[Fwd: FW: Thick resist eval for SVTC]

Mahnaz Mansourpour mahnaz at stanford.edu
Thu May 15 16:36:16 PDT 2008



Hello all,

Here is the MSDS for TOK resist, request from ASML.
Regardless to say that will be spun up in KScoater.
I do not have any issues with it, let me know if any?
mahnaz
-------- Original Message --------
Subject: FW: Thick resist eval for SVTC
Date: Wed, 14 May 2008 15:55:49 -0400
From: "Binder Mann" <binder.mann at asml.com>
To: "Mahnaz Mansourpour" <mahnaz at stanford.edu>
CC: "Nandasiri Samarakone" <nandasiri.samarakone at asml.com>, "Paul Yick" 
<paul.yick at asml.com>



Hi Mahnaz,
The MSDS is attached for TOK resist we will be evaluating after your 
review. Can you please let us know if approved by the Spec Mat 
committee, we can bring the material in and start developing the coating 
process. Please let me know if you need any additional information.
Thanks and regards, Binder

------------------------------------------------------------------------
From: Alfred Renaldo [mailto:alfred.renaldo at svtc.com]
Sent: Monday, May 12, 2008 10:48
To: Binder Mann
Subject: RE: Thick resist eval for SVTC

Binder, See attached file.  Am trying to get the material for your 
evaluation this week.
 
Al

------------------------------------------------------------------------
From: Binder Mann [mailto:binder.mann at asml.com]
Sent: Monday, May 12, 2008 10:47 AM
To: Alfred Renaldo
Subject: RE: Thick resist eval for SVTC

Hi Alfred,
Can we please get MSDS for TOK material, we will be coating the wafers 
at Stanford Nano lab. We will have to make a proper, complete, 
application to the Spec Mat committee at Stanford prior taking the 
material in the lab. Also can you please give us some time line when we 
will get the material so we can schedule the tool time for imaging.
Thanks and regards, Binder

------------------------------------------------------------------------
From: Alfred Renaldo [mailto:alfred.renaldo at svtc.com]
Sent: Monday, May 05, 2008 13:27
To: Nandasiri Samarakone; Mary Zawadzki
Cc: Danny Wallis; Arnout Smit; Binder Mann; Paul Yick; Linda Ohara
Subject: RE: Thick resist eval for SVTC

Nanda,  I have a better chance of obtaining an SU-8 equivalent to KMPR 
from TOK meeting a 50 um thickness requirement.  Do you wish me to 
investigate this option?  I can most likely get the bottle for free from 
TOK. Mary needs to close on item #2.
 
Al

------------------------------------------------------------------------
From: Nandasiri Samarakone [mailto:nandasiri.samarakone at asml.com]
Sent: Monday, May 05, 2008 10:42 AM
To: Alfred Renaldo; Mary Zawadzki
Cc: Danny Wallis; Arnout Smit; Binder Mann; Paul Yick; Linda Ohara
Subject: Thick resist eval for SVTC

Hi Mary,
 
I am trying to schedule our activities / priorities at Stanford.
 
a) I urgently need to know if SVTC can purchase 500 ml of KMPR ( 50 um 
thick negative photoresist ) approx $600 so that we may continue with 
this evaluation.
b) Can someone communicate to My Thang that ASML needs acess to the HV 
SEM at SVTC so that the AZ 125NXT and 15NXT samples (allready exposed) 
can be examined.
 
Thanks
 
Nanda
 
 

-- The information contained in this communication and any attachments 
is confidential and may be privileged, and is for the sole use of the 
intended recipient(s). Any unauthorized review, use, disclosure or 
distribution is prohibited. Unless explicitly stated otherwise in the 
body of this communication or the attachment thereto (if any), the 
information is provided on an AS-IS basis without any express or implied 
warranties or liabilities. To the extent you are relying on this 
information, you are doing so at your own risk. If you are not the 
intended recipient, please notify the sender immediately by replying to 
this message and destroy all copies of this message and any attachments. 
ASML is neither liable for the proper and complete transmission of the 
information contained in this communication, nor for any delay in its 
receipt.

The content of this message is SVTC Technologies Confidential. This 
message may contain confidential, proprietary or legally privileged 
information. It is for the use of the named recipient only, and access 
by anyone else is unauthorized. If you have received this message in 
error, please reply to that effect and delete this message. Thank you.


-- The information contained in this communication and any attachments 
is confidential and may be privileged, and is for the sole use of the 
intended recipient(s). Any unauthorized review, use, disclosure or 
distribution is prohibited. Unless explicitly stated otherwise in the 
body of this communication or the attachment thereto (if any), the 
information is provided on an AS-IS basis without any express or implied 
warranties or liabilities. To the extent you are relying on this 
information, you are doing so at your own risk. If you are not the 
intended recipient, please notify the sender immediately by replying to 
this message and destroy all copies of this message and any attachments. 
ASML is neither liable for the proper and complete transmission of the 
information contained in this communication, nor for any delay in its 
receipt.
-- The information contained in this communication and any attachments 
is confidential and may be privileged, and is for the sole use of the 
intended recipient(s). Any unauthorized review, use, disclosure or 
distribution is prohibited. Unless explicitly stated otherwise in the 
body of this communication or the attachment thereto (if any), the 
information is provided on an AS-IS basis without any express or implied 
warranties or liabilities. To the extent you are relying on this 
information, you are doing so at your own risk. If you are not the 
intended recipient, please notify the sender immediately by replying to 
this message and destroy all copies of this message and any attachments. 
ASML is neither liable for the proper and complete transmission of the 
information contained in this communication, nor for any delay in its 
receipt.
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20080515/9a743127/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: TMMR S2000 20060105 (A) US.doc
Type: application/msword
Size: 95232 bytes
Desc: not available
URL: <http://snf.stanford.edu/pipermail/specmat/attachments/20080515/9a743127/attachment.doc>


More information about the specmat mailing list