From mtang at stanford.edu Mon Dec 1 22:53:52 2008 From: mtang at stanford.edu (Mary Tang) Date: Mon, 01 Dec 2008 22:53:52 -0800 Subject: Special Materials In-Reply-To: References: <492C856B.10700@stanford.edu> Message-ID: <4934DB80.2050909@stanford.edu> HI Mike and Senyo -- Much better. However, it looks like it might be ethylene diamine based. Better than cyanide salts, but still not the best. First off, it stains benches terribly. Second, we've banned EDP from the lab (ethylene diamine/pyrocatechol mix for etching silicon) because of safety concerns (same thing as cyanide salts -- OK if you have a dedicated setup with engineering controls, but not really OK to heat at our manual benches, since NH3 gas can be generated under a broad range of conditions.) There's not a whole lot of info in the MSDS (is it really ethylene diamine and what's the rough concentration?) and I don't know what your protocol is (is the solution heated? Do you need a power supply? A quick Google search suggests to me this EDA is used for electroless plating of gold.) What I'd really like to see is a clear, documented protocol for gold electroplating at the wbgaas bench -- everything from the administrative controls (like, maybe reserving the whole bench and blocking off with hazard tape when you're plating, or posting signs or sending out email notifications or whatever) to engineering controls (e.g. limited volumes, storing the power supply away from the bench) and as much info as possible about the chemical composition and the chemical reaction and byproducts. By the way, it seems that most gold electroplating solutions are incompatible with oxidizers and acids. So for storage... this could be stored in the personal chemicals storage in the chemicals passthrough (although there are oxidizers there, personal chemicals are separated by secondary containment) or in the Flammables cabinet area (there are no incompatibles in that area.) We'll find a spot once you have the chemical (and a protocol that Uli and Jim H are happy with.) Mary Mike Wiemer wrote: > Hi Mary & Specmat, > > Senyo and I are working together on this. > > 1.) How about if we switch the chemical to the non-cyanide based one? > Everything else would be the same (see Senyo's specmat request below). I > have attached the new MSDS for the non-cyanide chemical. > > 2.) Where would we store the chemical? I would be a 1 gal jug.... > > Best, > > -Mike > > > > -----Original Message----- > From: Mary Tang [mailto:mtang at stanford.edu] > Sent: Tuesday, November 25, 2008 3:08 PM > To: Senyo Dogbe > Cc: specmat at snf.stanford.edu; uli at snf.stanford.edu; > mwiemer at snf.stanford.edu > Subject: Re: Special Materials > > Hi Senyo -- > > Thanks for the request. I'm afraid, though, that you would have to > justify using cyanide-based solution in our lab. Although this has been > > used in the distant past, it was used at a wet bench that was dedicated > for gold electroplating. We no longer have this set up -- and manual > handling of these kinds of chemicals poses greater risks. So, if this > were to be allowed, we'd have to have very strict procedures and rules > about use of this class of chemicals. > > The reason is that these cyanide based solutions are highly toxic. > Cyanide can be easily absorbed through the skin upon contact. Free > cyanide vapors are extremely toxic and can be easily generated when the > solution comes in contact with oxidizing acids, as might occur when > using at one of the shared stations. In fact, when medical > professionals respond to cyanide poisonings, they will not work on a > victim until all clothing and anything the person has come into contact > is removed. And my concern is personal -- similar cyanide solutions are > > often used in synthetic chemistry -- just down the hall from the lab > where I did my graduate work, a post-doc doing synthetic chemistry died > from cyanide poisoning. > > I understand that cyanide based solutions are preferred for some > applications, especially electronics, but that much safer solutions, > such as sulfide based ones are also available. I'd recommend doing some > > investigation into other electroplating solutions to determine which > would meet your needs. If your requirements are more stringent, then > I'd suggest sending your devices out for gold electroplating -- there > are several local services which specialize in electronics > applications. Finally, I'm copying Mike Wiemer on this -- Mike is also > interested in a non-cyanide-based gold electroplating solution for quick > > turnaround processing. Maybe you two could share notes and work with > Uli and Jim H (who are responsible for the wbgaas station) on > establishing a procedure for the lab. > > Thanks, > > Mary > > Senyo Dogbe wrote: > >> Dear Sir/Madam, >> I would like to seek permission to use a non-standard chemical for >> future work in device processing at SNF. >> The information below and the attached MSDS provide more information >> about the Chemical. >> >> Chemical Name - Techni-Gold 434 HS (for electroplating). >> >> MSDS - Attached. >> >> Equipment - GaAs wet bench. >> >> Procedure - Beaker (labuser to provide own beaker) with leads attached >> > > >> to DC regulated power supply. Beaker to be placed on hot plate at 50C. >> > > >> Plating Chemical will be lightly stirred with a stir bar. >> >> Power Supply -BK Precision DC regulated power supply. Model #1670A. >> Max current for electroplating will be at 5mA ( a couple of volts >> from DC power source required for this process). >> >> Waste Disposal - Lab user intends to use waste collection bottle to >> catch the rinse water so that waste water does not go into AWN system. >> > > >> The used 434 chemical will be stored in a labelled waste bottle. >> >> Thanks >> >> Senyo >> >> >> >> >> > > > From jwpchen at stanford.edu Wed Dec 3 05:25:14 2008 From: jwpchen at stanford.edu (Peter Chen) Date: Wed, 03 Dec 2008 05:25:14 -0800 Subject: new material request: HP Lab's PECVD oxide Message-ID: <493688BA.2020703@stanford.edu> Hi Mary and Specmat, As I described briefly yesterday morning, I will be depositing HP Laboratories' PECVD oxide in one of my process steps. It's a P5000-series PECVD system, able to deposit 20um of oxide rapidly and with conformality. I have communicated with HP's Peter Hartwell regarding their cleaniness; quote: "... it has seen metals typical to the interconnect metallization in a standard cmos process - aluminum, tantalum, titanium ,tungsten. We have kept metals out of it that would interfere with active device performance (specifically, gold). We have fabricated thin film transistors in the machine including the doped silicon layers and the gate dielectrics." I would like it classified as semi-clean, same as our metal-boat LTO. My wafers before PECVD are SNF-clean. This is the HP Laboratories on Page Mill Road. Thanks, -Peter From mwiemer at sj-solar.com Thu Dec 4 23:35:30 2008 From: mwiemer at sj-solar.com (Mike Wiemer) Date: Thu, 4 Dec 2008 23:35:30 -0800 Subject: Special Materials References: <492C856B.10700@stanford.edu> <4934DB80.2050909@stanford.edu> Message-ID: Hi Mary, Thanks for the thoughtful email. The attached file is an attempt at the procedure and information you asked for here. I tried to organize it for quick reading. I will be around Stanford tomorrow afternoon from ~12:00 noon - 1:30pm. Perhaps we could chat briefly about this (which is faster than email). Thanks! -Mike -----Original Message----- From: Mary Tang [mailto:mtang at stanford.edu] Sent: Monday, December 01, 2008 10:54 PM To: Mike Wiemer Cc: Senyo Dogbe; specmat at snf.stanford.edu; uli at snf.stanford.edu Subject: Re: Special Materials HI Mike and Senyo -- Much better. However, it looks like it might be ethylene diamine based. Better than cyanide salts, but still not the best. First off, it stains benches terribly. Second, we've banned EDP from the lab (ethylene diamine/pyrocatechol mix for etching silicon) because of safety concerns (same thing as cyanide salts -- OK if you have a dedicated setup with engineering controls, but not really OK to heat at our manual benches, since NH3 gas can be generated under a broad range of conditions.) There's not a whole lot of info in the MSDS (is it really ethylene diamine and what's the rough concentration?) and I don't know what your protocol is (is the solution heated? Do you need a power supply? A quick Google search suggests to me this EDA is used for electroless plating of gold.) What I'd really like to see is a clear, documented protocol for gold electroplating at the wbgaas bench -- everything from the administrative controls (like, maybe reserving the whole bench and blocking off with hazard tape when you're plating, or posting signs or sending out email notifications or whatever) to engineering controls (e.g. limited volumes, storing the power supply away from the bench) and as much info as possible about the chemical composition and the chemical reaction and byproducts. By the way, it seems that most gold electroplating solutions are incompatible with oxidizers and acids. So for storage... this could be stored in the personal chemicals storage in the chemicals passthrough (although there are oxidizers there, personal chemicals are separated by secondary containment) or in the Flammables cabinet area (there are no incompatibles in that area.) We'll find a spot once you have the chemical (and a protocol that Uli and Jim H are happy with.) Mary Mike Wiemer wrote: > Hi Mary & Specmat, > > Senyo and I are working together on this. > > 1.) How about if we switch the chemical to the non-cyanide based one? > Everything else would be the same (see Senyo's specmat request below). I > have attached the new MSDS for the non-cyanide chemical. > > 2.) Where would we store the chemical? I would be a 1 gal jug.... > > Best, > > -Mike > > > > -----Original Message----- > From: Mary Tang [mailto:mtang at stanford.edu] > Sent: Tuesday, November 25, 2008 3:08 PM > To: Senyo Dogbe > Cc: specmat at snf.stanford.edu; uli at snf.stanford.edu; > mwiemer at snf.stanford.edu > Subject: Re: Special Materials > > Hi Senyo -- > > Thanks for the request. I'm afraid, though, that you would have to > justify using cyanide-based solution in our lab. Although this has been > > used in the distant past, it was used at a wet bench that was dedicated > for gold electroplating. We no longer have this set up -- and manual > handling of these kinds of chemicals poses greater risks. So, if this > were to be allowed, we'd have to have very strict procedures and rules > about use of this class of chemicals. > > The reason is that these cyanide based solutions are highly toxic. > Cyanide can be easily absorbed through the skin upon contact. Free > cyanide vapors are extremely toxic and can be easily generated when the > solution comes in contact with oxidizing acids, as might occur when > using at one of the shared stations. In fact, when medical > professionals respond to cyanide poisonings, they will not work on a > victim until all clothing and anything the person has come into contact > is removed. And my concern is personal -- similar cyanide solutions are > > often used in synthetic chemistry -- just down the hall from the lab > where I did my graduate work, a post-doc doing synthetic chemistry died > from cyanide poisoning. > > I understand that cyanide based solutions are preferred for some > applications, especially electronics, but that much safer solutions, > such as sulfide based ones are also available. I'd recommend doing some > > investigation into other electroplating solutions to determine which > would meet your needs. If your requirements are more stringent, then > I'd suggest sending your devices out for gold electroplating -- there > are several local services which specialize in electronics > applications. Finally, I'm copying Mike Wiemer on this -- Mike is also > interested in a non-cyanide-based gold electroplating solution for quick > > turnaround processing. Maybe you two could share notes and work with > Uli and Jim H (who are responsible for the wbgaas station) on > establishing a procedure for the lab. > > Thanks, > > Mary > > Senyo Dogbe wrote: > >> Dear Sir/Madam, >> I would like to seek permission to use a non-standard chemical for >> future work in device processing at SNF. >> The information below and the attached MSDS provide more information >> about the Chemical. >> >> Chemical Name - Techni-Gold 434 HS (for electroplating). >> >> MSDS - Attached. >> >> Equipment - GaAs wet bench. >> >> Procedure - Beaker (labuser to provide own beaker) with leads attached >> > > >> to DC regulated power supply. Beaker to be placed on hot plate at 50C. >> > > >> Plating Chemical will be lightly stirred with a stir bar. >> >> Power Supply -BK Precision DC regulated power supply. Model #1670A. >> Max current for electroplating will be at 5mA ( a couple of volts >> from DC power source required for this process). >> >> Waste Disposal - Lab user intends to use waste collection bottle to >> catch the rinse water so that waste water does not go into AWN system. >> > > >> The used 434 chemical will be stored in a labelled waste bottle. >> >> Thanks >> >> Senyo >> >> >> >> >> > > > -------------- next part -------------- A non-text attachment was scrubbed... Name: GOLD ELECTROPLATING AT THE WBGAAS BENCH.docx Type: application/octet-stream Size: 16143 bytes Desc: GOLD ELECTROPLATING AT THE WBGAAS BENCH.docx URL: From jimkruger at yahoo.com Fri Dec 5 08:57:18 2008 From: jimkruger at yahoo.com (jim kruger) Date: Fri, 5 Dec 2008 08:57:18 -0800 (PST) Subject: Proposal for Ga use in PQuest Message-ID: <640888.6947.qm@web38907.mail.mud.yahoo.com> Proposal for Ga use in PQuest Thanks, jim -------------- next part -------------- A non-text attachment was scrubbed... Name: Ga-SpecMat12-4-08.doc Type: application/msword Size: 22016 bytes Desc: not available URL: From chris.detrick at global-fab.com Sun Dec 7 23:31:56 2008 From: chris.detrick at global-fab.com (Christopher Detrick) Date: Mon, 8 Dec 2008 02:31:56 -0500 (EST) Subject: Equipment Available for immediate sale Message-ID: <1102358511674.1101401002153.9044.6.13023046@scheduler> G-Fab LOGO [http://rs6.net/tn.jsp?e=001jlH2KPpN-TxswMnG3gUYOHc_lNCx2jzdr4b5rk8TLFE0z2oAgC_I3P3FKlQSQVXArj_BscYa2SxFLDgaiG-4Sso5xoQ3L-X-dYFbFoEM_zvTZYdteIKWIg==] ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Global Fab Surplus LLC [http://rs6.net/tn.jsp?e=001jlH2KPpN-TxswMnG3gUYOHc_lNCx2jzdr4b5rk8TLFE0z2oAgC_I3P3FKlQSQVXArj_BscYa2SxFLDgaiG-4Sso5xoQ3L-X-dYFbFoEM_zvTZYdteIKWIg==](G-Fab) has the below list of the equipment available for sale immediatly. All tools are crated and located in our warehouse in Colorado Springs. 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Equipment list Description * Complete 4" fab line capable of 1K wafers per month and more with an additional stepper * IPEC 372m CMP (Very Clean) * IPEC 372m CMP (Very Clean) * LAm Rainbow 4428 (In like new condition) * BioRad/Accent Q7 overlay system * SVG 90s I-line track * SVG 90s I-line track * Teradyne T666 Static tester * Ecosys Exhaust scrubberAlso available are hundreds of other tools as listed on our website at www.global-fab.com [http://rs6.net/tn.jsp?e=001jlH2KPpN-TxswMnG3gUYOHc_lNCx2jzdr4b5rk8TLFE0z2oAgC_I3P3FKlQSQVXArj_BscYa2SxFLDgaiG-4Sso5xoQ3L-X-dYFbFoEM_zvTZYdteIKWIg==]We can be contacted at: Chris Detrick California office (805) 215-9188 chris.detrick at global-fab.com David Lee Colorado office (719) 229-6066 support at global-fab.com ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Global Fab Surplus Semiconductor Equipment LLC [http://rs6.net/tn.jsp?e=001jlH2KPpN-TxswMnG3gUYOHc_lNCx2jzdr4b5rk8TLFE0z2oAgC_I3P3FKlQSQVXArj_BscYa2SxFLDgaiG-4Sso5xoQ3L-X-dYFbFoEM_zvTZYdteIKWIg==], provides surplus, used, rebuilt and refurbished semiconductor process equipment to integrated device manufacturers, wafer foundries, research and development sites and to the semiconductor refurbishing and rebuilding community. We buy and sell used semiconductor equipment, including backend, front end and special application tools and toolsets. Visit us online at: www.global-fab.com [http://rs6.net/tn.jsp?e=001jlH2KPpN-TxswMnG3gUYOHc_lNCx2jzdr4b5rk8TLFE0z2oAgC_I3P3FKlQSQVXArj_BscYa2SxFLDgaiG-4Sso5xoQ3L-X-dYFbFoEM_zvTZYdteIKWIg==] for a complete list of tools available. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat at snf.stanford.edu&a=1102358511674 This email was sent to specmat at snf.stanford.edu by chris.detrick at global-fab.com. Update Profile/Email Address http://visitor.constantcontact.com/d.jsp?v=001RO3dPrXHwIHjNc18qg2uYpS-p4D8dFWv6tBKlDwbbZSyB2kh-5USSd7QDX4VQZFz5pZ46wdjs-w%3D&p=oo Instant removal with SafeUnsubscribe(TM) http://visitor.constantcontact.com/d.jsp?v=001RO3dPrXHwIHjNc18qg2uYpS-p4D8dFWv6tBKlDwbbZSyB2kh-5USSd7QDX4VQZFz5pZ46wdjs-w%3D&p=un Privacy Policy: http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906 -------------- next part -------------- An HTML attachment was scrubbed... URL: From grace.m.credo at intel.com Thu Dec 11 10:48:05 2008 From: grace.m.credo at intel.com (Credo, Grace M) Date: Thu, 11 Dec 2008 10:48:05 -0800 Subject: monolayers on silicon pieces Message-ID: <517AF11CC9FF404E8B27650E116B147C470E834C@orsmsx505.amr.corp.intel.com> Hi, I would like to use the Woollam ellipsometer to characterize organic monolayers on silicon pieces. Should I submit chemical information (MSDS's/process or run sheets?) on the different molecules that would be on the silicon? It should be monolayer thickness ~8-10A. I checked with Ed Myers and Woollam and the tool should be able to measure this. Thanks for your help, Grace -------------------------- Grace Credo Intel Research grace.m.credo at intel.com gcredo at snf.stanford.edu 1-408-653-8495 -------------- next part -------------- An HTML attachment was scrubbed... URL: From info at fabsurplus.com Thu Dec 11 15:17:56 2008 From: info at fabsurplus.com (SDI-Fabsurplus) Date: Thu, 11 Dec 2008 23:17:56 +0000 (GMT) Subject: SHORT NOTICE ~ SDI-FABSURPLUS Year-End Inventory Clearance Sale Message-ID: <13589915.1229037504052.JavaMail.root@server1.fabsurplus.com> In association with Hilco Industrial Europe Industrial Asset Acquisition and Disposition Services Online Auction - BID NOW Closes: Tuesday December 16, 2008 from 13:00pm (GMT) Assets Located: Trim, Dublin Ireland & Avezzano Italy and selected client locations Preview: Strictly by prior appointment only For sale details, please visit:- http://www.hilcoind.com/images/ftp/HIE/HM0496/HM0496.htm Featuring: ? Applied Materials Producer, PECVD (Plasma Enhanced) ? Applied Materials P5000 TEOS 2 Chamber system ? Hitachi S3000N Variable Pressure SEM with EDX ? Lambda Physik Novaline K2005 Excimer Lasers ? KLA Tencor EV300 Defect Review SEM ? IPEC 472 Tungsten CMP ? Canon FPA 3000 EX3 DUV Stepper (200mm) ? 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Avezzano Italy Preview Information: By appointment only For More Information, Contact: Greg Zaharewicz gzaharewicz at hilcoeurope.com + 44 (0)8453 130 140 EQUIPMENT WANTED FOR PURCHASE DECEMBER 2008 ******************************************* DNS SU 3000 SCP Global Semi Auto CABIN ENGINEERING or other Reticle Stocker SDI SPV station - carrier lifetime measurement NICOLET MICRO RAMAN Strasbaugh 6DSSP CMP system Thank you, Stephen Howe CEO, SDI-Fabsurplus Group c/o SDI Semiconductor Instruments Srl Via Rocco Galdieri, 6 Napoli 80123 Italy Office: (Naples) Italy (39) 081 575 0506 Mobile: Italy (39) 335 710 7756 Fax: Italy (39) 066 051 3344 showe at fabsurplus.com Skype: Stephencshowe http://www.fabsurplus.com Ollie Dunne Managing Director SDI Semiconductor Instruments Ireland Ltd. Trim, Co. Meath, Ireland Phone: (353) 4694 37097 Mobile: (353) 872 985 561 Fax: (353) 4694 37113 ollie.dunne at fabsurplus.com Important Notice: This message is intended for the attention of the person or organization to which it has been addressed. It may contain information that is confidential, proprietary and/or exempt from disclosure by law. If you have received this message in error please be aware that the sender does not waive any confidentiality, ownership rights or privilege applicable to it. You are therefore strictly prohibited to disseminate, distribute or copy this message in any way. This message may be considered an advertisement or solicitation under U.S.law. If you would like to opt-out of receiving future commercial e-mail marketing messages from the sender, please send a message to the following e-mail address with the word "REMOVE" in the subject line to: info at fabsurplus.com From mtang at stanford.edu Tue Dec 16 09:43:05 2008 From: mtang at stanford.edu (Mary Tang) Date: Tue, 16 Dec 2008 09:43:05 -0800 Subject: FW: new chemical request: WaferBOND spin-on polymer In-Reply-To: <5C05BFF2A7014621BC3ADCFC69A41DAF@stanford.edu> References: <000901c94e77$3d0f2fd0$b72d8f70$@edu> <4946C81F.8040003@stanford.edu> <5C05BFF2A7014621BC3ADCFC69A41DAF@stanford.edu> Message-ID: <4947E8A9.1000400@stanford.edu> Hi Ross -- Your SpecMat request is officially approved, with the following reservations: 1. When spin coating on the headway2, treat this as you would SU-8. If you are not familiar with handling SU-8, please contact James Conway. 2. When doing YES prime on the first photomask after the KOH etch, make sure that your samples are the only ones loaded in the YES oven. There is some small risk of off-gasing of volatile residues which could adversely affect the surface quality of other wafers which might be processed at the same time. 3. Make sure to contact Jeannie about low temperature processing at sts dep. She specially qualifies people to perform low temp processing to ensure against peeling films in subsequent depositions. And of course, please make sure to properly label, yellow tag, and transport (through the service area) your waferbond when it arrives. Mary Ross Audet wrote: > Mary, > > I won't be starting until after the shutdown, so waiting is not a problem. > > After the long KOH etch, the waferbond will have completely dissolved from > the exposed surfaces, so only the area under the bonded chip will have > Waferbond remaining. Hopefully this means the outgassing concern in the YES > oven is minimal, but we'll see what Mahnaz thinks. > > We don't anticipate needing to thin the Waferbond. > > Liz Edwards and I will be in touch with Jeannie about the PECVD. > > Thanks! > Ross > > > > -----Original Message----- > From: Mary Tang [mailto:mtang at stanford.edu] > Sent: Monday, December 15, 2008 1:12 PM > To: Ross Audet > Subject: Re: FW: new chemical request: WaferBOND spin-on polymer > > Hi Ross -- > > I've forwarded your request to Jeannie to let her know you'll be getting > in touch with her. I've also forwarded it to James, since he manages > the headway (and likes to keep on top of the whacky chemicals used > there.) Will you be thinning down the waferbond in any way? If so, > please let me know what solvent you plan to use and how you'll be mixing > it. I've also forwarded your request to Mahnaz, since it looks like > there will be exposed waferbond present on the carrier (provided it > survives your KOH etch) when it goes into the YES oven. It is generally > not a good idea to put polymers into the YES oven since they off gas and > have a tendency to distribute onto the chamber walls and other wafers, > so there may be some concerns there. > > So, could you please hold off a day or so? I don't anticipate problems, > but am sure there will be provisions requested. I know there's only a > couple of days left this week -- let me know if this is a problem -- > > Thanks, > > Mary > > > Ross Audet wrote: > >> Dear Mary, >> >> >> >> I submitted a request to Specmat about a month ago for an adhesive >> wafer bonding compound, but haven't received a reply yet. Is there >> anything you can do to help speed the review process? >> >> >> >> Perhaps you could take a look at the attached document and let me know >> if there are any concerns on your end about use of the chemical. >> >> >> >> Thanks, >> >> Ross Audet >> >> >> >> *From:* Ross Audet [mailto:audet at stanford.edu] >> *Sent:* Sunday, October 19, 2008 4:34 PM >> *To:* 'specmat at snf.stanford.edu' >> *Subject:* new chemical request: Waferbond spin on polymer >> >> >> >> >> >> Dear Specmat committee, >> >> >> >> Please see the attached document requesting permission to use of >> Brewer Waferbond in the SNF cleanroom. Contact me with any questions. >> >> >> >> Regards, >> >> Ross Audet >> >> > > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu