From mtang at stanford.edu  Mon May  5 08:33:42 2008
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 05 May 2008 08:33:42 -0700
Subject: [Fwd: Fwd: Contamination results from SNF]
Message-ID: <481F28D6.2090502@stanford.edu>

Hi again --

Aditya came by to talk last Friday and may have talked with some of 
you.  As I understand it, his devices contain TiSi (Ti from gryphon).  
The wafers go through EVBond and so are considered gold.  The problem is 
that he is concerned about contamination from the rtagaas.  He had 
looked at the rtaag, but it does not offer the control he requires.  He 
has proposed that his company install an RTA from AllWin (at $60K, or 
so) with the understanding that it be used by his company exclusively 
and then donated to SNF when they are done.

Alternatively, he'd like to use the AG4108, if his wafers can be 
considered semiclean.  They would be considered semiclean, if it were 
not for the EVBond step.  We should talk with him about what his 
experimental plans are because eventually, he will be migrating over to 
some really odd materials.

I think Aditya is planning to come to today's SpecMat clinic at 3 pm to 
discuss his processing needs. 

Mary

-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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Subject: Fwd: Contamination results from SNF
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From mahnaz at stanford.edu  Mon May  5 13:40:52 2008
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Mon, 05 May 2008 13:40:52 -0700
Subject: [Fwd: Yes oven after APTES]
Message-ID: <481F70D4.9080708@stanford.edu>



-------- Original Message --------
Subject: Yes oven after APTES
Date: Mon, 05 May 2008 12:43:25 -0700
From: Johan Andreasson <johan at andreasson.com>
To: Mahnaz Mansourpour <mahnaz at stanford.edu>



Hi Mahnaz,
For my project I will add a layer of APTES 
(3-AminoPropylTriEthoxySilane) to my quartz wafer before adding the 
photoresist. Should I still use the YES oven before using the svgcoat 
(is this even allowed?), or should I use another approach? The protocol 
calls for 20 min bake at 115 degrees after dipping the wafer into the 
APTES solution and I was planning on doing this step in my lab. Do I 
need to use HDMS after that or should I use the normal program, as it is 
defined in the recipe?
Best regards
Johan

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From bwchui at gmail.com  Mon May  5 15:59:28 2008
From: bwchui at gmail.com (Ben Chui)
Date: Mon, 5 May 2008 15:59:28 -0700
Subject: specmat request for polyimide thinner
Message-ID: <ac0983ff0805051559o1ed44ce6r3e1a8c0423b6c21d@mail.gmail.com>

Dear Specmat Committee,

      On behalf of A.M. Fitzgerald and Associates, I'd like to request
approval to use T-9039, which is a polyimide thinner sold by
Dupont/Hitachi (to allow polyimide films to be spun thinner than
usual).  I enclose the MSDS.  It is apparently just a mixture of two
different solvents.

      Please let me know if you have any questions.  Thanks!

Ben Chui
A.M. Fitzgerald and Assoc
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From mtang at stanford.edu  Mon May  5 16:54:54 2008
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 05 May 2008 16:54:54 -0700
Subject: specmat request for polyimide thinner
In-Reply-To: <ac0983ff0805051559o1ed44ce6r3e1a8c0423b6c21d@mail.gmail.com>
References: <ac0983ff0805051559o1ed44ce6r3e1a8c0423b6c21d@mail.gmail.com>
Message-ID: <481F9E4E.50901@stanford.edu>

Hi all --

This is a mixture of two chemicals which I believe are already accepted 
for use in the lab.  NMP is OK.  And PGME, I am not sure we've 
explicitly OK'ed for use in the lab before, but it is of the same family 
of "acceptable" propylene glycol ethers which appears in many resists.  
I think these are fine, given the standard precautions for labeling, 
handling, and waste disposal.

Mary

Ben Chui wrote:
> Dear Specmat Committee,
>
>       On behalf of A.M. Fitzgerald and Associates, I'd like to request
> approval to use T-9039, which is a polyimide thinner sold by
> Dupont/Hitachi (to allow polyimide films to be spun thinner than
> usual).  I enclose the MSDS.  It is apparently just a mixture of two
> different solvents.
>
>       Please let me know if you have any questions.  Thanks!
>
> Ben Chui
> A.M. Fitzgerald and Assoc
>   


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From athiel at stanford.edu  Thu May  8 15:34:40 2008
From: athiel at stanford.edu (Andrew Thiel)
Date: Thu, 08 May 2008 15:34:40 -0700
Subject: CVD of organosilicate glass films at SNF
Message-ID: <20080508153440.7ffugg48u8444sww@webmail.stanford.edu>

Hello,

I am a materials science graduate student interested in depositing  
thin films of organosilicate glass films by means of CVD.  However,  
this goal is merely in the planning stages, so I am simply trying to  
extract all the fundamental information I need to get started.  I have  
never performed CVD, so bear with me.

If you could provide me with all the essential information about  
setting up a new CVD process, that would be of great help to me.  I'll  
be supplying my own gases (the exact precursors are not yet known), so  
are there gas tank restrictions/suggestions?  Are any special tools or  
fixtures needed?  Are you currently set up to deposit  
carbon-containing films?  Are there special considerations for  
carbon-containing films?  What else do I need to know?

Once I know more details, I will certainly fill you in.  I appreciate  
you taking the time to walk me through this process.

Thank you,
Andrew Thiel


From mahnaz at stanford.edu  Thu May  8 17:04:35 2008
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 08 May 2008 17:04:35 -0700
Subject: [Fwd: Parylene]
Message-ID: <48239513.4070203@stanford.edu>


Hello all,

I already have talked to him , I need to look at the msds and decide on 
the yes oven part of it, the rest of litho is ok.  What do every one 
think of the etching part of it?
mahnaz
-------- Original Message --------
Subject: Parylene
Date: Thu, 8 May 2008 16:01:26 -0700
From: "Vikram Mukundan" <mvikram at stanford.edu>
Organization: Stanford University
To: "Mahnaz Mansourpour" <mahnaz at snf.stanford.edu>



Hi Mahnaz,
 
I had talked to you this afternoon about allowing parylene coated wafers 
in the litho and possibly in the plasma. I have attached some files 
related to this for your reference.
 
1. My process run with highlighted steps after parylene-N deposition.
2. MSDS for parylene-N.
3. A paper on the thermal stability of parylene-N (they are stable up to 
350 C)
4. A paper on plasma etching techniques on parylene coatings using O2 
plasma, RIE and Bosch process. This paper involves lithography with HMDS 
prime, spin resist, baking and developing. In a private communication, 
the author of this paper has mentioned that parylene is inert in most 
processes.
 
My minimum requirement would be to be able to perform litho steps on 
coated wafers. If things work out well I would like to see if I can use 
one of the plasma etchers. My process is gold contaminated at this stage.
 
Please let me know if you need any more information.
 
thank you for the help,
Vikram
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From mtang at stanford.edu  Thu May  8 17:32:33 2008
From: mtang at stanford.edu (Mary Tang)
Date: Thu, 08 May 2008 17:32:33 -0700
Subject: [Fwd: Parylene]
In-Reply-To: <48239513.4070203@stanford.edu>
References: <48239513.4070203@stanford.edu>
Message-ID: <48239BA1.4040501@stanford.edu>

Hi all --

My two cents'...  Since the parylene is already polymerized/deposited, 
it's pretty inert.  It is a cyclic, fairly inert polymer, maybe kind of 
like cyclotene/BCB, so I think the etching chemistry might be similar -- 
so fluorine-based chemistry with oxygen, I suspect, would be a good 
place to start.  This places the etching in drytek4 or pquest.  It would 
be helpful to know what his etch needs are (how deep, what for, what 
resist/mask, what size structures.)  That would help determine whether 
the drytek4 or pquest can meet his process needs.

Who will be getting back to him?

Mary

Mahnaz Mansourpour wrote:
>
> Hello all,
>
> I already have talked to him , I need to look at the msds and decide 
> on the yes oven part of it, the rest of litho is ok.  What do every 
> one think of the etching part of it?
> mahnaz
> -------- Original Message --------
> Subject: 	Parylene
> Date: 	Thu, 8 May 2008 16:01:26 -0700
> From: 	"Vikram Mukundan" <mvikram at stanford.edu>
> Organization: 	Stanford University
> To: 	"Mahnaz Mansourpour" <mahnaz at snf.stanford.edu>
>
>
>
> Hi Mahnaz,
>  
> I had talked to you this afternoon about allowing parylene coated 
> wafers in the litho and possibly in the plasma. I have attached some 
> files related to this for your reference.
>  
> 1. My process run with highlighted steps after parylene-N deposition.
> 2. MSDS for parylene-N.
> 3. A paper on the thermal stability of parylene-N (they are stable up 
> to 350 C)
> 4. A paper on plasma etching techniques on parylene coatings using O2 
> plasma, RIE and Bosch process. This paper involves lithography with 
> HMDS prime, spin resist, baking and developing. In a private 
> communication, the author of this paper has mentioned that parylene is 
> inert in most processes.
>  
> My minimum requirement would be to be able to perform litho steps on 
> coated wafers. If things work out well I would like to see if I can 
> use one of the plasma etchers. My process is gold contaminated at this 
> stage.
>  
> Please let me know if you need any more information.
>  
> thank you for the help,
> Vikram


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From mtang at snf.stanford.edu  Thu May  8 17:35:13 2008
From: mtang at snf.stanford.edu (Mary Tang)
Date: Thu, 08 May 2008 17:35:13 -0700
Subject: specmat request for polyimide thinner
In-Reply-To: <ac0983ff0805051559o1ed44ce6r3e1a8c0423b6c21d@mail.gmail.com>
References: <ac0983ff0805051559o1ed44ce6r3e1a8c0423b6c21d@mail.gmail.com>
Message-ID: <48239C41.30801@snf.stanford.edu>

Hi Ben --

This chemical is officially approved for use as polyimide thinner, 
provided standard storage and waste collection procedures are noted.  
Please get the yellow tag and barcode from Mahnaz if you plan to store 
in the flammables are of the lab and collect any waste in the solvent 
carboy.

Mary on behalf of SpecMat

Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



Ben Chui wrote:
> Dear Specmat Committee,
>
>       On behalf of A.M. Fitzgerald and Associates, I'd like to request
> approval to use T-9039, which is a polyimide thinner sold by
> Dupont/Hitachi (to allow polyimide films to be spun thinner than
> usual).  I enclose the MSDS.  It is apparently just a mixture of two
> different solvents.
>
>       Please let me know if you have any questions.  Thanks!
>
> Ben Chui
> A.M. Fitzgerald and Assoc



From bwchui at gmail.com  Thu May  8 19:25:23 2008
From: bwchui at gmail.com (Ben Chui)
Date: Thu, 8 May 2008 19:25:23 -0700
Subject: specmat request for polyimide thinner
In-Reply-To: <48239C41.30801@snf.stanford.edu>
References: <ac0983ff0805051559o1ed44ce6r3e1a8c0423b6c21d@mail.gmail.com>
	 <48239C41.30801@snf.stanford.edu>
Message-ID: <ac0983ff0805081925t13104796n665b26a91bcb0d9d@mail.gmail.com>

Mary,

   Thanks for the notification!

Cheers,

Ben


On 08/05/2008, Mary Tang <mtang at snf.stanford.edu> wrote:
> Hi Ben --
>
> This chemical is officially approved for use as polyimide thinner, provided
> standard storage and waste collection procedures are noted.  Please get the
> yellow tag and barcode from Mahnaz if you plan to store in the flammables
> are of the lab and collect any waste in the solvent carboy.
>
> Mary on behalf of SpecMat
>
> Mary X. Tang, Ph.D.
> Stanford Nanofabrication Facility
> CIS Room 136, Mail Code 4070
> Stanford, CA  94305
> (650)723-9980
> mtang at stanford.edu
> http://snf.stanford.edu
>
>
>
>
> Ben Chui wrote:
> > Dear Specmat Committee,
> >
> >      On behalf of A.M. Fitzgerald and Associates, I'd like to request
> > approval to use T-9039, which is a polyimide thinner sold by
> > Dupont/Hitachi (to allow polyimide films to be spun thinner than
> > usual).  I enclose the MSDS.  It is apparently just a mixture of two
> > different solvents.
> >
> >      Please let me know if you have any questions.  Thanks!
> >
> > Ben Chui
> > A.M. Fitzgerald and Assoc
> >
>
>


From support at global-fab.com  Thu May  8 22:21:30 2008
From: support at global-fab.com (David Lee)
Date: Fri, 9 May 2008 01:21:30 -0400 (EDT)
Subject: Closed Bid Auction of Semiconductor Tools, LAM, SVG, IPEC, BioRad
Message-ID: <1102091572737.1101401002153.9044.6.14012023@scheduler>


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support at global-fab.com
Global Fab Surplus


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From newsletter at discount-educational-software.net  Fri May  9 04:16:40 2008
From: newsletter at discount-educational-software.net (Educational Software Newsletter)
Date: Fri, 9 May 2008 07:16:40 -0400
Subject: Educational Software News - May 2008                   
Message-ID: <47aa08762dcdce065125ba7498512d@bmw>

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From mcvittie at cis.Stanford.EDU  Fri May  9 10:28:45 2008
From: mcvittie at cis.Stanford.EDU (Jim McVittie)
Date: Fri, 9 May 2008 10:28:45 -0700 (PDT)
Subject: CVD of organosilicate glass films at SNF
In-Reply-To: <20080508153440.7ffugg48u8444sww@webmail.stanford.edu>
Message-ID: <Pine.LNX.4.44.0805091015151.5815-100000@cis.Stanford.EDU>

Andrew,

Back around 1990 we had extra low pressure CVD tubes, and we tested at
least 3 different organosilicate precursors for silicon glass deposition.  
See Lie-Yea Cheng's 1991 dissertation.  Since that time, the extra tubes
are long gone, and it has become much more difficult to test new 
precursors in SNF. I think you would be more successful if you looked for 
a research reactor outside of SNF. 

	Jim 

On Thu, 8 May 2008, Andrew Thiel wrote:

> Hello,
> 
> I am a materials science graduate student interested in depositing  
> thin films of organosilicate glass films by means of CVD.  However,  
> this goal is merely in the planning stages, so I am simply trying to  
> extract all the fundamental information I need to get started.  I have  
> never performed CVD, so bear with me.
> 
> If you could provide me with all the essential information about  
> setting up a new CVD process, that would be of great help to me.  I'll  
> be supplying my own gases (the exact precursors are not yet known), so  
> are there gas tank restrictions/suggestions?  Are any special tools or  
> fixtures needed?  Are you currently set up to deposit  
> carbon-containing films?  Are there special considerations for  
> carbon-containing films?  What else do I need to know?
> 
> Once I know more details, I will certainly fill you in.  I appreciate  
> you taking the time to walk me through this process.
> 
> Thank you,
> Andrew Thiel
> 

-- 
--------------------------------------------------------------
Jim McVittie, Ph.D.    			Senior Research Scientist 
Allen Center for Integrated Systems     Electrical Engineering
Stanford University             	jmcvittie at stanford.edu
Rm. 336, 330 Serra Mall			Fax: (650) 723-4659
Stanford, CA 94305-4075			Tel: (650) 725-3640




From nlatta at stanford.edu  Fri May  9 11:08:46 2008
From: nlatta at stanford.edu (Nancy Latta)
Date: Fri, 09 May 2008 11:08:46 -0700
Subject: [Fwd: Parylene]
In-Reply-To: <48239513.4070203@stanford.edu>
References: <48239513.4070203@stanford.edu>
Message-ID: <4824932E.1000303@stanford.edu>

Folks,

As I am reading this, what is being requested in EtchWorld is to do deep 
Si RIE in an STS on wafers with no processing other than litho.  Fine 
with me.  Then later a parylene etch using a contamined etcher (resist 
as an etch mask?  If yes, selectivity to parylene?).  Again, fine with 
me in drytek1 or 4, mrc or pquest- they all have O2 and Fl if needed.

Hope this helps,

-Nancy

Mahnaz Mansourpour wrote:

>
> Hello all,
>
> I already have talked to him , I need to look at the msds and decide 
> on the yes oven part of it, the rest of litho is ok.  What do every 
> one think of the etching part of it?
> mahnaz
> -------- Original Message --------
> Subject: 	Parylene
> Date: 	Thu, 8 May 2008 16:01:26 -0700
> From: 	"Vikram Mukundan" <mvikram at stanford.edu>
> Organization: 	Stanford University
> To: 	"Mahnaz Mansourpour" <mahnaz at snf.stanford.edu>
>
>
>
> Hi Mahnaz,
>  
> I had talked to you this afternoon about allowing parylene coated 
> wafers in the litho and possibly in the plasma. I have attached some 
> files related to this for your reference.
>  
> 1. My process run with highlighted steps after parylene-N deposition.
> 2. MSDS for parylene-N.
> 3. A paper on the thermal stability of parylene-N (they are stable up 
> to 350 C)
> 4. A paper on plasma etching techniques on parylene coatings using O2 
> plasma, RIE and Bosch process. This paper involves lithography with 
> HMDS prime, spin resist, baking and developing. In a private 
> communication, the author of this paper has mentioned that parylene is 
> inert in most processes.
>  
> My minimum requirement would be to be able to perform litho steps on 
> coated wafers. If things work out well I would like to see if I can 
> use one of the plasma etchers. My process is gold contaminated at this 
> stage.
>  
> Please let me know if you need any more information.
>  
> thank you for the help,
> Vikram




From mahnaz at stanford.edu  Fri May  9 14:29:05 2008
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Fri, 09 May 2008 14:29:05 -0700
Subject: [Fwd: Parylene]
References: <48239513.4070203@stanford.edu> <48239BA1.4040501@stanford.edu>
Message-ID: <4824C221.3010807@stanford.edu>


 Hello all,

He can not go to the yes oven any way. He will  use the track coater 
prime station.
Please get back to him regarding the  etching. He will do the litho this 
week.
mahnaz
Mary Tang wrote:

> Hi all --
>
> My two cents'...  Since the parylene is already polymerized/deposited, 
> it's pretty inert.  It is a cyclic, fairly inert polymer, maybe kind 
> of like cyclotene/BCB, so I think the etching chemistry might be 
> similar -- so fluorine-based chemistry with oxygen, I suspect, would 
> be a good place to start.  This places the etching in drytek4 or 
> pquest.  It would be helpful to know what his etch needs are (how 
> deep, what for, what resist/mask, what size structures.)  That would 
> help determine whether the drytek4 or pquest can meet his process needs.
>
> Who will be getting back to him?
>
> Mary
>
> Mahnaz Mansourpour wrote:
>
>>
>> Hello all,
>>
>> I already have talked to him , I need to look at the msds and decide 
>> on the yes oven part of it, the rest of litho is ok.  What do every 
>> one think of the etching part of it?
>> mahnaz
>> -------- Original Message --------
>> Subject:     Parylene
>> Date:     Thu, 8 May 2008 16:01:26 -0700
>> From:     "Vikram Mukundan" <mvikram at stanford.edu>
>> Organization:     Stanford University
>> To:     "Mahnaz Mansourpour" <mahnaz at snf.stanford.edu>
>>
>>
>>
>> Hi Mahnaz,
>>  
>> I had talked to you this afternoon about allowing parylene coated 
>> wafers in the litho and possibly in the plasma. I have attached some 
>> files related to this for your reference.
>>  
>> 1. My process run with highlighted steps after parylene-N deposition.
>> 2. MSDS for parylene-N.
>> 3. A paper on the thermal stability of parylene-N (they are stable up 
>> to 350 C)
>> 4. A paper on plasma etching techniques on parylene coatings using O2 
>> plasma, RIE and Bosch process. This paper involves lithography with 
>> HMDS prime, spin resist, baking and developing. In a private 
>> communication, the author of this paper has mentioned that parylene 
>> is inert in most processes.
>>  
>> My minimum requirement would be to be able to perform litho steps on 
>> coated wafers. If things work out well I would like to see if I can 
>> use one of the plasma etchers. My process is gold contaminated at 
>> this stage.
>>  
>> Please let me know if you need any more information.
>>  
>> thank you for the help,
>> Vikram
>
>
>




From mahnaz at stanford.edu  Fri May  9 16:39:45 2008
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Fri, 09 May 2008 16:39:45 -0700
Subject: [Fwd: [Fwd: Protocol and APTES]]
Message-ID: <4824E0C1.8070401@stanford.edu>


Just a heads up....Johan will send a request to specmatt only worry 
about the Aptes part of it the rest  of it, I am working with hi.

mahnaz
-------- Original Message --------
Subject: [Fwd: Protocol and APTES]
Date: Fri, 09 May 2008 16:37:00 -0700
From: Mahnaz Mansourpour <mahnaz at stanford.edu>
To: Binder Mann <binder.mann at asml.com>, Johan Andreasson 
<johana at stanford.edu>, Mahnaz Mansourpour <mahnaz at stanford.edu>



Hi Binder,

Here is the information from Johan. He is quiet interested in applying 
the Barli to the back of the wafers.
Due to Aptes on his wafers his etching is limited. So the ball is in 
your court, would you consider it ? Would you be comfortable? We need to 
think about it as the news always spread much faster we like it too.
If not , next step will be I line resist with dye in it.

mahnaz

-------- Original Message --------
Subject: Protocol and APTES
Date: Fri, 09 May 2008 15:44:31 -0700
From: Johan Andreasson <johana at stanford.edu>
To: mahnaz at snf.stanford.edu



Hi Mahnaz,
I have attached the protocol I'm following so you can have a look for
yourself regarding the antireflective coating etc.
They spin it onto the reverse side and bake it at 180 degrees for 2
min, which is similar to what we discussed earlier, so I really think
that we should try this.
Also, I think that using the APTES inside the clean room would really
make it easier keeping the wafers totally clean, avoiding trips to and
from my lab, and baking them in clean ovens at a fix temperature. All
of this is somewhat problematic now. I tried it out and there is
definitely room for improvement.
One address which lists the product is
http://www.sigmaaldrich.com/catalog/search/ProductDetail/ALDRICH/440140
Aptes is in solution and I will use a 95% ethanol, 5% water mixture
(pH 5.0 using acetic acid) to dilute it to a final concentration of 1%.

I will go ahead and make a proper, complete, application to the
SpecMat committee unless you strongly recommend against it. Please let
me know what you think.
Best regards,
Johan


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From lwchang at stanford.edu  Sun May 11 02:33:04 2008
From: lwchang at stanford.edu (Li-Wen Chang)
Date: Sun, 11 May 2008 02:33:04 -0700
Subject: New Chemicals & Materials Request for CMP slurries
Message-ID: <8ab79e460805110233q73c129aan4c892f8c34b60d9b@mail.gmail.com>


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From johan at andreasson.com  Mon May 12 11:06:44 2008
From: johan at andreasson.com (Johan Andreasson)
Date: Mon, 12 May 2008 11:06:44 -0700
Subject: APTES
Message-ID: <48288734.7020500@andreasson.com>

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From mtang at stanford.edu  Mon May 12 12:13:18 2008
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 12 May 2008 12:13:18 -0700
Subject: APTES
In-Reply-To: <48288734.7020500@andreasson.com>
References: <48288734.7020500@andreasson.com>
Message-ID: <482896CE.5090302@stanford.edu>

Hi SpecMat'ers --

Before sending a reply to Johan, I thought I'd pass it by you.  Add your 
comments/suggestions, please:

****************************************
Hi Johan --

APTES is OK to use in the lab in very specific areas.

1.  Keep liquid out of the litho area.  This could cause problems with 
surface quality in other people's wafers.
2.  Store the APTES in the flammables cabinet or flammables 
refrigerator.  (Does is require rfrigeration?  I don't think it can 
hurt, if tightly sealed.)  Make sure to have the barcode and yellow 
label.  Be aware that APTES should be kept as dry as possible, which 
includes minimizing the time the bottle is opened to air.  APTES will 
hydrolyze in the presence of trace moisture.  So, if you refrigerate, 
bring the bottle up to room temperature before opening, to minimize 
condensation.
3.  Processing of your quartz should be done in wbsolvent.  If you are 
not already qualified, please talk with Uli about getting 
trained/qualified.  Work with her on your protocol.  I would suggest 
obtaining, using, and storing your own glassware.  Clean your labware 
first.  Trace chemicals can contaminate your wafer surfaces.
4.  We don't have a pH meter in the lab.  I'd suggest that actually pH 
paper would be better (more accurate and allow you to keep probes out of 
your solution), so you'd have to obtain paper with the appropriate 
range.  (By the way, it is a misconception that you actually obtain a 
monolayer -- it is actually quite difficult, I understand, to get a nice 
monolayer of APTES.)
5.  On step 3C, do not use the singe oven to bake the APTES coated 
wafer.  Please use one of the litho hot plates -- make sure to replace 
the foil on top before and after your APTES wafers are heated.

I believe the rest of the procedure is OK.  However, I do think that 
before committing your wafers to this process, it would be useful to do 
some quick experiments.  One experiment would be to see how well the 
i-line resist holds up to CHF3/O2 etching...  Typically, we have found 
that the i-line resist etches more quickly than the standard 3612.  I am 
not sure even the 3612 would stand up to 60 minutes of etching in the 
amtetcher.  It might help also to have an idea of the etch rate of X-cut 
quartz, so you'll know how long an etch the resist needs to withstand.

One last thing -- I would not do an HMDS singe/prime before coating your 
wafers with resist.  This could mess up your APTES coating.  Without 
HMDS, resist adhesion might be a problem.  (It may be that hand-develop 
might be required, if your resist dots wash off in the svgdev.)

Mary

Johan Andreasson wrote:
>
>    1. Contact information
>
>          1. Name                         Johan Andreasson
>          2. Coral login                  johana
>          3. Phone number             650-724-5536
>          4. E-mail address            johana at stanford.edu
>             <mailto:johana at stanford.edu>
>          5. Who I work for           Prof. Steven M. Block,
>             Biology/Applied physics
>
>    1. Chemical
>
>          1. Name                           3-AMINOPROPYLTRIETHOXYSILANE
>          2. Synonym                     C9-H23-N-O3-Si,
>             C9-H23-N-O3-Si, "1-propanamine, 3-(triethoxysilyl)",
>             "1-propanamine, 3-(triethoxysilyl)", "propylamine,
>             3-(triethoxysilyl)-", "propylamine, 3-(triethoxysilyl)-",
>             "silane, (3-aminopropyl)triethoxy-",
>             3-(triethoxysilyl)propylamine,
>             3-(triethoxysilyl)propylamine,
>             (3-aminopropyl)triethoxysilane, "silane,
>             gamma-aminopropyltriethoxy-", "aminopropyl triethoxy
>             silane", triethoxy(3-aminopropyl)silane,
>             gamma-aminopropyltriethoxysilane, "Union Carbide A-1100",
>             A1102, A1112, A0750, "Silicone A1100", APS, APSE, APTES,
>             "Dynasylan AMEO", GF93, KBE903, KBM903, KH550, "NUCA
>             1100", "Sila-Ace S330", "Silane AM69", "Prosil 220",
>             "Prosil 221", "VM651 Coupling Agent", APTS
>          3. Secondary chemical     Acetic acid and ethanol
>          4. Main hazards               Water reactives, corrosives
>          5. Storage group              B, Pyrophoric and Water
>             Reactive Materials
>
>    1. Vendor/manufacturer info
>          1. Address                       Sigma-Aldrich
>                                                 Customer Support
>                                                 PO Box 14508
>                                                 St. Louis, MO 63178
>                                                 UNITED STATES
>          2. Phone number             800-325-3010
>          3. Website URL              www.sigmaaldrich.com
>             <http://www.sigmaaldrich.com/> (company)
>                        
>             www.sigmaaldrich.com/catalog/search/ProductDetail/ALDRICH/440140-BULK
>             <http://www.sigmaaldrich.com/catalog/search/ProductDetail/ALDRICH/440140-BULK>
>             (product)
>    2. Reason for request
>          1. This is an essential material in the protocol for my
>             application, published in Nature methods last year (see
>             attachment Supplementary methods.pdf). There is no other
>             viable chemical that can replace APTES and the wafers,
>             later exposed with 0.5 ?m features, need to be maintained
>             in a clean state. This has been attempted, by using our
>             own lab, but it proved very challenging.
>    3. Process flow
>          1. The APTES will be used for surface treatment of quartz
>             wafers, following initial cleaning in piranha solution and
>             adding of an antireflective coating on the back side of
>             the wafer.
>          2. 200 microliter of APTES will be pipetted into a beaker
>             containing a solution of 95% ethanol and 5% water,
>             adjusted to pH 5.0 using acetic acid. A quartz wafer will
>             be added and sonicated for 4 min. Then follows three wash
>             steps where the wafer is placed in 50 ml of ethanol and
>             sonicated briefly. This will lead to a monolayer of APTES
>             onto the clean side of the wafer.
>          3. The wafers are dried with a nitrogen gun and placed in a
>             115 degree oven for 20 min. (singe oven)
>          4. iLine resist added using svgcoat. The step includes a
>             pre-coat and post coat bake.
>          5. Exposure using the AMSL.
>          6. Post exposure bake and development using svgdev.
>          7. UV illumination and postbake at 110 degrees.
>          8. AMT etcher, CF3 and o2 etching.
>          9. Drytek2, polymer cleanup.
>         10. Removal of photoresist using WBsolvent. Sonication for 20
>             min in acetone.
>         11. Characterization in semhitachi
>    4. Amount and form
>          1. 100 ml liquid. It will be diluted to 1% immediately before
>             use.
>    5. Storage
>          1. I would like to store a small plastic bottle at SNF if
>             possible.
>          2. Potential reactivities:  strong oxidizing agents, acids,
>             moisture
>    6. Disposal
>          1. Local collection. APTES is water reactive so the storage
>             is probably best to be a separate waste container, where
>             the diluted APTES and ethanol from subsequent wash steps
>             are collected.
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From akamath at kovio.com  Thu May 15 14:31:51 2008
From: akamath at kovio.com (Arvind Kamath)
Date: Thu, 15 May 2008 14:31:51 -0700
Subject: AP400 approval
Message-ID: <0A734412B02624499172B7366A97336B0E1C0BD198@server.print-this.com>

Hello,

            We would like to  if AP400 from Silicon Resources is preapproved to be brought in? This is an adhesion promoter for Tungsten etching that we would use on the Headway. Some users on the mailing list had suggested this to me so I assume it is used- but I am checking anyway.

            Please let me know,

                     Regards,

                        Arvind Kamath


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From mtang at stanford.edu  Thu May 15 14:35:52 2008
From: mtang at stanford.edu (Mary Tang)
Date: Thu, 15 May 2008 14:35:52 -0700
Subject: AP400 approval
In-Reply-To: <0A734412B02624499172B7366A97336B0E1C0BD198@server.print-this.com>
References: <0A734412B02624499172B7366A97336B0E1C0BD198@server.print-this.com>
Message-ID: <482CACB8.1080209@stanford.edu>

Hi SpecMat'ers --

You know, I do believe this has already been approved by SpecMat.  I'm 
pretty sure we've a couple of bottles in the lab (or did, last year or so.)

We should ask him for the MSDS as a matter of course.  But it would be 
REALLY NICE to keep an ongoing database of the commonly requested 
chemicals, their application notes and MSDS's.  Maybe the Wiki?

Mary

Arvind Kamath wrote:
>
> Hello,
>
>  
>
>             We would like to  if AP400 from Silicon Resources is 
> preapproved to be brought in? This is an adhesion promoter for 
> Tungsten etching that we would use on the Headway. Some users on the 
> mailing list had suggested this to me so I assume it is used- but I am 
> checking anyway.
>
>  
>
>             Please let me know,
>
>  
>
>                      Regards,
>
>  
>
>                         Arvind Kamath
>
>  
>
>  
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




From mahnaz at stanford.edu  Thu May 15 16:10:44 2008
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 15 May 2008 16:10:44 -0700
Subject: AP400 approval
References: <0A734412B02624499172B7366A97336B0E1C0BD198@server.print-this.com>
Message-ID: <482CC2F4.6030609@stanford.edu>

Hello

The chemical has been approved previously. Please use it at headway and 
take all the precaution  that applies to HMDS. Please see me if you have 
any other question or process question , I have used it myself.
Please come by my office and do the proper paper work and get the label 
and the barcode before the chemical finds its way to the lab.

mahnaz

Arvind Kamath wrote:

> Hello,
>
>  
>
>             We would like to  if AP400 from Silicon Resources is 
> preapproved to be brought in? This is an adhesion promoter for 
> Tungsten etching that we would use on the Headway. Some users on the 
> mailing list had suggested this to me so I assume it is used- but I am 
> checking anyway.
>
>  
>
>             Please let me know,
>
>  
>
>                      Regards,
>
>  
>
>                         Arvind Kamath
>
>  
>
>  
>

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From mahnaz at stanford.edu  Thu May 15 16:36:16 2008
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 15 May 2008 16:36:16 -0700
Subject: [Fwd: FW: Thick resist eval for SVTC]
Message-ID: <482CC8F0.5000608@stanford.edu>



Hello all,

Here is the MSDS for TOK resist, request from ASML.
Regardless to say that will be spun up in KScoater.
I do not have any issues with it, let me know if any?
mahnaz
-------- Original Message --------
Subject: FW: Thick resist eval for SVTC
Date: Wed, 14 May 2008 15:55:49 -0400
From: "Binder Mann" <binder.mann at asml.com>
To: "Mahnaz Mansourpour" <mahnaz at stanford.edu>
CC: "Nandasiri Samarakone" <nandasiri.samarakone at asml.com>, "Paul Yick" 
<paul.yick at asml.com>



Hi Mahnaz,
The MSDS is attached for TOK resist we will be evaluating after your 
review. Can you please let us know if approved by the Spec Mat 
committee, we can bring the material in and start developing the coating 
process. Please let me know if you need any additional information.
Thanks and regards, Binder

------------------------------------------------------------------------
From: Alfred Renaldo [mailto:alfred.renaldo at svtc.com]
Sent: Monday, May 12, 2008 10:48
To: Binder Mann
Subject: RE: Thick resist eval for SVTC

Binder, See attached file.  Am trying to get the material for your 
evaluation this week.
 
Al

------------------------------------------------------------------------
From: Binder Mann [mailto:binder.mann at asml.com]
Sent: Monday, May 12, 2008 10:47 AM
To: Alfred Renaldo
Subject: RE: Thick resist eval for SVTC

Hi Alfred,
Can we please get MSDS for TOK material, we will be coating the wafers 
at Stanford Nano lab. We will have to make a proper, complete, 
application to the Spec Mat committee at Stanford prior taking the 
material in the lab. Also can you please give us some time line when we 
will get the material so we can schedule the tool time for imaging.
Thanks and regards, Binder

------------------------------------------------------------------------
From: Alfred Renaldo [mailto:alfred.renaldo at svtc.com]
Sent: Monday, May 05, 2008 13:27
To: Nandasiri Samarakone; Mary Zawadzki
Cc: Danny Wallis; Arnout Smit; Binder Mann; Paul Yick; Linda Ohara
Subject: RE: Thick resist eval for SVTC

Nanda,  I have a better chance of obtaining an SU-8 equivalent to KMPR 
from TOK meeting a 50 um thickness requirement.  Do you wish me to 
investigate this option?  I can most likely get the bottle for free from 
TOK. Mary needs to close on item #2.
 
Al

------------------------------------------------------------------------
From: Nandasiri Samarakone [mailto:nandasiri.samarakone at asml.com]
Sent: Monday, May 05, 2008 10:42 AM
To: Alfred Renaldo; Mary Zawadzki
Cc: Danny Wallis; Arnout Smit; Binder Mann; Paul Yick; Linda Ohara
Subject: Thick resist eval for SVTC

Hi Mary,
 
I am trying to schedule our activities / priorities at Stanford.
 
a) I urgently need to know if SVTC can purchase 500 ml of KMPR ( 50 um 
thick negative photoresist ) approx $600 so that we may continue with 
this evaluation.
b) Can someone communicate to My Thang that ASML needs acess to the HV 
SEM at SVTC so that the AZ 125NXT and 15NXT samples (allready exposed) 
can be examined.
 
Thanks
 
Nanda
 
 

-- The information contained in this communication and any attachments 
is confidential and may be privileged, and is for the sole use of the 
intended recipient(s). Any unauthorized review, use, disclosure or 
distribution is prohibited. Unless explicitly stated otherwise in the 
body of this communication or the attachment thereto (if any), the 
information is provided on an AS-IS basis without any express or implied 
warranties or liabilities. To the extent you are relying on this 
information, you are doing so at your own risk. If you are not the 
intended recipient, please notify the sender immediately by replying to 
this message and destroy all copies of this message and any attachments. 
ASML is neither liable for the proper and complete transmission of the 
information contained in this communication, nor for any delay in its 
receipt.

The content of this message is SVTC Technologies Confidential. This 
message may contain confidential, proprietary or legally privileged 
information. It is for the use of the named recipient only, and access 
by anyone else is unauthorized. If you have received this message in 
error, please reply to that effect and delete this message. Thank you.


-- The information contained in this communication and any attachments 
is confidential and may be privileged, and is for the sole use of the 
intended recipient(s). Any unauthorized review, use, disclosure or 
distribution is prohibited. Unless explicitly stated otherwise in the 
body of this communication or the attachment thereto (if any), the 
information is provided on an AS-IS basis without any express or implied 
warranties or liabilities. To the extent you are relying on this 
information, you are doing so at your own risk. If you are not the 
intended recipient, please notify the sender immediately by replying to 
this message and destroy all copies of this message and any attachments. 
ASML is neither liable for the proper and complete transmission of the 
information contained in this communication, nor for any delay in its 
receipt.
-- The information contained in this communication and any attachments 
is confidential and may be privileged, and is for the sole use of the 
intended recipient(s). Any unauthorized review, use, disclosure or 
distribution is prohibited. Unless explicitly stated otherwise in the 
body of this communication or the attachment thereto (if any), the 
information is provided on an AS-IS basis without any express or implied 
warranties or liabilities. To the extent you are relying on this 
information, you are doing so at your own risk. If you are not the 
intended recipient, please notify the sender immediately by replying to 
this message and destroy all copies of this message and any attachments. 
ASML is neither liable for the proper and complete transmission of the 
information contained in this communication, nor for any delay in its 
receipt.
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From mtang at stanford.edu  Fri May 16 11:41:20 2008
From: mtang at stanford.edu (Mary Tang)
Date: Fri, 16 May 2008 11:41:20 -0700
Subject: [Fwd: FW: Thick resist eval for SVTC]
In-Reply-To: <482CC8F0.5000608@stanford.edu>
References: <482CC8F0.5000608@stanford.edu>
Message-ID: <482DD550.3070000@stanford.edu>

Looks good to me.  A minor point...  This contains the kind of 
perfluoroalkyl sulfonates that the government is phasing out this year 
as being hazardous to health -- the same reason why we're having to 
qualify alternative versions PAD etch, gold etch, and LDD26W developer.  
So, not a problem for a demo, but maybe not a good choice for long term 
process development.

Mary

Mahnaz Mansourpour wrote:
>
>
> Hello all,
>
> Here is the MSDS for TOK resist, request from ASML.
> Regardless to say that will be spun up in KScoater.
> I do not have any issues with it, let me know if any?
> mahnaz
> -------- Original Message --------
> Subject: 	FW: Thick resist eval for SVTC
> Date: 	Wed, 14 May 2008 15:55:49 -0400
> From: 	"Binder Mann" <binder.mann at asml.com>
> To: 	"Mahnaz Mansourpour" <mahnaz at stanford.edu>
> CC: 	"Nandasiri Samarakone" <nandasiri.samarakone at asml.com>, "Paul 
> Yick" <paul.yick at asml.com>
>
>
>
> Hi Mahnaz,
> The MSDS is attached for TOK resist we will be evaluating after your 
> review. Can you please let us know if approved by the Spec Mat 
> committee, we can bring the material in and start developing the 
> coating process. Please let me know if you need any additional 
> information.
> Thanks and regards, Binder
>
> ------------------------------------------------------------------------
> *From:* Alfred Renaldo [mailto:alfred.renaldo at svtc.com]
> *Sent:* Monday, May 12, 2008 10:48
> *To:* Binder Mann
> *Subject:* RE: Thick resist eval for SVTC
>
> Binder, See attached file.  Am trying to get the material for your 
> evaluation this week.
>  
> Al
>
> ------------------------------------------------------------------------
> *From:* Binder Mann [mailto:binder.mann at asml.com]
> *Sent:* Monday, May 12, 2008 10:47 AM
> *To:* Alfred Renaldo
> *Subject:* RE: Thick resist eval for SVTC
>
> Hi Alfred,
> Can we please get MSDS for TOK material, we will be coating the wafers 
> at Stanford Nano lab. We will have to make a proper, complete, 
> application to the Spec Mat committee at Stanford prior taking the 
> material in the lab. Also can you please give us some time line when 
> we will get the material so we can schedule the tool time for imaging.
> Thanks and regards, Binder
>
> ------------------------------------------------------------------------
> *From:* Alfred Renaldo [mailto:alfred.renaldo at svtc.com]
> *Sent:* Monday, May 05, 2008 13:27
> *To:* Nandasiri Samarakone; Mary Zawadzki
> *Cc:* Danny Wallis; Arnout Smit; Binder Mann; Paul Yick; Linda Ohara
> *Subject:* RE: Thick resist eval for SVTC
>
> Nanda,  I have a better chance of obtaining an SU-8 equivalent to KMPR 
> from TOK meeting a 50 um thickness requirement.  Do you wish me to 
> investigate this option?  I can most likely get the bottle for free 
> from TOK. Mary needs to close on item #2.
>  
> Al
>
> ------------------------------------------------------------------------
> *From:* Nandasiri Samarakone [mailto:nandasiri.samarakone at asml.com]
> *Sent:* Monday, May 05, 2008 10:42 AM
> *To:* Alfred Renaldo; Mary Zawadzki
> *Cc:* Danny Wallis; Arnout Smit; Binder Mann; Paul Yick; Linda Ohara
> *Subject:* Thick resist eval for SVTC
>
> Hi Mary,
>  
> I am trying to schedule our activities / priorities at Stanford.
>  
> a) I urgently need to know if SVTC can purchase 500 ml of KMPR ( 50 um 
> thick negative photoresist ) approx $600 so that we may continue with 
> this evaluation.
> b) Can someone communicate to My Thang that ASML needs acess to the HV 
> SEM at SVTC so that the AZ 125NXT and 15NXT samples (allready exposed) 
> can be examined.
>  
> Thanks
>  
> Nanda
>  
>  
>
> -- The information contained in this communication and any attachments 
> is confidential and may be privileged, and is for the sole use of the 
> intended recipient(s). Any unauthorized review, use, disclosure or 
> distribution is prohibited. Unless explicitly stated otherwise in the 
> body of this communication or the attachment thereto (if any), the 
> information is provided on an AS-IS basis without any express or 
> implied warranties or liabilities. To the extent you are relying on 
> this information, you are doing so at your own risk. If you are not 
> the intended recipient, please notify the sender immediately by 
> replying to this message and destroy all copies of this message and 
> any attachments. ASML is neither liable for the proper and complete 
> transmission of the information contained in this communication, nor 
> for any delay in its receipt.
>
> The content of this message is SVTC Technologies Confidential. This 
> message may contain confidential, proprietary or legally privileged 
> information. It is for the use of the named recipient only, and access 
> by anyone else is unauthorized. If you have received this message in 
> error, please reply to that effect and delete this message. Thank you.
>
>
> -- The information contained in this communication and any attachments 
> is confidential and may be privileged, and is for the sole use of the 
> intended recipient(s). Any unauthorized review, use, disclosure or 
> distribution is prohibited. Unless explicitly stated otherwise in the 
> body of this communication or the attachment thereto (if any), the 
> information is provided on an AS-IS basis without any express or 
> implied warranties or liabilities. To the extent you are relying on 
> this information, you are doing so at your own risk. If you are not 
> the intended recipient, please notify the sender immediately by 
> replying to this message and destroy all copies of this message and 
> any attachments. ASML is neither liable for the proper and complete 
> transmission of the information contained in this communication, nor 
> for any delay in its receipt.
> -- The information contained in this communication and any attachments 
> is confidential and may be privileged, and is for the sole use of the 
> intended recipient(s). Any unauthorized review, use, disclosure or 
> distribution is prohibited. Unless explicitly stated otherwise in the 
> body of this communication or the attachment thereto (if any), the 
> information is provided on an AS-IS basis without any express or 
> implied warranties or liabilities. To the extent you are relying on 
> this information, you are doing so at your own risk. If you are not 
> the intended recipient, please notify the sender immediately by 
> replying to this message and destroy all copies of this message and 
> any attachments. ASML is neither liable for the proper and complete 
> transmission of the information contained in this communication, nor 
> for any delay in its receipt. 


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



From mahnaz at stanford.edu  Fri May 16 17:55:32 2008
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Fri, 16 May 2008 17:55:32 -0700
Subject: SVTC resist
Message-ID: <482E2D04.4090909@stanford.edu>

Hello Binder


I like to let you know that your chemical has been approved for use  in 
the KScoater. Although the resist contains perfluoroalkyl sulfonates 
that the government is  phasing out so for long term usage we need to 
revisit this. At SNF we are looking at  replacing  one of our developer 
LDD-26W as well by end of this year which contains the above chemical.

I like to take this opportunity and seriously look in to the smell issue 
with KScoater so I am suggesting that Mike works very closely with Gary 
during the usage of this chemical in the lab to see if we can improve 
the issue. I also like to suggest doing  it early in the morning  when 
 the lab is not as busy.
Let me know if you have any suggestions or questions.

mahnaz





From chingmei at stanford.edu  Thu May 22 22:01:49 2008
From: chingmei at stanford.edu (Ching-Mei Hsu)
Date: Thu, 22 May 2008 22:01:49 -0700
Subject: ZnO/Al2O3
Message-ID: <20080522220149.z6tul8s288c840ww@webmail.stanford.edu>


Dear committee,

I am a user in SNF from Materials Science working with Prof. Yi Cui.  
Recently, one of our projects need to deposit ZnO/Al2O3 alloys or ITO  
(Indium Tin Oxide) as devices contact. We look around on campus to  
find potential equipemt for this purpose. We are considering "  
Metallica" which may have the capability to reach this goal. However,  
we don't know whether this is allowed or you have other suggestion to  
deposite ZnO or ITo.Thanks, look forward to your news!

Best regards,

Ching-Mei


From athiel at stanford.edu  Wed May 28 13:15:58 2008
From: athiel at stanford.edu (Andrew Thiel)
Date: Wed, 28 May 2008 13:15:58 -0700
Subject: CVD of nitride layer onto organosilicate glass
Message-ID: <20080528131558.jkcdkn064kkc8o4k@webmail.stanford.edu>

Hello,

I'm a graduate student in materials science interested in using CVD at  
SNF.  I have a silicon wafer topped with a thin film of an  
organosilicate glass, and I'd simply like a silicon nitride film  
deposited onto it.  My research group (Dauskardt in MSE) has actually  
done this exact deposition at SNF several times over the past couple  
years without any issues, but the current manager of CVD at SNF  
(Maurice Stevens) is reluctant to allow an organosilicate glass into  
any chamber without the permission of SpecMat.

The specific organosilicate glass I would be introducing into the CVD  
chamber is DiEthoxyMethylSilane (DEMS).  My research group has  
conducted thermal studies and found this material to stable up to  
temperatures of at least 400 C.

Please let me know of any other additional information you may need.

Thanks,
Andrew


From edmyers at stanford.edu  Wed May 28 13:30:04 2008
From: edmyers at stanford.edu (Ed Myers)
Date: Wed, 28 May 2008 13:30:04 -0700
Subject: CVD of nitride layer onto organosilicate glass
In-Reply-To: <20080528131558.jkcdkn064kkc8o4k@webmail.stanford.edu>
References: <20080528131558.jkcdkn064kkc8o4k@webmail.stanford.edu>
Message-ID: <6.2.5.6.2.20080528132744.02db2cd0@stanford.edu>

Andrew,

By chance are you following Bree Sharrat's work?  If so, she was not 
approved for our LPCVD systems managed by Maurice, but allowed to run 
her samples in the STS PECVD system for nitride deposition.

Regards,
Ed


At 01:15 PM 5/28/2008, Andrew Thiel wrote:
>Hello,
>
>I'm a graduate student in materials science interested in using CVD at
>SNF.  I have a silicon wafer topped with a thin film of an
>organosilicate glass, and I'd simply like a silicon nitride film
>deposited onto it.  My research group (Dauskardt in MSE) has actually
>done this exact deposition at SNF several times over the past couple
>years without any issues, but the current manager of CVD at SNF
>(Maurice Stevens) is reluctant to allow an organosilicate glass into
>any chamber without the permission of SpecMat.
>
>The specific organosilicate glass I would be introducing into the CVD
>chamber is DiEthoxyMethylSilane (DEMS).  My research group has
>conducted thermal studies and found this material to stable up to
>temperatures of at least 400 C.
>
>Please let me know of any other additional information you may need.
>
>Thanks,
>Andrew