Fwd: PECVD SiC on glass - Cleaning of PECVD
Ed Myers
edmyers at stanford.edu
Thu Apr 30 14:43:01 PDT 2009
Gary's specmat emails have been getting returned without delivery.
>Delivered-To: edmyers at stanford.edu
>Date: Thu, 30 Apr 2009 15:14:16 -0400
>From: "Trott, Gary R" <TrottGR at corning.com>
>Subject: PECVD SiC on glass - Cleaning of PECVD
>To: specmat at snf.stanford.edu
>Cc: Ed Myers <edmyers at stanford.edu>, Trottgr <TrottGR at corning.com>
>Thread-Topic: PECVD SiC on glass - Cleaning of PECVD
>Thread-Index: AcnJx9r7WbnWihIpQ5ysfsT1BdxRjQ==
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>
>Hi Ed
>
>This is a follow up message from my original of
>4.16.09 where I would like to deposit SiC in the
>STS PECVD. We will see if the email for specmat works time.
>
>Attached below is a compendium of cleaning
>information. Both related to the STS PECVD in
>the PERL clean room at the HP/Agilent on the
>Deer Creek site. Plus I contacted Todd Smith,
>Regional Sales of ST systems for more background
>information. Todd's information was more
>generic, and not very tool specific. Less than helpful.
>
>Based on this information I would like to have a
>decision made by the SpecMat committee. Then I
>can plan forward. From a commercial point of
>view, indecision results in wasted time. Already
>I have been pursuing this since January when
>Paul Rissman thought it was part of the SNF
>capabilities. Some of that time was spent
>dealing with funding and paper work issues.
>
>Regards
>
> <?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
>
>Dr. Gary Trott
>Corning West Technology Center
>Corning Incorporated
>1891 Page Mill Road, Suite 100
>Palo Alto, CA 94304
>Office: 650-846-6012
>Cell: 408-500-5153
>
>
>======================================================
>STS PECVD cleaning information
>
>1) As part of the STS 310 PECVD acceptance
>criteria at Deek Creek, STS provided SiC
>guidelines. Deposition receipes and measurements
>(refractive index & stress). The PERL
>information was lost when the facility was
>closed. Are there any STS SiC guidelines for the STS at Stanford?
>
>2) PERL PECVD Cleaning.
> This cleaning process worked well for 15yr
> with multiple users in a contaminated system.
>
>Required tools: Does Stanford have these?
> - Window Screen over the vacuum exhaust
> port. Keeps small particles and wafers
> from getting on the O-ring main valve below the chamber
> - House keeping vacuum cleaner. Built in at
> Deer Creek so particles sucked up go outside
> Or, we had Nilfisk, hepa vacuum cleaners.
> - SSteel metal vacuum nozzle with scraper at end across the diameter.
> scrapper ~3/4 in wide
> nozzle ~ 3/4 diameter SSteel tube
> 1.5 ft long. It fits under the sample platter
> and keeps hands from touching hot
> sample holder. Attaches to vacuum cleaner.
> - Cleanroom Kemwipes and IPA
>
>Standard Gas Clean, system at 300C or normal temperature
> Every ~5 um of deposition: SiN, SiO2 or SiC
> - CF4 etch (recipe lost) ~15min. It
> could be run multiple times as needed
> - SiO2 1000A cover deposition
> The CF4 etch was not designed for,
> nor did it remove all previous deposits
> It removes the "easy" to remove stuff
> The cover layer was designed to
> bury any leftovers and particles from previous processes.
>
> Scrub Clean, system at 300C or normal temperature
> Every 25um of deposition SiO2 or
> SiNx.: Or ~10um for SiC: or as needed by the operators
> • lid up
> • With house keeping vacuum cleaner and metal scraping nozzle
> Flat end ~3/4" wide on end of 3/4" tube
> - Scrap the inside of the lid, and
> all surfaces. Suck up material that comes off
> Mostly scraped with nozzle or
> tweezers. Scotch brite pad or steel wool ok.
> - Suck under the sample holder,
> screen over main vacuum valve and all other areas
> - wipe the inside the lid with an IPA Kemwipe towel
> - Repeat sucking and wiping with IPA
> until all loose, built up material removed
> and no major particle dust is observed.
> - make sure the screen to vacuum exhaust is clean. or replace it
> • Close lid
> • Then Standard Gas Clean
> - std CF4 clean
> - SiO2 1000A cover deposition
>
> This process got rid of materials that were building up
> - at the plasma edges that are not
> effectively removed by the plasma clean
> - loose layers that were building up on the lid.
> Then buried everything that was left under an SiO2 layer.
> It took about 30min of scraping and vacuuming.
> No touching the hot sample holder
>
>Once a year
> Mechanical Clean, system cold
> • take apart the chamber gas delivery and sample holder
> • Sand blast or etch clean as needed.
> • Degrease with IPA or ACE Kemwipe towels.
> • Re-assemble.
> • Then run a standard Gas Clean
>
>3) See attached info from Todd Smith on SiC and cleaning discussion.
>
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>Content-class: urn:content-classes:message
>Subject: RE: Cleaning SiC PECVD
>Date: Tue, 28 Apr 2009 12:40:44 -0400
>Message-ID: <6324FA8D77941F41AF6FCEBDE150D6AE4A5B74F78A at MAIL1.stsystems.co.uk>
>In-reply-to: <E7434A43F961B24F9259EB1891694C90F454FD at cvcv0xi06.na.corning.com>
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>Thread-Topic: Cleaning SiC PECVD
>Thread-Index: AcnIHmguLtKSLtLERLOHjGeYvBQRXgAAC0sAAABJ9LA=
>From: "Todd Smith" <Todd.Smith at stsystems.co.uk>
>To: "Trott, Gary R" <TrottGR at corning.com>
>
>Hi Gary,
>
>Particles will be generated always during a
>deposition process more in an open load system
>than a load lock system. But we do minimize the
>particles by heating the chamber sidewalls and shower head
>
>
>Thanks,
>
>Todd
>
>Todd Smith
>Western Regional Sales Manager
>ST Systems (USA) Inc
>Office: +1 408 688 7255
>Email: <mailto:todd.smith at stsystems.co.uk>todd.smith at stsystems.co.uk
>Web: <http://www.stsystems.com/>http://www.stsystems.com
>
>ST Systems (USA) Inc is registered in CA. Corporate ID Number: D1951172
>Registered Office: 611 Veterans Blvd, Suite 107, Redwood City, CA 94063
>
>----------
>From: Trott, Gary R [mailto:TrottGR at corning.com]
>Sent: Tuesday, April 28, 2009 9:33 AM
>To: Todd Smith
>Subject: RE: Cleaning SiC PECVD
>
>Todd
>
>Is there any information on particle generation or, lack of, during SiC PECVD?
>Is it more or less dirty vs SiO2 depositions?
>How to minimize or clean any particles?
>
>Just Curious
>Gary Trott
>
>
>
>----------
>From: Todd Smith [mailto:Todd.Smith at stsystems.co.uk]
>Sent: Tuesday, April 28, 2009 9:29 AM
>To: Trott, Gary R
>Subject:
>
>
>
>Hi Gary,
>
>Please find below a recipe for SiC.
>
>10sccm SiH4
>250sccm CH4
>300sccm Ar
>600mTorr
>60Watts LF
>250oC showerhead temperature
>300oC platen temperature
>
>This yielded the following information:
>
>Deposition rate = ~22.3nm/minute
>Uniformity = <1%
>Refractive index = ~2.46
>Stress = ~400MPa
>
>
>Currently we use C4F8/O2 plasma clean after the
>SiC deposition. Is this an old MPX CVD system?
>Do they have our plasma clean gases?
>
>We use 400sccm O2, 100C4F8 at 600mT and 500W HF at the above temperatures.
>
>On older systems, 400sccmCF4, 100sccm O2 at
>700Mt and 600W LF at the above temperatures would be used.
>
>Hope this helps
>
>Best Regards
>
>Todd
>
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>STS-logo.jpg
>
>Todd Smith
>Western Regional Sales Manager
>ST Systems (USA) Inc
>Cell: +1 408 688 7255
>Email: <mailto:todd.smith at stsystems.co.uk>todd.smith at stsystems.co.uk
>Web: <http://www.stsystems.com>http://www.stsystems.com
>
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>ST Systems (USA) Inc is registered in CA. Corporate ID Number: D1951172
>Registered Office: 611 Veterans Blvd, Suite 107, Redwood City, CA 94063
>
>
>
>----------
>
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>----------
>
>The information in this email (and any
>attachments) is confidential. If you are not the
>intended recipient, you must not use, review,
>print, alter, disclose or disseminate the
>information. If you have received this email in
>error, please immediately notify the sender or
>forward the email to postmaster at stsystems.co.uk
>
>Surface Technology Systems (STS) does not accept
>responsibility for changes to any e-mail which
>may occur after the e-mail has been sent.
>Attachments to this e-mail may contain software
>viruses that could damage your systems. STS
>check attachments for viruses before sending,
>but you should virus-check them before opening.
>The sender therefore does not accept liability
>for any errors or omissions in this message,
>which arise as a result of e-mail transmission.
>
>The views or opinions expressed in this email do
>not necessarily represent the views and opinions of STS.
>
>Think before you print! Save paper - do you really need to print this email?
>
>
>
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