Fwd: PECVD SiC on glass substrates at SNF
mcvittie at cis.Stanford.EDU
Thu Apr 16 18:07:18 PDT 2009
I think we should d need to find what the glass composition is. Some
glasses are 10% Na. I think we should leave the door open for users who
want to do clear processing in the PECVD system since we only have one
On Thu, 16 Apr 2009, Ed Myers wrote:
> >Delivered-To: edmyers at stanford.edu
> >Date: Thu, 16 Apr 2009 19:48:47 -0400
> >From: "Trott, Gary R" <TrottGR at corning.com>
> >Subject: PECVD SiC on glass substrates at SNF
> >To: SpecMat at snf.stanford.edu
> >Cc: Ed Myers <edmyers at stanford.edu>, Trottgr <TrottGR at corning.com>
> >Thread-Topic: PECVD SiC on glass substrates at SNF
> >thread-index: Acm+7eKpecii7ZJPTt+OEfyE4qhF/Q==
> >X-OriginalArrivalTime: 16 Apr 2009 23:48:49.0262 (UTC)
> > FILETIME=[E3A640E0:01C9BEED]
> >Dear SpecMat group
> >I would like to deposit STS PECVD SiC:H onto glass samples. It was
> >suggested I provide and overview of the process plan to the SpecMat
> >group to uncover any interactions or dependencies that would need to
> >be resolved before actually committing to the work. Here is the
> >information requested from the Web page.
> >Once approved, I need to make arrangements for connecting a methane
> >cylinder(or equivalent carbon source) to the STS and be trained on
> >the specific tools.
> >STS PECVD and measurement tools.
> >If you need more information, feel free to ask.
> > <?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
> >Dr. Gary Trott
> >Corning West Technology Center
> >Corning Incorporated
> >1891 Page Mill Road, Suite 100
> >Palo Alto, CA 94304
> >Office: 650-846-6012
> >Cell: 408-500-5153
> >1) Contact Info:
> > Gary Trott, Corning Inc. 650-846-6012,
> > <mailto:trottgr at corning.com>trottgr at corning.com PI=myself
> > Coral login - TBD
> >2) Materials to bring in
> > Bare Substrates
> > Si pieces for deposition set up (from SNF stockroom)
> > and whole wafers if needed for stress measurements.
> > Glass substrates. From Corning Inc
> > Corning 0211, Standard Microscope slide
> > material, (4.6% Na in glass)
> > Corning EagleXG glass - alkali free
> > Corning fused silica - alkali free
> > Possibly external fused silica microscope
> > slides or wafers for comparisons
> > Notes:a) The glass substrates are different thicknesses
> > and affected by stress.
> > Not all are the same
> > The 0211 covers the most range. So it is the
> > most desirable.
> > b) Standard microscope slides have 4.6% Na content.
> > A contamination source for Si IC
> > c) the glass samples likely have external
> > particle contamination from
> > non-clean packaging and exposure to air
> > outside the cleanroom.
> > d) the Si pieces can be cleaved in or out of
> > the clean room.
> >3) Reason for request
> > SiNx and SiO2 are not the proper material choices
> > SiC has significantly different refractive index, and
> > chemical properties
> > The substrate must be optically transparent. Fused silica
> > is ok for testing
> > but is less interesting
> >4) Process flow
> >SiC deposition on substrates in STS PECVD
> > Equipment group = Gold Contaminated.
> > Use standard 350C and deposition pressure
> > Target thickness for testing = easy to measure = ~750A
> > Vary the flow rate and power (high) for dense films
> > Measure thickness, stress
> > ellipseometery, and
> > possibly etch rate offline on Si samples
> > (in KOH or HF)
> > Deposit on cleaved Si pieces, no cleaning ~30cm square
> > to establish recipe.
> > Deposit glass substrates with the preferred deposition condition.
> > Possibly solvent clean before deposition.
> > Possibly a light HF dip to clean before
> > final depostion
> > No SiC pattering required
> > Finish with standard STS PECVD clean.
> >5) Amount and form:
> > Form = solid
> > Si pieces from SNF stock - as many as needed cleaved into
> > ~30mm squares
> > Glass
> > Microscope slide pieces 71mm x 71mm ~12
> > EagleXG glass pieces 100mm x 100mm ~12
> > Fused silica ~30mm square less than 6
> > Do these need to be cleaned from particles for the SNF?
> > The surfaces have been exposed to non-cleanroom environment.
> > The could undergo a standard degrease/clean
> >6) Storage
> > No storage at Stanford
> > I need a recommendation for transportation container in/out of
> > the cleanroom.
> > Old Si wafer box or equivalent
> >7) Disposal
> > Take all substrate pieces back to Corning.
James (Jim) P. McVittie, Ph.D. Sr. Research Scientist
Paul G. Allen Building Electrical Engineering
Stanford Nanofabrication Facility jmcvittie at stanford.edu
Stanford University Office: (650) 725-3640
Rm. 336X, 330 Serra Mall Lab: (650) 721-6834
Stanford, CA 94305-4075 Fax: (650) 723-4659
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