Thermally Conductive Adhesive Transfer Tapes

Mary Tang mtang at stanford.edu
Fri Apr 25 13:27:34 PDT 2008


Oh, and here's the technical datasheet.

M

Mary Tang wrote:
> Hi all --
>
> Il Woong got this information from UCSB, where he does 
> gold-contaminated etching in the STS.  This is what they recommend for 
> bonding wafers.  It is thermally conductive, yet electrically 
> insulating.  It also appears to have a "ceramic filler" for thermal 
> conductivity which appears to be boron nitride.  There's an 
> antioxidant in this formulation as well, which appears from the MSDS 
> CAS number to be Octadecyl 
> 3-(3,5-Di-tert-butyl-4-Hydroxyphenyl)Propionate -- basically, just a 
> long chain organic no worse than the acrylate adhesive.
>
> The 3M website is here:
>
> http://solutions.3m.com/wps/portal/3M/en_WW/electronics/home/productsandservices/products/ProductNavigator/TapeAdhesives/?PC_7_RJH9U5230GE3E02LECIE20KHO6_nid=FDPLP2X4B3beG7W0C8BLTFgl 
>
>
> What are the prospects for use in STSetch?
>
> Mary
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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