Fwd: PECVD SiC on glass - Cleaning of PECVD

Ed Myers edmyers at stanford.edu
Thu Apr 30 14:43:01 PDT 2009


Gary's specmat emails have been getting returned without delivery.

>Delivered-To: edmyers at stanford.edu
>Date: Thu, 30 Apr 2009 15:14:16 -0400
>From: "Trott, Gary R" <TrottGR at corning.com>
>Subject: PECVD SiC on glass - Cleaning of PECVD
>To: specmat at snf.stanford.edu
>Cc: Ed Myers <edmyers at stanford.edu>, Trottgr  <TrottGR at corning.com>
>Thread-Topic: PECVD SiC on glass - Cleaning of PECVD
>Thread-Index: AcnJx9r7WbnWihIpQ5ysfsT1BdxRjQ==
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>Hi Ed
>
>This is a follow up message from my original of 
>4.16.09 where I would like to deposit SiC in the 
>STS PECVD.  We will see if the email for specmat works time.
>
>Attached below is a compendium of cleaning 
>information. Both related to the STS PECVD in 
>the PERL clean room at the HP/Agilent on the 
>Deer Creek site. Plus I contacted Todd Smith, 
>Regional Sales of ST systems for more background 
>information. Todd's information was more 
>generic, and not very tool specific.  Less than helpful.
>
>Based on this information I would like to have a 
>decision made by the SpecMat committee. Then I 
>can plan forward. From a commercial point of 
>view, indecision results in wasted time. Already 
>I have been pursuing this since January when 
>Paul Rissman thought it was part of the SNF 
>capabilities. Some of that time was spent 
>dealing with funding and paper work issues.
>
>Regards
>
>  <?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
>
>Dr. Gary Trott
>Corning West Technology Center
>Corning Incorporated
>1891 Page Mill Road, Suite 100
>Palo Alto, CA  94304
>Office: 650-846-6012
>Cell: 408-500-5153
>
>
>======================================================
>STS PECVD cleaning information
>
>1) As part of the STS 310 PECVD acceptance 
>criteria at Deek Creek, STS provided SiC 
>guidelines. Deposition receipes and measurements 
>(refractive index & stress).  The PERL 
>information was lost when the facility was 
>closed. Are there any STS SiC guidelines for the STS at Stanford?
>
>2) PERL PECVD Cleaning.
>     This cleaning process worked well for 15yr 
> with multiple users in a contaminated system.
>
>Required tools: Does Stanford have these?
>    - Window Screen over the vacuum exhaust 
> port. Keeps small particles and wafers
>       from getting on the O-ring main valve below the chamber
>    - House keeping vacuum cleaner. Built in at 
> Deer Creek so particles sucked up go outside
>       Or,  we had Nilfisk, hepa vacuum cleaners.
>    - SSteel metal vacuum nozzle with scraper at end across the diameter.
>             scrapper ~3/4 in wide
>             nozzle ~ 3/4 diameter SSteel tube 
> 1.5 ft long. It fits under the sample platter
>             and keeps hands from touching hot 
> sample holder. Attaches to vacuum cleaner.
>    - Cleanroom Kemwipes and IPA
>
>Standard Gas Clean, system at 300C or normal temperature
>        Every ~5 um of deposition: SiN, SiO2 or SiC
>        - CF4 etch (recipe lost)  ~15min. It 
> could be run multiple times as needed
>        - SiO2 1000A cover deposition
>              The CF4 etch was not designed for, 
> nor did it remove all previous deposits
>               It removes the "easy" to remove stuff
>              The cover layer was designed to 
> bury any leftovers and particles from previous processes.
>
>  Scrub Clean, system at 300C or normal temperature
>           Every  25um of deposition SiO2 or 
> SiNx.: Or ~10um for SiC: or as needed by the operators
>         •  lid up
>         • With house keeping vacuum cleaner and metal scraping nozzle
>                Flat end ~3/4" wide on end of 3/4" tube
>           - Scrap the inside of the lid, and 
> all surfaces. Suck up material that comes off
>              Mostly scraped with nozzle or 
> tweezers. Scotch brite pad or steel wool ok.
>           - Suck under the sample holder, 
> screen over main vacuum valve and all other areas
>           - wipe the inside the lid with an IPA Kemwipe towel
>           - Repeat sucking and wiping with IPA 
> until all loose, built up material removed
>             and no major particle dust is observed.
>           - make sure the screen to vacuum exhaust is clean. or replace it
>         • Close lid
>         • Then Standard Gas Clean
>            - std CF4 clean
>            - SiO2 1000A cover deposition
>
>       This process got rid of materials that were building up
>            - at the plasma edges that are not 
> effectively removed by the plasma clean
>            - loose layers that were building up on the lid.
>        Then buried everything that was left under an SiO2 layer.
>        It took about 30min of scraping and vacuuming.
>        No touching the hot sample holder
>
>Once a year
>      Mechanical Clean, system cold
>         • take apart the chamber gas delivery and sample holder
>         •   Sand blast  or etch clean as needed.
>         • Degrease with IPA or ACE Kemwipe towels.
>         • Re-assemble.
>         • Then run a standard Gas Clean
>
>3) See attached info from Todd Smith on SiC and cleaning discussion.
>
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>Content-class: urn:content-classes:message
>Subject: RE: Cleaning SiC PECVD
>Date: Tue, 28 Apr 2009 12:40:44 -0400
>Message-ID: <6324FA8D77941F41AF6FCEBDE150D6AE4A5B74F78A at MAIL1.stsystems.co.uk>
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>Thread-Topic: Cleaning SiC PECVD
>Thread-Index: AcnIHmguLtKSLtLERLOHjGeYvBQRXgAAC0sAAABJ9LA=
>From: "Todd Smith" <Todd.Smith at stsystems.co.uk>
>To: "Trott, Gary R" <TrottGR at corning.com>
>
>Hi Gary,
>
>Particles will be generated always during a 
>deposition process more in an open load system 
>than a load lock system. But we do minimize the 
>particles by heating the chamber sidewalls and shower head
>
>
>Thanks,
>
>Todd
>
>Todd Smith
>Western Regional Sales Manager
>ST Systems (USA) Inc
>Office: +1 408 688 7255
>Email: <mailto:todd.smith at stsystems.co.uk>todd.smith at stsystems.co.uk
>Web: <http://www.stsystems.com/>http://www.stsystems.com
>
>ST Systems (USA) Inc is registered in CA. Corporate ID Number: D1951172
>Registered Office: 611 Veterans Blvd, Suite 107, Redwood City, CA 94063
>
>----------
>From: Trott, Gary R [mailto:TrottGR at corning.com]
>Sent: Tuesday, April 28, 2009 9:33 AM
>To: Todd Smith
>Subject: RE: Cleaning SiC PECVD
>
>Todd
>
>Is there any information on particle generation or, lack of, during SiC PECVD?
>Is it more or less dirty vs SiO2 depositions?
>How to minimize or clean any particles?
>
>Just Curious
>Gary Trott
>
>
>
>----------
>From: Todd Smith [mailto:Todd.Smith at stsystems.co.uk]
>Sent: Tuesday, April 28, 2009 9:29 AM
>To: Trott, Gary R
>Subject:
>
>
>
>Hi Gary,
>
>Please find below a recipe for SiC.
>
>10sccm SiH4
>250sccm CH4
>300sccm Ar
>600mTorr
>60Watts LF
>250oC showerhead temperature
>300oC platen temperature
>
>This yielded the following information:
>
>Deposition rate         =          ~22.3nm/minute
>Uniformity                   =          <1%
>Refractive index        =          ~2.46
>Stress                         =          ~400MPa
>
>
>Currently we use C4F8/O2 plasma clean after the 
>SiC deposition. Is this an old MPX CVD system? 
>Do they have our plasma clean gases?
>
>We use 400sccm O2, 100C4F8 at 600mT and 500W HF at the above temperatures.
>
>On older systems, 400sccmCF4, 100sccm O2 at 
>700Mt and 600W LF at the above temperatures would be used.
>
>Hope this helps
>
>Best Regards
>
>Todd
>
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>STS-logo.jpg
>
>Todd Smith
>Western Regional Sales Manager
>ST Systems (USA) Inc
>Cell:  +1 408 688 7255
>Email: <mailto:todd.smith at stsystems.co.uk>todd.smith at stsystems.co.uk
>Web: <http://www.stsystems.com>http://www.stsystems.com
>
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>ST Systems (USA) Inc is registered in CA. Corporate ID Number: D1951172
>Registered Office: 611 Veterans Blvd, Suite 107, Redwood City, CA 94063
>
>
>
>----------
>
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>----------
>
>The information in this email (and any 
>attachments) is confidential. If you are not the 
>intended recipient, you must not use, review, 
>print, alter, disclose or disseminate the 
>information. If you have received this email in 
>error, please immediately notify the sender or 
>forward the email to postmaster at stsystems.co.uk
>
>Surface Technology Systems (STS) does not accept 
>responsibility for changes to any e-mail which 
>may occur after the e-mail has been sent. 
>Attachments to this e-mail may contain software 
>viruses that could damage your systems. STS 
>check attachments for viruses before sending, 
>but you should virus-check them before opening. 
>The sender therefore does not accept liability 
>for any errors or omissions in this message, 
>which arise as a result of e-mail transmission.
>
>The views or opinions expressed in this email do 
>not necessarily represent the views and opinions of STS.
>
>Think before you print! Save paper - do you really need to print this email?
>
>
>
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