Exhausted solvent sink access

Mary Tang mtang at stanford.edu
Mon Sep 28 20:15:18 PDT 2009

Hi all --

This could possbily be done in the solvent bench in the wafersaw room.   
We have previously approved waferbond and wafer bond remover for 
non-clean tools.  However, we do not have a hot plate of this size.  
Also, they should dispose of the chemical through normal SNF procedures 
-- transporting chemical waste off the premises is a no-no.  It sounds 
like they want to air brush or hand spray the waferbond.  I don't think 
this is a problem provided they are aware of good chemical handling 
practices.  And have a plan for handling the sprayer or other hardware 
used.  I don't think Gary Trott has been trained at wet benches (well, 
any tools.)  Unless he is qualified at some manual wet bench 
(wbsolvent?) he should not be using the utility room benches unless he 
is escorted by staff.

Ed, you've been the primary contact for this group -- what do you think?


Trott, Gary R wrote:
> Dear Ed and SpecMat group.
> I would like to inquire about usage of an exhausted solvent bench for 
> doing some, wafer bond preparation using a temporary 
> bond, polyimide like process on glass substrates. Preferably it would 
> be outside the cleanroom. The process is not sensitive to particles. I 
> do need a chemically safe place to work with polymers and polymer 
> solvent. Please let me know if there are options to implement this at 
> the Stanford Nanofab Facility.
> If you need more information, please ask.
> Warm Regards
> // 
> /Dr. Gary Trott/
> /  Corning West Technology Center/
> /  Corning Incorporated/
> /     1891 Page Mill Road, Suite 100 /
> /     Palo Alto, CA  94304/ 
> /     Office: 650-846-6012/
> /     Cell: 408-500-5153
> / 
> *1) Contact Info:*
>      Gary Trott, Corning Inc. 650-846-6012, trottgr at corning.com 
> <mailto:trottgr at corning.com>  PI=myself
>      Coral login - trottgr
> *2) Materials to bring in*
>     Glass Substrates
>            Glass substrates. From Corning Inc
>                     Corning  glass,  (4.6% Na in glass)
>                     Various large sizes up to 400mm x 500mm
>    Process Material (MSDS sheets attached)
>             Waferbond - temporary wafer bonding polymer material from 
> Brewer Science
>             Waferbond solvent - A solvent for removing the waferbond 
> polymer (Dodecene)
>     Very large hot plate ~ 400mm x 500mm
>      Al foil to protect surfaces for easy clean up
> *3) Reason for request*
>         We need a chemically safe location to apply the waferbond 
> material to
>         a glass substrate.
> *4) Process flow* 
>         In a chemically exhausted hood.
>        1) Apply the wafer bond material to the glass substrate 
> and/or the device wafer
>            (another piece of glass to be temporarily bonded)
>            For large substrates spinning is not an option. So
>            a) Paint the waferbond onto the combined pieces of glass 
> around the edges
>                or
>            b) Use a paint sprayer and spray the waferbond onto the carrier
>         2) Evaporate, and dry the solvent out of the waferbond polymer 
> by heating
>             on a hot plate to 160C for 5min.
>         3) Remove glass,  clean up, and return all to Corning* *
>         4) Clean up will create some waste streams of
>              a) Used dodecene solvent
>              b) IPA used for final clean
>              c) cleanroom disposable towels with solvent
>              d) possibly Al foil with waferbond on it.
>              All could be put in waste bottle and taken back to Corning.
> *5) Amount and form:*
>           1 liter of waferbond polymer
>           1 gal of waferbond solvent
>            several pieces of glass of various sizes
> *6) Storage*
>      Waferbond polymer and waferbond solvent for the days of active 
> experiments
> *7) Disposal*
>      - Take all substrates pieces with waferbond back to Corning.
>      - used dodecene solvent and cleanroom wipes transport back to 
> Corning.

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