UV3 Resist

Mary Tang mtang at stanford.edu
Mon Aug 4 13:26:39 PDT 2008


Ooooh!  OK, no problem at all, then, your process is fine.  Good luck.

Mary

Claudia Richter wrote:
> Hi Mary,
>
> The substrate is silicon (actually pieces). They already have baked 
> patterned resist on it. The idea is to use the UV oven (next to the EV 
> aligner) for about 15 min to flood expose the unexposed regions. Then 
> do a post flood exposure bake ( small Blue M oven) for about 30 min at 
> 120-130C. Then finally the LDD26W developer for about 5-10 min at the 
> Headway station to make sure the resist is removed. As with the 
> positive resists used at SNF the resist could either be poured into 
> the Headway sink or collected (which ever is best). 
>
> This is a short test and no liquid chemicals (resists) are planned to 
> be brought in.
>
> Thanks!
> Claudia
>
>  
>
>     -------------- Original message from Mary Tang
>     <mtang at stanford.edu>: --------------
>
>
>     > Hi Claudia --
>     >
>     > Just for the sake of completeness... Could we get a process flow
>     from
>     > you, describing your substrate (if not silicon), which tools you
>     plan to
>     > use (headway2 or laurell for coat, which exposure tool for flood
>     expose,
>     > the temperature of your bake, and where/how you plan to
>     develop), and
>     > how you will dispose of any waste?
>     >
>     > Thanks,
>     >
>     > Mary
>     >
>     > Claudia Richter wrote:
>     > > Dear SpecMat committee,
>     > >
>     > > I'm submitting a MSDS for UV3 resist. I think it may be a
>     resist that
>     > > might have been used in the past at SNF. It is a positive
>     chemically
>     > > amplified resist. I plan on trying out a flood exposure test on
>     > > wafers/pieces that have patterned UV3 resist (softbaked). Its
>     the hope
>     > > that this test can help eliminate the use of organic solvents
>     to strip
>     > > resist.
>     > >
>     > > The plan is to UV (flood) expose the unexposed resist and then
>     doing a
>     > > post-flood exposure bake in an oven (small Blue M oven ok to
>     use?) and
>     > > then attempting to remove the resist with your standard
>     developers
>     > > (LDD26W).
>     > >
>     > > Is this ok for me to do?
>     > >
>     > > Best regards,
>     > > Claudia
>     > >
>     >
>     >
>     > --
>     > Mary X. Tang, Ph.D.
>     > Stanford Nanofabrication Facility
>     > CIS Room 136, Mail Code 4070
>     > Stanford, CA 94305
>     > (650)723-9980
>     > mtang at stanford.edu
>     > http://snf.stanford.edu
>     > 
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




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