Request for bringing new material (Pyralin Polyimide Coating and Pyralin Thinner)
mahnaz at stanford.edu
Tue Mar 3 13:35:47 PST 2009
I need a process flow meaning step by step of what wafers will go (
oven, development...) through as I mentioned to you in the lab. I need
to know what temperature are you curing the wafers and where will go
Secondly, write to me and tell me how and how much of materials need to
be thinned and where are you planning to do this? You need to come and
get a yellow label after giving me the information I am requesting.
You are using some of my polyimide, have you ordered your thinner already?
I believe that curing should be done in bluem oven, are you qualified?
Are you a headway user?
I will send you su8 and polyimide handling in a separate email and I
need it to be followed to the letter.
Mary Tang wrote:
> Hi all --
> I'll defer to Mahnaz for the final word, but this request looks fine
> to me -- with a couple of questions:
> 1. PI 2545 is actually used by a number of people. You might check
> with Mahnaz to find out if there is some available for your use, if
> you don't want to order it. It lasts a long time.
> 2. Your process flow does not mention adhesion promoter which some
> people find useful (it'sVM-651 or 652 and one is better than the
> other, although I don't remember which right now. Other people in the
> lab will have this on hand, so you might want to ask around.)
> 3. Your process flow does not mention curing of the polyimide
> (usually done in the BlueM oven) and if you plan further processing at
> SNF for these wafers. If so, please let us know.
> And a couple of reminders for bringing in and handling these materials
> in the lab:
> 4. Follow all safety procedures in bringing in and storing personal
> materials. (Contact Mahnaz or other staff member for the yellow label
> and barcode for personal chemicals. You will have to log your
> chemicals under the barcode assigned to your chemicals on the
> logsheet. Make sure to store these chemicals in the designated area
> of the Flammables cabinet or refrigerator as appropriate.)
> 5. Follow all safety (all litho) handling procedures for volatile
> solvents in the lab. (Use only at solvent-compatible stations. Make
> sure to transport freshly spun/unbaked wafers in wafer boxes or other
> enclosed containers or risk the wrath of Uli.)
> Unless other SpecMat'ers disagree, I believe what you have proposed is
> OK (provided you follow #4 and #5 above.) However, if you plan
> further processing in the lab, please make sure to check/answer #2 and
> #3 above.
> Zhiqiang Guo wrote:
>> Hi, Mary:
>> I have sent this email for bringing in personal material in SNF,
>> those are common material, but not got reply, could you please tell
>> me when I can receive the decision of the SpecMat committee?
>> ----- Forwarded Message -----
>> From: "Zhiqiang Guo" <zguo at stanford.edu>
>> To: SpecMat at snf.stanford.edu
>> Sent: Friday, February 27, 2009 6:11:43 AM GMT -08:00 US/Canada Pacific
>> Subject: Request for bringing new material (Pyralin Polyimide Coating
>> and Pyralin Thinner)
>> Hi, SpecMat Committee members:
>> I apply for bring two materials into SNF, the two materials are all
>> on MSDS Index at SNF. Because I need your decision then I can place
>> an order, so could you please tell me your decision today, I will
>> really appreciate your early decision?
>> Please review the detailed information below:
>> 1. Contact information:
>> Name: Zhiqiang Guo
>> Coral login: zguo
>> Phone(email): 650-723-3524 (zguo at stanford.edu)
>> PI: Prof. Fu-Kuo Chang (Department of Aeronautics and
>> Astronautics, Stanford University)
>> 2. Material:
>> 1) Common name: PI-2545
>> Trade name: Pyralin(R) Polyimide Coating
>> Components CAS numbers: 25038-81-7, 872-50-4, 64742-95-6,
>> 95-63-6, usage: Coating polyimide film
>> 2) Common name: T-9039
>> Trade name: Pyralin Thinner
>> Components CAS numbers: 872-50-4, 107-98-2 usage: To thin
>> the PI-2545 before coating
>> 3. Vendor/manufacturer info(the same vendor): HD MicroSystems(TM)
>> Cheesequake Road
>> New Jersey
>> USA 08859
>> phone: (800)346-5656
>> url: http://hdmicrosystems.com/HDMicroSystems/en_US/index.html
>> 4. Reason for request
>> In our process, we need to coat an thin polyimide film onto the
>> surface of our device, seems there is no such material for common use
>> in SNF, so I need to bring by myself.
>> 5. Process Flow:
>> Start at 5 parts thinner T-9039 to 1 part PI-2545 (Lithosolv).
>> After thinning run a spin coating(Headway2). The soft bake is done on
>> a hot plate by 10' x 130C or convection oven by 30' x 135C (Blue M
>> white). Coat with photoresist(svgcoat 1&2), expose the resist(EV or
>> Karlsuss) and develop(svgdev 1&2). Remove the photoresist by using
>> acetone(lithosolv or wbsolvent).
>> 6. Amont and form:
>> 1) PI-2545 for 250g, liquid in a bottle.
>> 2) T-9039 for 1 liter, liquid in bottle.
>> 7. Storage
>> 1) PI-2545: group B (in refrige 0~4F)
>> 2) T-9039: group B (Room temperature, below 90F )
>> 8. Disposal
>> The liquid waste of those products are to be disposed into the
>> solvent waster container in lito solvent benth. The baked polyimide
>> film can be placed in a ziplock bag disposed in a hazardous waste
>> container in the photolithography area.
>> If you agree me to bring those two materials, could you please tell
>> me where I can get the label and barcode?
>> Thanks very much!
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