Fwd: HD-3007 polyimide and thinnerT9039

Usha Raghuram usharaghuram at gmail.com
Sun Aug 1 22:18:50 PDT 2010


Mahnaz,

Attached are the copies of the certificate of analysis and MSDS for both
HD-3007 and T-9039.

Regards,

Usha

On Fri, Jul 30, 2010 at 1:49 PM, Mahnaz Mansourpour <mahnaz at stanford.edu>wrote:

>
> Hi Usha ,
>
> This is to let you know that you are confirmed on the use of these
> chemicals.
> Usha has given  me the hard copy of the MSDS  which for now I am putting it
> in the chemical log binder in my office.
>
> I have asked the mixture get mixed in a small bottle so we can get rid of
> it easily.
> I have asked and Usha understand the cleaning of  back of the wafers is a
> must for ASML  so  after the blue dicing removed still should be cleaned (
> q-tips)  quickly before going to hot plate.
> mahnaz
>
> Usha Raghuram wrote:
>
>> Hi Mahnaz,
>>
>> Below is my plan as to how this polyimide will be processed and subsequent
>> processing steps.
>>
>> 1.  Thin poly imide with thinner and coat in Headway - Need 3 labels, one
>> for thinned material, one for thinner (T-9039)and one for polyimide
>> (HD-3007). 2.  Bake and cure - Blue-M and hot plate
>> 3.  Resist spin, Expose (ASML) and develop - Will use blue tape before
>> coating with polyimide to keep the backside clean.
>> 4.  Etch & clean - Drytek 4 - solvent clean (wbmiscres)
>> 5.  Coat with resist and expose - ASML
>> 6.  Innotec metal dep & lift off.
>> 7.  Attach top wafer - Blue M oven / hot plate bake
>> 8. Handle wafer removal - back grind / etch - contaminated tool set or
>> outside processing.
>> 9.  Polyimide coat, cure, resist coat, pattern (contact printing) & etch
>> 10.  Wafer saw.
>>
>> Regards,
>>
>> Usha
>>
>> Note:  HD-3007 is commonly used in wafer bonding proces.  Attached is is a
>> reference for that.
>>
>> ---------- Forwarded message ----------
>> From: *Usha Raghuram* <usharaghuram at gmail.com <mailto:
>> usharaghuram at gmail.com>>
>> Date: Wed, Jul 28, 2010 at 1:54 PM
>> Subject: HD-3007 polyimide and thinnerT9039
>> To: specmat at snf.stanford.edu <mailto:specmat at snf.stanford.edu>
>>
>>
>> Hello,
>>
>> I have ordered HD-3007 and the thinner T-9039 for my experiments and would
>> like to get approval for using them.  Attached are the process guide for
>> these materials.
>> Regards,
>>
>> Usha
>>
>>
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