From mtang at stanford.edu  Mon Mar  2 14:26:57 2009
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 02 Mar 2009 14:26:57 -0800
Subject: Request for bringing new material (Pyralin Polyimide Coating
 and Pyralin Thinner)
In-Reply-To: <411437380.840911236029936905.JavaMail.root@zm01.stanford.edu>
References: <411437380.840911236029936905.JavaMail.root@zm01.stanford.edu>
Message-ID: <49AC5D31.2050309@stanford.edu>

Hi all --

I'll defer to Mahnaz for the final word, but this request looks fine to 
me -- with a couple of questions:

1.  PI 2545 is actually used by a number of people.  You might check 
with Mahnaz to find out if there is some available for your use, if you 
don't want to order it.  It lasts a long time.

2.  Your process flow does not mention adhesion promoter which some 
people find useful (it'sVM-651 or 652 and one is better than the other, 
although I don't remember which right now.  Other people in the lab will 
have this on hand, so you might want to ask around.)

3.  Your process flow does not mention curing of the polyimide (usually 
done in the BlueM oven) and if you plan further processing at SNF for 
these wafers.  If so, please let us know.

And a couple of reminders for bringing in and handling these materials 
in the lab:

4.  Follow all safety procedures in bringing in and storing personal 
materials.  (Contact Mahnaz or other staff member for the yellow label 
and barcode for personal chemicals.  You will have to log your chemicals 
under the barcode assigned to your chemicals on the logsheet.  Make sure 
to store these chemicals in the designated area of the Flammables 
cabinet or refrigerator as appropriate.)

5.  Follow all safety (all litho) handling procedures for volatile 
solvents in the lab.  (Use only at solvent-compatible stations.  Make 
sure to transport freshly spun/unbaked wafers in wafer boxes or other 
enclosed containers or risk the wrath of Uli.)

Unless other SpecMat'ers disagree, I believe what you have proposed is 
OK (provided you follow #4 and #5 above.)  However, if you plan further 
processing in the lab, please make sure to check/answer #2 and #3 above.

Thanks,

Mary

Zhiqiang Guo wrote:
> Hi, Mary:
>
> I have sent this email for bringing in personal material in SNF, those are common material, but not got reply, could you please tell me when I can receive the decision of the SpecMat committee?
>
> Thanks,
>
> Zhiqiang
>
>
> ----- Forwarded Message -----
> From: "Zhiqiang Guo" <zguo at stanford.edu>
> To: SpecMat at snf.stanford.edu
> Sent: Friday, February 27, 2009 6:11:43 AM GMT -08:00 US/Canada Pacific
> Subject: Request for bringing new material (Pyralin Polyimide Coating and Pyralin Thinner)
>
> Hi, SpecMat Committee members:
>
> I apply for bring two materials into SNF, the two materials are all on MSDS Index at SNF. Because I need your decision then I can place an order, so could you please tell me your decision today, I will really appreciate your early decision?
>
> Please review the detailed information below:
>
> 1. Contact information:
>     Name: Zhiqiang Guo
>     Coral login: zguo
>     Phone(email): 650-723-3524 (zguo at stanford.edu)
>     PI: Prof. Fu-Kuo Chang (Department of Aeronautics and Astronautics, Stanford University)
>
> 2. Material:
>    1) Common name: PI-2545
>       Trade name: Pyralin(R) Polyimide Coating
>       Components CAS numbers: 25038-81-7, 872-50-4, 64742-95-6, 95-63-6, 
>       usage: Coating polyimide film
>
>    2) Common name: T-9039
>       Trade name: Pyralin Thinner
>       Components CAS numbers: 872-50-4, 107-98-2 
>       usage: To thin the PI-2545 before coating
>
> 3. Vendor/manufacturer info(the same vendor): 
>    HD MicroSystems(TM)
>    Cheesequake Road
>    Parlin
>    New Jersey
>    USA 08859
>    phone: (800)346-5656
>    url: http://hdmicrosystems.com/HDMicroSystems/en_US/index.html
>
> 4. Reason for request
>    In our process, we need to coat an thin polyimide film onto the surface of our device, seems there is no such material for common use in SNF, so I need to bring by myself.
>
> 5. Process Flow:
>    Start at 5 parts thinner T-9039 to 1 part PI-2545 (Lithosolv). After thinning run a spin coating(Headway2). The soft bake is done on a hot plate by 10' x 130C or convection oven by 30' x 135C (Blue M white). Coat with photoresist(svgcoat 1&2), expose the resist(EV or Karlsuss) and develop(svgdev 1&2). Remove the photoresist by using acetone(lithosolv or wbsolvent).
>
> 6. Amont and form:
>    1) PI-2545 for 250g, liquid in a bottle.
>    2) T-9039 for 1 liter, liquid in bottle.
>
> 7. Storage
>    1) PI-2545: group B (in refrige 0~4F)
>    2) T-9039: group B (Room temperature, below 90F )
>
> 8. Disposal
>    The liquid waste of those products are to be disposed into the solvent waster container in lito solvent benth. The baked polyimide film can be placed in a ziplock bag disposed in a hazardous waste container in the photolithography area.
>
>
> If you agree me to bring those two materials, could you please tell me where I can get the label and barcode?
>
> Thanks very much!
>
> Zhiqiang


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



From jweisse at stanford.edu  Tue Mar  3 13:10:30 2009
From: jweisse at stanford.edu (Jeffrey M. Weisse)
Date: Tue, 3 Mar 2009 13:10:30 -0800 (PST)
Subject: materials in TylanBPSG
In-Reply-To: <741700737.1150231236114326743.JavaMail.root@zm06.stanford.edu>
Message-ID: <988873705.1151681236114630176.JavaMail.root@zm06.stanford.edu>

hi,

I was wondering if my samples would be allowed in the TylanBPSG.  They are NWs grown top down with silver as a catalyst for a wet etch of HF/H2O2/H2O so they are gold free.  Maurice, the trainer, was unsure if the silver catalyst would contaminate the machine and wanted me to verify it with specmat.

Thank you,

Jeff


From mtang at stanford.edu  Tue Mar  3 13:26:04 2009
From: mtang at stanford.edu (Mary Tang)
Date: Tue, 03 Mar 2009 13:26:04 -0800
Subject: materials in TylanBPSG
In-Reply-To: <988873705.1151681236114630176.JavaMail.root@zm06.stanford.edu>
References: <988873705.1151681236114630176.JavaMail.root@zm06.stanford.edu>
Message-ID: <49ADA06C.8020800@stanford.edu>

What about just before a tube pull?

M

Jeffrey M. Weisse wrote:
> hi,
>
> I was wondering if my samples would be allowed in the TylanBPSG.  They are NWs grown top down with silver as a catalyst for a wet etch of HF/H2O2/H2O so they are gold free.  Maurice, the trainer, was unsure if the silver catalyst would contaminate the machine and wanted me to verify it with specmat.
>
> Thank you,
>
> Jeff
>   


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



From edmyers at stanford.edu  Tue Mar  3 13:31:01 2009
From: edmyers at stanford.edu (Ed Myers)
Date: Tue, 03 Mar 2009 13:31:01 -0800
Subject: materials in TylanBPSG
In-Reply-To: <49ADA06C.8020800@stanford.edu>
References: <988873705.1151681236114630176.JavaMail.root@zm06.stanford.edu>
 <49ADA06C.8020800@stanford.edu>
Message-ID: <6.2.5.6.2.20090303133035.03261e80@stanford.edu>

Or wait until ThermcoLTO is up and we have divided the tubes.

At 01:26 PM 3/3/2009, Mary Tang wrote:
>What about just before a tube pull?
>
>M
>
>Jeffrey M. Weisse wrote:
>>hi,
>>
>>I was wondering if my samples would be allowed in the 
>>TylanBPSG.  They are NWs grown top down with silver as a catalyst 
>>for a wet etch of HF/H2O2/H2O so they are gold free.  Maurice, the 
>>trainer, was unsure if the silver catalyst would contaminate the 
>>machine and wanted me to verify it with specmat.
>>
>>Thank you,
>>
>>Jeff
>>
>
>
>--
>Mary X. Tang, Ph.D.
>Stanford Nanofabrication Facility
>CIS Room 136, Mail Code 4070
>Stanford, CA  94305
>(650)723-9980
>mtang at stanford.edu
>http://snf.stanford.edu




From mahnaz at stanford.edu  Tue Mar  3 13:35:47 2009
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Tue, 03 Mar 2009 13:35:47 -0800
Subject: Request for bringing new material (Pyralin Polyimide Coating
 and Pyralin Thinner)
In-Reply-To: <49AC5D31.2050309@stanford.edu>
References: <411437380.840911236029936905.JavaMail.root@zm01.stanford.edu> <49AC5D31.2050309@stanford.edu>
Message-ID: <49ADA2B3.9060103@stanford.edu>

Hello Zhiqiang,

I need a process flow meaning step by step of what wafers will go ( 
oven, development...) through as I mentioned to you in the lab.  I need 
to know what temperature  are you curing the wafers and  where will go 
after that.

Secondly, write to me and tell me how and how much of materials need to 
be thinned and where are you planning to do this? You need to come and 
get a yellow label after giving me the information I am requesting.
You are using some of my polyimide, have you ordered your thinner already?
I believe that curing should be done in bluem oven, are you qualified?
Are you a headway user?
I will send you su8 and polyimide handling in a separate email and I 
need it to be followed to the letter.

mahnaz



Mary Tang wrote:
> Hi all --
>
> I'll defer to Mahnaz for the final word, but this request looks fine 
> to me -- with a couple of questions:
>
> 1.  PI 2545 is actually used by a number of people.  You might check 
> with Mahnaz to find out if there is some available for your use, if 
> you don't want to order it.  It lasts a long time.
>
> 2.  Your process flow does not mention adhesion promoter which some 
> people find useful (it'sVM-651 or 652 and one is better than the 
> other, although I don't remember which right now.  Other people in the 
> lab will have this on hand, so you might want to ask around.)
>
> 3.  Your process flow does not mention curing of the polyimide 
> (usually done in the BlueM oven) and if you plan further processing at 
> SNF for these wafers.  If so, please let us know.
>
> And a couple of reminders for bringing in and handling these materials 
> in the lab:
>
> 4.  Follow all safety procedures in bringing in and storing personal 
> materials.  (Contact Mahnaz or other staff member for the yellow label 
> and barcode for personal chemicals.  You will have to log your 
> chemicals under the barcode assigned to your chemicals on the 
> logsheet.  Make sure to store these chemicals in the designated area 
> of the Flammables cabinet or refrigerator as appropriate.)
>
> 5.  Follow all safety (all litho) handling procedures for volatile 
> solvents in the lab.  (Use only at solvent-compatible stations.  Make 
> sure to transport freshly spun/unbaked wafers in wafer boxes or other 
> enclosed containers or risk the wrath of Uli.)
>
> Unless other SpecMat'ers disagree, I believe what you have proposed is 
> OK (provided you follow #4 and #5 above.)  However, if you plan 
> further processing in the lab, please make sure to check/answer #2 and 
> #3 above.
>
> Thanks,
>
> Mary
>
> Zhiqiang Guo wrote:
>> Hi, Mary:
>>
>> I have sent this email for bringing in personal material in SNF, 
>> those are common material, but not got reply, could you please tell 
>> me when I can receive the decision of the SpecMat committee?
>>
>> Thanks,
>>
>> Zhiqiang
>>
>>
>> ----- Forwarded Message -----
>> From: "Zhiqiang Guo" <zguo at stanford.edu>
>> To: SpecMat at snf.stanford.edu
>> Sent: Friday, February 27, 2009 6:11:43 AM GMT -08:00 US/Canada Pacific
>> Subject: Request for bringing new material (Pyralin Polyimide Coating 
>> and Pyralin Thinner)
>>
>> Hi, SpecMat Committee members:
>>
>> I apply for bring two materials into SNF, the two materials are all 
>> on MSDS Index at SNF. Because I need your decision then I can place 
>> an order, so could you please tell me your decision today, I will 
>> really appreciate your early decision?
>>
>> Please review the detailed information below:
>>
>> 1. Contact information:
>>     Name: Zhiqiang Guo
>>     Coral login: zguo
>>     Phone(email): 650-723-3524 (zguo at stanford.edu)
>>     PI: Prof. Fu-Kuo Chang (Department of Aeronautics and 
>> Astronautics, Stanford University)
>>
>> 2. Material:
>>    1) Common name: PI-2545
>>       Trade name: Pyralin(R) Polyimide Coating
>>       Components CAS numbers: 25038-81-7, 872-50-4, 64742-95-6, 
>> 95-63-6,       usage: Coating polyimide film
>>
>>    2) Common name: T-9039
>>       Trade name: Pyralin Thinner
>>       Components CAS numbers: 872-50-4, 107-98-2       usage: To thin 
>> the PI-2545 before coating
>>
>> 3. Vendor/manufacturer info(the same vendor):    HD MicroSystems(TM)
>>    Cheesequake Road
>>    Parlin
>>    New Jersey
>>    USA 08859
>>    phone: (800)346-5656
>>    url: http://hdmicrosystems.com/HDMicroSystems/en_US/index.html
>>
>> 4. Reason for request
>>    In our process, we need to coat an thin polyimide film onto the 
>> surface of our device, seems there is no such material for common use 
>> in SNF, so I need to bring by myself.
>>
>> 5. Process Flow:
>>    Start at 5 parts thinner T-9039 to 1 part PI-2545 (Lithosolv). 
>> After thinning run a spin coating(Headway2). The soft bake is done on 
>> a hot plate by 10' x 130C or convection oven by 30' x 135C (Blue M 
>> white). Coat with photoresist(svgcoat 1&2), expose the resist(EV or 
>> Karlsuss) and develop(svgdev 1&2). Remove the photoresist by using 
>> acetone(lithosolv or wbsolvent).
>>
>> 6. Amont and form:
>>    1) PI-2545 for 250g, liquid in a bottle.
>>    2) T-9039 for 1 liter, liquid in bottle.
>>
>> 7. Storage
>>    1) PI-2545: group B (in refrige 0~4F)
>>    2) T-9039: group B (Room temperature, below 90F )
>>
>> 8. Disposal
>>    The liquid waste of those products are to be disposed into the 
>> solvent waster container in lito solvent benth. The baked polyimide 
>> film can be placed in a ziplock bag disposed in a hazardous waste 
>> container in the photolithography area.
>>
>>
>> If you agree me to bring those two materials, could you please tell 
>> me where I can get the label and barcode?
>>
>> Thanks very much!
>>
>> Zhiqiang
>
>


From zguo at stanford.edu  Wed Mar  4 04:01:26 2009
From: zguo at stanford.edu (Zhiqiang Guo)
Date: Wed, 4 Mar 2009 04:01:26 -0800 (PST)
Subject: Request for bringing new material (Pyralin Polyimide Coating
 and Pyralin Thinner)
In-Reply-To: <204110128.1283101236167487559.JavaMail.root@zm01.stanford.edu>
Message-ID: <765739647.1283331236168086455.JavaMail.root@zm01.stanford.edu>

Hi, Mahnaz:

The process flow for PI-2545 and T-9039 will be:
    1) Thin: Use 5 parts thinner T-9039 to 1 part PI-2545 in Lithosolv, you mentioned I need to shake the bottle of mixture, so could you please tell me where and how to do this.
    2) spin coating on Headway2. Then do soft bake at 135degC for 30min at Blue oven(I need a blueoven training)
    3) Photoresist coating. This done on svgcoat 1 or 2.
    3) Exposure: expose the photo resist on EV or Karlsussand.
    4) Develop:  on svgdev 1&2.
    5) Remove the photoresist by using acetone. At lithosolv or wbsolvent.
    6) Hard back: this is done in blue oven at 250degC for 30min







----- Original Message -----
From: "Mahnaz Mansourpour" <mahnaz at stanford.edu>
To: "Mary Tang" <mtang at stanford.edu>
Cc: "Zhiqiang Guo" <zguo at stanford.edu>, pilotqiang at gmail.com, specmat at snf.stanford.edu
Sent: Tuesday, March 3, 2009 1:35:47 PM GMT -08:00 US/Canada Pacific
Subject: Re: Request for bringing new material (Pyralin Polyimide Coating and Pyralin Thinner)

Hello Zhiqiang,

I need a process flow meaning step by step of what wafers will go ( 
oven, development...) through as I mentioned to you in the lab.  I need 
to know what temperature  are you curing the wafers and  where will go 
after that.

Secondly, write to me and tell me how and how much of materials need to 
be thinned and where are you planning to do this? You need to come and 
get a yellow label after giving me the information I am requesting.
You are using some of my polyimide, have you ordered your thinner already?
I believe that curing should be done in bluem oven, are you qualified?
Are you a headway user?
I will send you su8 and polyimide handling in a separate email and I 
need it to be followed to the letter.

mahnaz



Mary Tang wrote:
> Hi all --
>
> I'll defer to Mahnaz for the final word, but this request looks fine 
> to me -- with a couple of questions:
>
> 1.  PI 2545 is actually used by a number of people.  You might check 
> with Mahnaz to find out if there is some available for your use, if 
> you don't want to order it.  It lasts a long time.
>
> 2.  Your process flow does not mention adhesion promoter which some 
> people find useful (it'sVM-651 or 652 and one is better than the 
> other, although I don't remember which right now.  Other people in the 
> lab will have this on hand, so you might want to ask around.)
>
> 3.  Your process flow does not mention curing of the polyimide 
> (usually done in the BlueM oven) and if you plan further processing at 
> SNF for these wafers.  If so, please let us know.
>
> And a couple of reminders for bringing in and handling these materials 
> in the lab:
>
> 4.  Follow all safety procedures in bringing in and storing personal 
> materials.  (Contact Mahnaz or other staff member for the yellow label 
> and barcode for personal chemicals.  You will have to log your 
> chemicals under the barcode assigned to your chemicals on the 
> logsheet.  Make sure to store these chemicals in the designated area 
> of the Flammables cabinet or refrigerator as appropriate.)
>
> 5.  Follow all safety (all litho) handling procedures for volatile 
> solvents in the lab.  (Use only at solvent-compatible stations.  Make 
> sure to transport freshly spun/unbaked wafers in wafer boxes or other 
> enclosed containers or risk the wrath of Uli.)
>
> Unless other SpecMat'ers disagree, I believe what you have proposed is 
> OK (provided you follow #4 and #5 above.)  However, if you plan 
> further processing in the lab, please make sure to check/answer #2 and 
> #3 above.
>
> Thanks,
>
> Mary
>
> Zhiqiang Guo wrote:
>> Hi, Mary:
>>
>> I have sent this email for bringing in personal material in SNF, 
>> those are common material, but not got reply, could you please tell 
>> me when I can receive the decision of the SpecMat committee?
>>
>> Thanks,
>>
>> Zhiqiang
>>
>>
>> ----- Forwarded Message -----
>> From: "Zhiqiang Guo" <zguo at stanford.edu>
>> To: SpecMat at snf.stanford.edu
>> Sent: Friday, February 27, 2009 6:11:43 AM GMT -08:00 US/Canada Pacific
>> Subject: Request for bringing new material (Pyralin Polyimide Coating 
>> and Pyralin Thinner)
>>
>> Hi, SpecMat Committee members:
>>
>> I apply for bring two materials into SNF, the two materials are all 
>> on MSDS Index at SNF. Because I need your decision then I can place 
>> an order, so could you please tell me your decision today, I will 
>> really appreciate your early decision?
>>
>> Please review the detailed information below:
>>
>> 1. Contact information:
>>     Name: Zhiqiang Guo
>>     Coral login: zguo
>>     Phone(email): 650-723-3524 (zguo at stanford.edu)
>>     PI: Prof. Fu-Kuo Chang (Department of Aeronautics and 
>> Astronautics, Stanford University)
>>
>> 2. Material:
>>    1) Common name: PI-2545
>>       Trade name: Pyralin(R) Polyimide Coating
>>       Components CAS numbers: 25038-81-7, 872-50-4, 64742-95-6, 
>> 95-63-6,       usage: Coating polyimide film
>>
>>    2) Common name: T-9039
>>       Trade name: Pyralin Thinner
>>       Components CAS numbers: 872-50-4, 107-98-2       usage: To thin 
>> the PI-2545 before coating
>>
>> 3. Vendor/manufacturer info(the same vendor):    HD MicroSystems(TM)
>>    Cheesequake Road
>>    Parlin
>>    New Jersey
>>    USA 08859
>>    phone: (800)346-5656
>>    url: http://hdmicrosystems.com/HDMicroSystems/en_US/index.html
>>
>> 4. Reason for request
>>    In our process, we need to coat an thin polyimide film onto the 
>> surface of our device, seems there is no such material for common use 
>> in SNF, so I need to bring by myself.
>>
>> 5. Process Flow:
>>    Start at 5 parts thinner T-9039 to 1 part PI-2545 (Lithosolv). 
>> After thinning run a spin coating(Headway2). The soft bake is done on 
>> a hot plate by 10' x 130C or convection oven by 30' x 135C (Blue M 
>> white). Coat with photoresist(svgcoat 1&2), expose the resist(EV or 
>> Karlsuss) and develop(svgdev 1&2). Remove the photoresist by using 
>> acetone(lithosolv or wbsolvent).
>>
>> 6. Amont and form:
>>    1) PI-2545 for 250g, liquid in a bottle.
>>    2) T-9039 for 1 liter, liquid in bottle.
>>
>> 7. Storage
>>    1) PI-2545: group B (in refrige 0~4F)
>>    2) T-9039: group B (Room temperature, below 90F )
>>
>> 8. Disposal
>>    The liquid waste of those products are to be disposed into the 
>> solvent waster container in lito solvent benth. The baked polyimide 
>> film can be placed in a ziplock bag disposed in a hazardous waste 
>> container in the photolithography area.
>>
>>
>> If you agree me to bring those two materials, could you please tell 
>> me where I can get the label and barcode?
>>
>> Thanks very much!
>>
>> Zhiqiang
>
>


From zguo at stanford.edu  Wed Mar  4 04:12:14 2009
From: zguo at stanford.edu (Zhiqiang Guo)
Date: Wed, 4 Mar 2009 04:12:14 -0800 (PST)
Subject: Request for bringing new material (Pyralin Polyimide Coating
 and Pyralin Thinner)
In-Reply-To: <765739647.1283331236168086455.JavaMail.root@zm01.stanford.edu>
Message-ID: <1384163925.1283671236168734991.JavaMail.root@zm01.stanford.edu>

Hi, Mahnaz:

The process flow for PI-2545 and T-9039 will be:
    1) Thin: Use 5 parts thinner T-9039 to 1 part PI-2545 in Lithosolv, you mentioned I need to shake the bottle of mixture, so could you please tell me where and how to do this.
    2) spin coating on Headway2(I am headway2 user). Then do soft bake at 135degC for 30min at Blue oven(I need a blueoven training)
    3) Photoresist coating. This done on svgcoat 1 or 2.
    3) Exposure: expose the photo resist on EV or Karlsussand.
    4) Develop:  on svgdev 1&2.
    5) Remove the photoresist by using acetone. At lithosolv or wbsolvent.
    6) Hard back: this is done in blue oven at 250degC for 30min.
then the polyimide pattern is finished.

I will bring in one small bottle of PI-2545(250g, this bottle is the same as the old one in SNF) and one bottle of T-9039(1 liter thinner), I have ordered both of them.  Each time I tend to use 1~2ml PI-2545 and 5~10ml T-9039. I may need your suggestion where to thin them.

I have read the SU-8 procedure very carefully. 

So I may need 2 yellow labels, one is for my PI-2545, another one is for the T-9039.

Please tell me if you need any further information.

Thanks,

Zhiqiang Guo










----- Original Message -----
From: "Mahnaz Mansourpour" <mahnaz at stanford.edu>
To: "Mary Tang" <mtang at stanford.edu>
Cc: "Zhiqiang Guo" <zguo at stanford.edu>, pilotqiang at gmail.com, specmat at snf.stanford.edu
Sent: Tuesday, March 3, 2009 1:35:47 PM GMT -08:00 US/Canada Pacific
Subject: Re: Request for bringing new material (Pyralin Polyimide Coating and Pyralin Thinner)

Hello Zhiqiang,

I need a process flow meaning step by step of what wafers will go ( 
oven, development...) through as I mentioned to you in the lab.  I need 
to know what temperature  are you curing the wafers and  where will go 
after that.

Secondly, write to me and tell me how and how much of materials need to 
be thinned and where are you planning to do this? You need to come and 
get a yellow label after giving me the information I am requesting.
You are using some of my polyimide, have you ordered your thinner already?
I believe that curing should be done in bluem oven, are you qualified?
Are you a headway user?
I will send you su8 and polyimide handling in a separate email and I 
need it to be followed to the letter.

mahnaz



Mary Tang wrote:
> Hi all --
>
> I'll defer to Mahnaz for the final word, but this request looks fine 
> to me -- with a couple of questions:
>
> 1.  PI 2545 is actually used by a number of people.  You might check 
> with Mahnaz to find out if there is some available for your use, if 
> you don't want to order it.  It lasts a long time.
>
> 2.  Your process flow does not mention adhesion promoter which some 
> people find useful (it'sVM-651 or 652 and one is better than the 
> other, although I don't remember which right now.  Other people in the 
> lab will have this on hand, so you might want to ask around.)
>
> 3.  Your process flow does not mention curing of the polyimide 
> (usually done in the BlueM oven) and if you plan further processing at 
> SNF for these wafers.  If so, please let us know.
>
> And a couple of reminders for bringing in and handling these materials 
> in the lab:
>
> 4.  Follow all safety procedures in bringing in and storing personal 
> materials.  (Contact Mahnaz or other staff member for the yellow label 
> and barcode for personal chemicals.  You will have to log your 
> chemicals under the barcode assigned to your chemicals on the 
> logsheet.  Make sure to store these chemicals in the designated area 
> of the Flammables cabinet or refrigerator as appropriate.)
>
> 5.  Follow all safety (all litho) handling procedures for volatile 
> solvents in the lab.  (Use only at solvent-compatible stations.  Make 
> sure to transport freshly spun/unbaked wafers in wafer boxes or other 
> enclosed containers or risk the wrath of Uli.)
>
> Unless other SpecMat'ers disagree, I believe what you have proposed is 
> OK (provided you follow #4 and #5 above.)  However, if you plan 
> further processing in the lab, please make sure to check/answer #2 and 
> #3 above.
>
> Thanks,
>
> Mary
>
> Zhiqiang Guo wrote:
>> Hi, Mary:
>>
>> I have sent this email for bringing in personal material in SNF, 
>> those are common material, but not got reply, could you please tell 
>> me when I can receive the decision of the SpecMat committee?
>>
>> Thanks,
>>
>> Zhiqiang
>>
>>
>> ----- Forwarded Message -----
>> From: "Zhiqiang Guo" <zguo at stanford.edu>
>> To: SpecMat at snf.stanford.edu
>> Sent: Friday, February 27, 2009 6:11:43 AM GMT -08:00 US/Canada Pacific
>> Subject: Request for bringing new material (Pyralin Polyimide Coating 
>> and Pyralin Thinner)
>>
>> Hi, SpecMat Committee members:
>>
>> I apply for bring two materials into SNF, the two materials are all 
>> on MSDS Index at SNF. Because I need your decision then I can place 
>> an order, so could you please tell me your decision today, I will 
>> really appreciate your early decision?
>>
>> Please review the detailed information below:
>>
>> 1. Contact information:
>>     Name: Zhiqiang Guo
>>     Coral login: zguo
>>     Phone(email): 650-723-3524 (zguo at stanford.edu)
>>     PI: Prof. Fu-Kuo Chang (Department of Aeronautics and 
>> Astronautics, Stanford University)
>>
>> 2. Material:
>>    1) Common name: PI-2545
>>       Trade name: Pyralin(R) Polyimide Coating
>>       Components CAS numbers: 25038-81-7, 872-50-4, 64742-95-6, 
>> 95-63-6,       usage: Coating polyimide film
>>
>>    2) Common name: T-9039
>>       Trade name: Pyralin Thinner
>>       Components CAS numbers: 872-50-4, 107-98-2       usage: To thin 
>> the PI-2545 before coating
>>
>> 3. Vendor/manufacturer info(the same vendor):    HD MicroSystems(TM)
>>    Cheesequake Road
>>    Parlin
>>    New Jersey
>>    USA 08859
>>    phone: (800)346-5656
>>    url: http://hdmicrosystems.com/HDMicroSystems/en_US/index.html
>>
>> 4. Reason for request
>>    In our process, we need to coat an thin polyimide film onto the 
>> surface of our device, seems there is no such material for common use 
>> in SNF, so I need to bring by myself.
>>
>> 5. Process Flow:
>>    Start at 5 parts thinner T-9039 to 1 part PI-2545 (Lithosolv). 
>> After thinning run a spin coating(Headway2). The soft bake is done on 
>> a hot plate by 10' x 130C or convection oven by 30' x 135C (Blue M 
>> white). Coat with photoresist(svgcoat 1&2), expose the resist(EV or 
>> Karlsuss) and develop(svgdev 1&2). Remove the photoresist by using 
>> acetone(lithosolv or wbsolvent).
>>
>> 6. Amont and form:
>>    1) PI-2545 for 250g, liquid in a bottle.
>>    2) T-9039 for 1 liter, liquid in bottle.
>>
>> 7. Storage
>>    1) PI-2545: group B (in refrige 0~4F)
>>    2) T-9039: group B (Room temperature, below 90F )
>>
>> 8. Disposal
>>    The liquid waste of those products are to be disposed into the 
>> solvent waster container in lito solvent benth. The baked polyimide 
>> film can be placed in a ziplock bag disposed in a hazardous waste 
>> container in the photolithography area.
>>
>>
>> If you agree me to bring those two materials, could you please tell 
>> me where I can get the label and barcode?
>>
>> Thanks very much!
>>
>> Zhiqiang
>
>


From mtang at stanford.edu  Thu Mar  5 15:38:25 2009
From: mtang at stanford.edu (Mary Tang)
Date: Thu, 05 Mar 2009 15:38:25 -0800
Subject: Ta etch solution
In-Reply-To: <b02a013c0903051459t49b83c80obcb1e140c417c7a5@mail.gmail.com>
References: <b02a013c0903051434l1d4cadd2qc17207e05b5aacf7@mail.gmail.com> <b02a013c0903051459t49b83c80obcb1e140c417c7a5@mail.gmail.com>
Message-ID: <49B06271.6030701@stanford.edu>

Thanks --

Please give us some more info:

1.  Where do you plan to use it?  Wbgeneral, I trust?
2.  How do you plan on getting rid of waste?  I trust you will be 
placing this and the first few rinses in the HF drain at wbgeneral?
3.  Where do you plan to store it?  I take it you know to contact a 
staff member about storing in the personal chemicals part of the 
passthrough?
4.  When will you be done with this chemical?  We would like to have an 
expiration date to remove any remaining chemical (so we don't accumulate 
old stuff.)

Please make sure to check with Uli before bringing the chemical into the 
lab.  She needs to be aware.

Thanks,

Mary

junjun wu wrote:
> Here is the MSDS for the chemical.
>
> Junjun
>
> On Thu, Mar 5, 2009 at 2:34 PM, junjun wu 
> <junjun at twincreekstechnologies.com 
> <mailto:junjun at twincreekstechnologies.com>> wrote:
>
>     Mary, Mahnaz,
>
>     I've ordered 1 quart of a Tantalum etch solution from Transene.
>     Based on the MSDS of it, it is simply composed of 10%HF, 30%HNO3
>     and 60%H2O, all of which already exist in SNF. Can I bring it into
>     the fab when I receive it? I will get the chemical label from you
>     if OK.
>
>     Thanks,
>
>     -- 
>     Junjun Wu
>     Twin Creeks Technologies
>     Phone: 408-759-1426
>     Fax: 408-986-9142
>
>
>
>
> -- 
> Junjun Wu
> Twin Creeks Technologies
> Phone: 408-759-1426
> Fax: 408-986-9142


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



From junjun at twincreekstechnologies.com  Thu Mar  5 19:30:23 2009
From: junjun at twincreekstechnologies.com (junjun wu)
Date: Thu, 5 Mar 2009 19:30:23 -0800
Subject: Ta etch solution
In-Reply-To: <49B06271.6030701@stanford.edu>
References: <b02a013c0903051434l1d4cadd2qc17207e05b5aacf7@mail.gmail.com>
	 <b02a013c0903051459t49b83c80obcb1e140c417c7a5@mail.gmail.com>
	 <49B06271.6030701@stanford.edu>
Message-ID: <b02a013c0903051930uba66a34lffb5961f8684845b@mail.gmail.com>

Hi Mary,

Here are my brief answers.

1. Wbgeneral or Wbgaas.
2. It will be disposed in exactly the way you described.
3. I have used the passthrough in the past. I'll find an SNF staff for the
tag etc.
4. I hope it will be used up in a month since there is only one quart of it.
Otherwise, it can be removed and disposed of in the HF drain when time is
up.

Thanks,

Junjun

On Thu, Mar 5, 2009 at 3:38 PM, Mary Tang <mtang at stanford.edu> wrote:

> Thanks --
>
> Please give us some more info:
>
> 1.  Where do you plan to use it?  Wbgeneral, I trust?
> 2.  How do you plan on getting rid of waste?  I trust you will be placing
> this and the first few rinses in the HF drain at wbgeneral?
> 3.  Where do you plan to store it?  I take it you know to contact a staff
> member about storing in the personal chemicals part of the passthrough?
> 4.  When will you be done with this chemical?  We would like to have an
> expiration date to remove any remaining chemical (so we don't accumulate old
> stuff.)
>
> Please make sure to check with Uli before bringing the chemical into the
> lab.  She needs to be aware.
>
> Thanks,
>
> Mary
>
> junjun wu wrote:
>
>> Here is the MSDS for the chemical.
>>
>> Junjun
>>
>> On Thu, Mar 5, 2009 at 2:34 PM, junjun wu <
>> junjun at twincreekstechnologies.com <mailto:
>> junjun at twincreekstechnologies.com>> wrote:
>>
>>    Mary, Mahnaz,
>>
>>    I've ordered 1 quart of a Tantalum etch solution from Transene.
>>    Based on the MSDS of it, it is simply composed of 10%HF, 30%HNO3
>>    and 60%H2O, all of which already exist in SNF. Can I bring it into
>>    the fab when I receive it? I will get the chemical label from you
>>    if OK.
>>
>>    Thanks,
>>
>>    --    Junjun Wu
>>    Twin Creeks Technologies
>>    Phone: 408-759-1426
>>    Fax: 408-986-9142
>>
>>
>>
>>
>> --
>> Junjun Wu
>> Twin Creeks Technologies
>> Phone: 408-759-1426
>> Fax: 408-986-9142
>>
>
>
> --
> Mary X. Tang, Ph.D.
> Stanford Nanofabrication Facility
> CIS Room 136, Mail Code 4070
> Stanford, CA  94305
> (650)723-9980
> mtang at stanford.edu
> http://snf.stanford.edu
>
>


-- 
Junjun Wu
Twin Creeks Technologies
Phone: 408-759-1426
Fax: 408-986-9142
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From mahnaz at stanford.edu  Fri Mar  6 09:46:05 2009
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Fri, 06 Mar 2009 09:46:05 -0800
Subject: Request for bringing new material (Pyralin Polyimide Coating
 and Pyralin Thinner)
In-Reply-To: <1384163925.1283671236168734991.JavaMail.root@zm01.stanford.edu>
References: <1384163925.1283671236168734991.JavaMail.root@zm01.stanford.edu>
Message-ID: <49B1615D.1030307@stanford.edu>

Hello Zhiqiang,

This emails is to let you know that your request has been accepted.
Is this material is one of those that has adhesion promoter built in it?
The training for bluem oven takes about 30 minutes so when you are here 
let me know and we will do it.
The stirrer is out side  so  we need to schedule this so we can bring it 
in and then take it out of litho area.
I usually tell people to breakdown the chemical in smaller bottles as 
moisture contamination is detrimental to stability of this chemical. If 
you like to do this, you might need more yellow labels.
One other thing , I assume that you know you need to bring the chemical 
to room temperature before using it and I like you to get beakers and 
label them with polyimide contaminate warning for developing 
purposes....etc.
You may get your labels and barcode from me in my office, I am in room 143.
I will not be here Monday 9th but Mary and Ed can help you as well.

mahnaz



Zhiqiang Guo wrote:
> Hi, Mahnaz:
>
> The process flow for PI-2545 and T-9039 will be:
>     1) Thin: Use 5 parts thinner T-9039 to 1 part PI-2545 in Lithosolv, you mentioned I need to shake the bottle of mixture, so could you please tell me where and how to do this.
>     2) spin coating on Headway2(I am headway2 user). Then do soft bake at 135degC for 30min at Blue oven(I need a blueoven training)
>     3) Photoresist coating. This done on svgcoat 1 or 2.
>     3) Exposure: expose the photo resist on EV or Karlsussand.
>     4) Develop:  on svgdev 1&2.
>     5) Remove the photoresist by using acetone. At lithosolv or wbsolvent.
>     6) Hard back: this is done in blue oven at 250degC for 30min.
> then the polyimide pattern is finished.
>
> I will bring in one small bottle of PI-2545(250g, this bottle is the same as the old one in SNF) and one bottle of T-9039(1 liter thinner), I have ordered both of them.  Each time I tend to use 1~2ml PI-2545 and 5~10ml T-9039. I may need your suggestion where to thin them.
>
> I have read the SU-8 procedure very carefully. 
>
> So I may need 2 yellow labels, one is for my PI-2545, another one is for the T-9039.
>
> Please tell me if you need any further information.
>
> Thanks,
>
> Zhiqiang Guo
>
>
>
>
>
>
>
>
>
>
> ----- Original Message -----
> From: "Mahnaz Mansourpour" <mahnaz at stanford.edu>
> To: "Mary Tang" <mtang at stanford.edu>
> Cc: "Zhiqiang Guo" <zguo at stanford.edu>, pilotqiang at gmail.com, specmat at snf.stanford.edu
> Sent: Tuesday, March 3, 2009 1:35:47 PM GMT -08:00 US/Canada Pacific
> Subject: Re: Request for bringing new material (Pyralin Polyimide Coating and Pyralin Thinner)
>
> Hello Zhiqiang,
>
> I need a process flow meaning step by step of what wafers will go ( 
> oven, development...) through as I mentioned to you in the lab.  I need 
> to know what temperature  are you curing the wafers and  where will go 
> after that.
>
> Secondly, write to me and tell me how and how much of materials need to 
> be thinned and where are you planning to do this? You need to come and 
> get a yellow label after giving me the information I am requesting.
> You are using some of my polyimide, have you ordered your thinner already?
> I believe that curing should be done in bluem oven, are you qualified?
> Are you a headway user?
> I will send you su8 and polyimide handling in a separate email and I 
> need it to be followed to the letter.
>
> mahnaz
>
>
>
> Mary Tang wrote:
>   
>> Hi all --
>>
>> I'll defer to Mahnaz for the final word, but this request looks fine 
>> to me -- with a couple of questions:
>>
>> 1.  PI 2545 is actually used by a number of people.  You might check 
>> with Mahnaz to find out if there is some available for your use, if 
>> you don't want to order it.  It lasts a long time.
>>
>> 2.  Your process flow does not mention adhesion promoter which some 
>> people find useful (it'sVM-651 or 652 and one is better than the 
>> other, although I don't remember which right now.  Other people in the 
>> lab will have this on hand, so you might want to ask around.)
>>
>> 3.  Your process flow does not mention curing of the polyimide 
>> (usually done in the BlueM oven) and if you plan further processing at 
>> SNF for these wafers.  If so, please let us know.
>>
>> And a couple of reminders for bringing in and handling these materials 
>> in the lab:
>>
>> 4.  Follow all safety procedures in bringing in and storing personal 
>> materials.  (Contact Mahnaz or other staff member for the yellow label 
>> and barcode for personal chemicals.  You will have to log your 
>> chemicals under the barcode assigned to your chemicals on the 
>> logsheet.  Make sure to store these chemicals in the designated area 
>> of the Flammables cabinet or refrigerator as appropriate.)
>>
>> 5.  Follow all safety (all litho) handling procedures for volatile 
>> solvents in the lab.  (Use only at solvent-compatible stations.  Make 
>> sure to transport freshly spun/unbaked wafers in wafer boxes or other 
>> enclosed containers or risk the wrath of Uli.)
>>
>> Unless other SpecMat'ers disagree, I believe what you have proposed is 
>> OK (provided you follow #4 and #5 above.)  However, if you plan 
>> further processing in the lab, please make sure to check/answer #2 and 
>> #3 above.
>>
>> Thanks,
>>
>> Mary
>>
>> Zhiqiang Guo wrote:
>>     
>>> Hi, Mary:
>>>
>>> I have sent this email for bringing in personal material in SNF, 
>>> those are common material, but not got reply, could you please tell 
>>> me when I can receive the decision of the SpecMat committee?
>>>
>>> Thanks,
>>>
>>> Zhiqiang
>>>
>>>
>>> ----- Forwarded Message -----
>>> From: "Zhiqiang Guo" <zguo at stanford.edu>
>>> To: SpecMat at snf.stanford.edu
>>> Sent: Friday, February 27, 2009 6:11:43 AM GMT -08:00 US/Canada Pacific
>>> Subject: Request for bringing new material (Pyralin Polyimide Coating 
>>> and Pyralin Thinner)
>>>
>>> Hi, SpecMat Committee members:
>>>
>>> I apply for bring two materials into SNF, the two materials are all 
>>> on MSDS Index at SNF. Because I need your decision then I can place 
>>> an order, so could you please tell me your decision today, I will 
>>> really appreciate your early decision?
>>>
>>> Please review the detailed information below:
>>>
>>> 1. Contact information:
>>>     Name: Zhiqiang Guo
>>>     Coral login: zguo
>>>     Phone(email): 650-723-3524 (zguo at stanford.edu)
>>>     PI: Prof. Fu-Kuo Chang (Department of Aeronautics and 
>>> Astronautics, Stanford University)
>>>
>>> 2. Material:
>>>    1) Common name: PI-2545
>>>       Trade name: Pyralin(R) Polyimide Coating
>>>       Components CAS numbers: 25038-81-7, 872-50-4, 64742-95-6, 
>>> 95-63-6,       usage: Coating polyimide film
>>>
>>>    2) Common name: T-9039
>>>       Trade name: Pyralin Thinner
>>>       Components CAS numbers: 872-50-4, 107-98-2       usage: To thin 
>>> the PI-2545 before coating
>>>
>>> 3. Vendor/manufacturer info(the same vendor):    HD MicroSystems(TM)
>>>    Cheesequake Road
>>>    Parlin
>>>    New Jersey
>>>    USA 08859
>>>    phone: (800)346-5656
>>>    url: http://hdmicrosystems.com/HDMicroSystems/en_US/index.html
>>>
>>> 4. Reason for request
>>>    In our process, we need to coat an thin polyimide film onto the 
>>> surface of our device, seems there is no such material for common use 
>>> in SNF, so I need to bring by myself.
>>>
>>> 5. Process Flow:
>>>    Start at 5 parts thinner T-9039 to 1 part PI-2545 (Lithosolv). 
>>> After thinning run a spin coating(Headway2). The soft bake is done on 
>>> a hot plate by 10' x 130C or convection oven by 30' x 135C (Blue M 
>>> white). Coat with photoresist(svgcoat 1&2), expose the resist(EV or 
>>> Karlsuss) and develop(svgdev 1&2). Remove the photoresist by using 
>>> acetone(lithosolv or wbsolvent).
>>>
>>> 6. Amont and form:
>>>    1) PI-2545 for 250g, liquid in a bottle.
>>>    2) T-9039 for 1 liter, liquid in bottle.
>>>
>>> 7. Storage
>>>    1) PI-2545: group B (in refrige 0~4F)
>>>    2) T-9039: group B (Room temperature, below 90F )
>>>
>>> 8. Disposal
>>>    The liquid waste of those products are to be disposed into the 
>>> solvent waster container in lito solvent benth. The baked polyimide 
>>> film can be placed in a ziplock bag disposed in a hazardous waste 
>>> container in the photolithography area.
>>>
>>>
>>> If you agree me to bring those two materials, could you please tell 
>>> me where I can get the label and barcode?
>>>
>>> Thanks very much!
>>>
>>> Zhiqiang
>>>       
>>     


From mwiemer at sj-solar.com  Thu Mar 12 09:40:30 2009
From: mwiemer at sj-solar.com (Mike Wiemer)
Date: Thu, 12 Mar 2009 09:40:30 -0700
Subject: Iodic Acid
Message-ID: <CEDB7C87FAC5AC4C917F08022C26CD030B88B617@exchange.SolarJunction.local>

Hi Specmat,

We would like to use Iodic Acid in SNF. This chemical is commonly used as an echant for III-V materials like InP. MSDS attached.


1.)    Iodic Acid comes in dry crystal form

2.)    One mixes the crystals with water to form the acid (0.2 M/Liter) in a glass, non-transparent bottle (Iodic acid should be kept from light)

3.)    We will mix the crystals & water to create the solution at the GaAs bench

4.)    At the GaAs bench, we will combine: HIO3 (0.2M/L) :  HCl  :  H2O  - 1:1:x where x goes from 1 to 100.

5.)    All work will be done at room temp

6.)    We will store the mixed solution in the personal chemical pass-through area, along with the dry crystals

What do you think?

Thanks!

-Mike

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From dongrip at stanford.edu  Fri Mar 13 12:24:55 2009
From: dongrip at stanford.edu (Dong Rip Kim)
Date: Fri, 13 Mar 2009 12:24:55 -0700
Subject: SiO2 or SixNy for Innotec
Message-ID: <010101c9a411$64109f20$2c31dd60$@edu>

Hi Specmat committee,

 

I'm Dong Rip Kim (coral ID: dongrip), a SNF labmember, and I'd like to
deposit SiO2 or SixNy using the e-beam evaporator, Innotec, with my own
sources. I'm wondering if you approve this.

Please let me know.

 

Thank you,

Dong Rip

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From mahnaz at stanford.edu  Mon Mar 16 16:31:37 2009
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Mon, 16 Mar 2009 16:31:37 -0700
Subject: EVG bonder for GaAs?
In-Reply-To: <180205.19982.qm@web50508.mail.re2.yahoo.com>
References: <180205.19982.qm@web50508.mail.re2.yahoo.com>
Message-ID: <49BEE159.1050609@stanford.edu>


Hello Lan,

Sorry that has taken me a while to get back to you.

Here are some info/constrain that I need to bring up to your attention.
Since I have joined  Stanford and made a wide use of EV bonder, GaAs is 
one of the material I have okay once in almost 10 years I have been 
here. I think that we  do not have the capability of supporting this 
material in our bonder because of:

  concern about possible safety issues.
 The Ev bonder does not have exhausted hood or even arsenic MDA  monitors.
If  we okay it, I have to limit the individual's use on day shift and 
the hours  that the staff are here so we can supervise the  usage.

Not mentioning that we have to go with some process modification like 
sandwich the sample between two other wafers, makes bonding more 
complicated.  Last and only time they were 1 cm samples and now we are 
talking 4" wafers. So simply saying   "I will do a low temp does not 
help me".

Here are some info last time i asked expert in Stanford  to help me with 
the matter for you to read.
I am open to the idea but I need to be convinced is the right thing to 
do for our lab.
Please let me what do you think?

mahnaz

GaAs info:
 
If you're heating GaAs, you really do want to do it under a fume hood
or other exhaust.  Pure arsenic will evaporate at much lower
temperatures than GaAs desorption, even some under 200C, so you have
to make sure your wafers aren't arsenic-rich on the surface if you're
getting up that hot.  You also have to be careful about overshoot:
I've evaporated off thick arsenic caps by mistake in the MBE chamber
when the PID controller overshot 160C.

The desorption of As from GaAs happens at a higher temperature,
somewhere around 300C.  We prebake our wafers before growth at "350C"
or "400C" but this is thermocouple temperature at the heater, not the
actual wafer temperature.  If you need to prevent arsenic desorption
for device reasons, you may need another source of arsenic nearby,
like another gallium arsenide wafer on top of the first.  Of course,
that would complicate wafer bonding.

Oxide blowoff for GaAs happens at 582C.  There are other oxides
(mostly AsOx) which come off at lower temperatures, but the last layer
of gallium oxide comes off very close to 582C, and it's quite clear
from electron diffraction.  We typically grow around 450 for InGaAs,
570-580 for GaAs, and 580-600 for AlGaAs.  These are all real
temperatures (as opposed to thermocouple) but are only approximate.
InP info:
 
P2 desorb at 300C (I am talking about real temp)
P4 desorb at higher than 650C
In desorb at 500C

InP sublimation temp is 360C
InP oxide blowoff temp is 510C










Lan Zhang wrote:
> Hi Mahnaz,
>  
> I just wondering if GaAs wafers are allowed in the bonder.  I think to 
> do some eutectic bonding with GaAs (~400C and low pressure).
>  
> Thanks
> Lan
>


From mwiemer at sj-solar.com  Mon Mar 16 19:57:49 2009
From: mwiemer at sj-solar.com (Mike Wiemer)
Date: Mon, 16 Mar 2009 19:57:49 -0700
Subject: Iodic Acid
Message-ID: <CEDB7C87FAC5AC4C917F08022C26CD030B88B669@exchange.SolarJunction.local>

Hi Specmat,

Any thoughts on this yet?
I think we are ready to try this on our side....

Thanks!

-Mike



From: Mike Wiemer
Sent: Thursday, March 12, 2009 9:41 AM
To: specmat at snf.stanford.edu
Cc: Senyo Dogbe
Subject: Iodic Acid

Hi Specmat,

We would like to use Iodic Acid in SNF. This chemical is commonly used as an echant for III-V materials like InP. MSDS attached.


1.)    Iodic Acid comes in dry crystal form

2.)    One mixes the crystals with water to form the acid (0.2 M/Liter) in a glass, non-transparent bottle (Iodic acid should be kept from light)

3.)    We will mix the crystals & water to create the solution at the GaAs bench

4.)    At the GaAs bench, we will combine: HIO3 (0.2M/L) :  HCl  :  H2O  - 1:1:x where x goes from 1 to 100.

5.)    All work will be done at room temp

6.)    We will store the mixed solution in the personal chemical pass-through area, along with the dry crystals

What do you think?

Thanks!

-Mike

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From mtang at stanford.edu  Tue Mar 17 09:52:48 2009
From: mtang at stanford.edu (Mary Tang)
Date: Tue, 17 Mar 2009 09:52:48 -0700
Subject: Iodic Acid
In-Reply-To: <CEDB7C87FAC5AC4C917F08022C26CD030B88B617@exchange.SolarJunction.local>
References: <CEDB7C87FAC5AC4C917F08022C26CD030B88B617@exchange.SolarJunction.local>
Message-ID: <49BFD560.2000309@stanford.edu>

Hi Mike, Senyo --

Thanks for the reminder...  Just a couple of things.

1.  Powders (including crystals -- as well as free nanoparticles and 
nanotubes) aren't allowed in the cleanroom.  It's just too difficult to 
handle powders (dispensing, weighing, mixing) when there's laminar flow 
and exhaust blasting in different directions.  You can, however, mix 
solutions from powders outside the cleanroom, in the wafersaw room, and 
bring them in, either through the chemicals passthrough (get a staff 
member to help you with access) or using a single bottle carrier through 
the service area in the back.  Alternatively, if you can find a source 
of pre-mixed solution, you won't have to mix it up yourself. 

2.  Can you store the solution for an appreciable time or does it have 
to be mixed up just before use?  If you store the bottle of solution, it 
should be kept in the chemicals passthrough.  Make sure to get a yellow 
label.  I take it that a brown bottle should be sufficient for excluding 
light -- if you decide to also wrap it in foil or other covering, make 
sure to label the outside of the foil with all the critical info as well.

3.  Crystals should be stored outside the lab.  We have a corrosives 
room where this can be stored.  However, you'll need staff help to 
access the vault, so this will limit availability to working hours.

4.  How will you be disposing of the waste?  If you are etching III-V's, 
then etchant waste should be collected locally and appropriately 
tagged.  The unused acid itself, I believe, can disposed of by 
aspirating at the bench.

5.  Could you write up a procedure for this (like what you have below, 
but with the where's and how's)?

Thanks,

Mary

Mike Wiemer wrote:
>
> Hi Specmat,
>
>  
>
> We would like to use Iodic Acid in SNF. This chemical is commonly used 
> as an echant for III-V materials like InP. MSDS attached.
>
>  
>
> 1.)    Iodic Acid comes in dry crystal form
>
> 2.)    One mixes the crystals with water to form the acid (0.2 
> M/Liter) in a glass, non-transparent bottle (Iodic acid should be kept 
> from light)
>
> 3.)    We will mix the crystals & water to create the solution at the 
> GaAs bench
>
> 4.)    At the GaAs bench, we will combine: HIO3 (0.2M/L) :  HCl  : 
>  H2O  - 1:1:x where x goes from 1 to 100.
>
> 5.)    All work will be done at room temp
>
> 6.)    We will store the mixed solution in the personal chemical 
> pass-through area, along with the dry crystals
>
>  
>
> What do you think?
>
>  
>
> Thanks!
>
>  
>
> -Mike
>
>  
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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From mwiemer at sj-solar.com  Tue Mar 17 10:37:48 2009
From: mwiemer at sj-solar.com (Mike Wiemer)
Date: Tue, 17 Mar 2009 10:37:48 -0700
Subject: Iodic Acid
In-Reply-To: <49BFD560.2000309@stanford.edu>
References: <CEDB7C87FAC5AC4C917F08022C26CD030B88B617@exchange.SolarJunction.local>
 <49BFD560.2000309@stanford.edu>
Message-ID: <CEDB7C87FAC5AC4C917F08022C26CD030B88B67B@exchange.SolarJunction.local>

Iodic Acid Procedure

1.)    We will mix the powder into solution using the acid hood in the dicing saw room (0.2M/L solution).

2.)    The powder will be stored in the acid vault.

3.)    The acid will be brought into the lab either through the chemical passthrough or the cleanroom "back door" using a bottle carrier

4.)    The mixed acid will be stored in the chemical passthrough in a dark brown bottle (with a yellow label of course)

5.)    All etch waste will be collected and tagged and placed in the proper chemical passthrough area

6.)    Waste acid which has not etched material will be aspirated

Approved?

Thanks!

-Mike


From: Mary Tang [mailto:mtang at stanford.edu]
Sent: Tuesday, March 17, 2009 9:53 AM
To: Mike Wiemer
Cc: specmat at snf.stanford.edu; Senyo Dogbe
Subject: Re: Iodic Acid

Hi Mike, Senyo --

Thanks for the reminder...  Just a couple of things.

1.  Powders (including crystals -- as well as free nanoparticles and nanotubes) aren't allowed in the cleanroom.  It's just too difficult to handle powders (dispensing, weighing, mixing) when there's laminar flow and exhaust blasting in different directions.  You can, however, mix solutions from powders outside the cleanroom, in the wafersaw room, and bring them in, either through the chemicals passthrough (get a staff member to help you with access) or using a single bottle carrier through the service area in the back.  Alternatively, if you can find a source of pre-mixed solution, you won't have to mix it up yourself.

2.  Can you store the solution for an appreciable time or does it have to be mixed up just before use?  If you store the bottle of solution, it should be kept in the chemicals passthrough.  Make sure to get a yellow label.  I take it that a brown bottle should be sufficient for excluding light -- if you decide to also wrap it in foil or other covering, make sure to label the outside of the foil with all the critical info as well.

3.  Crystals should be stored outside the lab.  We have a corrosives room where this can be stored.  However, you'll need staff help to access the vault, so this will limit availability to working hours.

4.  How will you be disposing of the waste?  If you are etching III-V's, then etchant waste should be collected locally and appropriately tagged.  The unused acid itself, I believe, can disposed of by aspirating at the bench.

5.  Could you write up a procedure for this (like what you have below, but with the where's and how's)?

Thanks,

Mary

Mike Wiemer wrote:
Hi Specmat,

We would like to use Iodic Acid in SNF. This chemical is commonly used as an echant for III-V materials like InP. MSDS attached.


Iodic Acid comes in dry crystal form

One mixes the crystals with water to form the acid (0.2 M/Liter) in a glass, non-transparent bottle (Iodic acid should be kept from light)

We will mix the crystals & water to create the solution at the GaAs bench

At the GaAs bench, we will combine: HIO3 (0.2M/L) :  HCl  :  H2O  - 1:1:x where x goes from 1 to 100.

All work will be done at room temp

We will store the mixed solution in the personal chemical pass-through area, along with the dry crystals

What do you think?

Thanks!

-Mike





--

Mary X. Tang, Ph.D.

Stanford Nanofabrication Facility

CIS Room 136, Mail Code 4070

Stanford, CA  94305

(650)723-9980

mtang at stanford.edu<mailto:mtang at stanford.edu>

http://snf.stanford.edu
-------------- next part --------------
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From mtang at stanford.edu  Tue Mar 17 13:39:40 2009
From: mtang at stanford.edu (Mary Tang)
Date: Tue, 17 Mar 2009 13:39:40 -0700
Subject: Iodic Acid
In-Reply-To: <CEDB7C87FAC5AC4C917F08022C26CD030B88B67B@exchange.SolarJunction.local>
References: <CEDB7C87FAC5AC4C917F08022C26CD030B88B617@exchange.SolarJunction.local> <49BFD560.2000309@stanford.edu> <CEDB7C87FAC5AC4C917F08022C26CD030B88B67B@exchange.SolarJunction.local>
Message-ID: <49C00A8C.2000303@stanford.edu>

Looks good to me -- any objections, SpecMat'ers?

M

Mike Wiemer wrote:
>
> Iodic Acid Procedure
>
> 1.) We will mix the powder into solution using the acid hood in the 
> dicing saw room (0.2M/L solution).
>
> 2.) The powder will be stored in the acid vault.
>
> 3.) The acid will be brought into the lab either through the chemical 
> passthrough or the cleanroom ?back door? using a bottle carrier
>
> 4.) The mixed acid will be stored in the chemical passthrough in a 
> dark brown bottle (with a yellow label of course)
>
> 5.) All etch waste will be collected and tagged and placed in the 
> proper chemical passthrough area
>
> 6.) Waste acid which has not etched material will be aspirated
>
> Approved?
>
> Thanks!
>
> -Mike
>
> *From:* Mary Tang [mailto:mtang at stanford.edu]
> *Sent:* Tuesday, March 17, 2009 9:53 AM
> *To:* Mike Wiemer
> *Cc:* specmat at snf.stanford.edu; Senyo Dogbe
> *Subject:* Re: Iodic Acid
>
> Hi Mike, Senyo --
>
> Thanks for the reminder... Just a couple of things.
>
> 1. Powders (including crystals -- as well as free nanoparticles and 
> nanotubes) aren't allowed in the cleanroom. It's just too difficult to 
> handle powders (dispensing, weighing, mixing) when there's laminar 
> flow and exhaust blasting in different directions. You can, however, 
> mix solutions from powders outside the cleanroom, in the wafersaw 
> room, and bring them in, either through the chemicals passthrough (get 
> a staff member to help you with access) or using a single bottle 
> carrier through the service area in the back. Alternatively, if you 
> can find a source of pre-mixed solution, you won't have to mix it up 
> yourself.
>
> 2. Can you store the solution for an appreciable time or does it have 
> to be mixed up just before use? If you store the bottle of solution, 
> it should be kept in the chemicals passthrough. Make sure to get a 
> yellow label. I take it that a brown bottle should be sufficient for 
> excluding light -- if you decide to also wrap it in foil or other 
> covering, make sure to label the outside of the foil with all the 
> critical info as well.
>
> 3. Crystals should be stored outside the lab. We have a corrosives 
> room where this can be stored. However, you'll need staff help to 
> access the vault, so this will limit availability to working hours.
>
> 4. How will you be disposing of the waste? If you are etching III-V's, 
> then etchant waste should be collected locally and appropriately 
> tagged. The unused acid itself, I believe, can disposed of by 
> aspirating at the bench.
>
> 5. Could you write up a procedure for this (like what you have below, 
> but with the where's and how's)?
>
> Thanks,
>
> Mary
>
> Mike Wiemer wrote:
>
> Hi Specmat,
>
> We would like to use Iodic Acid in SNF. This chemical is commonly used 
> as an echant for III-V materials like InP. MSDS attached.
>
> Iodic Acid comes in dry crystal form
>
> One mixes the crystals with water to form the acid (0.2 M/Liter) in a 
> glass, non-transparent bottle (Iodic acid should be kept from light)
>
> We will mix the crystals & water to create the solution at the GaAs bench
>
> At the GaAs bench, we will combine: HIO3 (0.2M/L) : HCl : H2O - 1:1:x 
> where x goes from 1 to 100.
>
> All work will be done at room temp
>
> We will store the mixed solution in the personal chemical pass-through 
> area, along with the dry crystals
>
> What do you think?
>
> Thanks!
>
> -Mike
>
>
>
>
> -- 
> Mary X. Tang, Ph.D.
> Stanford Nanofabrication Facility
> CIS Room 136, Mail Code 4070
> Stanford, CA  94305
> (650)723-9980
> mtang at stanford.edu <mailto:mtang at stanford.edu>
> http://snf.stanford.edu


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



From mahnaz at stanford.edu  Tue Mar 17 14:12:34 2009
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Tue, 17 Mar 2009 14:12:34 -0700
Subject: Iodic Acid
In-Reply-To: <49C00A8C.2000303@stanford.edu>
References: <CEDB7C87FAC5AC4C917F08022C26CD030B88B617@exchange.SolarJunction.local> <49BFD560.2000309@stanford.edu> <CEDB7C87FAC5AC4C917F08022C26CD030B88B67B@exchange.SolarJunction.local> <49C00A8C.2000303@stanford.edu>
Message-ID: <49C01242.9060904@stanford.edu>

I am okay with this.
mahnaz

Mary Tang wrote:
> Looks good to me -- any objections, SpecMat'ers?
>
> M
>
> Mike Wiemer wrote:
>>
>> Iodic Acid Procedure
>>
>> 1.) We will mix the powder into solution using the acid hood in the 
>> dicing saw room (0.2M/L solution).
>>
>> 2.) The powder will be stored in the acid vault.
>>
>> 3.) The acid will be brought into the lab either through the chemical 
>> passthrough or the cleanroom ?back door? using a bottle carrier
>>
>> 4.) The mixed acid will be stored in the chemical passthrough in a 
>> dark brown bottle (with a yellow label of course)
>>
>> 5.) All etch waste will be collected and tagged and placed in the 
>> proper chemical passthrough area
>>
>> 6.) Waste acid which has not etched material will be aspirated
>>
>> Approved?
>>
>> Thanks!
>>
>> -Mike
>>
>> *From:* Mary Tang [mailto:mtang at stanford.edu]
>> *Sent:* Tuesday, March 17, 2009 9:53 AM
>> *To:* Mike Wiemer
>> *Cc:* specmat at snf.stanford.edu; Senyo Dogbe
>> *Subject:* Re: Iodic Acid
>>
>> Hi Mike, Senyo --
>>
>> Thanks for the reminder... Just a couple of things.
>>
>> 1. Powders (including crystals -- as well as free nanoparticles and 
>> nanotubes) aren't allowed in the cleanroom. It's just too difficult 
>> to handle powders (dispensing, weighing, mixing) when there's laminar 
>> flow and exhaust blasting in different directions. You can, however, 
>> mix solutions from powders outside the cleanroom, in the wafersaw 
>> room, and bring them in, either through the chemicals passthrough 
>> (get a staff member to help you with access) or using a single bottle 
>> carrier through the service area in the back. Alternatively, if you 
>> can find a source of pre-mixed solution, you won't have to mix it up 
>> yourself.
>>
>> 2. Can you store the solution for an appreciable time or does it have 
>> to be mixed up just before use? If you store the bottle of solution, 
>> it should be kept in the chemicals passthrough. Make sure to get a 
>> yellow label. I take it that a brown bottle should be sufficient for 
>> excluding light -- if you decide to also wrap it in foil or other 
>> covering, make sure to label the outside of the foil with all the 
>> critical info as well.
>>
>> 3. Crystals should be stored outside the lab. We have a corrosives 
>> room where this can be stored. However, you'll need staff help to 
>> access the vault, so this will limit availability to working hours.
>>
>> 4. How will you be disposing of the waste? If you are etching 
>> III-V's, then etchant waste should be collected locally and 
>> appropriately tagged. The unused acid itself, I believe, can disposed 
>> of by aspirating at the bench.
>>
>> 5. Could you write up a procedure for this (like what you have below, 
>> but with the where's and how's)?
>>
>> Thanks,
>>
>> Mary
>>
>> Mike Wiemer wrote:
>>
>> Hi Specmat,
>>
>> We would like to use Iodic Acid in SNF. This chemical is commonly 
>> used as an echant for III-V materials like InP. MSDS attached.
>>
>> Iodic Acid comes in dry crystal form
>>
>> One mixes the crystals with water to form the acid (0.2 M/Liter) in a 
>> glass, non-transparent bottle (Iodic acid should be kept from light)
>>
>> We will mix the crystals & water to create the solution at the GaAs 
>> bench
>>
>> At the GaAs bench, we will combine: HIO3 (0.2M/L) : HCl : H2O - 1:1:x 
>> where x goes from 1 to 100.
>>
>> All work will be done at room temp
>>
>> We will store the mixed solution in the personal chemical 
>> pass-through area, along with the dry crystals
>>
>> What do you think?
>>
>> Thanks!
>>
>> -Mike
>>
>>
>>
>>
>> -- 
>> Mary X. Tang, Ph.D.
>> Stanford Nanofabrication Facility
>> CIS Room 136, Mail Code 4070
>> Stanford, CA  94305
>> (650)723-9980
>> mtang at stanford.edu <mailto:mtang at stanford.edu>
>> http://snf.stanford.edu
>
>


From mwiemer at sj-solar.com  Tue Mar 17 18:04:03 2009
From: mwiemer at sj-solar.com (Mike Wiemer)
Date: Tue, 17 Mar 2009 18:04:03 -0700
Subject: Iodic Acid
In-Reply-To: <49C01242.9060904@stanford.edu>
References: <CEDB7C87FAC5AC4C917F08022C26CD030B88B617@exchange.SolarJunction.local>
 <49BFD560.2000309@stanford.edu>
 <CEDB7C87FAC5AC4C917F08022C26CD030B88B67B@exchange.SolarJunction.local>
 <49C00A8C.2000303@stanford.edu> <49C01242.9060904@stanford.edu>
Message-ID: <CEDB7C87FAC5AC4C917F08022C26CD030C011690@exchange.SolarJunction.local>

Great!
Thanks.
We will use the acid this week!

Thanks,

-Mike


-----Original Message-----
From: Mahnaz Mansourpour [mailto:mahnaz at stanford.edu] 
Sent: Tuesday, March 17, 2009 2:13 PM
To: Mary Tang
Cc: Mike Wiemer; specmat at snf.stanford.edu; Senyo Dogbe
Subject: Re: Iodic Acid

I am okay with this.
mahnaz

Mary Tang wrote:
> Looks good to me -- any objections, SpecMat'ers?
>
> M
>
> Mike Wiemer wrote:
>>
>> Iodic Acid Procedure
>>
>> 1.) We will mix the powder into solution using the acid hood in the 
>> dicing saw room (0.2M/L solution).
>>
>> 2.) The powder will be stored in the acid vault.
>>
>> 3.) The acid will be brought into the lab either through the chemical 
>> passthrough or the cleanroom "back door" using a bottle carrier
>>
>> 4.) The mixed acid will be stored in the chemical passthrough in a 
>> dark brown bottle (with a yellow label of course)
>>
>> 5.) All etch waste will be collected and tagged and placed in the 
>> proper chemical passthrough area
>>
>> 6.) Waste acid which has not etched material will be aspirated
>>
>> Approved?
>>
>> Thanks!
>>
>> -Mike
>>
>> *From:* Mary Tang [mailto:mtang at stanford.edu]
>> *Sent:* Tuesday, March 17, 2009 9:53 AM
>> *To:* Mike Wiemer
>> *Cc:* specmat at snf.stanford.edu; Senyo Dogbe
>> *Subject:* Re: Iodic Acid
>>
>> Hi Mike, Senyo --
>>
>> Thanks for the reminder... Just a couple of things.
>>
>> 1. Powders (including crystals -- as well as free nanoparticles and 
>> nanotubes) aren't allowed in the cleanroom. It's just too difficult 
>> to handle powders (dispensing, weighing, mixing) when there's laminar 
>> flow and exhaust blasting in different directions. You can, however, 
>> mix solutions from powders outside the cleanroom, in the wafersaw 
>> room, and bring them in, either through the chemicals passthrough 
>> (get a staff member to help you with access) or using a single bottle 
>> carrier through the service area in the back. Alternatively, if you 
>> can find a source of pre-mixed solution, you won't have to mix it up 
>> yourself.
>>
>> 2. Can you store the solution for an appreciable time or does it have 
>> to be mixed up just before use? If you store the bottle of solution, 
>> it should be kept in the chemicals passthrough. Make sure to get a 
>> yellow label. I take it that a brown bottle should be sufficient for 
>> excluding light -- if you decide to also wrap it in foil or other 
>> covering, make sure to label the outside of the foil with all the 
>> critical info as well.
>>
>> 3. Crystals should be stored outside the lab. We have a corrosives 
>> room where this can be stored. However, you'll need staff help to 
>> access the vault, so this will limit availability to working hours.
>>
>> 4. How will you be disposing of the waste? If you are etching 
>> III-V's, then etchant waste should be collected locally and 
>> appropriately tagged. The unused acid itself, I believe, can disposed 
>> of by aspirating at the bench.
>>
>> 5. Could you write up a procedure for this (like what you have below, 
>> but with the where's and how's)?
>>
>> Thanks,
>>
>> Mary
>>
>> Mike Wiemer wrote:
>>
>> Hi Specmat,
>>
>> We would like to use Iodic Acid in SNF. This chemical is commonly 
>> used as an echant for III-V materials like InP. MSDS attached.
>>
>> Iodic Acid comes in dry crystal form
>>
>> One mixes the crystals with water to form the acid (0.2 M/Liter) in a 
>> glass, non-transparent bottle (Iodic acid should be kept from light)
>>
>> We will mix the crystals & water to create the solution at the GaAs 
>> bench
>>
>> At the GaAs bench, we will combine: HIO3 (0.2M/L) : HCl : H2O - 1:1:x 
>> where x goes from 1 to 100.
>>
>> All work will be done at room temp
>>
>> We will store the mixed solution in the personal chemical 
>> pass-through area, along with the dry crystals
>>
>> What do you think?
>>
>> Thanks!
>>
>> -Mike
>>
>>
>>
>>
>> -- 
>> Mary X. Tang, Ph.D.
>> Stanford Nanofabrication Facility
>> CIS Room 136, Mail Code 4070
>> Stanford, CA  94305
>> (650)723-9980
>> mtang at stanford.edu <mailto:mtang at stanford.edu>
>> http://snf.stanford.edu
>
>