From mariamd at stanford.edu Thu Apr 2 10:54:06 2009 From: mariamd at stanford.edu (=?utf-8?Q?Mar=C3=ADa_Montero_D=C3=ADez?=) Date: Thu, 2 Apr 2009 10:54:06 -0700 (PDT) Subject: Sapphire Wafers In-Reply-To: <2075118684.936631238694675804.JavaMail.root@zm03.stanford.edu> Message-ID: <985227691.937371238694846090.JavaMail.root@zm03.stanford.edu> Hi, I'm a labmember and grad student working for a physics professor. Usually we do our processing on quartz wafers, but we need sapphire wafers now because their thermal properties are better suited for use in our cryostat. The processing would be pretty standard: a sapphire wafer with 2 microns of aluminum coated with 1.6 microns of shipley 3612 photoresist. Exposure is done on karlsuss, and the aluminum is etched on the p5000 etcher. Photoresist is stripped on wbmetal with prx 127. That would be it. Would this be ok? Thank you, Maria Montero From leoyu at stanford.edu Thu Apr 2 16:55:38 2009 From: leoyu at stanford.edu (Leo Yu) Date: Thu, 2 Apr 2009 16:55:38 -0700 (PDT) Subject: Request to bring new chemicals Nickel Etchant TFG In-Reply-To: <721146583.1045921238716494480.JavaMail.root@zm03.stanford.edu> Message-ID: <424313611.1046171238716538073.JavaMail.root@zm03.stanford.edu> Dear SpecMat Committee, My name is Ching-Yang Yu and my CORAL Id is leoyu. I am a EE graduate student at Stanford and work in the Yamamoto group. For GaAs-compatible Nickel etching, I would like to bring the Nickel Etchant TFG into the SNF fab. The ingredients are Thiourea, CAS#62-56-6, Sodium N-Nitro Benzene Sulfonate, CAS#127-68-4, and Sulfuric Acid, CAS#7664-93-9. (More details can be found in the MSDS enclosed. ) The main hazard class is CORROSIVE and the storage Group Identifier is F. The vendor is Transene Company, whose contact information is Danvers industrial park 10 Electronics Avenue Danvers, MA 01923 Tel:978-777-7860 FAX:978-739-5640 Their website is www.transene.com. The reason for the request is to strip off Nickel from GaAs/AlGaAs layered structures. Nickel is one of the best metal hardmask used in dry etching. However, most of the Ni etchants available are not compatible with GaAs substrates. The Ni etchant developed by the Transene Company provides this compatibility. In my process a film of 50nm Ni is deposited using Innotec in SNF as a hardmask. After dry-etching with PQuest in SNF, the Ni hardmask is then supposed to be stripped off by this new Ni etchant. The sample will be wet-etched in Ni etchant on 90 degrees hotplate for 60sec, and rinsed in DI water. This final step is done in wbgaas. The amount to bring in is 1 quart for storage. The chemical will be directly put to use without mixing. The EPA Hazardous waste number is D002 corrosive waste. Regards, Ching-Yang (Leo) Yu EE PhD student Ginzton Lab Stanford University -------------- next part -------------- A non-text attachment was scrubbed... Name: MSDS_Ni etchant TFG.pdf Type: application/pdf Size: 937411 bytes Desc: not available URL: From mtang at stanford.edu Thu Apr 2 17:03:10 2009 From: mtang at stanford.edu (Mary Tang) Date: Thu, 02 Apr 2009 17:03:10 -0700 Subject: Request to bring new chemicals Nickel Etchant TFG In-Reply-To: <424313611.1046171238716538073.JavaMail.root@zm03.stanford.edu> References: <424313611.1046171238716538073.JavaMail.root@zm03.stanford.edu> Message-ID: <49D5523E.6030808@stanford.edu> Hi Leo -- This should be OK to use. Please do the following: 1. When your chemical arrives, contact a staff member about getting a yellow label and a barcode label. These should be filled out placed on the bottle. The chemical should be stored in the Corrosives chemicals passthrough. Please contact a staff member about getting access to store this. (It should be stored in the personal chemicals area, outlined in red tape.) 2. You should contact Uli about using the hot plate at wbgaas. I believe there are new procedures. 3. Make sure to collect the waste and rinse water in a chemically compatible, appropriately labeled container for hazardous waste pickup. This should not be aspirated. 4. When at some future date you no longer need the nickel etchant, please label for hazardous waste pickup. Mary Leo Yu wrote: > Dear SpecMat Committee, > > My name is Ching-Yang Yu and my CORAL Id is leoyu. > I am a EE graduate student at Stanford and work in the Yamamoto group. > For GaAs-compatible Nickel etching, I would like to bring the Nickel Etchant TFG into the SNF fab. > > The ingredients are Thiourea, CAS#62-56-6, Sodium N-Nitro Benzene Sulfonate, CAS#127-68-4, > and Sulfuric Acid, CAS#7664-93-9. > (More details can be found in the MSDS enclosed. ) > The main hazard class is CORROSIVE and the storage Group Identifier is F. > > The vendor is Transene Company, whose contact information is > Danvers industrial park > 10 Electronics Avenue > Danvers, MA 01923 > Tel:978-777-7860 FAX:978-739-5640 > Their website is www.transene.com. > > The reason for the request is to strip off Nickel from GaAs/AlGaAs layered structures. > Nickel is one of the best metal hardmask used in dry etching. > However, most of the Ni etchants available are not compatible with GaAs substrates. > The Ni etchant developed by the Transene Company provides this compatibility. > > In my process a film of 50nm Ni is deposited using Innotec in SNF as a hardmask. > After dry-etching with PQuest in SNF, the Ni hardmask is then supposed to be stripped off by this new Ni etchant. > The sample will be wet-etched in Ni etchant on 90 degrees hotplate for 60sec, and rinsed in DI water. > This final step is done in wbgaas. > > The amount to bring in is 1 quart for storage. > The chemical will be directly put to use without mixing. > > The EPA Hazardous waste number is D002 corrosive waste. > > > Regards, > > Ching-Yang (Leo) Yu > EE PhD student > Ginzton Lab > Stanford University -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From lizhb at stanford.edu Tue Apr 7 12:07:42 2009 From: lizhb at stanford.edu (Elizabeth Ann Hager-Barnard) Date: Tue, 7 Apr 2009 12:07:42 -0700 Subject: New materials request Message-ID: <04340363-8340-4ECF-9D98-FD76406FD106@stanford.edu> To Whom It May Concern: My name is Elizabeth Hager-Barnard and I am a 4th year Ph.D. student in Nick Melosh?s group (Materials Science and Engineering). I have worked in SNF previously and I am now beginning a collaboration with Fatih Sarioglu from Prof. Solgaard?s group. Fatih has developed new AFM techniques and my group plans to help him apply his techniques to new systems. We will be using the Agilent AFM in SNF. The purpose of this e-mail is to request permission to bring new materials into SNF to use with the AFM. Specifically, I would like to bring synthetic lipid molecules and cholesterol into SNF. These materials, as confirmed by the attached MSDS files, are non- hazardous. These materials will only be used on the AFM. They will not contact any other equipment in the lab. We will not do any processing of these materials in SNF. Furthermore, we will neither store nor dispose of these materials in SNF. In the remainder of this e-mail I have responded to the questions outlined in the SNF webpage, ?Procedures for Bringing in New Chemicals & Materials?. If you have any further questions regarding this request please let me know. Thank you for your time, Elizabeth Hager-Barnard Your contact information: Name: Elizabeth Hager-Barnard Coral login: lizhb E-mail: lizhb at stanford.edu Phone number: 650-796-9302 PI: Nick Melosh (Materials Science and Engineering) The chemical or material: Synthetic lipid molecules: for example, SOPC SOPC (18:0-18:1 PC, C44H86NO8P) 2 alternative naming schemes: 1-stearoyl-2-oleyl-sn-glycero-3-phosphocholine OR 1-octadecanoyl-2-(9Z-octadecenoyl)-sn-glycero-3- phosphocholine Cholesterol: cholesterol derived from ovine wool Saline solution: for example, 2% NaCl in water Note: lipid molecules are amphiphilic molecules with hydrophilic headgroups and hydrophobic tails. The lipid molecules we would use are synthetic and non-hazardous. MSDS sheets for SOPC and cholesterol are attached to this e-mail. All the synthetic lipid molecules we would use have similar MSDS and are all non-hazardous. Vendor: Avanti Polar Lipids 700 Industrial Park Drive Alabaster, Alabama 35007-9105 www.avantilipids.com (800) 227-0651 We will not store our materials in SNF. Synthetic lipid molecules and cholesterol derived from ovine wool are not hazardous (they do not have a hazard class). Reason for request: We would like to bring these materials into SNF as part of our colloboration with the Solgaard group. We have used these materials many times in a different AFM, but in order to use the new techniques developed by the Solgaard group, we need to use them with the SNF AFM. No other approved SNF materials are similar to the ones we are requesting. Our materials are not hazardous. Process Flow: We will only use our materials on the AFM. We will not do any processing of our materials in SNF. We will simply place our materials onto the AFM stage. Amount and form: Our materials will not be in powder form when we bring them into SNF. In our lab in McCullough, we will form a sheet of lipids and cholesterol on a glass slide, and put the glass slide in a beaker with saline solution (NaCl in water). I expect that the glass slide will be about 25mm in diameter and the slide will be submerged in approximately 5ml of saline solution. We will cover the beaker when bringing it into SNF. While in SNF we will not do any processing of our material, except to possibly pipette additional saline solution over the glass slide if a significant fraction of the solution evaporates. Storage: We will not store our materials at SNF. Disposal: We will not dispose our materials in SNF. We will remove our materials from SNF and dispose of them in our own lab in McCullough. We will clean the AFM head when we are finished. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: SOPC MSDS.pdf Type: application/pdf Size: 79133 bytes Desc: not available URL: -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Cholesterol MSDS.pdf Type: application/pdf Size: 78204 bytes Desc: not available URL: -------------- next part -------------- An HTML attachment was scrubbed... URL: From lizhb at stanford.edu Tue Apr 14 20:27:58 2009 From: lizhb at stanford.edu (Elizabeth Ann Hager-Barnard) Date: Tue, 14 Apr 2009 20:27:58 -0700 Subject: Fwd: New materials request (SOPC and cholesterol) References: <04340363-8340-4ECF-9D98-FD76406FD106@stanford.edu> Message-ID: <0C7D22CB-07AF-4E59-AE48-4437199D5A9C@stanford.edu> Dear Members of the SpecMat Committee, If you have any questions about the request I submitted last week, please let me know. I would be glad to provide additional information. In case you did not receive my request I have included the original e-mail below. Thank you, Elizabeth Hager-Barnard Ph.D. candidate Melosh Group Dept. of Mat. Sci. and Eng. (650)796-9302 Begin forwarded message: > From: Elizabeth Ann Hager-Barnard > Date: April 7, 2009 12:07:42 PM PDT > To: specmat at snf.stanford.edu > Subject: New materials request > > To Whom It May Concern: > My name is Elizabeth Hager-Barnard and I am a 4th year Ph.D. student > in Nick Melosh?s group (Materials Science and Engineering). I have > worked in SNF previously and I am now beginning a collaboration with > Fatih Sarioglu from Prof. Solgaard?s group. Fatih has developed new > AFM techniques and my group plans to help him apply his techniques > to new systems. We will be using the Agilent AFM in SNF. > The purpose of this e-mail is to request permission to bring new > materials into SNF to use with the AFM. Specifically, I would like > to bring synthetic lipid molecules and cholesterol into SNF. These > materials, as confirmed by the attached MSDS files, are non- > hazardous. These materials will only be used on the AFM. They will > not contact any other equipment in the lab. We will not do any > processing of these materials in SNF. Furthermore, we will neither > store nor dispose of these materials in SNF. > In the remainder of this e-mail I have responded to the questions > outlined in the SNF webpage, ?Procedures for Bringing in New > Chemicals & Materials?. If you have any further questions regarding > this request please let me know. > > Thank you for your time, > Elizabeth Hager-Barnard > > > > > Your contact information: > Name: Elizabeth Hager-Barnard > Coral login: lizhb > E-mail: lizhb at stanford.edu > Phone number: 650-796-9302 > PI: Nick Melosh (Materials Science and > Engineering) > > The chemical or material: > Synthetic lipid molecules: for example, SOPC > SOPC (18:0-18:1 PC, C44H86NO8P) > 2 alternative naming schemes: > 1-stearoyl-2-oleyl-sn-glycero-3-phosphocholine OR > 1-octadecanoyl-2-(9Z-octadecenoyl)-sn-glycero-3- > phosphocholine > Cholesterol: cholesterol derived from ovine wool > Saline solution: for example, 2% NaCl in water > > Note: lipid molecules are amphiphilic molecules with hydrophilic > headgroups and hydrophobic tails. The lipid molecules we would use > are synthetic and non-hazardous. > > MSDS sheets for SOPC and cholesterol are attached to this e-mail. > All the synthetic lipid molecules we would use have similar MSDS and > are all non-hazardous. > > Vendor: Avanti Polar Lipids > 700 Industrial Park Drive > Alabaster, Alabama 35007-9105 > www.avantilipids.com > (800) 227-0651 > > We will not store our materials in SNF. Synthetic lipid molecules > and cholesterol derived from ovine wool are not hazardous (they do > not have a hazard class). > > Reason for request: > We would like to bring these materials into SNF as part > of our colloboration with the Solgaard group. We have used these > materials many times in a different AFM, but in order to use the new > techniques developed by the Solgaard group, we need to use them with > the SNF AFM. No other approved SNF materials are similar to the > ones we are requesting. Our materials are not hazardous. > > Process Flow: > We will only use our materials on the AFM. We will not > do any processing of our materials in SNF. We will simply place our > materials onto the AFM stage. > > Amount and form: > Our materials will not be in powder form when we bring > them into SNF. In our lab in McCullough, we will form a sheet of > lipids and cholesterol on a glass slide, and put the glass slide in > a beaker with saline solution (NaCl in water). I expect that the > glass slide will be about 25mm in diameter and the slide will be > submerged in approximately 5ml of saline solution. We will cover > the beaker when bringing it into SNF. While in SNF we will not do > any processing of our material, except to possibly pipette > additional saline solution over the glass slide if a significant > fraction of the solution evaporates. > > Storage: > We will not store our materials at SNF. > > Disposal: > > We will not dispose our materials in SNF. We will remove our > materials from SNF and dispose of them in our own lab in > McCullough. We will clean the AFM head when we are finished. > > > > > > > > > > -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: SOPC MSDS.pdf Type: application/pdf Size: 79133 bytes Desc: not available URL: -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Cholesterol MSDS.pdf Type: application/pdf Size: 78204 bytes Desc: not available URL: -------------- next part -------------- An HTML attachment was scrubbed... URL: From mahnaz at stanford.edu Wed Apr 15 09:09:09 2009 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Wed, 15 Apr 2009 09:09:09 -0700 Subject: Nanosys oxide wfs for Litho at SNF In-Reply-To: <98A950CEC6D73D4BB644B880D0254D2F01BCAE2C@mail1.at.nanosysinc.com> References: <98A950CEC6D73D4BB644B880D0254D2F01BCAE2C@mail1.at.nanosysinc.com> Message-ID: <49E606A5.6090600@stanford.edu> Hi Josephine, In cases like this we ask for TXRF data. mahnaz Josephine Suarez wrote: > Hi Mahnaz, > > Oxidation will take place in a class 100 lab. > > Josephine > > -----Original Message----- > From: Mahnaz Mansourpour [mailto:mahnaz at stanford.edu] > Sent: Tuesday, April 14, 2009 3:36 PM > To: Josephine Suarez > Subject: Re: Nanosys oxide wfs for Litho at SNF > > Hi > What is the level of cleannines in your lab? > > mahnaz > > Josephine Suarez wrote: > >> Hi Mahnaz, >> >> We're planning to do in-house oxidation here at Nanosys. These will be >> > > >> <1-1-1> silicon wafers with 100nm thermal oxide. The Litho (SVG spin - >> > > >> ASML - SVG develop) and Etch (AMTETCHER) will still be processed at >> SNF. Is this OK or will there be any concerns? >> >> Please advise. >> >> Thank you, >> >> Josephine >> >> From edmyers at stanford.edu Thu Apr 16 17:56:03 2009 From: edmyers at stanford.edu (Ed Myers) Date: Thu, 16 Apr 2009 17:56:03 -0700 Subject: Fwd: PECVD SiC on glass substrates at SNF Message-ID: <6.2.5.6.2.20090416175533.032e5618@stanford.edu> >Delivered-To: edmyers at stanford.edu >Date: Thu, 16 Apr 2009 19:48:47 -0400 >From: "Trott, Gary R" >Subject: PECVD SiC on glass substrates at SNF >To: SpecMat at snf.stanford.edu >Cc: Ed Myers , Trottgr >Thread-Topic: PECVD SiC on glass substrates at SNF >thread-index: Acm+7eKpecii7ZJPTt+OEfyE4qhF/Q== >X-MS-Has-Attach: >X-MS-TNEF-Correlator: >X-OriginalArrivalTime: 16 Apr 2009 23:48:49.0262 (UTC) > FILETIME=[E3A640E0:01C9BEED] > >Dear SpecMat group > >I would like to deposit STS PECVD SiC:H onto glass samples. It was >suggested I provide and overview of the process plan to the SpecMat >group to uncover any interactions or dependencies that would need to >be resolved before actually committing to the work. Here is the >information requested from the Web page. > >Once approved, I need to make arrangements for connecting a methane >cylinder(or equivalent carbon source) to the STS and be trained on >the specific tools. >STS PECVD and measurement tools. > >If you need more information, feel free to ask. >Regards > > > >Dr. Gary Trott >Corning West Technology Center >Corning Incorporated >1891 Page Mill Road, Suite 100 >Palo Alto, CA 94304 >Office: 650-846-6012 >Cell: 408-500-5153 > > > >1) Contact Info: > Gary Trott, Corning Inc. 650-846-6012, > trottgr at corning.com PI=myself > Coral login - TBD > >2) Materials to bring in > Bare Substrates > Si pieces for deposition set up (from SNF stockroom) > and whole wafers if needed for stress measurements. > > Glass substrates. From Corning Inc > Corning 0211, Standard Microscope slide > material, (4.6% Na in glass) > Corning EagleXG glass - alkali free > Corning fused silica - alkali free > Possibly external fused silica microscope > slides or wafers for comparisons > > Notes:a) The glass substrates are different thicknesses > and affected by stress. > Not all are the same > The 0211 covers the most range. So it is the > most desirable. > > b) Standard microscope slides have 4.6% Na content. > A contamination source for Si IC > > c) the glass samples likely have external > particle contamination from > non-clean packaging and exposure to air > outside the cleanroom. > > d) the Si pieces can be cleaved in or out of > the clean room. > > >3) Reason for request > SiNx and SiO2 are not the proper material choices > SiC has significantly different refractive index, and > chemical properties > The substrate must be optically transparent. Fused silica > is ok for testing > but is less interesting > >4) Process flow >SiC deposition on substrates in STS PECVD > Equipment group = Gold Contaminated. > Use standard 350C and deposition pressure > Target thickness for testing = easy to measure = ~750A > Vary the flow rate and power (high) for dense films > Measure thickness, stress > ellipseometery, and > possibly etch rate offline on Si samples > (in KOH or HF) > Deposit on cleaved Si pieces, no cleaning ~30cm square > to establish recipe. > Deposit glass substrates with the preferred deposition condition. > Possibly solvent clean before deposition. > Possibly a light HF dip to clean before > final depostion > No SiC pattering required > Finish with standard STS PECVD clean. > >5) Amount and form: > Form = solid > Si pieces from SNF stock - as many as needed cleaved into > ~30mm squares > Glass > Microscope slide pieces 71mm x 71mm ~12 > EagleXG glass pieces 100mm x 100mm ~12 > Fused silica ~30mm square less than 6 > > Do these need to be cleaned from particles for the SNF? > The surfaces have been exposed to non-cleanroom environment. > The could undergo a standard degrease/clean > >6) Storage > No storage at Stanford > I need a recommendation for transportation container in/out of > the cleanroom. > Old Si wafer box or equivalent > >7) Disposal > Take all substrate pieces back to Corning. > > From mcvittie at cis.Stanford.EDU Thu Apr 16 18:07:18 2009 From: mcvittie at cis.Stanford.EDU (Jim McVittie) Date: Thu, 16 Apr 2009 18:07:18 -0700 (PDT) Subject: Fwd: PECVD SiC on glass substrates at SNF In-Reply-To: <6.2.5.6.2.20090416175533.032e5618@stanford.edu> Message-ID: Hi, I think we should d need to find what the glass composition is. Some glasses are 10% Na. I think we should leave the door open for users who want to do clear processing in the PECVD system since we only have one PECVD system. Jim On Thu, 16 Apr 2009, Ed Myers wrote: > > >Delivered-To: edmyers at stanford.edu > >Date: Thu, 16 Apr 2009 19:48:47 -0400 > >From: "Trott, Gary R" > >Subject: PECVD SiC on glass substrates at SNF > >To: SpecMat at snf.stanford.edu > >Cc: Ed Myers , Trottgr > >Thread-Topic: PECVD SiC on glass substrates at SNF > >thread-index: Acm+7eKpecii7ZJPTt+OEfyE4qhF/Q== > >X-MS-Has-Attach: > >X-MS-TNEF-Correlator: > >X-OriginalArrivalTime: 16 Apr 2009 23:48:49.0262 (UTC) > > FILETIME=[E3A640E0:01C9BEED] > > > >Dear SpecMat group > > > >I would like to deposit STS PECVD SiC:H onto glass samples. It was > >suggested I provide and overview of the process plan to the SpecMat > >group to uncover any interactions or dependencies that would need to > >be resolved before actually committing to the work. Here is the > >information requested from the Web page. > > > >Once approved, I need to make arrangements for connecting a methane > >cylinder(or equivalent carbon source) to the STS and be trained on > >the specific tools. > >STS PECVD and measurement tools. > > > >If you need more information, feel free to ask. > >Regards > > > > > > > >Dr. Gary Trott > >Corning West Technology Center > >Corning Incorporated > >1891 Page Mill Road, Suite 100 > >Palo Alto, CA 94304 > >Office: 650-846-6012 > >Cell: 408-500-5153 > > > > > > > >1) Contact Info: > > Gary Trott, Corning Inc. 650-846-6012, > > trottgr at corning.com PI=myself > > Coral login - TBD > > > >2) Materials to bring in > > Bare Substrates > > Si pieces for deposition set up (from SNF stockroom) > > and whole wafers if needed for stress measurements. > > > > Glass substrates. From Corning Inc > > Corning 0211, Standard Microscope slide > > material, (4.6% Na in glass) > > Corning EagleXG glass - alkali free > > Corning fused silica - alkali free > > Possibly external fused silica microscope > > slides or wafers for comparisons > > > > Notes:a) The glass substrates are different thicknesses > > and affected by stress. > > Not all are the same > > The 0211 covers the most range. So it is the > > most desirable. > > > > b) Standard microscope slides have 4.6% Na content. > > A contamination source for Si IC > > > > c) the glass samples likely have external > > particle contamination from > > non-clean packaging and exposure to air > > outside the cleanroom. > > > > d) the Si pieces can be cleaved in or out of > > the clean room. > > > > > >3) Reason for request > > SiNx and SiO2 are not the proper material choices > > SiC has significantly different refractive index, and > > chemical properties > > The substrate must be optically transparent. Fused silica > > is ok for testing > > but is less interesting > > > >4) Process flow > >SiC deposition on substrates in STS PECVD > > Equipment group = Gold Contaminated. > > Use standard 350C and deposition pressure > > Target thickness for testing = easy to measure = ~750A > > Vary the flow rate and power (high) for dense films > > Measure thickness, stress > > ellipseometery, and > > possibly etch rate offline on Si samples > > (in KOH or HF) > > Deposit on cleaved Si pieces, no cleaning ~30cm square > > to establish recipe. > > Deposit glass substrates with the preferred deposition condition. > > Possibly solvent clean before deposition. > > Possibly a light HF dip to clean before > > final depostion > > No SiC pattering required > > Finish with standard STS PECVD clean. > > > >5) Amount and form: > > Form = solid > > Si pieces from SNF stock - as many as needed cleaved into > > ~30mm squares > > Glass > > Microscope slide pieces 71mm x 71mm ~12 > > EagleXG glass pieces 100mm x 100mm ~12 > > Fused silica ~30mm square less than 6 > > > > Do these need to be cleaned from particles for the SNF? > > The surfaces have been exposed to non-cleanroom environment. > > The could undergo a standard degrease/clean > > > >6) Storage > > No storage at Stanford > > I need a recommendation for transportation container in/out of > > the cleanroom. > > Old Si wafer box or equivalent > > > >7) Disposal > > Take all substrate pieces back to Corning. > > > > > > > -- -------------------------------------------------------------- James (Jim) P. McVittie, Ph.D. Sr. Research Scientist Paul G. Allen Building Electrical Engineering Stanford Nanofabrication Facility jmcvittie at stanford.edu Stanford University Office: (650) 725-3640 Rm. 336X, 330 Serra Mall Lab: (650) 721-6834 Stanford, CA 94305-4075 Fax: (650) 723-4659 From mtang at stanford.edu Tue Apr 21 15:54:41 2009 From: mtang at stanford.edu (Mary Tang) Date: Tue, 21 Apr 2009 15:54:41 -0700 Subject: Fwd: New materials request (SOPC and cholesterol) In-Reply-To: <0C7D22CB-07AF-4E59-AE48-4437199D5A9C@stanford.edu> References: <04340363-8340-4ECF-9D98-FD76406FD106@stanford.edu> <0C7D22CB-07AF-4E59-AE48-4437199D5A9C@stanford.edu> Message-ID: <49EE4EB1.7050401@stanford.edu> Hi all -- Elizabeth just came by to talk about her request. From a general chemical safety/contamination standpoint, this should be OK. I'll have to defer to Ed for tools specifics, but there are two possible concerns. First, does the Agilent AFM have a wet cell? Second, the solution contains significant amounts of sodium, so I was not sure if there were cross-contamination concerns on this system. Ed? Mary Elizabeth Ann Hager-Barnard wrote: > Dear Members of the SpecMat Committee, > > If you have any questions about the request I submitted last week, > please let me know. I would be glad to provide additional > information. In case you did not receive my request I have included > the original e-mail below. > > Thank you, > > Elizabeth Hager-Barnard > Ph.D. candidate > Melosh Group > Dept. of Mat. Sci. and Eng. > (650)796-9302 > > > Begin forwarded message: > >> *From: * Elizabeth Ann Hager-Barnard > > >> *Date: * April 7, 2009 12:07:42 PM PDT >> *To: * specmat at snf.stanford.edu >> *Subject: * *New materials request* >> >> To Whom It May Concern: >> >> My name is Elizabeth Hager-Barnard and I am a 4 ^ th year Ph.D. >> student in Nick Melosh?s group (Materials Science and Engineering). >> I have worked in SNF previously and I am now beginning a >> collaboration with Fatih Sarioglu from Prof. Solgaard?s group. >> Fatih has developed new AFM techniques and my group plans to help him >> apply his techniques to new systems. We will be using the Agilent >> AFM in SNF. >> >> The purpose of this e-mail is to request permission to bring new >> materials into SNF to use with the AFM. Specifically, I would like >> to bring synthetic lipid molecules and cholesterol into SNF. These >> materials, as confirmed by the attached MSDS files, are >> non-hazardous. These materials will only be used on the AFM. They >> will not contact any other equipment in the lab. We will not do any >> processing of these materials in SNF. Furthermore, we will neither >> store nor dispose of these materials in SNF. >> >> In the remainder of this e-mail I have responded to the questions >> outlined in the SNF webpage, ? Procedures for Bringing in New >> Chemicals & Materials?. If you have any further questions regarding >> this request please let me know. >> >> >> >> Thank you for your time, >> >> Elizabeth Hager-Barnard >> >> >> >> >> >> >> Your contact information: >> >> Name: Elizabeth Hager-Barnard >> Coral login: lizhb >> E-mail: lizhb at stanford.edu >> >> Phone number: 650-796-9302 >> PI: Nick Melosh (Materials Science and >> Engineering) >> >> >> The chemical or material: >> >> Synthetic lipid molecules : for example, SOPC >> >> SOPC (18:0-18:1 PC, C _ 44 H _ 86 NO _ 8 P) >> 2 alternative naming schemes: >> 1- stearoyl -2-oleyl-sn-glycero-3-phosphocholine OR >> >> 1-octadecanoyl-2-(9Z-octadecenoyl)-sn-glycero-3-phosphocholine >> >> Cholesterol : cholesterol derived from ovine wool >> >> Saline solution : for example, 2% NaCl in water >> >> >> >> Note: lipid molecules are amphiphilic molecules with hydrophilic >> headgroups and hydrophobic tails. The lipid molecules we would use >> are synthetic and non-hazardous. >> >> MSDS sheets for SOPC and cholesterol are attached to this e-mail. >> All the synthetic lipid molecules we would use have similar MSDS and >> are all non-hazardous. >> >> >> >> Vendor: Avanti Polar Lipids >> >> 700 Industrial Park Drive >> >> Alabaster, Alabama 35007-9105 >> >> www.avantilipids.com >> >> >> (800) 227-0651 >> >> >> >> We will not store our materials in SNF. Synthetic lipid molecules >> and cholesterol derived from ovine wool are not hazardous (they do >> not have a hazard class). >> >> Reason for request: >> We would like to bring these materials into SNF as part >> of our colloboration with the Solgaard group. We have used these >> materials many times in a different AFM, but in order to use the new >> techniques developed by the Solgaard group, we need to use them with >> the SNF AFM. No other approved SNF materials are similar to the >> ones we are requesting. Our materials are not hazardous. >> >> >> >> Process Flow: >> >> We will only use our materials on the AFM. We will not >> do any processing of our materials in SNF. We will simply place our >> materials onto the AFM stage. >> >> >> >> Amount and form: >> Our materials will not be in powder form when we bring >> them into SNF. In our lab in McCullough, w e will form a sheet of >> lipids and cholesterol on a glass slide, and put the glass slide in a >> beaker with saline solution (NaCl in water). I expect that the >> glass slide will be about 25mm in diameter and t he slide will be >> submerged in approximately 5ml of saline solution. We will cover >> the beaker when bringing it into SNF. While in SNF we will not do >> any processing of our material, except to possibly pipette additional >> saline solution over the glass slide if a significant fraction of the >> solution evaporates. >> >> >> >> Storage: >> We will not store our materials at SNF. >> >> Disposal : >> >> We will not dispose our materials in SNF. We will remove our >> materials from SNF and dispose of them in our own lab in McCullough. >> We will clean the AFM head when we are finished. >> >> >> > = > ------------------------------------------------------------------------ > >> >> > > ------------------------------------------------------------------------ > >> >> > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From mahnaz at stanford.edu Fri Apr 24 16:06:01 2009 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Fri, 24 Apr 2009 16:06:01 -0700 Subject: [POSSIBLE VIRUS:###] [Fwd: FW: Nanosys oxide wfs for Litho at SNF] Message-ID: <15410_1240614362_49F245DA_15410_165267_1_49F245D9.1010905@stanford.edu> -------------- next part -------------- An embedded message was scrubbed... From: "Josephine Suarez" Subject: FW: Nanosys oxide wfs for Litho at SNF Date: Fri, 24 Apr 2009 15:41:18 -0700 Size: 7920 URL: From edmyers at stanford.edu Mon Apr 27 14:35:43 2009 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 27 Apr 2009 14:35:43 -0700 Subject: Fwd: New materials request (SOPC and cholesterol) In-Reply-To: <49EE4EB1.7050401@stanford.edu> References: <04340363-8340-4ECF-9D98-FD76406FD106@stanford.edu> <0C7D22CB-07AF-4E59-AE48-4437199D5A9C@stanford.edu> <49EE4EB1.7050401@stanford.edu> Message-ID: <6.2.5.6.2.20090427141319.03308f60@stanford.edu> Yes, the Agilent system does have a wet cell but it is being claimed by another group to run electrochemical experiments. Funny how this group forgets to tell you they need to change the laser, the control box and add a computer to capture the signals. That's what all the components are laying in the corner of the room. At 03:54 PM 4/21/2009, Mary Tang wrote: >Hi all -- > >Elizabeth just came by to talk about her request. From a general >chemical safety/contamination standpoint, this should be OK. I'll >have to defer to Ed for tools specifics, but there are two possible >concerns. First, does the Agilent AFM have a wet cell? Second, the >solution contains significant amounts of sodium, so I was not sure >if there were cross-contamination concerns on this system. > >Ed? > >Mary > >Elizabeth Ann Hager-Barnard wrote: >>Dear Members of the SpecMat Committee, >> >>If you have any questions about the request I submitted last week, >>please let me know. I would be glad to provide additional >>information. In case you did not receive my request I have >>included the original e-mail below. >> >>Thank you, >> >>Elizabeth Hager-Barnard >>Ph.D. candidate >>Melosh Group >>Dept. of Mat. Sci. and Eng. >>(650)796-9302 >> >> >>Begin forwarded message: >> >>>From: Elizabeth Ann Hager-Barnard >>><lizhb at stanford.edu> >>>Date: April 7, 2009 12:07:42 PM PDT >>>To: specmat at snf.stanford.edu >>>Subject: New materials request >>> >>>To Whom It May Concern: >>> >>>My name is Elizabeth Hager-Barnard and I am a 4 th year Ph.D. >>>student in Nick Melosh's group (Materials Science and >>>Engineering). I have worked in SNF previously and I am now >>>beginning a collaboration with Fatih Sarioglu from Prof. >>>Solgaard's group. Fatih has developed new AFM techniques and my >>>group plans to help him apply his techniques to new systems. We >>>will be using the Agilent AFM in SNF. >>> >>>The purpose of this e-mail is to request permission to bring new >>>materials into SNF to use with the AFM. Specifically, I would >>>like to bring synthetic lipid molecules and cholesterol into >>>SNF. These materials, as confirmed by the attached MSDS files, >>>are non-hazardous. These materials will only be used on the >>>AFM. They will not contact any other equipment in the lab. We >>>will not do any processing of these materials in >>>SNF. Furthermore, we will neither store nor dispose of these >>>materials in SNF. >>> >>>In the remainder of this e-mail I have responded to the questions >>>outlined in the SNF webpage, " Procedures for Bringing in New >>>Chemicals & Materials". If you have any further questions >>>regarding this request please let me know. >>> >>> >>> >>>Thank you for your time, >>> >>>Elizabeth Hager-Barnard >>> >>> >>> >>> >>> >>>Your contact information: >>> Name: Elizabeth Hager-Barnard >>>Coral login: lizhb >>>E-mail: lizhb at stanford.edu >>>Phone number: 650-796-9302 >>>PI: Nick Melosh (Materials Science and >>>Engineering) >>> >>> >>>The chemical or material: >>> >>> Synthetic lipid molecules : for example, SOPC >>>SOPC (18:0-18:1 PC, C 44 H 86 NO 8 P) >>> 2 alternative naming schemes: >>> 1- stearoyl -2-oleyl-sn-glycero-3-phosphocholine OR >>> 1-octadecanoyl-2-(9Z-octadecenoyl)-sn-glycero-3-phosphocholine >>> >>>Cholesterol : cholesterol derived from ovine wool >>> >>>Saline solution : for example, 2% NaCl in water >>> >>> >>>Note: lipid molecules are amphiphilic molecules with hydrophilic >>>headgroups and hydrophobic tails. The lipid molecules we would >>>use are synthetic and non-hazardous. >>> >>>MSDS sheets for SOPC and cholesterol are attached to this >>>e-mail. All the synthetic lipid molecules we would use have >>>similar MSDS and are all non-hazardous. >>> >>> >>> >>>Vendor: Avanti Polar Lipids >>> >>> 700 Industrial Park Drive >>> >>> Alabaster, Alabama 35007-9105 >>> >>> >>>www.avantilipids.com >>>(800) 227-0651 >>> >>> >>>We will not store our materials in SNF. Synthetic lipid >>>molecules and cholesterol derived from ovine wool are not >>>hazardous (they do not have a hazard class). >>> >>>Reason for request: >>> We would like to bring these materials into SNF as >>> part of our colloboration with the Solgaard group. We have used >>> these materials many times in a different AFM, but in order to >>> use the new techniques developed by the Solgaard group, we need >>> to use them with the SNF AFM. No other approved SNF materials >>> are similar to the ones we are requesting. Our materials are >>> not hazardous. >>> >>> >>> >>>Process Flow: >>> We will only use our materials on the AFM. We will >>> not do any processing of our materials in SNF. We will simply >>> place our materials onto the AFM stage. >>> >>> >>>Amount and form: >>> Our materials will not be in powder form when we >>> bring them into SNF. In our lab in McCullough, w e will form a >>> sheet of lipids and cholesterol on a glass slide, and put the >>> glass slide in a beaker with saline solution (NaCl in water). I >>> expect that the glass slide will be about 25mm in diameter and t >>> he slide will be submerged in approximately 5ml of saline >>> solution. We will cover the beaker when bringing it into >>> SNF. While in SNF we will not do any processing of our >>> material, except to possibly pipette additional saline solution >>> over the glass slide if a significant fraction of the solution evaporates. >>> >>> >>>Storage: >>> We will not store our materials at SNF. >>> >>>Disposal : >>> >>>We will not dispose our materials in SNF. We will remove our >>>materials from SNF and dispose of them in our own lab in >>>McCullough. We will clean the AFM head when we are finished. >>> >>> >>= >> >> >>> >> >> >> >>> > > > >-- >Mary X. Tang, Ph.D. >Stanford Nanofabrication Facility >CIS Room 136, Mail Code 4070 >Stanford, CA 94305 >(650)723-9980 >mtang at stanford.edu >http://snf.stanford.edu From mtang at stanford.edu Tue Apr 28 10:05:29 2009 From: mtang at stanford.edu (Mary Tang) Date: Tue, 28 Apr 2009 10:05:29 -0700 Subject: [POSSIBLE VIRUS:###] [Fwd: FW: Nanosys oxide wfs for Litho at SNF] In-Reply-To: <15410_1240614362_49F245DA_15410_165267_1_49F245D9.1010905@stanford.edu> References: <15410_1240614362_49F245DA_15410_165267_1_49F245D9.1010905@stanford.edu> Message-ID: <49F73759.2070506@stanford.edu> Hi all -- Josephine needed an answer today, in order to start this experiment. And in short, I told her to go ahead. I had a chat with her engineer at Nanosys. He says that Nanosys acquired a furnace from Hitek and have been working on qualifying it because the results they received from Eric's work was unsatisfactory, both in terms of thickness control (100 nm +/- 5 nm within wafer) and gate performance. Their Hitek furnace (he wasn't sure which model) delivers 100 nm +/- 1 nm uniformity within wafer. The TXRF here is from that furnace. There's one data point that shows Fe at 5e9, which strikes me as being a flag (if I recall correctly that 2e9 is the detection limit for W-filament at Evans), but the data generally looks very clean. Since Josephine needed an answer, I told her to go ahead, since the next (and only steps) are litho, amtetcher, gasonics. The Nanosys engineer is willing to share whatever data he has from our furnaces which would include a general range of processing dates, but he won't be able to tell us which furnace was used (which strikes me as less-than-diligent runcard use). The suspicion is that it was not tylan4, because this series of experiments involved clean start material. Anyway, hopefully, we'll see some data - but regardless, those furnaces need work... a plan would be a good place to start... Mary Mahnaz Mansourpour wrote: > > > > > > ------------------------------------------------------------------------ > > Subject: > FW: Nanosys oxide wfs for Litho at SNF > From: > "Josephine Suarez" > Date: > Fri, 24 Apr 2009 15:41:18 -0700 > To: > "Mahnaz Mansourpour" > > To: > "Mahnaz Mansourpour" > CC: > "Wanqing Cao" , "Paul Pong" > , "Virginia Robbins" > > > Hello Mahnaz, > > Please let me know as soon as possible if I can go ahead and process > litho on some (12)wfs that have been oxidized at Nanosys cleanroom. > > Thank you and have a great week-end. > Josephine > > -----Original Message----- > From: Wanqing Cao > Sent: Friday, April 24, 2009 3:30 PM > To: 'Mahnaz Mansourpour' > Cc: Virginia Robbins; Paul Pong; Wanqing Cao; Josephine Suarez > Subject: RE: Nanosys oxide wfs for Litho at SNF > > Hi Mahnaz, > > Here is the TXRF data on a Nanosys oxide wafer. Let me know if you have > any question or concern. > > Thanks. > > Wanqing > > > -----Original Message----- > From: Josephine Suarez > Sent: Wednesday, April 15, 2009 2:33 PM > To: Wanqing Cao > Cc: Virginia Robbins; Paul Pong; 'Mahnaz Mansourpour' > Subject: FW: Nanosys oxide wfs for Litho at SNF > > Hi Wanging, > > Please send TXRF data to Mahnaz. > > Thank you, > Josephine > > -----Original Message----- > From: Mahnaz Mansourpour [mailto:mahnaz at stanford.edu] > Sent: Wednesday, April 15, 2009 9:09 AM > To: Josephine Suarez; specmat at snf.stanford.edu > Subject: Re: Nanosys oxide wfs for Litho at SNF > > Hi Josephine, > > In cases like this we ask for TXRF data. > > mahnaz > > Josephine Suarez wrote: > >> Hi Mahnaz, >> >> Oxidation will take place in a class 100 lab. >> >> Josephine >> >> -----Original Message----- >> From: Mahnaz Mansourpour [mailto:mahnaz at stanford.edu] >> Sent: Tuesday, April 14, 2009 3:36 PM >> To: Josephine Suarez >> Subject: Re: Nanosys oxide wfs for Litho at SNF >> >> Hi >> What is the level of cleannines in your lab? >> >> mahnaz >> >> Josephine Suarez wrote: >> >> >>> Hi Mahnaz, >>> >>> We're planning to do in-house oxidation here at Nanosys. These will >>> > be > >>> >>> >> >> >>> <1-1-1> silicon wafers with 100nm thermal oxide. The Litho (SVG spin >>> > - > >>> >>> >> >> >>> ASML - SVG develop) and Etch (AMTETCHER) will still be processed at >>> SNF. Is this OK or will there be any concerns? >>> >>> Please advise. >>> >>> Thank you, >>> >>> Josephine >>> >>> >>> -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Thu Apr 30 14:43:01 2009 From: edmyers at stanford.edu (Ed Myers) Date: Thu, 30 Apr 2009 14:43:01 -0700 Subject: Fwd: PECVD SiC on glass - Cleaning of PECVD Message-ID: <6.2.5.6.2.20090430144217.03361ab0@stanford.edu> Gary's specmat emails have been getting returned without delivery. >Delivered-To: edmyers at stanford.edu >Date: Thu, 30 Apr 2009 15:14:16 -0400 >From: "Trott, Gary R" >Subject: PECVD SiC on glass - Cleaning of PECVD >To: specmat at snf.stanford.edu >Cc: Ed Myers , Trottgr >Thread-Topic: PECVD SiC on glass - Cleaning of PECVD >Thread-Index: AcnJx9r7WbnWihIpQ5ysfsT1BdxRjQ== >X-MS-Has-Attach: >X-MS-TNEF-Correlator: >X-OriginalArrivalTime: 30 Apr 2009 19:14:28.0148 (UTC) > FILETIME=[E1D81740:01C9C9C7] > >Hi Ed > >This is a follow up message from my original of >4.16.09 where I would like to deposit SiC in the >STS PECVD. We will see if the email for specmat works time. > >Attached below is a compendium of cleaning >information. Both related to the STS PECVD in >the PERL clean room at the HP/Agilent on the >Deer Creek site. Plus I contacted Todd Smith, >Regional Sales of ST systems for more background >information. Todd's information was more >generic, and not very tool specific. Less than helpful. > >Based on this information I would like to have a >decision made by the SpecMat committee. Then I >can plan forward. From a commercial point of >view, indecision results in wasted time. Already >I have been pursuing this since January when >Paul Rissman thought it was part of the SNF >capabilities. Some of that time was spent >dealing with funding and paper work issues. > >Regards > > > >Dr. Gary Trott >Corning West Technology Center >Corning Incorporated >1891 Page Mill Road, Suite 100 >Palo Alto, CA 94304 >Office: 650-846-6012 >Cell: 408-500-5153 > > >====================================================== >STS PECVD cleaning information > >1) As part of the STS 310 PECVD acceptance >criteria at Deek Creek, STS provided SiC >guidelines. Deposition receipes and measurements >(refractive index & stress). The PERL >information was lost when the facility was >closed. Are there any STS SiC guidelines for the STS at Stanford? > >2) PERL PECVD Cleaning. > This cleaning process worked well for 15yr > with multiple users in a contaminated system. > >Required tools: Does Stanford have these? > - Window Screen over the vacuum exhaust > port. Keeps small particles and wafers > from getting on the O-ring main valve below the chamber > - House keeping vacuum cleaner. Built in at > Deer Creek so particles sucked up go outside > Or, we had Nilfisk, hepa vacuum cleaners. > - SSteel metal vacuum nozzle with scraper at end across the diameter. > scrapper ~3/4 in wide > nozzle ~ 3/4 diameter SSteel tube > 1.5 ft long. It fits under the sample platter > and keeps hands from touching hot > sample holder. Attaches to vacuum cleaner. > - Cleanroom Kemwipes and IPA > >Standard Gas Clean, system at 300C or normal temperature > Every ~5 um of deposition: SiN, SiO2 or SiC > - CF4 etch (recipe lost) ~15min. It > could be run multiple times as needed > - SiO2 1000A cover deposition > The CF4 etch was not designed for, > nor did it remove all previous deposits > It removes the "easy" to remove stuff > The cover layer was designed to > bury any leftovers and particles from previous processes. > > Scrub Clean, system at 300C or normal temperature > Every 25um of deposition SiO2 or > SiNx.: Or ~10um for SiC: or as needed by the operators > ? lid up > ? With house keeping vacuum cleaner and metal scraping nozzle > Flat end ~3/4" wide on end of 3/4" tube > - Scrap the inside of the lid, and > all surfaces. Suck up material that comes off > Mostly scraped with nozzle or > tweezers. Scotch brite pad or steel wool ok. > - Suck under the sample holder, > screen over main vacuum valve and all other areas > - wipe the inside the lid with an IPA Kemwipe towel > - Repeat sucking and wiping with IPA > until all loose, built up material removed > and no major particle dust is observed. > - make sure the screen to vacuum exhaust is clean. or replace it > ? Close lid > ? Then Standard Gas Clean > - std CF4 clean > - SiO2 1000A cover deposition > > This process got rid of materials that were building up > - at the plasma edges that are not > effectively removed by the plasma clean > - loose layers that were building up on the lid. > Then buried everything that was left under an SiO2 layer. > It took about 30min of scraping and vacuuming. > No touching the hot sample holder > >Once a year > Mechanical Clean, system cold > ? take apart the chamber gas delivery and sample holder > ? Sand blast or etch clean as needed. > ? Degrease with IPA or ACE Kemwipe towels. > ? Re-assemble. > ? Then run a standard Gas Clean > >3) See attached info from Todd Smith on SiC and cleaning discussion. > >X-MimeOLE: Produced By Microsoft Exchange V6.5 >Received: from cvcv0xi14.na.corning.com >([10.180.41.240]) by cvcv0xi06.na.corning.com >with Microsoft SMTPSVC(6.0.3790.3959); Tue, 28 Apr 2009 12:43:05 -0400 >MIME-Version: 1.0 >Content-Type: multipart/related; > boundary="----_=_NextPart_003_01C9C820.670A3280"; > type="multipart/alternative" >Received: from ngoing.corning.com >([199.197.132.114]) by cvcv0xi14.na.corning.com >with Microsoft SMTPSVC(6.0.3790.3959); Tue, 28 Apr 2009 12:43:04 -0400 >Received: from psmtp.com >(exprod6mx281.postini.com [64.18.1.201]) by >ngoing.corning.com (PMDF V6.3-2 #31554) with >ESMTPS id <0KIT00L26L3Q0H at ngoing.corning.com> >for TrottGR at corning.com; Tue, 28 Apr 2009 12:43:04 -0400 (EDT) >Received: from source ([194.203.142.35]) (using >TLSv1) by exprod6mx281.postini.com >([64.18.5.10]) with SMTP; Tue, 28 Apr 2009 10:43:04 -0600 (MDT) >Received: from MAIL1.stsystems.co.uk >([192.168.0.9]) by MAIL1.stsystems.co.uk >([192.168.0.9]) with mapi; Tue, 28 Apr 2009 17:43:00 +0100 >Content-language: en-US >Return-Path: >x-originalarrivaltime: 28 Apr 2009 16:43:04.0862 >(UTC) FILETIME=[66F523E0:01C9C820] >x-pstn-addresses: from [46/2] >x-pstn-levels: (S:99.90000/99.90000 CV: 4.7523 >FC:95.5390 LC:95.5390 R:95.9108 P:95.9108 M:97.0282 C:98.6951 ) >x-pstn-settings: 3 (1.0000:1.0000) s CV gt3 gt2 gt1 r p m c >x-pstn-neptune: 0/0/0.00/0 >Accept-Language: en-US >acceptlanguage: en-US >Content-class: urn:content-classes:message >Subject: RE: Cleaning SiC PECVD >Date: Tue, 28 Apr 2009 12:40:44 -0400 >Message-ID: <6324FA8D77941F41AF6FCEBDE150D6AE4A5B74F78A at MAIL1.stsystems.co.uk> >In-reply-to: >X-MS-Has-Attach: yes >X-MS-TNEF-Correlator: >Thread-Topic: Cleaning SiC PECVD >Thread-Index: AcnIHmguLtKSLtLERLOHjGeYvBQRXgAAC0sAAABJ9LA= >From: "Todd Smith" >To: "Trott, Gary R" > >Hi Gary, > >Particles will be generated always during a >deposition process more in an open load system >than a load lock system. But we do minimize the >particles by heating the chamber sidewalls and shower head > > >Thanks, > >Todd > >Todd Smith >Western Regional Sales Manager >ST Systems (USA) Inc >Office: +1 408 688 7255 >Email: todd.smith at stsystems.co.uk >Web: http://www.stsystems.com > >ST Systems (USA) Inc is registered in CA. Corporate ID Number: D1951172 >Registered Office: 611 Veterans Blvd, Suite 107, Redwood City, CA 94063 > >---------- >From: Trott, Gary R [mailto:TrottGR at corning.com] >Sent: Tuesday, April 28, 2009 9:33 AM >To: Todd Smith >Subject: RE: Cleaning SiC PECVD > >Todd > >Is there any information on particle generation or, lack of, during SiC PECVD? >Is it more or less dirty vs SiO2 depositions? >How to minimize or clean any particles? > >Just Curious >Gary Trott > > > >---------- >From: Todd Smith [mailto:Todd.Smith at stsystems.co.uk] >Sent: Tuesday, April 28, 2009 9:29 AM >To: Trott, Gary R >Subject: > > > >Hi Gary, > >Please find below a recipe for SiC. > >10sccm SiH4 >250sccm CH4 >300sccm Ar >600mTorr >60Watts LF >250oC showerhead temperature >300oC platen temperature > >This yielded the following information: > >Deposition rate = ~22.3nm/minute >Uniformity = <1% >Refractive index = ~2.46 >Stress = ~400MPa > > >Currently we use C4F8/O2 plasma clean after the >SiC deposition. Is this an old MPX CVD system? >Do they have our plasma clean gases? > >We use 400sccm O2, 100C4F8 at 600mT and 500W HF at the above temperatures. > >On older systems, 400sccmCF4, 100sccm O2 at >700Mt and 600W LF at the above temperatures would be used. > >Hope this helps > >Best Regards > >Todd > > > > > > > > > > > > > > > > > > >STS-logo.jpg > >Todd Smith >Western Regional Sales Manager >ST Systems (USA) Inc >Cell: +1 408 688 7255 >Email: todd.smith at stsystems.co.uk >Web: http://www.stsystems.com > > > > > > > > > > > >ST Systems (USA) Inc is registered in CA. Corporate ID Number: D1951172 >Registered Office: 611 Veterans Blvd, Suite 107, Redwood City, CA 94063 > > > >---------- > >The information in this email (and any >attachments) is confidential. If you are not the >intended recipient, you must not use, review, >print, alter, disclose or disseminate the >information. If you have received this email in >error, please immediately notify the sender or >forward the email to postmaster at stsystems.co.uk > >Surface Technology Systems (STS) does not accept >responsibility for changes to any e-mail which >may occur after the e-mail has been sent. >Attachments to this e-mail may contain software >viruses that could damage your systems. STS >check attachments for viruses before sending, >but you should virus-check them before opening. >The sender therefore does not accept liability >for any errors or omissions in this message, >which arise as a result of e-mail transmission. > >The views or opinions expressed in this email do >not necessarily represent the views and opinions of STS. > >Think before you print! Save paper - do you really need to print this email? > > >---------- > >The information in this email (and any >attachments) is confidential. If you are not the >intended recipient, you must not use, review, >print, alter, disclose or disseminate the >information. If you have received this email in >error, please immediately notify the sender or >forward the email to postmaster at stsystems.co.uk > >Surface Technology Systems (STS) does not accept >responsibility for changes to any e-mail which >may occur after the e-mail has been sent. >Attachments to this e-mail may contain software >viruses that could damage your systems. STS >check attachments for viruses before sending, >but you should virus-check them before opening. >The sender therefore does not accept liability >for any errors or omissions in this message, >which arise as a result of e-mail transmission. > >The views or opinions expressed in this email do >not necessarily represent the views and opinions of STS. > >Think before you print! Save paper - do you really need to print this email? > > > -------------- next part -------------- A non-text attachment was scrubbed... Name: 195756c.jpg Type: image/jpeg Size: 3906 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: STS Vision Process Specs (for customers).pdf Type: application/pdf Size: 314125 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: STS Vision 300 Presentation.pdf Type: application/pdf Size: 6737514 bytes Desc: not available URL: