UV3 Resist
Mary Tang
mtang at stanford.edu
Mon Aug 4 11:51:03 PDT 2008
Hi Claudia --
Just for the sake of completeness... Could we get a process flow from
you, describing your substrate (if not silicon), which tools you plan to
use (headway2 or laurell for coat, which exposure tool for flood expose,
the temperature of your bake, and where/how you plan to develop), and
how you will dispose of any waste?
Thanks,
Mary
Claudia Richter wrote:
> Dear SpecMat committee,
>
> I'm submitting a MSDS for UV3 resist. I think it may be a resist that
> might have been used in the past at SNF. It is a positive chemically
> amplified resist. I plan on trying out a flood exposure test on
> wafers/pieces that have patterned UV3 resist (softbaked). Its the hope
> that this test can help eliminate the use of organic solvents to strip
> resist.
>
> The plan is to UV (flood) expose the unexposed resist and then doing a
> post-flood exposure bake in an oven (small Blue M oven ok to use?) and
> then attempting to remove the resist with your standard developers
> (LDD26W).
>
> Is this ok for me to do?
>
> Best regards,
> Claudia
>
--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu
More information about the specmat
mailing list