Fwd: PECVD SiC on glass substrates at SNF

Ed Myers edmyers at stanford.edu
Thu Apr 16 17:56:03 PDT 2009


>Delivered-To: edmyers at stanford.edu
>Date: Thu, 16 Apr 2009 19:48:47 -0400
>From: "Trott, Gary R" <TrottGR at corning.com>
>Subject: PECVD SiC on glass substrates at SNF
>To: SpecMat at snf.stanford.edu
>Cc: Ed Myers <edmyers at stanford.edu>, Trottgr  <TrottGR at corning.com>
>Thread-Topic: PECVD SiC on glass substrates at SNF
>thread-index: Acm+7eKpecii7ZJPTt+OEfyE4qhF/Q==
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>Dear SpecMat group
>
>I would like to deposit STS PECVD SiC:H onto glass samples. It was 
>suggested I provide and overview of the process plan to the SpecMat 
>group to uncover any interactions or dependencies that would need to 
>be resolved before actually committing to the work. Here is the 
>information requested from the Web page.
>
>Once approved, I need to make arrangements for connecting a methane 
>cylinder(or equivalent carbon source) to the STS and be trained on 
>the specific tools.
>STS PECVD and measurement tools.
>
>If you need more information, feel free to ask.
>Regards
>
>  <?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
>
>Dr. Gary Trott
>Corning West Technology Center
>Corning Incorporated
>1891 Page Mill Road, Suite 100
>Palo Alto, CA  94304
>Office: 650-846-6012
>Cell: 408-500-5153
>
>
>
>1) Contact Info:
>      Gary Trott, Corning Inc. 650-846-6012, 
> <mailto:trottgr at corning.com>trottgr at corning.com  PI=myself
>      Coral login - TBD
>
>2) Materials to bring in
>     Bare Substrates
>           Si pieces for deposition set up (from SNF stockroom)
>            and whole wafers if needed for stress measurements.
>
>            Glass substrates. From Corning Inc
>                     Corning 0211, Standard Microscope slide 
> material, (4.6% Na in glass)
>                     Corning EagleXG glass - alkali free
>                     Corning fused silica - alkali free
>                     Possibly external fused silica microscope 
> slides or wafers for comparisons
>
>           Notes:a) The glass substrates are different thicknesses 
> and affected by stress.
>                        Not all are the same
>                        The 0211 covers the most range. So it is the 
> most desirable.
>
>                     b) Standard microscope slides have 4.6% Na content.
>                         A contamination source for Si IC
>
>                      c) the glass samples likely have external 
> particle contamination from
>                          non-clean packaging and exposure to air 
> outside the cleanroom.
>
>                      d) the Si pieces can be cleaved in or out of 
> the clean room.
>
>
>3) Reason for request
>         SiNx and SiO2 are not the proper material choices
>         SiC has significantly different refractive index, and 
> chemical properties
>         The substrate must be optically transparent. Fused silica 
> is ok for testing
>          but is less interesting
>
>4) Process flow
>SiC deposition on substrates in STS PECVD
>           Equipment group = Gold Contaminated.
>           Use standard 350C and deposition pressure
>           Target thickness for testing = easy to measure = ~750A
>           Vary the flow rate and power (high) for dense films
>                          Measure thickness, stress
>                          ellipseometery, and
>                          possibly etch rate offline on Si samples 
> (in KOH or HF)
>            Deposit on cleaved Si pieces, no cleaning  ~30cm square 
> to establish recipe.
>            Deposit glass substrates with the preferred deposition condition.
>                        Possibly solvent clean before deposition.
>                        Possibly a light HF dip to clean before 
> final depostion
>            No SiC pattering required
>            Finish with standard STS PECVD clean.
>
>5) Amount and form:
>         Form = solid
>         Si pieces from SNF stock - as many as needed cleaved into 
> ~30mm squares
>        Glass
>              Microscope slide pieces 71mm x 71mm ~12
>              EagleXG glass pieces        100mm x 100mm ~12
>              Fused silica         ~30mm square  less than 6
>
>         Do these need to be cleaned from particles for the SNF?
>        The surfaces have been exposed to non-cleanroom environment.
>        The could undergo a standard degrease/clean
>
>6) Storage
>      No storage at Stanford
>      I need a recommendation for transportation container in/out of 
> the cleanroom.
>      Old Si wafer box or equivalent
>
>7) Disposal
>      Take all substrate pieces back to Corning.
>
>





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