Fwd: PECVD SiC on glass substrates at SNF
edmyers at stanford.edu
Thu Apr 16 17:56:03 PDT 2009
>Delivered-To: edmyers at stanford.edu
>Date: Thu, 16 Apr 2009 19:48:47 -0400
>From: "Trott, Gary R" <TrottGR at corning.com>
>Subject: PECVD SiC on glass substrates at SNF
>To: SpecMat at snf.stanford.edu
>Cc: Ed Myers <edmyers at stanford.edu>, Trottgr <TrottGR at corning.com>
>Thread-Topic: PECVD SiC on glass substrates at SNF
>X-OriginalArrivalTime: 16 Apr 2009 23:48:49.0262 (UTC)
>Dear SpecMat group
>I would like to deposit STS PECVD SiC:H onto glass samples. It was
>suggested I provide and overview of the process plan to the SpecMat
>group to uncover any interactions or dependencies that would need to
>be resolved before actually committing to the work. Here is the
>information requested from the Web page.
>Once approved, I need to make arrangements for connecting a methane
>cylinder(or equivalent carbon source) to the STS and be trained on
>the specific tools.
>STS PECVD and measurement tools.
>If you need more information, feel free to ask.
> <?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
>Dr. Gary Trott
>Corning West Technology Center
>1891 Page Mill Road, Suite 100
>Palo Alto, CA 94304
>1) Contact Info:
> Gary Trott, Corning Inc. 650-846-6012,
> <mailto:trottgr at corning.com>trottgr at corning.com PI=myself
> Coral login - TBD
>2) Materials to bring in
> Bare Substrates
> Si pieces for deposition set up (from SNF stockroom)
> and whole wafers if needed for stress measurements.
> Glass substrates. From Corning Inc
> Corning 0211, Standard Microscope slide
> material, (4.6% Na in glass)
> Corning EagleXG glass - alkali free
> Corning fused silica - alkali free
> Possibly external fused silica microscope
> slides or wafers for comparisons
> Notes:a) The glass substrates are different thicknesses
> and affected by stress.
> Not all are the same
> The 0211 covers the most range. So it is the
> most desirable.
> b) Standard microscope slides have 4.6% Na content.
> A contamination source for Si IC
> c) the glass samples likely have external
> particle contamination from
> non-clean packaging and exposure to air
> outside the cleanroom.
> d) the Si pieces can be cleaved in or out of
> the clean room.
>3) Reason for request
> SiNx and SiO2 are not the proper material choices
> SiC has significantly different refractive index, and
> chemical properties
> The substrate must be optically transparent. Fused silica
> is ok for testing
> but is less interesting
>4) Process flow
>SiC deposition on substrates in STS PECVD
> Equipment group = Gold Contaminated.
> Use standard 350C and deposition pressure
> Target thickness for testing = easy to measure = ~750A
> Vary the flow rate and power (high) for dense films
> Measure thickness, stress
> ellipseometery, and
> possibly etch rate offline on Si samples
> (in KOH or HF)
> Deposit on cleaved Si pieces, no cleaning ~30cm square
> to establish recipe.
> Deposit glass substrates with the preferred deposition condition.
> Possibly solvent clean before deposition.
> Possibly a light HF dip to clean before
> final depostion
> No SiC pattering required
> Finish with standard STS PECVD clean.
>5) Amount and form:
> Form = solid
> Si pieces from SNF stock - as many as needed cleaved into
> ~30mm squares
> Microscope slide pieces 71mm x 71mm ~12
> EagleXG glass pieces 100mm x 100mm ~12
> Fused silica ~30mm square less than 6
> Do these need to be cleaned from particles for the SNF?
> The surfaces have been exposed to non-cleanroom environment.
> The could undergo a standard degrease/clean
> No storage at Stanford
> I need a recommendation for transportation container in/out of
> the cleanroom.
> Old Si wafer box or equivalent
> Take all substrate pieces back to Corning.
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