[Fwd: RE: FW: new chemical request: WaferBOND spin-on polymer]

Mary Tang mtang at stanford.edu
Mon Jan 12 11:11:48 PST 2009


Hi all --

Ross came by.  Based on various emails between Mahnaz, James, and me 
just before shutdown, this looks OK (or at least, as James says, "can't 
be worse than SU-08!)  So, I gave Ross a yellow sticker and a barcode.

Mary

-------- Original Message --------
Subject: 	RE: FW: new chemical request: WaferBOND spin-on polymer
Date: 	Mon, 15 Dec 2008 13:42:31 -0800
From: 	Ross Audet <audet at stanford.edu>
To: 	'Mary Tang' <mtang at stanford.edu>
References: 	<000901c94e77$3d0f2fd0$b72d8f70$@edu> 
<4946C81F.8040003 at stanford.edu>



Mary,

I won't be starting until after the shutdown, so waiting is not a problem.

After the long KOH etch, the waferbond will have completely dissolved from
the exposed surfaces, so only the area under the bonded chip will have
Waferbond remaining.  Hopefully this means the outgassing concern in the YES
oven is minimal, but we'll see what Mahnaz thinks.

We don't anticipate needing to thin the Waferbond.

Liz Edwards and I will be in touch with Jeannie about the PECVD.

Thanks!
Ross



-----Original Message-----
From: Mary Tang [mailto:mtang at stanford.edu] 
Sent: Monday, December 15, 2008 1:12 PM
To: Ross Audet
Subject: Re: FW: new chemical request: WaferBOND spin-on polymer

Hi Ross --

I've forwarded your request to Jeannie to let her know you'll be getting 
in touch with her.  I've also forwarded it to James, since he manages 
the headway (and likes to keep on top of the whacky chemicals used 
there.)  Will you be thinning down the waferbond in any way?  If so, 
please let me know what solvent you plan to use and how you'll be mixing 
it.  I've also forwarded your request to Mahnaz, since it looks like 
there will be exposed waferbond present on the carrier (provided it 
survives your KOH etch) when it goes into the YES oven.  It is generally 
not a good idea to put polymers into the YES oven since they off gas and 
have a tendency to distribute onto the chamber walls and other wafers, 
so there may be some concerns there.

So, could you please hold off a day or so?  I don't anticipate problems, 
but am sure there will be provisions requested.  I know there's only a 
couple of days left this week -- let me know if this is a problem --

Thanks,

Mary


Ross Audet wrote:
>
> Dear Mary,
>
>  
>
> I submitted a request to Specmat about a month ago for an adhesive 
> wafer bonding compound, but haven't received a reply yet.  Is there 
> anything you can do to help speed the review process?
>
>  
>
> Perhaps you could take a look at the attached document and let me know 
> if there are any concerns on your end about use of the chemical.
>
>  
>
> Thanks,
>
> Ross Audet
>
>  
>
> *From:* Ross Audet [mailto:audet at stanford.edu]
> *Sent:* Sunday, October 19, 2008 4:34 PM
> *To:* 'specmat at snf.stanford.edu'
> *Subject:* new chemical request: Waferbond spin on polymer
>
>  
>
>  
>
> Dear Specmat committee,
>
>  
>
> Please see the attached document requesting permission to use of 
> Brewer Waferbond in the SNF cleanroom.  Contact me with any questions.
>
>  
>
> Regards,
>
> Ross Audet
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




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