From jennyhu at stanford.edu Sat Nov 7 20:44:20 2009 From: jennyhu at stanford.edu (Jenny Hu) Date: Sat, 7 Nov 2009 20:44:20 -0800 (PST) Subject: Ferric Chloride in SNF In-Reply-To: <562086892.9451721257655398260.JavaMail.root@zm06.stanford.edu> Message-ID: <211697302.9451791257655460270.JavaMail.root@zm06.stanford.edu> Hello, I would like to use Ferric Chloride (FeCl3) in SNF to etch Nickel. Please see my attached request and MSDS. Thank you, Jenny -------------- next part -------------- A non-text attachment was scrubbed... Name: Ferric Chloride Spec Mat.doc Type: application/msword Size: 31232 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Ferric Chloride MSDS.pdf Type: application/pdf Size: 53952 bytes Desc: not available URL: From rostam at stanford.edu Sun Nov 8 23:10:25 2009 From: rostam at stanford.edu (Rostam Dinyari) Date: Sun, 8 Nov 2009 23:10:25 -0800 (PST) Subject: spec mat request: SCT Pt in Wbmetal Message-ID: <727073127.9611931257750625364.JavaMail.root@zm06.stanford.edu> Hi, I wanted to double check if I can do the following process. If some parts of it are not allowed or I can do them with some alteration please let me know. - diff clean wafers - lithography - deposit Ti/Pt in SCT - do a clean (ie semi-clean) lift off using clean beakers, etc - wbmetal prx127 (If I should, I'll change the chemicals with fresh ones after using it) - wbmetal prs1000 (If I should, I'll change the chemicals with fresh ones after using it) - deposit 50nm LTO in tylanbpsg - etch the oxide in AMTetcher and stop on Pt (If stopping on Pt is not OK, how about if I don't etch all the way to the Pt) I know this is a short notice. I'd really appreciate it if you could let me know your decision in ~ 2 days. Thanks, Rostam From mtang at stanford.edu Mon Nov 9 12:43:39 2009 From: mtang at stanford.edu (Mary Tang) Date: Mon, 09 Nov 2009 12:43:39 -0800 Subject: spec mat request: SCT Pt in Wbmetal In-Reply-To: <727073127.9611931257750625364.JavaMail.root@zm06.stanford.edu> References: <727073127.9611931257750625364.JavaMail.root@zm06.stanford.edu> Message-ID: <4AF87EFB.3060504@stanford.edu> Hi Rostam -- I realized that the wiki did not have the description of Semi-Clean B materials and so just posted it: https://spf.stanford.edu/SNF/materials-and-chemicals/contamination-groups-at-snf/contamination-groups-for-controlling-process-flow-materials Sorry about that. According to this, your process is perfectly acceptable, provided your cleans are done in dedicated labware at wbgeneral or wbgaas. What does everyone think about the proposal to clean these at wbmetal? Mary Rostam Dinyari wrote: > Hi, > > I wanted to double check if I can do the following process. If some parts of it are not allowed or I can do them with some alteration please let me know. > > - diff clean wafers > - lithography > - deposit Ti/Pt in SCT > - do a clean (ie semi-clean) lift off using clean beakers, etc > - wbmetal prx127 (If I should, I'll change the chemicals with fresh ones after using it) > - wbmetal prs1000 (If I should, I'll change the chemicals with fresh ones after using it) > - deposit 50nm LTO in tylanbpsg > - etch the oxide in AMTetcher and stop on Pt (If stopping on Pt is not OK, how about if I don't etch all the way to the Pt) > > I know this is a short notice. I'd really appreciate it if you could let me know your decision in ~ 2 days. > > Thanks, > Rostam > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From edmyers at stanford.edu Mon Nov 9 15:43:47 2009 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 09 Nov 2009 15:43:47 -0800 Subject: spec mat request: SCT Pt in Wbmetal In-Reply-To: <4AF87EFB.3060504@stanford.edu> References: <727073127.9611931257750625364.JavaMail.root@zm06.stanford.edu> <4AF87EFB.3060504@stanford.edu> Message-ID: <6.2.5.6.2.20091109154242.05613348@stanford.edu> The only concern I had was the oxide etch stopping on Pt in the AMAT etcher. Nancy, what is the standing policy? Ed At 12:43 PM 11/9/2009, Mary Tang wrote: >Hi Rostam -- > > >I realized that the wiki did not have the description of Semi-Clean >B materials and so just posted it: >https://spf.stanford.edu/SNF/materials-and-chemicals/contamination-groups-at-snf/contamination-groups-for-controlling-process-flow-materials > > >Sorry about that. According to this, your process is perfectly >acceptable, provided your cleans are done in dedicated labware at >wbgeneral or wbgaas. > > >What does everyone think about the proposal to clean these at wbmetal? > > > >Mary > > > >Rostam Dinyari wrote: >>Hi, >> >>I wanted to double check if I can do the following process. If some >>parts of it are not allowed or I can do them with some alteration >>please let me know. >> >>- diff clean wafers >>- lithography >>- deposit Ti/Pt in SCT >>- do a clean (ie semi-clean) lift off using clean beakers, etc >>- wbmetal prx127 (If I should, I'll change the chemicals with fresh >>ones after using it) >>- wbmetal prs1000 (If I should, I'll change the chemicals with >>fresh ones after using it) >>- deposit 50nm LTO in tylanbpsg >>- etch the oxide in AMTetcher and stop on Pt (If stopping on Pt is >>not OK, how about if I don't etch all the way to the Pt) >> >>I know this is a short notice. I'd really appreciate it if you >>could let me know your decision in ~ 2 days. >> >>Thanks, >>Rostam >> > > >-- >Mary X. Tang, Ph.D. >Stanford Nanofabrication Facility >CIS Room 136, Mail Code 4070 >Stanford, CA 94305 >(650)723-9980 >mtang at stanford.edu >http://snf.stanford.edu From mtang at stanford.edu Mon Nov 9 16:04:24 2009 From: mtang at stanford.edu (Mary Tang) Date: Mon, 09 Nov 2009 16:04:24 -0800 Subject: spec mat request: SCT Pt in Wbmetal In-Reply-To: <6.2.5.6.2.20091109154242.05613348@stanford.edu> References: <727073127.9611931257750625364.JavaMail.root@zm06.stanford.edu> <4AF87EFB.3060504@stanford.edu> <6.2.5.6.2.20091109154242.05613348@stanford.edu> Message-ID: <4AF8AE08.5040603@stanford.edu> I had asked Mike to resend his memo announcing the semiclean B class of materials (from 2004!) and am attaching it here. I believe the only change since then was to add Pd to the list of semiclean B materials (series of SpecMat requests in Jan. 2005.) According to this -- and the discussions at the time, semiclean B materials were going to be allowed in Semiclean etchers (namely, amtetcher and p5000etch oxide chamber) because those etch chemistries should not chemically affect the materials listed (at least no more than other semiclean metals) and could be used as etch stops for making contacts. I think we have, in fact, been allowing the UCLA gang to etch stop on semiclean B materials in p5000etch oxide chamber since this class of materials has been defined. Rostam brings up a good question, though. Can semiclean B Ti/Pt wafers be cleaned at wbmetal? I don't think I could vouch for all the semiclean B materials on the list, but I would think that Ti/Pt would be pretty safe for the PRX and PRS chemistries. (I believe the UCLA gang has been cleaning their silicides at wbgeneral.) Mary Ed Myers wrote: > The only concern I had was the oxide etch stopping on Pt in the AMAT > etcher. > > Nancy, what is the standing policy? > > Ed > > At 12:43 PM 11/9/2009, Mary Tang wrote: >> Hi Rostam -- >> >> >> I realized that the wiki did not have the description of Semi-Clean B >> materials and so just posted it: >> https://spf.stanford.edu/SNF/materials-and-chemicals/contamination-groups-at-snf/contamination-groups-for-controlling-process-flow-materials >> >> >> >> Sorry about that. According to this, your process is perfectly >> acceptable, provided your cleans are done in dedicated labware at >> wbgeneral or wbgaas. >> >> >> What does everyone think about the proposal to clean these at wbmetal? >> >> >> >> Mary >> >> >> >> Rostam Dinyari wrote: >>> Hi, >>> >>> I wanted to double check if I can do the following process. If some >>> parts of it are not allowed or I can do them with some alteration >>> please let me know. >>> >>> - diff clean wafers >>> - lithography >>> - deposit Ti/Pt in SCT >>> - do a clean (ie semi-clean) lift off using clean beakers, etc >>> - wbmetal prx127 (If I should, I'll change the chemicals with fresh >>> ones after using it) >>> - wbmetal prs1000 (If I should, I'll change the chemicals with fresh >>> ones after using it) >>> - deposit 50nm LTO in tylanbpsg >>> - etch the oxide in AMTetcher and stop on Pt (If stopping on Pt is >>> not OK, how about if I don't etch all the way to the Pt) >>> >>> I know this is a short notice. I'd really appreciate it if you could >>> let me know your decision in ~ 2 days. >>> >>> Thanks, >>> Rostam >>> >> >> >> -- >> Mary X. Tang, Ph.D. >> Stanford Nanofabrication Facility >> CIS Room 136, Mail Code 4070 >> Stanford, CA 94305 >> (650)723-9980 >> mtang at stanford.edu >> http://snf.stanford.edu > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- A non-text attachment was scrubbed... Name: Semicleanb.memo.doc Type: application/msword Size: 23040 bytes Desc: not available URL: From nlatta at stanford.edu Tue Nov 10 09:32:23 2009 From: nlatta at stanford.edu (Nancy Latta) Date: Tue, 10 Nov 2009 09:32:23 -0800 Subject: spec mat request: SCT Pt in Wbmetal In-Reply-To: <6.2.5.6.2.20091109154242.05613348@stanford.edu> References: <727073127.9611931257750625364.JavaMail.root@zm06.stanford.edu> <4AF87EFB.3060504@stanford.edu> <6.2.5.6.2.20091109154242.05613348@stanford.edu> Message-ID: <4AF9A3A7.5030507@stanford.edu> In the absence of written policy regarding Ti/Pt, I don't think that it has been allowed in the amtetcher, wbmetal or LTO. I am a bit concerned about his 'clean beakers' for lift off; polypro or quartz? Be good to open these tools up to material, but I'd be more comfortable with policy statement rather than these onese/twoese authorizations. For example, why were we so concerned at Pt in the past? What has changed? -Nancy Ed Myers wrote: > The only concern I had was the oxide etch stopping on Pt in the AMAT > etcher. > > Nancy, what is the standing policy? > > Ed > > At 12:43 PM 11/9/2009, Mary Tang wrote: >> Hi Rostam -- >> >> >> I realized that the wiki did not have the description of Semi-Clean B >> materials and so just posted it: >> https://spf.stanford.edu/SNF/materials-and-chemicals/contamination-groups-at-snf/contamination-groups-for-controlling-process-flow-materials >> >> >> >> Sorry about that. According to this, your process is perfectly >> acceptable, provided your cleans are done in dedicated labware at >> wbgeneral or wbgaas. >> >> >> What does everyone think about the proposal to clean these at wbmetal? >> >> >> >> Mary >> >> >> >> Rostam Dinyari wrote: >>> Hi, >>> >>> I wanted to double check if I can do the following process. If some >>> parts of it are not allowed or I can do them with some alteration >>> please let me know. >>> >>> - diff clean wafers >>> - lithography >>> - deposit Ti/Pt in SCT >>> - do a clean (ie semi-clean) lift off using clean beakers, etc >>> - wbmetal prx127 (If I should, I'll change the chemicals with fresh >>> ones after using it) >>> - wbmetal prs1000 (If I should, I'll change the chemicals with fresh >>> ones after using it) >>> - deposit 50nm LTO in tylanbpsg >>> - etch the oxide in AMTetcher and stop on Pt (If stopping on Pt is >>> not OK, how about if I don't etch all the way to the Pt) >>> >>> I know this is a short notice. I'd really appreciate it if you could >>> let me know your decision in ~ 2 days. >>> >>> Thanks, >>> Rostam >>> >> >> >> -- >> Mary X. Tang, Ph.D. >> Stanford Nanofabrication Facility >> CIS Room 136, Mail Code 4070 >> Stanford, CA 94305 >> (650)723-9980 >> mtang at stanford.edu >> http://snf.stanford.edu > > From mctien at berkeley.edu Thu Nov 12 19:16:25 2009 From: mctien at berkeley.edu (mctien at berkeley.edu) Date: Thu, 12 Nov 2009 19:16:25 -0800 Subject: Bring processed wafer from ucsb Message-ID: <3c2abd6882255517f45d156f794eb40f.squirrel@calmail.berkeley.edu> Dear committee, I?m a postdoc in ucsb, and I?m evaluating a new process which uses SNF facility, epi2, in a certain fabrication step. The wafer will be processed in UCSB nanofab (http://www.nanotech.ucsb.edu/) first. Basically, it?s one step of Si etching. I wonder if the wafer can be accepted in SNF ?clean? group equipment. Please let me know if you need any more information for your evaluation. Or we can discuss via phone about the details. Thank you for your time! ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Ming-Chun (Jason) Tien Post-doctoral Researcher (805)893-5828 ECE Department University of California, Santa Barbara