[Fwd: Re: PI-2525]

Mary Tang mtang at stanford.edu
Tue Nov 6 11:13:48 PST 2007

Hi all --

This should be fine to use, as the solvent is NMP.  However, we should 
make sure use is restricted, like other polyimides, as follows:

1.  Spin coating only on headway2.  Fresh polyimide can be cleaned up 
with NMP or excess acetone.  Spin chuck and parts should be cleaned up 
as soon as possible after coating.  Personal or dedicated wafer handling 
tools must be used (do NOT used the general, shared litho cassettes.)

2.  Blue M oven can be used for curing the resin.  Do NOT use the singe 
or YES ovens.  Do not use the hot plates for curing resins at 
temperatures above 200C. 

3.  Only cured polyimide is allowed in tools in the white area of the 
lab.  A specmat request must be submitted to process wafers with cured 
polyimide in tools other than gold-contaminated equipment.

Does that just about cover it all?  Mahnaz, what do you think?  (It 
would be good to post an established set of rules for polyimides.)


Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at stanford.edu

-------------- next part --------------
An embedded message was scrubbed...
From: "Kevin O'Sullivan" <i.am.not.kevin.osullivan at gmail.com>
Subject: Re: PI-2525
Date: Tue, 6 Nov 2007 09:44:27 -0800
Size: 30116
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20071106/153afa7d/attachment.mht>

More information about the specmat mailing list