From akamath at kovio.com Mon Mar 3 17:09:22 2008 From: akamath at kovio.com (Arvind Kamath) Date: Mon, 3 Mar 2008 17:09:22 -0800 Subject: BCB use Message-ID: <0A734412B02624499172B7366A97336B8DCC7F@server.print-this.com> Hello, We would like to ask for approval to spin BCB (Benzocyclobutene) on the Headway at SNF and use the develop track. Please let us know if this is an already approved material or if any additional information is required. Regards, Arvind Kamath Director of Process Integration Kovio Inc. P.S. Mary- do we have a post bake oven that can be run at 70C for our material? -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: BCB-MSDS.pdf Type: application/pdf Size: 66655 bytes Desc: BCB-MSDS.pdf URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: BCB-developer.pdf Type: application/pdf Size: 25533 bytes Desc: BCB-developer.pdf URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Cyclotene-BCB.pdf Type: application/pdf Size: 318867 bytes Desc: Cyclotene-BCB.pdf URL: From patricia.carlson at global-fab.com Tue Mar 4 02:28:25 2008 From: patricia.carlson at global-fab.com (Patricia Carlson) Date: Tue, 4 Mar 2008 05:28:25 -0500 (EST) Subject: Complete fab lines from G-Fab Message-ID: <1102004370172.1101401002153.9044.6.12052546@scheduler> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Global Fab Surplus ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ March 4, 2008 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Greetings! Global Fab Surplus [http://rs6.net/tn.jsp?e=001fKKe0OexCXhFJwbF1sRQvR1fuyhJzvrklr5uiWe090EAvVYaHGI9tZwul6_sy0L46y5FkqviKRppY19XX629Gx5PgeLJ9aD6loXwP9TjrOjCwO7v_HcNOg==]has available the following complete fabs available. Included are completesets of equipment, clean rooms and buildings designed for high tech manufacturing. If you have a need for any of this equipment or manufacturing facilities or if you know someone who may be interested please contact us right away. * 200mm pilot line with 44 tools (ASML steppers) * 200mm manufacturing line (over 300 tools) * Technology center with over 700,000 sq ft of clean room and office space on almost 100 acres of land. We also have the following individual tools available for immediate sale. Inspections can be arranged at our warehouse in Colorado Springs, Colorado USA. * Varian Kestrial 750 implanter * Varian Kestrial 650 implanter * LAM A4 Alliance TCP9400SE Poly Etch and 4520XL Oxide Etch * LAM 4428 Plasma Etch * SVG 90S DUV Coater Developer * SVG 90S iLine Coater Developer * Gaard 676 CMP Oxide * IPEC 372 CMP Oxide * Accent Biorad Q8 Registration Tool * Applied Material Centura 5200 PVD Ti/TiN, AlCu * Applied Materials ALD * Ecosys scrubber * * Teradyne T666 tester * Over 10K SMT parts in inventory we would like to sell all together or in pieces Our customers are always looking for equipment and requirements change daily. If you have any surplus equipment either in your production facilities or in a warehouse we can help you sell them. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ If you have an interest in any of these tools or have surplus equipment available please call us at your earliest convience. We are here to help you with all your semiconductor manufacturing equipment needs. (Buying or selling) Please feel free to forward the email to anyone who may be interested any of these tools. Sincerely, ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Patricia Carlson (Colorado) 719-686-0128 patricia.carlson at global-fab.com Global Fab Surplus David Lee (Colorado) 719-686-0128 support at global-fab.com Global Fab Surplus Chris Detrick (California) 805-215-9188 chris.detrick at global-fab.com ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?m=1101401002153&ea=specmat at snf.stanford.edu&a=1102004370172 This email was sent to specmat at snf.stanford.edu, by patricia.carlson at global-fab.com Update Profile/Email Address http://visitor.constantcontact.com/d.jsp?v=001RO3dPrXHwIHjNc18qg2uYpS-p4D8dFWvYFRp0Cvj0mbtUC152AjybkRdHrwK46plQayQAbMUYyM%3D&p=oo Instant removal with SafeUnsubscribe(TM) http://visitor.constantcontact.com/d.jsp?v=001RO3dPrXHwIHjNc18qg2uYpS-p4D8dFWvYFRp0Cvj0mbtUC152AjybkRdHrwK46plQayQAbMUYyM%3D&p=un Privacy Policy: http://ui.constantcontact.com/roving/CCPrivacyPolicy.jsp Global Fab Surplus | 195 Kirkstone Lane | Colorado Springs | CO | 80906 -------------- next part -------------- An HTML attachment was scrubbed... URL: From mahnaz at stanford.edu Tue Mar 4 14:22:28 2008 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Tue, 04 Mar 2008 14:22:28 -0800 Subject: BCB use References: <0A734412B02624499172B7366A97336B8DCC7F@server.print-this.com> Message-ID: <47CDCBA4.1010509@stanford.edu> Hi Arvind, Labels can be picked up for the chemicals in my office. I do not see a process flow but any how I am not sure what do you mean when you say that you like to use the developer track? Hot plates are available and can be used and also we have 90 c, 110 c oven. we do have a small oven that we can change the temp. and that can be ran at 70c. Who will be running this process? Is the person qualified on the headway? Contamination is an issue for me so we need to go over this. mahnaz Arvind Kamath wrote: > Hello, > > > > We would like to ask for approval to spin BCB > (Benzocyclobutene) on the Headway at SNF and use the develop track. > Please let us know if this is an already approved material or if any > additional information is required. > > > > Regards, > > > > > > Arvind Kamath > > Director of Process Integration > > Kovio Inc. > > > > P.S. Mary- do we have a post bake oven that can be run at 70C for our > material? > > > > > -------------- next part -------------- An HTML attachment was scrubbed... URL: From ak4689 at gmail.com Tue Mar 11 11:05:00 2008 From: ak4689 at gmail.com (Adam Khan) Date: Tue, 11 Mar 2008 11:05:00 -0700 Subject: Procedures for Bringing in New Materials. Message-ID: <47d6ca0b.1a36720a.1050.ffffde4a@mx.google.com> To Whom It May Concern, This email is in reference to the procedures for bringing a new material into the SNF. The material requested is an UltraNanoCrystallineDiamond (UNCD) thin film wafer (4"). The film is comprised of 1um UNCD, 1 um SiO2, and 500 um Si, and is available from Advanced Diamond Technologies, Inc. (www.thindiamond.com), located at 429 B Weber Rd. #286, Romeoville, IL 60446. They can be reached at 815.293.0900. This film is considered clean by SNF standards. The TXRF analysis report, which verifies this claim is attached and shall also be faxed in hard copy to your attention, along with a process flow chart, which will be summarized here in brief. Preimplant Mask(Al), Ion Implant (B11, outsourced), RIE, SIMS (outsourced), RTA, Mask liftoff, CVD, dry Etch, lithography (mask), lithography (contact metallization), Ion Beam Deposition, E beam lithography, dry etch, and again Ion beam deposition. This corresponds to the following SNF machinery: Gryphon Metal Sputter, Metal Wetbench, A64108 RTAm LPCVD POLY, AMT Oxide Plasma Etcher, EV Group Nanoimprint, Metallica System, and Hitachi H-700 EBeam. Special attention has been made to ensure Contamination will not be an issue with the SNF Machinery. Some questions may arise of the ion implantation step but I am assured that the reactor used complies with SNF standards as it is CMOS compatible. The implantation will be done at Innovion Corp. (www.innovioncorp.com), located at 2121 Zanker Road, San Jose CA. The process engineer, Ron Eddy, can be reached at 480.216.6218. His comments are listed below, and will be faxed in hard copy along with the other documents: "The implanter is used for a variety of applications. The system is used for CMOS, Bipolar, Discrete, Compound Semi, LED applications as well as for materials modification studies. In this tool we have run the following: H, B/BF2, C, N, Al, Si, P, Ar, As. In the past 2 -3 months we also ran Cd, Hf and Mg but we used dedicated apertures for these and we do an Argon beam cleanup after the run. The Rs (with a B implant) and particles are verified 2 - 3X/week. Note that Mg is a 1% component of the Al alloy that the entire implanter beamline is made from and the Hf is used at Intel and other 300mm fabs as a "component" of new dielectrics." Lastly, I apologize for not providing my coral information. I have completed and passed the safety test, taken the lab tour, and have filed all pertainent documentaion, I am simply awaiting the coompletion of processing. I am working on this project with Senyo Dogbe, an SNF independent contractor. If there are any comments or concerns please don't hesitate to call or email me. Best Regards, Adam Khan President AKHAN Technologies, Inc. 847.553.1897 adam at akhantech.com ------------------------ Sent from my handheld, please forgive any tipos. -------------- next part -------------- A non-text attachment was scrubbed... Name: ReportC08T5437TX_1.doc Type: application/msword Size: 161280 bytes Desc: not available URL: From mtang at stanford.edu Tue Mar 11 14:17:54 2008 From: mtang at stanford.edu (Mary Tang) Date: Tue, 11 Mar 2008 14:17:54 -0700 Subject: Qualification for Germanium bench cleans Message-ID: <47D6F702.1060803@stanford.edu> Hi all -- The germanium group wants to qualify wbgen2 for their cleans. What kind of qual should they do? TXRF is standard. So, what kind of TXRF testing should be done? And what kind of levels are considered "wbdiff clean"? Should CV's be done? I ask, because what is done here is very likely going to be what will be recommended for the spin-etch station. Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Thu Mar 13 08:05:54 2008 From: mtang at stanford.edu (Mary Tang) Date: Thu, 13 Mar 2008 08:05:54 -0700 Subject: Chemicals brought into SNF In-Reply-To: References: <47D1D8AF.9060704@stanford.edu> <3DBCF51A-5F2C-4275-87EF-71FB85DF1121@stanford.edu> <47D2C10F.2060907@stanford.edu> Message-ID: <47D942D2.3070103@stanford.edu> Hi Serena -- So, if I understand correctly: 1. You plan to bring in pre-mixed chemicals to use in the lab. I take it that you are familiar with the procedures for brining outside chemicals into the lab (through the service area?) If not, please review with a staff member. 2. You plan to use the chemicals at the headway coater to coat substrates. But then you do not plan to use the chemicals or the substrates anywhere else. Is that correct? No hot plates or ovens to softbake? No ebeam or raith to pattern? No develop? 3. If you plan to use any glassware or other labware, please use your own -- there is concern that the fluorescent chemicals can interfere with others' processing. 4. Do you plan to store your mixed chemicals at SNF? Or will you be using and disposing of what you will have brought in? Will anyone else be using these chemicals? Please be careful in handling these chemicals. (Although they are commonly used in molecular biology labs, they preferentially bind DNA and are mutagens/cancer causing agents.) Mary Serena Faruque wrote: > Hi Mary, > > I'm sorry for replying earlier, but I have been working on other things. > > So I will be mixing everything our lab glovebox. So I'm making > solutions of these materials in PMMA in anisole. I will be spin > coating wafers with these materials on the Headway spinner. > > I hope this is what you needed. Please don't hesitate to ask further > questions - while its extra work for me, I really appreciate that you > care about our safety! > > Serena > > > On Mar 8, 2008, at 8:38 AM, Mary Tang wrote: > >> Thanks Serena -- >> >> Please also forward us a detailed description of how and where you >> plan to use these materials. As we discussed, we do not store or use >> powders inside the lab, but have space outside where you can mix >> things. We'll also want to know which solvents/diluents you will be >> using, if any. >> >> Mary >> >> Serena Faruque wrote: >>> Hi Mary, >>> >>> So I haven't started using the materials yet, but I will forward you >>> the MSDS. >>> >>> Serena >>> >>> >>> ------------------------------------------------------------------------ >>> >>> >>> ------------------------------------------------------------------------ >>> >>> >>> On Mar 7, 2008, at 4:07 PM, Mary Tang wrote: >>> >>>> Hi Serena -- >>>> >>>> I believe I gave you barcode stickers and yellow tags for chemicals >>>> for making up some fluorescent resists. As I vaguely recall, it >>>> was a one-time thing and you were going to dispose of the chemicals >>>> once you were done. Is this correct? >>>> >>>> If you are going to continue using these chemicals, could you >>>> please provide MSDS's for each of them as well as a procedure for >>>> how/where you are mixing them and using them? Please come and talk >>>> with either Mahnaz or me about your chemicals. >>>> >>>> Thanks, >>>> >>>> Mary >>>> >>>> -- >>>> Mary X. Tang, Ph.D. >>>> Stanford Nanofabrication Facility >>>> CIS Room 136, Mail Code 4070 >>>> Stanford, CA 94305 >>>> (650)723-9980 >>>> mtang at stanford.edu >>>> http://snf.stanford.edu >>>> >>> >>> Serena Faruque >>> Center for Integrated Systems, CISX-213A >>> 330 Serra Mall >>> Stanford, CA 94305-4470 >>> serenaf at stanford.edu >>> Office: (650) 725 - 6924 >>> Cell: (650) 387-9834 >>> >>> = >> > > Serena Faruque > Center for Integrated Systems, CISX-213A > 330 Serra Mall > Stanford, CA 94305-4470 > serenaf at stanford.edu > Office: (650) 725 - 6924 > Cell: (650) 387-9834 > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Thu Mar 13 08:09:21 2008 From: mtang at stanford.edu (Mary Tang) Date: Thu, 13 Mar 2008 08:09:21 -0700 Subject: [Fwd: Re: Chemicals brought into SNF] Message-ID: <47D943A1.3020905@stanford.edu> For the record... -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- An embedded message was scrubbed... From: Serena Faruque Subject: Re: Chemicals brought into SNF Date: Fri, 7 Mar 2008 16:22:57 -0800 Size: 100511 URL: From serenaf at stanford.edu Thu Mar 13 10:49:11 2008 From: serenaf at stanford.edu (Serena Faruque) Date: Thu, 13 Mar 2008 10:49:11 -0700 Subject: Chemicals brought into SNF In-Reply-To: <47D942D2.3070103@stanford.edu> References: <47D1D8AF.9060704@stanford.edu> <3DBCF51A-5F2C-4275-87EF-71FB85DF1121@stanford.edu> <47D2C10F.2060907@stanford.edu> <47D942D2.3070103@stanford.edu> Message-ID: On Mar 13, 2008, at 8:05 AM, Mary Tang wrote: > Hi Serena -- > > So, if I understand correctly: > > 1. You plan to bring in pre-mixed chemicals to use in the lab. I > take it that you are familiar with the procedures for brining > outside chemicals into the lab (through the service area?) If not, > please review with a staff member. > Yes, I have gone through these. > 2. You plan to use the chemicals at the headway coater to coat > substrates. But then you do not plan to use the chemicals or the > substrates anywhere else. Is that correct? No hot plates or ovens > to softbake? No ebeam or raith to pattern? No develop? > I plan on using the hot plate next to the hadway spinner to cure PMMA layer, which I will cover with foil. I will measure these devices eventually on the Cascade. I don't plan on using anything else in this lab. > 3. If you plan to use any glassware or other labware, please use > your own -- there is concern that the fluorescent chemicals can > interfere with others' processing. > I do have and use my own glassware. > 4. Do you plan to store your mixed chemicals at SNF? Or will you > be using and disposing of what you will have brought in? Will > anyone else be using these chemicals? > I will not store my chemicals at SNF. I will take them back to my lab for storage. No one else will use these materials. > Please be careful in handling these chemicals. (Although they are > commonly used in molecular biology labs, they preferentially bind > DNA and are mutagens/cancer causing agents.) > > Mary > > Serena Faruque wrote: >> Hi Mary, >> >> I'm sorry for replying earlier, but I have been working on other >> things. >> >> So I will be mixing everything our lab glovebox. So I'm making >> solutions of these materials in PMMA in anisole. I will be spin >> coating wafers with these materials on the Headway spinner. >> >> I hope this is what you needed. Please don't hesitate to ask >> further questions - while its extra work for me, I really >> appreciate that you care about our safety! >> >> Serena >> >> >> On Mar 8, 2008, at 8:38 AM, Mary Tang wrote: >> >>> Thanks Serena -- >>> >>> Please also forward us a detailed description of how and where >>> you plan to use these materials. As we discussed, we do not >>> store or use powders inside the lab, but have space outside where >>> you can mix things. We'll also want to know which solvents/ >>> diluents you will be using, if any. >>> >>> Mary >>> >>> Serena Faruque wrote: >>>> Hi Mary, >>>> >>>> So I haven't started using the materials yet, but I will forward >>>> you the MSDS. >>>> >>>> Serena >>>> >>>> >>>> ------------------------------------------------------------------- >>>> ----- >>>> >>>> >>>> ------------------------------------------------------------------- >>>> ----- >>>> >>>> >>>> On Mar 7, 2008, at 4:07 PM, Mary Tang wrote: >>>> >>>>> Hi Serena -- >>>>> >>>>> I believe I gave you barcode stickers and yellow tags for >>>>> chemicals for making up some fluorescent resists. As I vaguely >>>>> recall, it was a one-time thing and you were going to dispose >>>>> of the chemicals once you were done. Is this correct? >>>>> >>>>> If you are going to continue using these chemicals, could you >>>>> please provide MSDS's for each of them as well as a procedure >>>>> for how/where you are mixing them and using them? Please come >>>>> and talk with either Mahnaz or me about your chemicals. >>>>> >>>>> Thanks, >>>>> >>>>> Mary >>>>> >>>>> -- >>>>> Mary X. Tang, Ph.D. >>>>> Stanford Nanofabrication Facility >>>>> CIS Room 136, Mail Code 4070 >>>>> Stanford, CA 94305 >>>>> (650)723-9980 >>>>> mtang at stanford.edu >>>>> http://snf.stanford.edu >>>>> >>>> >>>> Serena Faruque >>>> Center for Integrated Systems, CISX-213A >>>> 330 Serra Mall >>>> Stanford, CA 94305-4470 >>>> serenaf at stanford.edu >>>> Office: (650) 725 - 6924 >>>> Cell: (650) 387-9834 >>>> >>>> = >>> >> >> Serena Faruque >> Center for Integrated Systems, CISX-213A >> 330 Serra Mall >> Stanford, CA 94305-4470 >> serenaf at stanford.edu >> Office: (650) 725 - 6924 >> Cell: (650) 387-9834 >> > > > -- > Mary X. Tang, Ph.D. > Stanford Nanofabrication Facility > CIS Room 136, Mail Code 4070 > Stanford, CA 94305 > (650)723-9980 > mtang at stanford.edu > http://snf.stanford.edu > > Serena Faruque Center for Integrated Systems, CISX-213A 330 Serra Mall Stanford, CA 94305-4470 serenaf at stanford.edu Office: (650) 725 - 6924 Cell: (650) 387-9834 -------------- next part -------------- An HTML attachment was scrubbed... URL: From mcvittie at cis.Stanford.EDU Thu Mar 13 12:17:43 2008 From: mcvittie at cis.Stanford.EDU (Jim McVittie) Date: Thu, 13 Mar 2008 11:17:43 -0800 (PST) Subject: Qualification for Germanium bench cleans In-Reply-To: <47D6F702.1060803@stanford.edu> Message-ID: Mary, The test should be guided by what are the likely contamination problems for the particular tool or material. For a cleaning bench the likely problem is that someone put a metal wafer one or all the tanks. I am sure TXRF should be fine. But for the diff clean benches, I do not remember ever seeing a problem with them if we cleaned the hot pots and rinse tanks with HCl any time there was a question about a bench. I can say this because we did a number of TXRF tests where we uses a diff cleaned wafer as the ref and we never saw problems with our ref wafers. I assume the HCl cleaning method will work for the Ge cleaning tanks. As for looking as post cleaning contaminants on Ge, I would refer you to Jungyup Kim's thesis. He did a lot of Ge cleaning and measurements. As to what is a good TXRF result, our old criteria was that all the metal levels should below mid 10E10 atoms/cm2. I would think we should keep this criteria for Si wafers coming out of a Diff clean. For other places in the lab, we may want to relax this pass level because we now have to deal with a number of new materials and processes. Jim On Tue, 11 Mar 2008, Mary Tang wrote: > Hi all -- > > The germanium group wants to qualify wbgen2 for their cleans. What kind > of qual should they do? TXRF is standard. So, what kind of TXRF > testing should be done? And what kind of levels are considered "wbdiff > clean"? Should CV's be done? > > I ask, because what is done here is very likely going to be what will be > recommended for the spin-etch station. > > Mary > > -- -------------------------------------------------------------- Jim McVittie, Ph.D. Senior Research Scientist Allen Center for Integrated Systems Electrical Engineering Stanford University jmcvittie at stanford.edu Rm. 336, 330 Serra Mall Fax: (650) 723-4659 Stanford, CA 94305-4075 Tel: (650) 725-3640 From newsletter at discount-educational-software.net Mon Mar 17 13:41:04 2008 From: newsletter at discount-educational-software.net (Educational Software Newsletter) Date: Mon, 17 Mar 2008 16:41:04 -0400 Subject: Educational Software News - March 2008 Message-ID: <417b8e6e5c9df0e281b3f75ccbffa9@bmw> Computer Products for Education is pleased to provide Educational Software News to qualified students, faculty, staff, and schools for current news on pricing and availability of Academic Edition Software from Microsoft, Adobe, Corel, Autodesk, Quark, EndNote, FileMaker, and many other major software manufacturers. Microsoft has just released Visual Studio 2008 Professional along with Windows Server 2008. SQL Server 2008 will be released later this year. Please visit our website for more information: http://www.discount-educational-software.net or call 800-679-7007. Educational software is exclusively available to qualified Students, Teachers, Faculty, Staff, and Schools of Higher Education and K-12 institutions. 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However, all prices and availability are subject to change without notice, due to factors outside our control. __________________________ We hope you have found this message valuable. However, if you do not wish to receive any more newsletters from CPE, please use the following link: http://www.discount-educational-software.net/rem.asp?a=remv&e=specmat at snf.stanford.edu Or call 800-679-7007 for additional options. __________________________ Sincerely, Computer Products for Education 5325 140th Avenue North Clearwater, Florida 33760 Tel: 800-679-7007 Fax: 800-679-6996 support at discount-educational-software.net ___________________ THANK YOU!!! From rostam at stanford.edu Fri Mar 21 17:50:47 2008 From: rostam at stanford.edu (Rostam Dinyari) Date: Fri, 21 Mar 2008 17:50:47 -0700 Subject: STS etch Message-ID: <20080321175047.bmu0gfq5400cws8k@webmail.stanford.edu> Hi, I was wondering if I can somehow do the following process at SNF: I have a clean Si wafer. I pattern Ir (25nm thick) on the wafer through liftoff. Then I coat it with some insulator like any of LP-CVD/PE-CVD Oxide/Nitride (doesn't matter which). Then I want to pattern the wafer and etch the insulating layer and then the Si 30um deep in STS or STS2. Only the areas with no Ir on them will be etched; i.e. Ir is not an etch mask. I don't have any requirements on using a specific insulating material or machine (for depositing Ir, for depositing insulating layer, for etching insulating layer) except for etching the silicon which should be done by STS or STS2. The reason for wanting to use STS/STS2 is because my structure has trenches 10um wide and 30um deep and two neighboring trenches are 1um apart and I'm not aware of any other machine that can do that. I was wondering if there is any sequence of procedures/machines that would allow me to this process. In case I can't do this, is it possible to do the above with Pt instead of Ir? Thanks, Rostam From mahnaz at stanford.edu Fri Mar 28 16:17:02 2008 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Fri, 28 Mar 2008 16:17:02 -0700 Subject: [Fwd: InSb] Message-ID: <47ED7C6E.2060609@stanford.edu> -------- Original Message -------- Subject: InSb Date: Fri, 28 Mar 2008 10:29:13 -0700 From: Erzsi Marie Szilagyi To: mahnaz at snf.stanford.edu Hi Mahnaz, I'm interested in using InSb (http://asp.cerac.com/CatalogNet/default.aspx?p=msdsFile&msds=m000860.htm) as my wafer material and was wondering if you could tell me what I need to do to be able to use it in the SNF? I'm working with Yves Acremann and he recommended that I email you. Thanks so much! Erzsi -------------- next part -------------- An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Mon Mar 31 15:49:27 2008 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 31 Mar 2008 15:49:27 -0700 Subject: Fwd: Re: [Fwd: InSb] Message-ID: <6.2.5.6.2.20080331154815.041d2bb8@stanford.edu> All, Looking over the MSDS and process flow, this seems OK. Does anyone have experience with InSb which would warrant concern? Ed >X-Sieve: CMU Sieve 2.3 >Delivered-To: edmyers at stanford.edu >DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; > d=gmail.com; s=beta; > >h=domainkey-signature:received:received:message-id:date:from:sender:to:subject:cc:in-reply-to:mime-version:content-type:references:x-google-sender-auth; > bh=HdWuGSRHkRA7u2MOVDtylYJLRAnR4JjWT3oQiEo99Vk=; > >b=L6n61Iu4rmilHzzAgy8hUep1aWpWVqsWFB/k/zz1m6KahFry9x0Sx+ItEZZOwdXv3t5JbqFb5eaxZiUi9yS304gfxdyeRutZhqPTBLNRlihZZKTuGRxhOK3xHRXhJYa/Q1nZX3mYGxfWKofdWVItqnW+nIgImVD0xpDI13OCvTo= >DomainKey-Signature: a=rsa-sha1; c=nofws; > d=gmail.com; s=beta; > >h=message-id:date:from:sender:to:subject:cc:in-reply-to:mime-version:content-type:references:x-google-sender-auth; > >b=JBoMyniKW8nbB5YcisgmIXvIddwJy6GvydNzDimcru7mK+NY0ON5ZcUrK91DLW9zFw+/HQwtgRPiql93Ce5nxAp0qPXJ5IzxNXWMvaIjxkrZsLXlb2yOrZ2LnPlb0I7svqApEo6i+6NiuvRYQEHw0D9AkBO7/RhBhtaNSZIcQZE= >Date: Mon, 31 Mar 2008 15:02:03 -0700 >From: "Erzsi Szilagyi" >Sender: erzsiszilagyi at gmail.com >To: "Ed Myers" >Subject: Re: [Fwd: InSb] >Cc: acremann at slac.stanford.edu >X-Google-Sender-Auth: 57bf7d2fb5b07465 > >Hi, > >Our process would be a fairly simple one with the temperature never >exceeding that of the YES oven: > >1. Standard optical lithography using the YES oven, headway, >Karlsuss, and manual development. >2. Optional: Oxygen cleaning in Drytek1or argon ion sputtering. >3. Optional: Etch in HCl to remove the oxides at either Wetbench >General or Wetbench GaAs. >2. Deposit the metal layers using Metallica. (There is a possibility >to do it outside of the SNF.) >3. Standard liftoff. >4. Cleave. > >I look forward to hearing from you soon on our use of InSb in the >SNF. Please let me know if there is other information that I can provide. > >Thanks, >Erzsi > > > > > >On Mon, Mar 31, 2008 at 9:45 AM, Ed Myers ><edmyers at stanford.edu> wrote: >Erzsi, > >In order to answer your question, we need a lot more >information. Yes, InSb has been ran in our fab. The real question >is what equipment and temperatures you need for your >processing. Along these lines, we would like to see your proposed >process flow. Once we have this information, we can evaluate what >type of risks our lab members and equipment will be exposed. > >Regards, >Ed > > > > >X-Sieve: CMU Sieve 2.3 > >Delivered-To: edmyers at stanford.edu > >Delivered-To: emyers at snf.stanford.edu > >Mailing-List: contact > specmat-help at snf.stanford.edu; > run by ezmlm > >X-No-Archive: yes > >List-Post: > >List-Help: > >List-Unsubscribe: > >List-Subscribe: > >Delivered-To: mailing list > specmat at snf.stanford.edu > >Date: Fri, 28 Mar 2008 16:17:02 -0700 > >From: Mahnaz Mansourpour <mahnaz at stanford.edu> > >User-Agent: Mozilla/5.0 (Windows; U; Windows NT 5.1; en-US; > >rv:1.0.1) Gecko/20020823 Netscape/7.0 > >X-Accept-Language: en-us, en > >To: "SpecMat at snf.stanford.edu" > <SpecMat at snf.stanford.edu> > >Subject: [Fwd: InSb] > > > > > > > >-------- Original Message -------- > >Subject: InSb > >Date: Fri, 28 Mar 2008 10:29:13 -0700 > >From: Erzsi Marie Szilagyi > ><eszila > gy at stanford.edu> > >To: > mahnaz at snf.stanford.edu > > > > > > > >Hi Mahnaz, > > > >I'm interested in using InSb > >(< 0860.htm>http://asp.cerac.com/CatalogNet/default.aspx?p=msdsFile&msds=m000860.htm>http://asp.cerac.com/CatalogNet/default.aspx?p=msdsFile&msds=m000860.htm) > >as > >my wafer material and was wondering if you could tell me what I need > >to do to be able to use it in the SNF? I'm working with Yves Acremann > >and he recommended that I email you. > > > >Thanks so much! > >Erzsi > > > > > >