lactate) for resist and polymer products.. Well, unless it's NMP. The PEL of 1-methoxy-2-propanol is 100 ppm. The TWA of PGMEA is 100 ppm. So, I think VM-652 is OK. By the way, Kevin O'Sullivan (tdo) and Matthew Buynowski from Nanosys (working with ericp and jsuarez) also requested polyimides and adhesion promoters from HD Micro. Matt asks for PI2610 and VM652. Kevin asks for PI2525. It would be worth getting these people to talk with each other. Also, I think there are enough requests that we ought to post a generic recommended process on the web (maybe in the litho processes section.) In general, Mahnaz and I propose the following: ********************* 1. Spin coating only on headway2. Fresh polyimide can be cleaned up with NMP or excess acetone. Spin chuck and parts should be cleaned up as soon as possible after coating. Personal or dedicated wafer handling tools must be used (do NOT used the general, shared litho cassettes.) 2. If photosensitive polyimide is used, it must be manually developed. Polyimide exposure is not approved (yet) for the steppers. 3. Blue M oven can be used for controlled curing of the resin. Do NOT use the singe or YES ovens. A hot plate bake of about 5 minutes is recommended prior to placing in the Blue M if only to drive off excess solvent. Do not use the hot plates for curing resins at temperatures above 200C. 4. Only cured polyimide is allowed in tools in the white area of the lab. A specmat request must be submitted to process wafers with cured polyimide in tools other than gold-contaminated equipment. Any suggestions, changes, comments? Mary Ed Myers wrote: > All, > > The P!-2610 and T-9036 might be OK (NMP based, if I understand the > language). The MSDS for both the VM-651 and VM-652 seem more > concerning. The VM-652 is 1-Methoxy-2-Propanol. This reads pretty > bad, but I don't know if anyone has any experience. > > There is no information on the VM-651 as what are it's components. > The MSDS also reads pretty bad, so I think we should say no to this > chemical. > > Comments, > Ed > > > At 11:27 AM 11/14/2007, Elizabeth Edwards wrote: >> Hi, >> >> I don't know who to send these MSDS forms to for approval. I would >> like to purchase at least the PI-2610 to use in the Stanford >> NanoFacility (in CIS). If you are the right person - can you please >> let me know which of these chemicals (I've attached the MSDS sheets) I >> can purchase? >> >> Thanks, >> Liz >> >> >> ---------- Forwarded message ---------- >> From: Elizabeth Edwards >> Date: Nov 5, 2007 3:32 PM >> Subject: HD Microsystems polyimide MSDS >> To: Mary Tang >> >> >> Hi Mary, >> >> I wanted to check with you before purchasing these 4 chemicals that >> they are permitted inside SNF. >> >> MSDS attached for HD Microsystems products: >> PI-2610 polyimide >> T-9039 polyimide thinner >> VM-651 and VM-652 (one is concentrated) adhesion promoters >> >> -Liz >> >> Content-Type: application/pdf; name="PI-2610 MSDS.pdf" >> X-Attachment-Id: 0.2 >> Content-Disposition: attachment; filename="PI-2610 MSDS.pdf" >> >> Content-Type: application/pdf; name="T-9039 MSDS.pdf" >> X-Attachment-Id: 0.3 >> Content-Disposition: attachment; filename="T-9039 MSDS.pdf" >> >> Content-Type: application/pdf; name="VM-651 MSDS.pdf" >> X-Attachment-Id: 0.4 >> Content-Disposition: attachment; filename="VM-651 MSDS.pdf" >> >> Content-Type: application/pdf; name="VM-652 MSDS.pdf" >> X-Attachment-Id: 0.5 >> Content-Disposition: attachment; filename="VM-652 MSDS.pdf" > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Wed Nov 14 14:19:15 2007 From: mtang at stanford.edu (Mary Tang) Date: Wed, 14 Nov 2007 14:19:15 -0800 Subject: chemical approval In-Reply-To: References: Message-ID: <473B7463.9050708@stanford.edu> Hi Elizabeth -- In principle, most of these are similar to what has been previously approved. But there are a few more questions... Would you happen to know what the VM-651 is? The MSDS does not really say nor does it give exposure limits. Is the VM-651 the "concentrated" version of the VM-652? If so, then I think it's OK (as I understand it, the proprietary ingredient in VM-652 is aminopropyl trimethoxysilane or something similar -- if you could check with HD Micro, it would be helpful.) How do you plan to use the polyimide? (Did I send you a generic process flow?) By the way, isn't the PI2610 supposed to be self-priming -- is adhesion promoter needed for this? Mary Elizabeth Edwards wrote: > Hi, > > I don't know who to send these MSDS forms to for approval. I would > like to purchase at least the PI-2610 to use in the Stanford > NanoFacility (in CIS). If you are the right person - can you please > let me know which of these chemicals (I've attached the MSDS sheets) I > can purchase? > > Thanks, > Liz > > > ---------- Forwarded message ---------- > From: Elizabeth Edwards > Date: Nov 5, 2007 3:32 PM > Subject: HD Microsystems polyimide MSDS > To: Mary Tang > > > Hi Mary, > > I wanted to check with you before purchasing these 4 chemicals that > they are permitted inside SNF. > > MSDS attached for HD Microsystems products: > PI-2610 polyimide > T-9039 polyimide thinner > VM-651 and VM-652 (one is concentrated) adhesion promoters > > -Liz > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From newsletter at nilt.com Fri Nov 16 01:56:31 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 16 Nov 2007 10:56:31 +0100 Subject: NILT nanonews nov. 16: Intel launches 45 nm chips, mining tiny diamonds for drug delivery, STM gets at least 100 times faster Message-ID: An HTML attachment was scrubbed... URL: From kai-mei.fu at hp.com Mon Nov 19 14:24:06 2007 From: kai-mei.fu at hp.com (Fu, Kai-Mei) Date: Mon, 19 Nov 2007 22:24:06 +0000 Subject: Znse in SNF Message-ID: Hello, I am a returning labmember to SNF (just went through basic safety training) and will be processing diamond/quartz samples. However, some of the samples may have a thin 300 nm film of ZnSe (zinc selenide) on the surface. I will not be etching this film and not be storing the wafer pieces in SNF- so all that comes in will come out with me. Do I need to have special labeling for this? Contact info: Kai-Mei Fu Kaimeifu Kai-mei.fu at hp.com Hewlett Packard Chemical: ZnSe, Zinc Selenide Process flow: deposit resist on top of this material and perform ebeam lithography and development Amount and form: solid, 300 nm layer on top of cm size quartz wafer pieces or mm size diamond pieces Storage: Will not be storing at SNF Disposal: There will be no waste associated with this chemical Thanks, Kai-Mei From michash at stanford.edu Mon Nov 19 14:35:39 2007 From: michash at stanford.edu (michash at stanford.edu) Date: Mon, 19 Nov 2007 14:35:39 -0800 Subject: New materials approval request Message-ID: <20071119143539.7rcwgj3mokkko4wc@webmail.stanford.edu> Hello, I am a new postdoc of Prof. Paul C. McIntyre from Materials Science and Engineering Department. I will be working in SNF on a project in which I'll need photolithography and patterning of fairly large square windows through Si3N4-coated Si wafers (from the backside, by KOH anisotropic etching). I plan to bring new materials to NSF lab in form of thin solid films deposited on Si wafers. Please see "new materials approval request" doc file. Please contact me if you need additional information. Thank you in advance and waiting for your approval. Michael Shandalov -- Michael Shandalov Postdoctoral researcher Materials Science and Engineering Department Standord University McCullough Building, Rm. 203 476 Lomita Mall Stanford, CA 94305 phone: 650-7252616 -------------- next part -------------- A non-text attachment was scrubbed... Name: New materials approval request.doc Type: application/msword Size: 26624 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Process flow chart+top view1.doc Type: application/msword Size: 118272 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: process_flow YSZ SOFC microfabrication1.xls Type: application/vnd.ms-excel Size: 24064 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Atomic Layer Deposition of Yttria Stabilized Zirconia1.doc Type: application/msword Size: 184832 bytes Desc: not available URL: From support at global-fab.com Tue Nov 20 00:59:18 2007 From: support at global-fab.com (Christopher Detrick) Date: Tue, 20 Nov 2007 03:59:18 -0500 (EST) Subject: AMAT DPS Etcher, Mirra CMP and Disco Grinders Message-ID: <1101878567193.1101401002153.9044.6.13035546@scheduler> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ November 19, 2007 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Greetings! Global Fab Surplus has an AMAT DPS etcher available for immediate sale. The system is still running production and will be removed from the fab in the next few weeks. This system has the second generation Centura frame, VBS+ robot, two ASP+ chambers, and more. It is in excellent condition and we are pricing it to sell very fast. For more information please contact us right away. Full specs are listed below! Also available for immediate sale are: * ASML Twinscan stepper (vintage 2003, 200mm) * IPEC 372 oxide CMP (two available) * AMAT Mirra with Track ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ AMAT Centura DPS Etcher Process Metal Etch Process Software Version E4.3 System Power Rating 208VAC 3Phase 4W Loading Configuration 2 loaders config Equipment manuals available? Yes Tool under OEM service contract? Yes Description Chemicals / Gases Used Photo Attached Chm Position 1 Etch Chamber A CL2, BCL3, CF4, N2, Ar, CHF3, NF3, O2 Chm Position 2 Etch Chamber B CL2, BCL3, CF4, N2, Ar, CHF3, NF3, O2 Chm Position 3 Strip Chamber C NH3, CF4, N2, O2 Chm Position 4 Strip Chamber D NH3, CF4, N2, O2 Chm Position ___ Orienter Chamber F N2 Chm Position ___ Cooldown Chamber E N2 PLATFORM TYPE 1 Etch 5200 Legacy Centura 1 Common Mainframe CHAMBER POSTION 'A' 2 Metal A1, DPS R1 1 includes ESC, heated turbo pump and foreline and 6 gas lines default. includes Vpp and Tc monitoring at the wafer and dome lift. CHAMBER POSTION 'B' 1 3 Metal A1, DPS R1 includes ESC, heated turbo pump and foreline and 6 gas lines default. includes Vpp and Tc monitoring at the wafer and dome lift. CHAMBER POSTION 'C' 6 ASP+ 1 Includes chuck type process kit for improved thermal stability CHAMBER POSTION 'D' 7 ASP+ 1 CHAMBER POSTION 'E' 8 Cooldown Chamber 1 CHAMBER POSTION 'F' 9 (OA) Orienter Chamber 1 Wafer Orienter chamber postion F ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Thank you for taking the time to read our email. Please feel free to forward the email to anyone who may be interested any of these tools. Sincerely, ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Chris Detrick (California) 805-215-9188 chris.detrick at global-fab.com David Lee (Colorado) 719-686-0128 support at global-fab.com Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat at snf.stanford.edu&a=1101878567193 This email was sent to specmat at snf.stanford.edu, by support at global-fab.com Update Profile/Email Address http://visitor.constantcontact.com/d.jsp?v=001RO3dPrXHwIHjNc18qg2uYpS-p4D8dFWvgBHl66BMw1sIWzfSedq7JrechbEUNpiiDbyKKiugXCE%3D&p=oo Instant removal with SafeUnsubscribe(TM) http://visitor.constantcontact.com/d.jsp?v=001RO3dPrXHwIHjNc18qg2uYpS-p4D8dFWvgBHl66BMw1sIWzfSedq7JrechbEUNpiiDbyKKiugXCE%3D&p=un Privacy Policy: http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906 -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Tue Nov 20 14:03:44 2007 From: mtang at stanford.edu (Mary Tang) Date: Tue, 20 Nov 2007 14:03:44 -0800 Subject: Gold in rtagaas Message-ID: <474359C0.3080200@stanford.edu> Hi all -- Jia Zhu would like to anneal gold contacts in rtagaas on silicon substrates that have Ge and/or SiGe nanowires. What's allowed in rtagaas? Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From newsletter at nilt.com Thu Nov 22 23:54:58 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 23 Nov 2007 08:54:58 +0100 Subject: NILT nanonews nov. 23: Nanotubes tangles power printable batteries, nanotech exciting but risky, CNT based NRAM to replace DRAM Message-ID: <1b2674880aaf1dfc2858737400147eb1@nilt.com> An HTML attachment was scrubbed... URL: From nppatil at stanford.edu Mon Nov 26 09:57:14 2007 From: nppatil at stanford.edu (Nishant Patil) Date: Mon, 26 Nov 2007 09:57:14 -0800 Subject: Scandium MSDS Message-ID: <20071126175920.C888C4C036@smtp1.stanford.edu> Hi, I would like to use the Innotec to evaporate the metal Scandium. The MSDS for Scandium and Scandium powder is attached. Thanks, Nishant -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 0000634876.pdf Type: application/pdf Size: 57264 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 0001068155.pdf Type: application/pdf Size: 52111 bytes Desc: not available URL: From mtang at stanford.edu Mon Nov 26 17:34:01 2007 From: mtang at stanford.edu (Mary Tang) Date: Mon, 26 Nov 2007 17:34:01 -0800 Subject: material approval In-Reply-To: <001b01c8308e$a53a74a0$350aa8c0@Dien> References: <001b01c8308e$a53a74a0$350aa8c0@Dien> Message-ID: <474B7409.8000900@stanford.edu> Hi Dien -- I believe I mentioned this in my previous note, but perhaps wasn't as clear as I ought to have been. I may be mistaken, but I gather these are positive tone resins -- meaning that these are monomers, not a polymer like PMMA, which is negative tone. PMMA is safe to use in the lab because its solvent (usually anisole) is mostly removed during the soft bake and as a polymer, it does not have significant vapors. If these materials are monomers, then I suspect they are of lower molecular weight and may be quite volatile. That is, after you spin coat and before you fully cure them, they will continue to outgas. Acrylate monomers are considered harmful to inhale and typically have PEL limits on the order of 10 ppm. I don't know if this is the case for the materials you have, but for SNF, chemicals with a PEL of 10 ppm must remain under fully ventilated benches or equipment at all times. As it turns out, you would have to transport your wafers from the spin coater, which is ventilated, to the aligner, which is not. Understand that we're learning about this, from our experience with positive tone, uv-curable nanoimprint resists. If your materials are of low volatility, then please ask the manufacturer to provide this information. Or, if you have a procedure that includes some sort of soft bake after spin coating, yet before you move them to the aligner, this would be appreciated. We just want to make sure that no volatiles will be released into the breathing air zones while your processing is taking place. Thanks, Mary Dien Nguyen wrote: > > Mary, > > I just received the MSDS for the WR material. The solvent used will be > acetone. Please let me know if this contains sufficient information. > I?d like to process the polymer as soon as possible as its lifetime is > limited. Thanks. > > Dien > > -----Original Message----- > *From:* Dien Nguyen [mailto:a.d.nguyen at lgrinc.com] > *Sent:* Wednesday, October 31, 2007 3:15 PM > *To:* 'mtang at snf.stanford.edu' > *Cc:* 'kj.jackson at comcast.net' > *Subject:* material approval > > Hi Mary, > > I plan to ask Kathy Jackson to process a new family of UV-cure, > acrylate-based material (WR-326, 346, or 388, see attached), at SNF. > The acrylate material and its processing steps are similar to PMMA. > > The polymer will be spin coated on Si wafers in a similar manner as > PMMA, UV cured by a evalign, and post baked. Drytek 2 will be used for > etching. Standard disposal procedure (for PMMA) will be used. We would > like to store the material in a 100g bottle in the yellow solvent > cabinet. > > Please let me know if this is OK with the special material committee. > Thanks. > > Dien Nguyen, PI > > Los Gatos Research, Inc. > > 67 E. Evelyn Ave., Suite 3 > > Mountain View, CA 94041 > > (650)965-7772 x 223 (phone) > > (650)965-7074 (fax) > > www.lgrinc.com > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From a.d.nguyen at lgrinc.com Mon Nov 26 18:02:21 2007 From: a.d.nguyen at lgrinc.com (Dien Nguyen) Date: Mon, 26 Nov 2007 18:02:21 -0800 Subject: material approval In-Reply-To: <474B7409.8000900@stanford.edu> Message-ID: <002201c83099$8e606270$350aa8c0@Dien> Mary, Thanks for your prompt reply. I'm requesting information on the volatility. The reported average molecular weight from the manufacturer is MW 4000. In our procedure, we will spin coat and soft bake the resin at 90C for 30 min before transferring to the aligner. Dien -----Original Message----- From: Mary Tang [mailto:mtang at stanford.edu] Sent: Monday, November 26, 2007 5:34 PM To: Dien Nguyen Cc: specmat at snf.stanford.edu; jackson at snf.stanford.edu Subject: Re: material approval Hi Dien -- I believe I mentioned this in my previous note, but perhaps wasn't as clear as I ought to have been. I may be mistaken, but I gather these are positive tone resins -- meaning that these are monomers, not a polymer like PMMA, which is negative tone. PMMA is safe to use in the lab because its solvent (usually anisole) is mostly removed during the soft bake and as a polymer, it does not have significant vapors. If these materials are monomers, then I suspect they are of lower molecular weight and may be quite volatile. That is, after you spin coat and before you fully cure them, they will continue to outgas. Acrylate monomers are considered harmful to inhale and typically have PEL limits on the order of 10 ppm. I don't know if this is the case for the materials you have, but for SNF, chemicals with a PEL of 10 ppm must remain under fully ventilated benches or equipment at all times. As it turns out, you would have to transport your wafers from the spin coater, which is ventilated, to the aligner, which is not. Understand that we're learning about this, from our experience with positive tone, uv-curable nanoimprint resists. If your materials are of low volatility, then please ask the manufacturer to provide this information. Or, if you have a procedure that includes some sort of soft bake after spin coating, yet before you move them to the aligner, this would be appreciated. We just want to make sure that no volatiles will be released into the breathing air zones while your processing is taking place. Thanks, Mary Dien Nguyen wrote: > > Mary, > > I just received the MSDS for the WR material. The solvent used will be > acetone. Please let me know if this contains sufficient information. > I'd like to process the polymer as soon as possible as its lifetime is > limited. Thanks. > > Dien > > -----Original Message----- > *From:* Dien Nguyen [mailto:a.d.nguyen at lgrinc.com] > *Sent:* Wednesday, October 31, 2007 3:15 PM > *To:* 'mtang at snf.stanford.edu' > *Cc:* 'kj.jackson at comcast.net' > *Subject:* material approval > > Hi Mary, > > I plan to ask Kathy Jackson to process a new family of UV-cure, > acrylate-based material (WR-326, 346, or 388, see attached), at SNF. > The acrylate material and its processing steps are similar to PMMA. > > The polymer will be spin coated on Si wafers in a similar manner as > PMMA, UV cured by a evalign, and post baked. Drytek 2 will be used for > etching. Standard disposal procedure (for PMMA) will be used. We would > like to store the material in a 100g bottle in the yellow solvent > cabinet. > > Please let me know if this is OK with the special material committee. > Thanks. > > Dien Nguyen, PI > > Los Gatos Research, Inc. > > 67 E. Evelyn Ave., Suite 3 > > Mountain View, CA 94041 > > (650)965-7772 x 223 (phone) > > (650)965-7074 (fax) > > www.lgrinc.com > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From a.d.nguyen at lgrinc.com Tue Nov 27 13:52:46 2007 From: a.d.nguyen at lgrinc.com (Dien Nguyen) Date: Tue, 27 Nov 2007 13:52:46 -0800 Subject: approval Message-ID: <003301c8313f$dad85350$350aa8c0@Dien> Dear Specmat committee, I would like to request permission to bring in a portable UV Flood Curing lamp (containing a UV lamp and proper protective UV shield housing) to be placed on the headway in the litho area so that we can spin coat and UV cure our acrylate polymer (MSDS attached) in the ventillated headway system. The lamp has a handle that can be easily transported to the headway each time it is used. It has an estimated dimension of 12"x12"x12". Please let me know if this procedure is acceptable. Thanks. Dien Nguyen, PI Los Gatos Research, Inc. 67 E. Evelyn Ave., Suite 3 Mountain View, CA 94041 (650)965-7772 x 223 (phone) (650)965-7074 (fax) www.lgrinc.com -------------- next part -------------- A non-text attachment was scrubbed... Name: WR346MSDS.doc Type: application/msword Size: 90112 bytes Desc: not available URL: From mtang at stanford.edu Wed Nov 28 09:48:04 2007 From: mtang at stanford.edu (Mary Tang) Date: Wed, 28 Nov 2007 09:48:04 -0800 Subject: [Fwd: Can we run our Au-etched wafers through semi-clean RTP?] Message-ID: <474DA9D4.10100@stanford.edu> Hi all -- Please expect a request from Alice for this. Some additional info. - The Au was used as catalyst for nanowire growth. It was "removed" using wet etch. This will be confirmed using TXRF. - Alice wants to use the semiclean RTA because they need N2O ambient for their anneal. We often get requests for processing substrates on which nanowires have been grown from metal catalysts -- it would be good to come up with a criterion or methodology for determining cleanliness levels, don't you think? Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- An embedded message was scrubbed... From: "Alice Fischer-Colbrie" Subject: Can we run our Au-etched wafers through semi-clean RTP? Date: Tue, 27 Nov 2007 15:18:31 -0800 Size: 6735 URL: From newsletter at nilt.com Fri Nov 30 00:31:46 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 30 Nov 2007 09:31:46 +0100 Subject: NILT nanonews nov. 30: FEE-TVs, 3-D photonic crystals will revolutionize Telecommunications, Ink aids molecular memory Message-ID: <6dc42182da5a63db2a40f6c5001cca2f@nilt.com> An HTML attachment was scrubbed... URL: