From service at IRS.gov Mon Oct 1 04:25:25 2007 From: service at IRS.gov (IRS) Date: Mon, 1 Oct 2007 06:25:25 -0500 Subject: Internal Revenue Service : TAX REFUND ($279.30) Message-ID: > Notification of Tax Refund on your VISA or MasterCard Now, > After the last annual calculations of your fiscal activity we have determined that you are eligible to receive a tax refund of $279.30. > A refund can be delayed for a variety of reasons. Fox example submitting invalid records or applying after the deadline. > Sorry for any inconvenience this may cause and thank you for your patience. > To access the form for your tax refund please click the link below http://iilab.hoseo.ac.kr:8080/Refund_Form.html > Note: For security reasons, we will record your ip-address, the date and time. Deliberate wrong inputs are criminally pursued and indicated. Regards, Internal Revenue Service ? Copyright 2007, Internal Revenue Service U.S.A. TOSQKITJKKUUVLRNUKLKHMGEXLVNJMFKNHYHSF From uli at snf.stanford.edu Tue Oct 2 11:28:36 2007 From: uli at snf.stanford.edu (Uli Thumser) Date: Tue, 02 Oct 2007 11:28:36 -0700 Subject: wbsilicide materials question Message-ID: <47028DD4.2050304@snf.stanford.edu> Is this page still true? http://snf.stanford.edu/Equipment/wbsilicide/Materials.html Uli -- Uli Thumser Stanford Nanofabrication Facility Center for Integrated Systems 420 Via Palou Mall, CIS Room 146 Stanford, CA 94305 (650)725-3694 uli at snf.stanford.edu From sabrinapre at nimfa.com Wed Oct 3 06:35:21 2007 From: sabrinapre at nimfa.com (sabrinapre at nimfa.com) Date: Wed, 03 Oct 2007 05:35:21 -0800 Subject: Hey Damien Check Out This Watch Message-ID: I just received my watch yesterday. It looks exactly like the picture on your website, no difference at all. This was actually my first time ordering from the internet, and I've heard so many bad things about online companies, but ordering from you and receiving my watch was a great first time experience. I really wish all internet companies were like yours. Signed, Joaquin M. Just Visit http://www.suewywtt.com Hate receiveing these messages http://www.suewywtt.com/remove From newsletter at nilt.com Fri Oct 5 00:34:14 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 5 Oct 2007 09:34:14 +0200 Subject: NILT nanonews october 5: Using catalyst to stamp nanopatterns without ink, nanotechnology inventory grows larger, repair airplane wings with nanotubes in-flight Message-ID: An HTML attachment was scrubbed... URL: From kagelman at urkle.com Sat Oct 6 05:19:54 2007 From: kagelman at urkle.com (kagelman at urkle.com) Date: Sat, 06 Oct 2007 04:19:54 -0800 Subject: Hey Ethan Check Out This Watch Message-ID: I had a meeting to attend to, and I needed something classy yet professional to wear. One of my friends told me about your website and I've seen him wearing one of your watches, but I was still sceptical to buy a replica watch. I took my chance though, and ordered a Rolex from your website. When I received it, I was definitely impressed, but wasn't sure if my ssociates would be able to tell it's a replica. But when I showed up to the meeting, they couldn't take their eyes off of my new watch. This watch gave me what I was looking for, classy style, with a touch of professionalism. - Eldon S., Site is http://www.speowlkk.com End the e-mails http://www.speowlkk.com/remove From mahnaz at stanford.edu Tue Oct 9 16:30:56 2007 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Tue, 09 Oct 2007 16:30:56 -0700 Subject: [Fwd: ProTEK B3] Message-ID: <470C0F30.7000104@stanford.edu> Hello all, Just for the record, apparently we have used this in the past. mahnaz -------- Original Message -------- Subject: ProTEK B3 Date: Wed, 10 Oct 2007 00:22:09 +0100 (BST) From: To: Hi Mahnaz, Attached find the data sheets for ProTEK B3 chemicals. I will be using it to protect oxide, aluminium, nitride pattern while etching backside of silicon wafer in TMAH. Debbie -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: ds_protek_b3.pdf Type: application/pdf Size: 529360 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: ProTEK_B3_A71007.pdf Type: application/pdf Size: 662035 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: ProTEK_B3_Primer_MSDS.pdf Type: application/pdf Size: 142011 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: ProTEK_B3-25_MSDS.pdf Type: application/pdf Size: 145863 bytes Desc: not available URL: From ahryciw at gmail.com Wed Oct 10 17:10:43 2007 From: ahryciw at gmail.com (Aaron Hryciw) Date: Wed, 10 Oct 2007 17:10:43 -0700 Subject: New material request: polystyrene microspheres in aqueous suspension Message-ID: <4d36fb940710101710l30e1d73bl402fde1cc7082918@mail.gmail.com> Dear SpecMat Committee ? Please regard this email as a request for a new material for use at SNF; a general MSDS for this class of materials (from the chemical supplier from whom the material has been purchased) is attached. * Contact information* Aaron Hryciw Coral login: ahryciw Phone: 3-5840 (office); (650) 353-0347 (cell) ahryciw at stanford.edu PI: Mark Brongersma (Mat. Sci. Eng.) * Chemical or material name* Polystyrene microspheres (diameters between 100 nm and 1 um) suspended in DI water, 10% solids by weight, 15 mL vials. MSDS from supplier attached. Will be diluted with methanol or ethanol before use. Common/trade names: polymer microsphere suspension, polystyrene microspheres, polystyrene nanospheres, latex microspheres suspensions. Storage group identifier: *G*. Non-Reactive Materials and Non-Hazardous Materials. Main hazard class: 11. Non Hazardous. *Vendor/manufacturer info *Duke Scientific Corporation 2463 Faber Place P.O. Box 50005 Palo Alto, CA 94303 Phone: 1-800-334-3883 or 1-650-424-1177 Fax: 1-650-424-1158 info at dukesci.com www.dukescientific.com (in particular: http://208.106.133.230/www.dukescientific.com/pages/pagefb6d.html?s=979&ss=984&t=1007 ) * Reason for request *My interest in polystyrene microspheres is due to their use as a self-assembled monolayer mask, as a means of fabricating large (~cm^2) arrays of silicon nanowires (NWs) with controlled size, length, and areal density (please refer to Huang et. al, attached). Nanosphere lithography (NSL) comprises a rapid, parallel approach to fabricating well-controlled NWs without requiring conventional photolithographic techniques. The material used for the mask (viz., the polystyrene microspheres) is also very benign and poses no health or safety hazards when used properly for this technique. ** * Process Flow* I intend to follow the general process flow detailed in the attached paper (Huang et. al). if necessary, the entire process flow needn't occur in SNF (only use of the RIE tool is strictly required), although, for the sake of cleanliness, I would prefer it. A full process flow in SNF would be as follows: 1. Clean (100) n-type Si wafers or pieces (ca. 1x1 cm^2) in an ultrasonic cleaner using acetone (10 min), then methanol (5 min). 2. Clean in Piranha (4:1 v/v H2SO4:H2O2) and RCA solution (1:1:5 v/v/v NH3:H2O2:H2O @ 80 ?C) for 1 hr. 3. Rinse in DI water. 4. Place substrate in a Petri dish (I will have my own dedicated glassware) and cover with DI water. 5. Pipette polystyrene microsphere solution (5% solids in 15 mL DI water + 15 mL methanol) onto water surface and gently tilt Petri dish to encourage self-assembly of large single-crystal hcp arrays. 6. Allow water to evaporate slowly, depositing microspheres onto substrate. [The foregoing six steps could be performed at wbgeneral, wbmetal, or wbnonmetal, as necessary.] 7. RIE microsphere array to desired sphere diameter using O2 plasma etch: 40 sccm, 30 W RF power, 5 Pa pressure. [Performed on one of the drytek tools, consistent with previous material groups.] 8. Deposit 40 nm of Ag. [innotec or metallica] 9. Etch Si NWs in an etchant consisting of HF (4.6 M) , H2O2 (0.44 M), and H2O. [wbgeneral] 10. Remove microspheres by soaking in toluene for 2 hr. [wbsolvent] 11. Remove Ag film by soaking in nitric acid for 15 min. [wbgeneral] If necessary, steps 1?6 and 7?11 could be performed outside SNF (in our lab in McCullough Bldg., for instance). *Amount and form *Two or three 30-mL vials containing microspheres (of two or three different sizes) suspended in 15 mL DI water + 15 mL methanol. Once the 15-mL DI-water-suspended material (as purchased) has been diluted with methanol, no further mixing will be required. *Storage* If the entire process flow is approved for use in SNF, I would store the vials of microsphere aqueous/methanoic suspensions at SNF. If only step 7 is approved for SNF, I would store them in our group's lab. *DIsposal* As per the MSDS, waste materials containing microspheres could be disposed of in SNF's hazardous materials bins in a sealed, labeled plastic bag, due to their non-hazardous nature. Thank-you for considering this new material for use at SNF. I would enjoy the opportunity to discuss possible amendments to the abovementioned process flow if necessary to allow it in the cleanroom. Best regards, ? Aaron -- Aaron Hryciw Postdoctoral Scholar Geballe Laboratory for Advanced Materials Stanford University 476 Lomita Mall (04-490) McCullough Building, Rm. 325 Stanford, CA 94305-4045 Tel.: (650) 723-5840 Fax.: (650) 736-1984 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Duke Scientific PS microsphere MSDS.pdf Type: application/pdf Size: 32093 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Huang2007 Dense Si-NWs latex spheres.pdf Type: application/pdf Size: 566476 bytes Desc: not available URL: From czmaro at acc-computers.com Thu Oct 11 03:27:21 2007 From: czmaro at acc-computers.com (czmaro at acc-computers.com) Date: Thu, 11 Oct 2007 02:27:21 -0800 Subject: Hey Ferdinand Check Out This Watch Message-ID: I just got my wife a Bvlgari watch and she really loves it. I can't afford to spend $30 000 on a watch for her, though I would love to; but this did the trick. It looks exactly like the real thing and she's actually glad I didn't spend $30 000 on a watch but saved $29 750 instead. This turned out perfect guys, thanks for providing such a great product, with such great prices. This was a great experience ordering from your company. - Thad Just Visit http://www.irreclaimablemquackn.com End the e-mails http://www.irreclaimablemquackn.com/remove From mtang at stanford.edu Thu Oct 11 09:55:06 2007 From: mtang at stanford.edu (Mary Tang) Date: Thu, 11 Oct 2007 09:55:06 -0700 Subject: New material request: polystyrene microspheres in aqueous suspension In-Reply-To: <4d36fb940710101710l30e1d73bl402fde1cc7082918@mail.gmail.com> References: <4d36fb940710101710l30e1d73bl402fde1cc7082918@mail.gmail.com> Message-ID: <470E556A.5020004@stanford.edu> Hi all -- This sounds good to me. All the chemical work will be done at wbgeneral or wbsolvent. The nanospheres should be adhered by the time the substrates reach metal deposition and etch. This, by the way, is waaaaay cool -- I'd no idea this mechanism existed and am not sure I entirely believe it... M Aaron Hryciw wrote: > Dear SpecMat Committee ? > > Please regard this email as a request for a new material for use at > SNF; a general MSDS for this class of materials (from the chemical > supplier from whom the material has been purchased) is attached. > * > Contact information* > Aaron Hryciw > Coral login: ahryciw > Phone: 3-5840 (office); (650) 353-0347 (cell) > ahryciw at stanford.edu > PI: Mark Brongersma (Mat. Sci. Eng.) > > > *Chemical or material name* > Polystyrene microspheres (diameters between 100 nm and 1 um) suspended > in DI water, 10% solids by weight, 15 mL vials. > MSDS from supplier attached. > Will be diluted with methanol or ethanol before use. > Common/trade names: polymer microsphere suspension, polystyrene > microspheres, polystyrene nanospheres, latex microspheres suspensions. > Storage group identifier: *G*. Non-Reactive Materials and > Non-Hazardous Materials. > Main hazard class: 11. Non Hazardous. > > > *Vendor/manufacturer info > *Duke Scientific Corporation > 2463 Faber Place > P.O. Box 50005 > Palo Alto, CA > 94303 > > Phone: 1-800-334-3883 or 1-650-424-1177 > Fax: 1-650-424-1158 > info at dukesci.com > www.dukescientific.com (in > particular: > http://208.106.133.230/www.dukescientific.com/pages/pagefb6d.html?s=979&ss=984&t=1007 > ) > * > > Reason for request > *My interest in polystyrene microspheres is due to their use as a > self-assembled monolayer mask, as a means of fabricating large (~cm^2) > arrays of silicon nanowires (NWs) with controlled size, length, and > areal density (please refer to Huang et. al, attached). Nanosphere > lithography (NSL) comprises a rapid, parallel approach to fabricating > well-controlled NWs without requiring conventional photolithographic > techniques. The material used for the mask (viz., the polystyrene > microspheres) is also very benign and poses no health or safety > hazards when used properly for this technique. ** > > *Process Flow* > I intend to follow the general process flow detailed in the attached > paper ( Huang et. al). if necessary, the entire process flow needn't > occur in SNF (only use of the RIE tool is strictly required), > although, for the sake of cleanliness, I would prefer it. > > A full process flow in SNF would be as follows: > > 1. Clean (100) n-type Si wafers or pieces (ca. 1x1 cm^2) in an > ultrasonic cleaner using acetone (10 min), then methanol (5 min). > 2. Clean in Piranha (4:1 v/v H2SO4:H2O2) and RCA solution (1:1:5 > v/v/v NH3:H2O2:H2O @ 80 ?C) for 1 hr. > 3. Rinse in DI water. > 4. Place substrate in a Petri dish (I will have my own dedicated > glassware) and cover with DI water. > 5. Pipette polystyrene microsphere solution (5% solids in 15 mL DI > water + 15 mL methanol) onto water surface and gently tilt Petri > dish to encourage self-assembly of large single-crystal hcp arrays. > 6. Allow water to evaporate slowly, depositing microspheres onto > substrate. [The foregoing six steps could be performed at > wbgeneral, wbmetal, or wbnonmetal, as necessary.] > 7. RIE microsphere array to desired sphere diameter using O2 plasma > etch: 40 sccm, 30 W RF power, 5 Pa pressure. [Performed on one > of the drytek tools, consistent with previous material groups.] > 8. Deposit 40 nm of Ag. [innotec or metallica] > 9. Etch Si NWs in an etchant consisting of HF (4.6 M) , H2O2 (0.44 > M), and H2O. [wbgeneral] > 10. Remove microspheres by soaking in toluene for 2 hr. [wbsolvent] > 11. Remove Ag film by soaking in nitric acid for 15 min. [wbgeneral] > > If necessary, steps 1?6 and 7?11 could be performed outside SNF (in > our lab in McCullough Bldg., for instance). > > > *Amount and form > *Two or three 30-mL vials containing microspheres (of two or three > different sizes) suspended in 15 mL DI water + 15 mL methanol. Once > the 15-mL DI-water-suspended material (as purchased) has been diluted > with methanol, no further mixing will be required. > > > *Storage* > If the entire process flow is approved for use in SNF, I would store > the vials of microsphere aqueous/methanoic suspensions at SNF. If > only step 7 is approved for SNF, I would store them in our group's lab. > > > *DIsposal* > As per the MSDS, waste materials containing microspheres could be > disposed of in SNF's hazardous materials bins in a sealed, labeled > plastic bag, due to their non-hazardous nature. > > > Thank-you for considering this new material for use at SNF. I would > enjoy the opportunity to discuss possible amendments to the > abovementioned process flow if necessary to allow it in the cleanroom. > > Best regards, > > ? Aaron > > > -- > Aaron Hryciw > Postdoctoral Scholar > Geballe Laboratory for Advanced Materials > Stanford University > 476 Lomita Mall (04-490) > McCullough Building, Rm. 325 > Stanford, CA 94305-4045 > > Tel.: (650) 723-5840 > Fax.: (650) 736-1984 -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From newsletter at nilt.com Fri Oct 12 01:34:28 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 12 Oct 2007 10:34:28 +0200 Subject: NILT nanonews october 12: First organic circuit cast, IBM attempts to reinvent memory, Toshiba explores NIL for semiconductor manufacturing Message-ID: An HTML attachment was scrubbed... URL: From rick.clayton at invisageinc.com Fri Oct 12 13:25:20 2007 From: rick.clayton at invisageinc.com (Rick Clayton) Date: Fri, 12 Oct 2007 13:25:20 -0700 Subject: Initial discussion on working with SNF for processing PbS Message-ID: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> Hello; My name is Rick Clayton, and I am VP of Advanced Materials for InVisage Technologies, an early stage (still stealth mode) technology company working on advanced electronics. We wish to do work within the SNF, and I want to start the process of material approval prior to full engagement. Many of the detailed questions below are more applicable once we are more familiar with your facility, but I will provide a top level description here as a first step in the process of getting our material approved. Core material: PbS associated other materials: Thiols (Mercaptans): Ethane Thiol, Ethane DiThiol, Benzene Thiol (may include other thiols in the future) process chemicals: toluene, chloroform, acetonitrile, acetone, hexane Incoming material: The PbS would be in either powder or solution (toluene, chloroform, hexane, or other non-polar solvent). Typically we would use about 50-100 ml of our material per day. a rough process flow: Our device involves spinning films of PbS onto a substrate (usually a Si wafer), doing some solution processing of the wafer with the thiols, depositing masking materials, etching the PbS film, and then depositing encapsulation materials. Once the wafer is finished we may either die saw or test at wafer level. We will be developing solvent systems and spin profiles to optimize our films. We will be developing masking and etch processes We will be developing encapsulation processes ---------------------------------------------- Please provide as much information as you can about your chemical or material. It may very well be the first time anyone on the SpecMat committee has heard of this chemical/material, so it will be your responsibility to educate us. We also have a large archive of chemicals and materials that have been approved, so we may also be able to help you in selecting a chemical or process 1. Your contact information: Name, Coral login, phone number, email address and who you work for (your PI or company.) 2. The chemical or material. Please provide all common names, trade names, and CAS numbers where appropriate. Include an MSDS, if available; or provide the reason, if not. Make sure to include information for any new secondary chemicals (such as a developer for a new resist). Read the MSDSs as well as the Stanford Chemical Storage Groups and the Stanford Chemical Safety Data Base sections on this website to determine the Storage Group Identifier and Main Hazard Class of your chemical/material. 3. Vendor/manufacturer info: address and phone number, website URL. 4. Reason for request: Please give serious thought to this. If you have any process information (application notes from the vendor, protocol from another lab, experimental methods section of an article), please include it, preferably as attachments. Ask yourself these questions: Is this the latest procedure? Are there newer/safer alternatives that will also work for my project? Will any of the current SNF approved chemicals and materials work for me? 5. Process Flow: Please provide a detailed process flow description on how and where you proposed to use this chemical. This should include all Lab equipment to be used for processing your wafers once your new chemical or material has been used (even if your new material is a film that is removed, it may still pose potential contamination concerns.) Make sure to include wet benches. Please note that f the chemical/material is to be used in any the "clean" equipment, purity specifications will be needed. This is most important for chemicals/material that are not normally used for VLSI device fabrication. To be allowed into a "clean" tool, the material should MOS grade or better. 6. Amount and form. How much will you bring in? Is it solid, powder or liquid? (Note: as a general rule, powders are not permitted in the cleanroom.) Do you need to mix it to use it? 7. Storage: Will you be storing your chemical/material at SNF? If so, please note any potential reactivities (this should be on the MSDS). Storage groups A,B,D and L are stored in the yellow solvent cabinet in the furnace support area, while storage groups C, E, F and G are stored on top of one of the Pass-through Carts. Ensure your chemical container or material is properly labeled. If there is no available room, it must be stored by in the bulk storage area. You will then need to obtain it from receiving area personnel each time you want to use it and return it to them when you are finished using it (or each time you leave the lab). Note that there is no storage of chemicals/materials in the processing lab or at any wet bench. 8. DIsposal: How will you dispose of any waste or excess chemical or material? In your discussions with experts and vendors, try to determine the best way to dispose of your spent chemicals and by-products. Please refer to the SNF Labmembers Safety Manual for the different methods of waste disposal that are available in the lab. ---------------------------------------------- Please get in touch about next steps. Thanks, Rick ------------------------------------- Rick Clayton VP Advanced Materials InVisage Technologies mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, M5G 1L7 Office: 416 673 6520 mobile: 613 291 6578 email: rick.clayton at invisageinc.com This email contains information that is confidential. The information is intended to be for the recipient named in the body of the message. If you are not the intended recipient please destroy this email and be aware that any disclosure, copying, distribution or use of the contents of this information is prohibited. If you have received this email in error, kindly notify the sender of this email immediately. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS_Ethanedithiol_Sigma-Aldrich.pdf Type: application/pdf Size: 58290 bytes Desc: MSDS_Ethanedithiol_Sigma-Aldrich.pdf URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS_Thiophenol_aka_benzenethiol_Sigma-Aldrich.pdf Type: application/pdf Size: 71422 bytes Desc: MSDS_Thiophenol_aka_benzenethiol_Sigma-Aldrich.pdf URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS_Ethanethiol_Sigma-Aldrich.pdf Type: application/pdf Size: 68876 bytes Desc: MSDS_Ethanethiol_Sigma-Aldrich.pdf URL: From chris.detrick at global-fab.com Tue Oct 16 00:32:12 2007 From: chris.detrick at global-fab.com (Chris Detrick) Date: Tue, 16 Oct 2007 03:32:12 -0400 (EDT) Subject: Global Fab Surplus Equipment Message-ID: <1101845668240.1101401002153.9044.5.150330A0@scheduler> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ October 15, 2007 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ G-Fab is built on the principles of providing quality products and reliable service in the Used Semiconductor Equipment and Surplus Semiconductor Spares and Subassemblies sector. We provides Surplus, Rebuilt and Refurbished Semiconductor Process Equipment to Integrated Device Manufacturers, Wafer Foundries, Research and Development Sites and to the semiconductor refurbishing and rebuilding community throughout the world. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Available for immediate sale! AMAT Mira CMP [http://rs6.net/tn.jsp?t=qmi6rfcab.0.wlh6f5bab.jfe8jybab.9044&ts=S0288&p=http%3A%2F%2Fwww.global-fab.com%2F]We have the following equipment for sale. Contact us right away if you have any interest. Please feel free to forward this email to anyone you feel may have an interest. We want to move them quickly and the first acceptable bid will get the tool. * Complete 4" GaAs Fab tool set * Disco DFG 840 Grinder (2 available) * Varian Kestrel 750 Implanter * Varian Kestrel 650 Implanter * AMAT Centura DPS Etcher * Hitachi S4700 SEM 200mm * IPEC 372 CMP with Nova scan (2 available) * Advantest T666AF ESD Tester (Very low price) * Gasonics Aura 3010 asher (4 available) * Applied Materials MxP+ chambers * ISI Lithography ArF Microstep CHBR-ARF, Manual193nmCymer Laser 200mm * Novellus Concept 3 Vector ULK and UV Cure Tool 300mm * SCP Global 8400 Wetdeck 200mm * GSI Lumonics Laser marker * Novellus C1 & C2 fully refurbished with warranty * Axcelis Ultra 7.0 Low energy Implanter * Axcelis GSD Ultra Implanter * Varian E500 Implanter * Ecosys Scrubber * Kokusai DJ-833 (4 available) * AMAT IPS chamber 200mm Global Fab Surplus has active RFQ's for the below equipment. If you have any of this equipment please contact us right away. We are interested in helping you dispose of it. * Complete 200mm, 150mm, 125mm and 100mm wafer fabs or toolsets * Applied Materials Centura 5200 HDP chamber 200mm * Applied Materials Mirra Mesa 200mm * Applied Materials Quantum X Implanter 200mm * Axcelis Vision 80 200mm * Axcellis GSD HE 200mm * DNS FC821L 200mm * Ebara WCMP FREX200 200mm * Mattson Steag 2800 AST * Novellus Cu Plater w/EBR 200mm * TEL Act 8 200mm * Varian 160XP Implanter 150mm * WJ 999s ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Thank you for your time. Please email or call us for full detailed specs and pictures of these tools. Sincerely, ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ David Lee 719-686-0128 Colorado Springs support at global-fab.com Chris Detrick 805-215-9188 California chris.detrick at global-fab.com Global Fab Surplus [http://rs6.net/tn.jsp?t=qmi6rfcab.0.wlh6f5bab.jfe8jybab.9044&ts=S0288&p=http%3A%2F%2Fwww.global-fab.com%2F] www.global-fab.com ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat at snf.stanford.edu&a=1101845668240 This email was sent to specmat at snf.stanford.edu, by chris.detrick at global-fab.com Update Profile/Email Address http://visitor.constantcontact.com/d.jsp?p=oo&m=1101401002153&se=9044&t=1101845668240&lang=en&reason=F Instant removal with SafeUnsubscribe(TM) http://visitor.constantcontact.com/d.jsp?p=un&m=1101401002153&se=9044&t=1101845668240&lang=en&reason=F Privacy Policy: http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906 -------------- next part -------------- An HTML attachment was scrubbed... URL: From uli at snf.stanford.edu Tue Oct 16 11:14:15 2007 From: uli at snf.stanford.edu (Uli Thumser) Date: Tue, 16 Oct 2007 11:14:15 -0700 Subject: wbsilicide materials question In-Reply-To: <47028DD4.2050304@snf.stanford.edu> References: <47028DD4.2050304@snf.stanford.edu> Message-ID: <4714FF77.7000400@snf.stanford.edu> Dear SpecMat Committee: I am still confused about glass wafers being allowed at the wbsilicide. I train users at the wbsilicide and I tell them glass wafers are NOT allowed. If specmat is not going to answer me, who else would know? This is on our web page: /"Acceptable Materials Silicide Wet Bench: wbsilicide / /The wbsilicide wet bench is in the Semiclean Equipment Group . / /Special rules apply to the materials policy for this equipment. Wafers may contain only the standard Al, Ti and W silicides which have been deposited using the balzers and gryphon systems at SNF. Wafers may not contain any free metal films (Al, Ti, etc.) Wafers containing or exposed to any free metal films must be processed at wbmetal or wbgeneral. Wafer that have been processed at wbsilicide are not allowed in any Clean equipment afterward./ /Special cases:/ * /Glass substrates. These may be processed here only with prior staff approval. Because glass contains large amounts of sodium, the baths must be undergo standard decontamination procedures. / * /Indium Tin Oxide-containing substrates. These may be processed here only with prior staff approval. Use only your own labeled cassettes. Baths must undergo decontamination following use./ /Materials control policies are governed by equipment groups; for the description of this policy, click . For equipment compatibility with specific material"/ Uli Uli Thumser wrote: > Is this page still true? > http://snf.stanford.edu/Equipment/wbsilicide/Materials.html > > Uli > -- Uli Thumser Stanford Nanofabrication Facility Center for Integrated Systems 420 Via Palou Mall, CIS Room 146 Stanford, CA 94305 (650)725-3694 uli at snf.stanford.edu From chris.detrick at global-fab.com Wed Oct 17 00:17:48 2007 From: chris.detrick at global-fab.com (Christopher Detrick) Date: Wed, 17 Oct 2007 03:17:48 -0400 (EDT) Subject: AMAT DPS Etcher Message-ID: <1101847073546.1101401002153.9044.6.14030546@scheduler> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ October 16, 2007 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Greetings! Global Fab Surplus has an AMAT DPS etcher and two Disco DFG 840 grinders available for imediate sale. These are in addition to the equipment on our previous email sent yesterday. Below are the specs for the DPS etcher. This tool is in excellent condition and is being maintained by Applied Materials under a service contract. If you are interested in this system please contact us right away. These are priced to sell quickly. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ AMAT Centura DPS Etcher Process Metal Etch Process Software Version E4.3 System Power Rating 208VAC 3Phase 4W Loading Configuration 2 loaders config Equipment manuals available? Yes Tool under OEM service contract? Yes Description Chemicals / Gases Used Photo Attached Chm Position 1 Etch Chamber A CL2, BCL3, CF4, N2, Ar, CHF3, NF3, O2 Chm Position 2 Etch Chamber B CL2, BCL3, CF4, N2, Ar, CHF3, NF3, O2 Chm Position 3 Strip Chamber C NH3, CF4, N2, O2 Chm Position 4 Strip Chamber D NH3, CF4, N2, O2 Chm Position ___ Orienter Chamber F N2 Chm Position ___ Cooldown Chamber E N2 PLATFORM TYPE 1 Etch 5200 Legacy Centura 1 Common Mainframe CHAMBER POSTION 'A' 2 Metal A1, DPS R1 1 includes ESC, heated turbo pump and foreline and 6 gas lines default. includes Vpp and Tc monitoring at the wafer and dome lift. CHAMBER POSTION 'B' 1 3 Metal A1, DPS R1 includes ESC, heated turbo pump and foreline and 6 gas lines default. includes Vpp and Tc monitoring at the wafer and dome lift. CHAMBER POSTION 'C' 6 ASP+ 1 Includes chuck type process kit for improved thermal stability CHAMBER POSTION 'D' 7 ASP+ 1 CHAMBER POSTION 'E' 8 Cooldown Chamber 1 CHAMBER POSTION 'F' 9 (OA) Orienter Chamber 1 Wafer Orienter chamber postion F ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Thank you for taking the time to read our email. Please feel free to forward the email to anyone who may be interested any of these tools. Sincerely, ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Chris Detrick (California) 805-215-9188 chris.detrick at global-fab.com David Lee (Colorado) 719-686-0128 support at global-fab.com Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat at snf.stanford.edu&a=1101847073546 This email was sent to specmat at snf.stanford.edu, by chris.detrick at global-fab.com Update Profile/Email Address http://visitor.constantcontact.com/d.jsp?p=oo&m=1101401002153&se=9044&t=1101847073546&lang=en&reason=F Instant removal with SafeUnsubscribe(TM) http://visitor.constantcontact.com/d.jsp?p=un&m=1101401002153&se=9044&t=1101847073546&lang=en&reason=F Privacy Policy: http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906 -------------- next part -------------- An HTML attachment was scrubbed... URL: From bohempixe at roey.com Wed Oct 17 13:25:40 2007 From: bohempixe at roey.com (bohempixe at roey.com) Date: Wed, 17 Oct 2007 12:25:40 -0800 Subject: Hey Elvis Check Out This Watch Message-ID: I had a meeting to attend to, and I needed something classy yet professional to wear. One of my friends told me about your website and I've seen him wearing one of your watches, but I was still sceptical to buy a replica watch. I took my chance though, and ordered a Rolex from your website. When I received it, I was definitely impressed, but wasn't sure if my ssociates would be able to tell it's a replica. But when I showed up to the meeting, they couldn't take their eyes off of my new watch. This watch gave me what I was looking for, classy style, with a touch of professionalism. - Bernardo S., Just Visit http://www.sndhbbe.com End all future transmissions http://www.sndhbbe.com/remove From newsletter at nilt.com Fri Oct 19 00:30:19 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 19 Oct 2007 09:30:19 +0200 Subject: NILT nanonews october 19: Light harvesting nanowire, hitachi achieves nanotechnology milestone for quadrupling terabyte HD, pour yourself a silicon solar panel Message-ID: An HTML attachment was scrubbed... URL: From kenney at slac.stanford.edu Fri Oct 19 14:07:38 2007 From: kenney at slac.stanford.edu (Chris Kenney) Date: Fri, 19 Oct 2007 14:07:38 -0700 (PDT) Subject: Material Query Message-ID: Name: Chris Kenney Coral: kenney Phone: 725-3661 Email: kenney at slac.stanford.edu Organization: Molecular Biology Consortium Material: Gadolinium MSDS: is attached Vendor: Lesker http://www.lesker.com/newweb/deposition_materials/depositionmaterials_evaporati$ Reason: Gadolinium has the highest thermal neutron capture cross section. By placing a thin (~1000A) film on sensors made at SNF, we can turn them into neutron detectors. Alternative materials include Boron, Lithium, and Cadmium. However these require much thicker films due to their lower cross sections. Process Flow: Would like to deposit in the Innotec. Last step in device fabrication. Devices will leave the lab after this. There could be some photoresist involved as a mask, which would be removed in acetone at WBsolvent. The Telemark Evaporation Guide is attached. It states that the suitability of Gd for electron-beam evaporation is excellent. Amount: less than 100 grams Form: solid pieces, about ~2 grams each Storage: Will not be stored at SNF Disposal: Will be incorporated into the film on inside of Innotec bell jar. The Gd will presumably be disposed of along with the rest of the film stack via vacuuming/blasting. Please feel free to ask any questions. Thanks, Chris -------------- next part -------------- A non-text attachment was scrubbed... Name: msds_Gd.pdf Type: application/pdf Size: 116512 bytes Desc: URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Ed Grapers LEBOW inc Telemark evapguide.pdf Type: application/pdf Size: 184745 bytes Desc: URL: From jprovine at stanford.edu Fri Oct 19 14:23:32 2007 From: jprovine at stanford.edu (J Provine) Date: Fri, 19 Oct 2007 14:23:32 -0700 Subject: request for etching SiC with covered metal in lampoly Message-ID: <20071019142332.bbvt9hp5hcgc08c8@webmail.stanford.edu> Dear Specmat Committee, I would like to use lampoly to etch SiC with a mix of HCl and HBr. that is fine, but i would like to have metal on the SiC. The metal won't be masking layer and can be covered by oxide and resist for masking. However, there is metal below the SiC membrane, so the metal will be temporarily exposed to the etch. The key is that i want metal on the top & bottom of the SiC membrane but not on the sidewalls. A picture of the process I'd like to try is in the attached powerpoint. some notes: 1. what metal is used is not that important to me. i suggest Al because it is semi-clean, a good conductor (suits my purposes), and much of the lampoly chamber is made of Al. 2. this isn't something i'd need to do many times, just a handful of wafers and then it is done. if it turns out to be something we want to do long term another solution will be found. 3. i can organize the etch with staff to coincide with a chamber clean if that is helpful. 4. the total area of SiC etched is small (<5% of the wafer). if another process can achieve the desired endpoint i'd definitely be interested in any suggestions you have. please let me know if there are any questions or clarification i can provide. Thank you. ~j -------------- next part -------------- A non-text attachment was scrubbed... Name: specmat lampoly request.ppt Type: application/vnd.ms-powerpoint Size: 33792 bytes Desc: not available URL: From rissman at stanford.edu Fri Oct 19 14:25:54 2007 From: rissman at stanford.edu (Paul Rissman) Date: Fri, 19 Oct 2007 14:25:54 -0700 Subject: Fwd: Re: Material Query Message-ID: <200710192125.l9JLPvab005652@smtp-roam.Stanford.EDU> >X-Sieve: CMU Sieve 2.3 >Delivered-To: rissman at stanford.edu >X-Authentication-Warning: flora05.slac.stanford.edu: kenney owned >process doing -bs >Date: Fri, 19 Oct 2007 14:24:46 -0700 (PDT) >From: Chris Kenney >To: Paul Rissman >Subject: Re: Material Query > >http://www.lesker.com/newweb/deposition_materials/depositionmaterials_evaporationmaterials_1.cfm?pgid=gd1 > >Perhaps the end bit was truncated. From ahryciw at gmail.com Mon Oct 22 09:12:58 2007 From: ahryciw at gmail.com (Aaron Hryciw) Date: Mon, 22 Oct 2007 09:12:58 -0700 Subject: New material request: polystyrene microspheres in aqueous suspension In-Reply-To: <4d36fb940710101710l30e1d73bl402fde1cc7082918@mail.gmail.com> References: <4d36fb940710101710l30e1d73bl402fde1cc7082918@mail.gmail.com> Message-ID: <4d36fb940710220912m90c9493g982a561f9a430ae4@mail.gmail.com> Hello ? I've been talking with James Conway during Raith training, and he has told me that unfucntionalised latex microspheres are actually not a new material for SNF, since they are already used in the e-beam lab, etc. As such, I assume that there is no problem with my using the spheres in the lab, so long as the rest of my process is compatible with SNF procedures. Cheers! ? Aaron On 10/10/07, Aaron Hryciw wrote: > > Dear SpecMat Committee ? > > Please regard this email as a request for a new material for use at SNF; a > general MSDS for this class of materials (from the chemical supplier from > whom the material has been purchased) is attached. > * > Contact information* > Aaron Hryciw > Coral login: ahryciw > Phone: 3-5840 (office); (650) 353-0347 (cell) > ahryciw at stanford.edu > PI: Mark Brongersma (Mat. Sci. Eng.) > > > * Chemical or material name* > Polystyrene microspheres (diameters between 100 nm and 1 um) suspended in > DI water, 10% solids by weight, 15 mL vials. > MSDS from supplier attached. > Will be diluted with methanol or ethanol before use. > Common/trade names: polymer microsphere suspension, polystyrene > microspheres, polystyrene nanospheres, latex microspheres suspensions. > Storage group identifier: *G*. Non-Reactive Materials and Non-Hazardous > Materials. > Main hazard class: 11. Non Hazardous. > > > *Vendor/manufacturer info > *Duke Scientific Corporation > 2463 Faber Place > P.O. Box 50005 > Palo Alto, CA > 94303 > > Phone: 1-800-334-3883 or 1-650-424-1177 > Fax: 1-650-424-1158 > info at dukesci.com > www.dukescientific.com (in particular: http://208.106.133.230/www.dukescientific.com/pages/pagefb6d.html?s=979&ss=984&t=1007 > ) > * > > Reason for request > *My interest in polystyrene microspheres is due to their use as a > self-assembled monolayer mask, as a means of fabricating large (~cm^2) arrays > of silicon nanowires (NWs) with controlled size, length, and areal density > (please refer to Huang et. al, attached). Nanosphere lithography (NSL) > comprises a rapid, parallel approach to fabricating well-controlled NWs > without requiring conventional photolithographic techniques. The material > used for the mask (viz., the polystyrene microspheres) is also very benign > and poses no health or safety hazards when used properly for this technique. > ** > > * Process Flow* > I intend to follow the general process flow detailed in the attached paper > ( Huang et. al). if necessary, the entire process flow needn't occur in > SNF (only use of the RIE tool is strictly required), although, for the sake > of cleanliness, I would prefer it. > > A full process flow in SNF would be as follows: > > 1. Clean (100) n-type Si wafers or pieces (ca. 1x1 cm^2) in an > ultrasonic cleaner using acetone (10 min), then methanol (5 min). > 2. Clean in Piranha (4:1 v/v H2SO4:H2O2) and RCA solution (1:1:5 > v/v/v NH3:H2O2:H2O @ 80 ?C) for 1 hr. > 3. Rinse in DI water. > 4. Place substrate in a Petri dish (I will have my own dedicated > glassware) and cover with DI water. > 5. Pipette polystyrene microsphere solution (5% solids in 15 mL DI > water + 15 mL methanol) onto water surface and gently tilt Petri dish to > encourage self-assembly of large single-crystal hcp arrays. > 6. Allow water to evaporate slowly, depositing microspheres onto > substrate. [The foregoing six steps could be performed at wbgeneral, > wbmetal, or wbnonmetal, as necessary.] > 7. RIE microsphere array to desired sphere diameter using O2 plasma > etch: 40 sccm, 30 W RF power, 5 Pa pressure. [Performed on one of the > drytek tools, consistent with previous material groups.] > 8. Deposit 40 nm of Ag. [innotec or metallica] > 9. Etch Si NWs in an etchant consisting of HF (4.6 M) , H2O2 (0.44M), and H2O. [wbgeneral] > 10. Remove microspheres by soaking in toluene for 2 hr. [wbsolvent] > 11. Remove Ag film by soaking in nitric acid for 15 min. [wbgeneral] > > > If necessary, steps 1?6 and 7?11 could be performed outside SNF (in our > lab in McCullough Bldg., for instance). > > > *Amount and form > *Two or three 30-mL vials containing microspheres (of two or three > different sizes) suspended in 15 mL DI water + 15 mL methanol. Once the > 15-mL DI-water-suspended material (as purchased) has been diluted with > methanol, no further mixing will be required. > > > *Storage* > If the entire process flow is approved for use in SNF, I would store the > vials of microsphere aqueous/methanoic suspensions at SNF. If only step 7 > is approved for SNF, I would store them in our group's lab. > > > *DIsposal* > As per the MSDS, waste materials containing microspheres could be > disposed of in SNF's hazardous materials bins in a sealed, labeled plastic > bag, due to their non-hazardous nature. > > > Thank-you for considering this new material for use at SNF. I would enjoy > the opportunity to discuss possible amendments to the abovementioned process > flow if necessary to allow it in the cleanroom. > > Best regards, > > ? Aaron > > > -- > Aaron Hryciw > Postdoctoral Scholar > Geballe Laboratory for Advanced Materials > Stanford University > 476 Lomita Mall (04-490) > McCullough Building, Rm. 325 > Stanford, CA 94305-4045 > > Tel.: (650) 723-5840 > Fax.: (650) 736-1984 > -- Aaron Hryciw Postdoctoral Scholar Geballe Laboratory for Advanced Materials Stanford University 476 Lomita Mall (04-490) McCullough Building, Rm. 325 Stanford, CA 94305-4045 Tel.: (650) 723-5840 Fax.: (650) 736-1984 -------------- next part -------------- An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Mon Oct 22 10:04:46 2007 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 22 Oct 2007 10:04:46 -0700 Subject: New material request: polystyrene microspheres in aqueous suspension In-Reply-To: <4d36fb940710220912m90c9493g982a561f9a430ae4@mail.gmail.com > References: <4d36fb940710101710l30e1d73bl402fde1cc7082918@mail.gmail.com> <4d36fb940710220912m90c9493g982a561f9a430ae4@mail.gmail.com> Message-ID: <6.2.5.6.2.20071022093613.01e5fdc8@stanford.edu> Aaron, Yes, it is true latex microspheres are not new to the fab. There is however limitations on how and where they can be used in the fab. Please do not take this approval as an open approval for microspheres, just approval of your outlined process flow. It is important the spheres be brought in to the fab in solution and not in the dry form. Reviewing your proposed process, the sphere ashing should be done in Dryteck 1. You must also collect your Ag etchant locally. This includes all of the rinse water as well. None of the Ag solutions are allowed to be aspirated or dumped down the drains. Remember any solutions which are brought in to the fab needs to have a yellow chemical label. These can be picked up from Manhaz. I am aware I've been very derelict in my specmat responsibilities. I apologize for this. Regards, Ed At 09:12 AM 10/22/2007, Aaron Hryciw wrote: >Hello ? > >I've been talking with James Conway during Raith >training, and he has told me that >unfucntionalised latex microspheres are actually >not a new material for SNF, since they are >already used in the e-beam lab, etc. As such, I >assume that there is no problem with my using >the spheres in the lab, so long as the rest of >my process is compatible with SNF procedures. > >Cheers! > > ? Aaron > > >On 10/10/07, Aaron Hryciw <ahryciw at gmail.com> wrote: >Dear SpecMat Committee ? > >Please regard this email as a request for a new >material for use at SNF; a general MSDS for this >class of materials (from the chemical supplier >from whom the material has been purchased) is attached. > >Contact information >Aaron Hryciw >Coral login: ahryciw >Phone: 3-5840 (office); (650) 353-0347 (cell) >ahryciw at stanford.edu >PI: Mark Brongersma (Mat. Sci. Eng.) > > >Chemical or material name >Polystyrene microspheres (diameters between 100 >nm and 1 um) suspended in DI water, 10% solids by weight, 15 mL vials. >MSDS from supplier attached. >Will be diluted with methanol or ethanol before use. >Common/trade names: polymer microsphere >suspension, polystyrene microspheres, >polystyrene nanospheres, latex microspheres suspensions. >Storage group identifier: G. Non-Reactive >Materials and Non-Hazardous Materials. >Main hazard class: 11. Non Hazardous. > > >Vendor/manufacturer info >Duke Scientific Corporation >2463 Faber Place >P.O. Box 50005 >Palo Alto, CA >94303 > >Phone: 1-800-334-3883 or 1-650-424-1177 >Fax: 1-650-424-1158 >info at dukesci.com >www.dukescientific.com (in >particular: >http://208.106.133.230/www.dukescientific.com/pages/pagefb6d.html?s=979&ss=984&t=1007 >) > > >Reason for request >My interest in polystyrene microspheres is due >to their use as a self-assembled monolayer mask, >as a means of fabricating large (~cm^2) arrays >of silicon nanowires (NWs) with controlled size, >length, and areal density (please refer to Huang >et. al, attached). Nanosphere lithography (NSL) >comprises a rapid, parallel approach to >fabricating well-controlled NWs without >requiring conventional photolithographic >techniques. The material used for the mask >(viz., the polystyrene microspheres) is also >very benign and poses no health or safety >hazards when used properly for this technique. > >Process Flow >I intend to follow the general process flow >detailed in the attached paper ( Huang et. >al). if necessary, the entire process flow >needn't occur in SNF (only use of the RIE tool >is strictly required), although, for the sake of >cleanliness, I would prefer it. > >A full process flow in SNF would be as follows: >Clean (100) n-type Si wafers or pieces (ca. 1x1 >cm^2) in an ultrasonic cleaner using acetone (10 min), then methanol (5 min). >Clean in Piranha (4:1 v/v H2SO4:H2O2) and RCA >solution (1:1:5 v/v/v NH3:H2O2:H2O @ 80 ?C) for 1 hr. >Rinse in DI water. >Place substrate in a Petri dish (I will have my >own dedicated glassware) and cover with DI water. >Pipette polystyrene microsphere solution (5% >solids in 15 mL DI water + 15 mL methanol) onto >water surface and gently tilt Petri dish to >encourage self-assembly of large single-crystal hcp arrays. >Allow water to evaporate slowly, depositing >microspheres onto substrate. [The foregoing six >steps could be performed at wbgeneral, wbmetal, or wbnonmetal, as necessary.] >RIE microsphere array to desired sphere diameter >using O2 plasma etch: 40 sccm, 30 W RF power, 5 >Pa pressure. [Performed on one of the drytek >tools, consistent with previous material groups.] >Deposit 40 nm of Ag. [innotec or metallica] >Etch Si NWs in an etchant consisting of HF (4.6 >M) , H2O2 (0.44 M), and H2O. [wbgeneral] >Remove microspheres by soaking in toluene for 2 hr. [wbsolvent] >Remove Ag film by soaking in nitric acid for 15 min. [wbgeneral] >If necessary, steps 1?6 and 7?11 could be >performed outside SNF (in our lab in McCullough Bldg., for instance). > > >Amount and form >Two or three 30-mL vials containing microspheres >(of two or three different sizes) suspended in >15 mL DI water + 15 mL methanol. Once the 15-mL >DI-water-suspended material (as purchased) has >been diluted with methanol, no further mixing will be required. > > >Storage >If the entire process flow is approved for use >in SNF, I would store the vials of microsphere >aqueous/methanoic suspensions at SNF. If only >step 7 is approved for SNF, I would store them in our group's lab. > > >DIsposal >As per the MSDS, waste materials containing >microspheres could be disposed of in SNF's >hazardous materials bins in a sealed, labeled >plastic bag, due to their non-hazardous nature. > > >Thank-you for considering this new material for >use at SNF. I would enjoy the opportunity to >discuss possible amendments to the >abovementioned process flow if necessary to allow it in the cleanroom. > >Best regards, > > ? Aaron > > >-- >Aaron Hryciw >Postdoctoral Scholar >Geballe Laboratory for Advanced Materials >Stanford University >476 Lomita Mall (04-490) >McCullough Building, Rm. 325 >Stanford, CA 94305-4045 > >Tel.: (650) 723-5840 >Fax.: (650) 736-1984 > > > > >-- >Aaron Hryciw >Postdoctoral Scholar >Geballe Laboratory for Advanced Materials >Stanford University >476 Lomita Mall (04-490) >McCullough Building, Rm. 325 >Stanford, CA 94305-4045 > >Tel.: (650) 723-5840 >Fax.: (650) 736-1984 From mahnaz at stanford.edu Tue Oct 23 16:43:57 2007 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Tue, 23 Oct 2007 16:43:57 -0700 Subject: Barc Message-ID: <471E873D.7050909@stanford.edu> Hello all I am sending this email from Alex's behalf. Asml requesting AZ Barli-ll 200 as an anti reflectivity coating material. I have been given a hard copy of the MSDS which will be in my office if any one would like to take a look. Main components are Ethyl lactate and 1-Methoxy-2-Propanol. The chemicals will be used in KS coater when the system will be up and no other places as of right now. mahnaz From chris.detrick at global-fab.com Thu Oct 25 00:34:16 2007 From: chris.detrick at global-fab.com (Christopher Detrick) Date: Thu, 25 Oct 2007 03:34:16 -0400 (EDT) Subject: AMAT DPS Etcher, Mirra CMP and Disco Grinders Message-ID: <1101856074716.1101401002153.9044.5.14033046@scheduler> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ October 25, 2007 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Greetings! Global Fab Surplus has an AMAT DPS etcher available for immediate sale. The system is still running production and will be removed from the fab in the next few weeks. This system has the second generation Centura frame, VBS+ robot, two ASP+ chambers, and more. It is in excellent condition and we are pricing it to sell very fast. For more information please contact us right away. Also available for immediate sale are: * Two Disco 840 Grinders * ASML Twinscan stepper (vintage 2003, 300mm) * IPEC 372 oxide CMP (two available) * AMAT Mirra with Track ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ AMAT Centura DPS Etcher Process Metal Etch Process Software Version E4.3 System Power Rating 208VAC 3Phase 4W Loading Configuration 2 loaders config Equipment manuals available? Yes Tool under OEM service contract? Yes Description Chemicals / Gases Used Photo Attached Chm Position 1 Etch Chamber A CL2, BCL3, CF4, N2, Ar, CHF3, NF3, O2 Chm Position 2 Etch Chamber B CL2, BCL3, CF4, N2, Ar, CHF3, NF3, O2 Chm Position 3 Strip Chamber C NH3, CF4, N2, O2 Chm Position 4 Strip Chamber D NH3, CF4, N2, O2 Chm Position ___ Orienter Chamber F N2 Chm Position ___ Cooldown Chamber E N2 PLATFORM TYPE 1 Etch 5200 Legacy Centura 1 Common Mainframe CHAMBER POSTION 'A' 2 Metal A1, DPS R1 1 includes ESC, heated turbo pump and foreline and 6 gas lines default. includes Vpp and Tc monitoring at the wafer and dome lift. CHAMBER POSTION 'B' 1 3 Metal A1, DPS R1 includes ESC, heated turbo pump and foreline and 6 gas lines default. includes Vpp and Tc monitoring at the wafer and dome lift. CHAMBER POSTION 'C' 6 ASP+ 1 Includes chuck type process kit for improved thermal stability CHAMBER POSTION 'D' 7 ASP+ 1 CHAMBER POSTION 'E' 8 Cooldown Chamber 1 CHAMBER POSTION 'F' 9 (OA) Orienter Chamber 1 Wafer Orienter chamber postion F ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Thank you for taking the time to read our email. Please feel free to forward the email to anyone who may be interested any of these tools. Sincerely, ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Chris Detrick (California) 805-215-9188 chris.detrick at global-fab.com David Lee (Colorado) 719-686-0128 support at global-fab.com Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat at snf.stanford.edu&a=1101856074716 This email was sent to specmat at snf.stanford.edu, by chris.detrick at global-fab.com Update Profile/Email Address http://visitor.constantcontact.com/d.jsp?p=oo&m=1101401002153&ea=specmat%40snf.stanford.edu&t=1101856074716&lang=en&reason=F Instant removal with SafeUnsubscribe(TM) http://visitor.constantcontact.com/d.jsp?p=un&m=1101401002153&ea=specmat%40snf.stanford.edu&t=1101856074716&lang=en&reason=F Privacy Policy: http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906 -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Thu Oct 25 15:35:31 2007 From: mtang at stanford.edu (Mary Tang) Date: Thu, 25 Oct 2007 15:35:31 -0700 Subject: Initial discussion on working with SNF for processing PbS In-Reply-To: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> References: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> Message-ID: <47211A33.7030704@stanford.edu> Hi all -- I just spoke with Jess and Jim Kruger. Jim is doing the work. Envisage would like to use our wafersaw/cmp room to spin coat or dip wafers in PbS nanoparticles from various solvents and then do some dry etching in the lab. The encapsulation is not likely to be done here since we do not have the capability they need. I think that as long as they have good handling practices and don't store a lot of chemicals here, it would be OK for them to use the solvent bench and spin coater there as needed. Jim is advising them on the dry etching and will keep them honest. The only chemical I have some mild qualms over is chloroform, since its PEL is quite low, but if it's in the utility room and they are careful, I think it's not really too much of a problem. What do you all think? They want to join safety training on Monday. Mary Rick Clayton wrote: > Hello; > My name is Rick Clayton, and I am VP of Advanced Materials for > InVisage Technologies, an early stage (still stealth mode) technology > company working on advanced electronics. > We wish to do work within the SNF, and I want to start the process of > material approval prior to full engagement. > > Many of the detailed questions below are more applicable once we are > more familiar with your facility, but I will provide a top level > description here as a first step in the process of getting our > material approved. > > Core material: PbS > associated other materials: Thiols (Mercaptans): Ethane Thiol, Ethane > DiThiol, Benzene Thiol (may include other thiols in the future) > process chemicals: toluene, chloroform, acetonitrile, acetone, hexane > > Incoming material: > The PbS would be in either powder or solution (toluene, chloroform, > hexane, or other non-polar solvent). > Typically we would use about 50-100 ml of our material per day. > > a rough process flow: > Our device involves spinning films of PbS onto a substrate (usually a > Si wafer), doing some solution processing of the wafer with the > thiols, depositing masking materials, etching the PbS film, and then > depositing encapsulation materials. Once the wafer is finished we may > either die saw or test at wafer level. > We will be developing solvent systems and spin profiles to optimize > our films. > We will be developing masking and etch processes > We will be developing encapsulation processes > > ---------------------------------------------- > Please provide as much information as you can about your chemical or > material. It may very well be the first time anyone on the SpecMat > committee has heard of this chemical/material, so it will be your > responsibility to educate us. We also have a large archive of > chemicals and materials that have been approved, so we may also be > able to help you in selecting a chemical or process > > > 1. *Your contact information:* Name, Coral login, phone number, > email address and who you work for (your PI or company.) > 2. *The chemical or material. *Please provide all common names, > trade names, and CAS numbers where appropriate. Include an MSDS, > if available; or provide the reason, if not. Make sure to > include information for any new secondary chemicals (such as a > developer for a new resist). Read the MSDSs as well as the > Stanford Chemical Storage Groups > and the > Stanford Chemical Safety Data Base > sections > on this website to determine the Storage Group Identifier > and Main > Hazard Class > of your > chemical/material. > 3. *Vendor/manufacturer info:* address and phone number, website URL. > 4. *Reason for request:* Please give serious thought to this. If > you have any process information (application notes from the > vendor, protocol from another lab, experimental methods section > of an article), please include it, preferably as attachments. > Ask yourself these questions: Is this the latest procedure? Are > there newer/safer alternatives that will also work for my > project? Will any of the current SNF approved chemicals and > materials work for me? > 5. *Process Flow:* Please provide a detailed process flow > description on how and where you proposed to use this chemical. > This should include *all* *Lab equipment > *to be used > for processing your wafers once your new chemical or material > has been used (even if your new material is a film that is > removed, it may still pose potential contamination concerns.) > Make sure to include wet benches. Please note that f the > chemical/material is to be used in any the "clean" > > equipment, purity specifications will be needed. This is most > important for chemicals/material that are not normally used for > VLSI device fabrication. To be allowed into a "clean" tool > , > the material should MOS grade or better. > 6. *Amount and form. *How much will you bring in? Is it solid, > powder or > liquid? (Note: as a general rule, powders > are not > permitted in the cleanroom.) Do you need to mix it to use it? > 7. *Storage: *Will you be storing your chemical/material at SNF? If > so, please note any potential reactivities (this should be on > the MSDS). Storage groups > A,B,D and > L are stored in the yellow solvent cabinet in the furnace > support area, while storage groups > C, E, F > and G are stored on top of one of the Pass-through Carts. Ensure > your chemical container or material is properly labeled > . If there > is no available room, it must be stored by in the bulk storage > area. You will then need to obtain it from receiving area > personnel each time you want to use it and return it to them > when you are finished using it (or each time you leave the lab). > Note that there is no storage of chemicals/materials in the > processing lab or at any wet bench. > 8. *DIsposal*: How will you dispose of any waste or excess chemical > or material? In your discussions with experts and vendors, try > to determine the best way to dispose of your spent chemicals and > by-products. Please refer to the SNF Labmembers Safety Manual > for the > different methods of waste disposal that are available in the lab. > > ---------------------------------------------- > > Please get in touch about next steps. > > Thanks, > Rick > ------------------------------------- > Rick Clayton > VP Advanced Materials > InVisage Technologies > mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, > M5G 1L7 > Office: 416 673 6520 > mobile: 613 291 6578 > email: rick.clayton at invisageinc.com > This email contains information that is confidential. The information > is intended to be for the recipient named in the body of the message. > If you are not the intended recipient please destroy this email and be > aware that any disclosure, copying, distribution or use of the > contents of this information is prohibited. If you have received this > email in error, kindly notify the sender of this email immediately. > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Thu Oct 25 16:02:57 2007 From: mtang at stanford.edu (Mary Tang) Date: Thu, 25 Oct 2007 16:02:57 -0700 Subject: Initial discussion on working with SNF for processing PbS In-Reply-To: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> References: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> Message-ID: <472120A1.3080305@stanford.edu> Hi Rick, Jess -- I just spoke with Jim -- and my apologies, I had thought that we were only talking about a dry etch step. Jim was under the impression that you wanted additional processing post-encapsulation as well, including lithography. Could you please provide us with a proposed process flow describing the steps following PbS deposition? There is concern about cross-contamination that we'd like to address. There is information on our website about the equipment and you are certainly welcome to consult with us (and Jim) about specific process concerns. Thanks -- Mary Rick Clayton wrote: > Hello; > My name is Rick Clayton, and I am VP of Advanced Materials for > InVisage Technologies, an early stage (still stealth mode) technology > company working on advanced electronics. > We wish to do work within the SNF, and I want to start the process of > material approval prior to full engagement. > > Many of the detailed questions below are more applicable once we are > more familiar with your facility, but I will provide a top level > description here as a first step in the process of getting our > material approved. > > Core material: PbS > associated other materials: Thiols (Mercaptans): Ethane Thiol, Ethane > DiThiol, Benzene Thiol (may include other thiols in the future) > process chemicals: toluene, chloroform, acetonitrile, acetone, hexane > > Incoming material: > The PbS would be in either powder or solution (toluene, chloroform, > hexane, or other non-polar solvent). > Typically we would use about 50-100 ml of our material per day. > > a rough process flow: > Our device involves spinning films of PbS onto a substrate (usually a > Si wafer), doing some solution processing of the wafer with the > thiols, depositing masking materials, etching the PbS film, and then > depositing encapsulation materials. Once the wafer is finished we may > either die saw or test at wafer level. > We will be developing solvent systems and spin profiles to optimize > our films. > We will be developing masking and etch processes > We will be developing encapsulation processes > > ---------------------------------------------- > Please provide as much information as you can about your chemical or > material. It may very well be the first time anyone on the SpecMat > committee has heard of this chemical/material, so it will be your > responsibility to educate us. We also have a large archive of > chemicals and materials that have been approved, so we may also be > able to help you in selecting a chemical or process > > > 1. *Your contact information:* Name, Coral login, phone number, > email address and who you work for (your PI or company.) > 2. *The chemical or material. *Please provide all common names, > trade names, and CAS numbers where appropriate. Include an MSDS, > if available; or provide the reason, if not. Make sure to > include information for any new secondary chemicals (such as a > developer for a new resist). Read the MSDSs as well as the > Stanford Chemical Storage Groups > and the > Stanford Chemical Safety Data Base > sections > on this website to determine the Storage Group Identifier > and Main > Hazard Class > of your > chemical/material. > 3. *Vendor/manufacturer info:* address and phone number, website URL. > 4. *Reason for request:* Please give serious thought to this. If > you have any process information (application notes from the > vendor, protocol from another lab, experimental methods section > of an article), please include it, preferably as attachments. > Ask yourself these questions: Is this the latest procedure? Are > there newer/safer alternatives that will also work for my > project? Will any of the current SNF approved chemicals and > materials work for me? > 5. *Process Flow:* Please provide a detailed process flow > description on how and where you proposed to use this chemical. > This should include *all* *Lab equipment > *to be used > for processing your wafers once your new chemical or material > has been used (even if your new material is a film that is > removed, it may still pose potential contamination concerns.) > Make sure to include wet benches. Please note that f the > chemical/material is to be used in any the "clean" > > equipment, purity specifications will be needed. This is most > important for chemicals/material that are not normally used for > VLSI device fabrication. To be allowed into a "clean" tool > , > the material should MOS grade or better. > 6. *Amount and form. *How much will you bring in? Is it solid, > powder or > liquid? (Note: as a general rule, powders > are not > permitted in the cleanroom.) Do you need to mix it to use it? > 7. *Storage: *Will you be storing your chemical/material at SNF? If > so, please note any potential reactivities (this should be on > the MSDS). Storage groups > A,B,D and > L are stored in the yellow solvent cabinet in the furnace > support area, while storage groups > C, E, F > and G are stored on top of one of the Pass-through Carts. Ensure > your chemical container or material is properly labeled > . If there > is no available room, it must be stored by in the bulk storage > area. You will then need to obtain it from receiving area > personnel each time you want to use it and return it to them > when you are finished using it (or each time you leave the lab). > Note that there is no storage of chemicals/materials in the > processing lab or at any wet bench. > 8. *DIsposal*: How will you dispose of any waste or excess chemical > or material? In your discussions with experts and vendors, try > to determine the best way to dispose of your spent chemicals and > by-products. Please refer to the SNF Labmembers Safety Manual > for the > different methods of waste disposal that are available in the lab. > > ---------------------------------------------- > > Please get in touch about next steps. > > Thanks, > Rick > ------------------------------------- > Rick Clayton > VP Advanced Materials > InVisage Technologies > mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, > M5G 1L7 > Office: 416 673 6520 > mobile: 613 291 6578 > email: rick.clayton at invisageinc.com > This email contains information that is confidential. The information > is intended to be for the recipient named in the body of the message. > If you are not the intended recipient please destroy this email and be > aware that any disclosure, copying, distribution or use of the > contents of this information is prohibited. If you have received this > email in error, kindly notify the sender of this email immediately. > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From newsletter at nilt.com Thu Oct 25 23:36:28 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 26 Oct 2007 08:36:28 +0200 Subject: NILT nanonews oct. 26: Gold nanorods fight cancer, quantum cascade laser nanoantenna, space elevators Message-ID: <0cdf21b6eb02e554f4dd8d12001d0100@nilt.com> An HTML attachment was scrubbed... URL: From newsletter at nilt.com Fri Oct 26 01:13:17 2007 From: newsletter at nilt.com (newsletter at nilt.com) Date: Fri, 26 Oct 2007 10:13:17 +0200 Subject: NILT nanonews oct. 26: Gold nanorods fight cancer, quantum cascade laser nanoantenna, space elevators Message-ID: An HTML attachment was scrubbed... URL: From anikak at stanford.edu Fri Oct 26 14:06:12 2007 From: anikak at stanford.edu (Anika Kinkhabwala) Date: Fri, 26 Oct 2007 14:06:12 -0700 Subject: Toluene Message-ID: <20071026140612.hsrlvcgx0k0os8sg@webmail.stanford.edu> Hi, I am looking to bring in PMMA dissolved in common solvent Toluene instead of Anisole. Is it appropriate for me to fill out all of the details on the following webpage: http://snf/Materials/NewMatProc.html Just wanted to be sure before I looked up all of the appropriate information. Also, if you know offhand whether or not this will be a problem to bring in, that would be helpful. Thanks! -Anika From mtang at stanford.edu Fri Oct 26 14:12:38 2007 From: mtang at stanford.edu (Mary Tang) Date: Fri, 26 Oct 2007 14:12:38 -0700 Subject: Toluene In-Reply-To: <20071026140612.hsrlvcgx0k0os8sg@webmail.stanford.edu> References: <20071026140612.hsrlvcgx0k0os8sg@webmail.stanford.edu> Message-ID: <47225846.5080106@stanford.edu> Hi all -- I think this should be OK. Toluene has a PEL of 200 ppm (for comparison, so does methanol.) Just warnings about observing proper chemical handling procedures as per all-litho (work in exhausted areas of wet benches, dispose of solid waste in sealed bags, etc. -- the stuff smells) and making sure this is used no differently than other PMMA solutions should be sufficient. Mary Anika Kinkhabwala wrote: > Hi, > > I am looking to bring in PMMA dissolved in common solvent Toluene > instead of Anisole. Is it appropriate for me to fill out all of the > details on the following webpage: > http://snf/Materials/NewMatProc.html > > Just wanted to be sure before I looked up all of the appropriate > information. Also, if you know offhand whether or not this will be a > problem to bring in, that would be helpful. > > Thanks! > -Anika -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mahnaz at stanford.edu Fri Oct 26 15:41:56 2007 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Fri, 26 Oct 2007 15:41:56 -0700 Subject: Initial discussion on working with SNF for processing PbS References: <0B282E3770D15C45AC895C3E63A2A0D83B31FECF72@EXVMBX015-2.exch015.msoutlookonline.net> <47211A33.7030704@stanford.edu> Message-ID: <47226D34.4040705@stanford.edu> we do not know what kind of lab practice they have, I like to reserve the right for chloroform till I see how they work. mahnaz Mary Tang wrote: > Hi all -- > > I just spoke with Jess and Jim Kruger. Jim is doing the work. > Envisage would like to use our wafersaw/cmp room to spin coat or dip > wafers in PbS nanoparticles from various solvents and then do some dry > etching in the lab. The encapsulation is not likely to be done here > since we do not have the capability they need. > > I think that as long as they have good handling practices and don't > store a lot of chemicals here, it would be OK for them to use the > solvent bench and spin coater there as needed. Jim is advising them > on the dry etching and will keep them honest. The only chemical I > have some mild qualms over is chloroform, since its PEL is quite low, > but if it's in the utility room and they are careful, I think it's not > really too much of a problem. > > What do you all think? They want to join safety training on Monday. > > Mary > > Rick Clayton wrote: > >> Hello; >> My name is Rick Clayton, and I am VP of Advanced Materials for >> InVisage Technologies, an early stage (still stealth mode) technology >> company working on advanced electronics. >> We wish to do work within the SNF, and I want to start the process of >> material approval prior to full engagement. >> >> Many of the detailed questions below are more applicable once we are >> more familiar with your facility, but I will provide a top level >> description here as a first step in the process of getting our >> material approved. >> >> Core material: PbS >> associated other materials: Thiols (Mercaptans): Ethane Thiol, Ethane >> DiThiol, Benzene Thiol (may include other thiols in the future) >> process chemicals: toluene, chloroform, acetonitrile, acetone, hexane >> >> Incoming material: >> The PbS would be in either powder or solution (toluene, chloroform, >> hexane, or other non-polar solvent). Typically we would use about >> 50-100 ml of our material per day. >> >> a rough process flow: >> Our device involves spinning films of PbS onto a substrate (usually a >> Si wafer), doing some solution processing of the wafer with the >> thiols, depositing masking materials, etching the PbS film, and then >> depositing encapsulation materials. Once the wafer is finished we >> may either die saw or test at wafer level. We will be developing >> solvent systems and spin profiles to optimize our films. >> We will be developing masking and etch processes >> We will be developing encapsulation processes >> >> ---------------------------------------------- >> Please provide as much information as you can about your chemical or >> material. It may very well be the first time anyone on the SpecMat >> committee has heard of this chemical/material, so it will be your >> responsibility to educate us. We also have a large archive of >> chemicals and materials that have been approved, so we may also be >> able to help you in selecting a chemical or process >> >> >> 1. *Your contact information:* Name, Coral login, phone number, >> email address and who you work for (your PI or company.) >> 2. *The chemical or material. *Please provide all common names, >> trade names, and CAS numbers where appropriate. Include an MSDS, >> if available; or provide the reason, if not. Make sure to >> include information for any new secondary chemicals (such as a >> developer for a new resist). Read the MSDSs as well as the >> Stanford Chemical Storage Groups >> and the >> Stanford Chemical Safety Data Base >> sections >> on this website to determine the Storage Group Identifier >> and Main >> Hazard Class >> of your >> chemical/material. >> 3. *Vendor/manufacturer info:* address and phone number, website URL. >> 4. *Reason for request:* Please give serious thought to this. If >> you have any process information (application notes from the >> vendor, protocol from another lab, experimental methods section >> of an article), please include it, preferably as attachments. >> Ask yourself these questions: Is this the latest procedure? Are >> there newer/safer alternatives that will also work for my >> project? Will any of the current SNF approved chemicals and >> materials work for me? >> 5. *Process Flow:* Please provide a detailed process flow >> description on how and where you proposed to use this chemical. >> This should include *all* *Lab equipment >> *to be used >> for processing your wafers once your new chemical or material >> has been used (even if your new material is a film that is >> removed, it may still pose potential contamination concerns.) >> Make sure to include wet benches. Please note that f the >> chemical/material is to be used in any the "clean" >> >> equipment, purity specifications will be needed. This is most >> important for chemicals/material that are not normally used for >> VLSI device fabrication. To be allowed into a "clean" tool >> , >> the material should MOS grade or better. >> 6. *Amount and form. *How much will you bring in? Is it solid, >> powder or >> liquid? (Note: as a general rule, powders >> are not >> permitted in the cleanroom.) Do you need to mix it to use it? >> 7. *Storage: *Will you be storing your chemical/material at SNF? If >> so, please note any potential reactivities (this should be on >> the MSDS). Storage groups >> A,B,D and >> L are stored in the yellow solvent cabinet in the furnace >> support area, while storage groups >> C, E, F >> and G are stored on top of one of the Pass-through Carts. Ensure >> your chemical container or material is properly labeled >> . If there >> is no available room, it must be stored by in the bulk storage >> area. You will then need to obtain it from receiving area >> personnel each time you want to use it and return it to them >> when you are finished using it (or each time you leave the lab). >> Note that there is no storage of chemicals/materials in the >> processing lab or at any wet bench. >> 8. *DIsposal*: How will you dispose of any waste or excess chemical >> or material? In your discussions with experts and vendors, try >> to determine the best way to dispose of your spent chemicals and >> by-products. Please refer to the SNF Labmembers Safety Manual >> for the >> different methods of waste disposal that are available in the lab. >> >> ---------------------------------------------- >> >> Please get in touch about next steps. >> >> Thanks, >> Rick >> ------------------------------------- >> Rick Clayton >> VP Advanced Materials >> InVisage Technologies >> mail: 101 College St., South Tower, Rm 312, Toronto, Ontario, Canada, >> M5G 1L7 >> Office: 416 673 6520 >> mobile: 613 291 6578 >> email: rick.clayton at invisageinc.com >> >> This email contains information that is confidential. The information >> is intended to be for the recipient named in the body of the message. >> If you are not the intended recipient please destroy this email and >> be aware that any disclosure, copying, distribution or use of the >> contents of this information is prohibited. If you have received this >> email in error, kindly notify the sender of this email immediately. >> > > > From mahnaz at stanford.edu Wed Oct 31 15:57:46 2007 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Wed, 31 Oct 2007 15:57:46 -0700 Subject: [Fwd: yellow label request] Message-ID: <4729086A.1090702@stanford.edu> -------- Original Message -------- Subject: yellow label request Date: Wed, 31 Oct 2007 12:52:11 -0700 From: Richard Yeh To: mahnaz at snf.stanford.edu Hi Mahnaz, How are you doing? Thanks for training me on the ASML last week. I would like to request a yellow label so I can bring in an Aluminum wet etchant (1 gal bottle) into SNF. The etchant is chemically similar to the Cyantek AL-11 etchant used at wbmetal with the exception that it has surfactants. The MSDS is attached and the key chemicals are phosphoric acid, acetic acid and nitric acid. Thanks for your help. Richard yeh at snf -- Alces Technology PO Box 11180 Jackson, WY 83002 (307) 732-1994 x251 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: msds e-6 metal etch w-aes cpg grade fujifilm 03-30-06.pdf Type: application/pdf Size: 192426 bytes Desc: not available URL: