[Fwd: processes on Cytop]

Ed Myers edmyers at stanford.edu
Wed Aug 11 13:55:00 PDT 2010


I'm OK with the wafer saw room.

At 09:05 AM 8/11/2010, Mary Tang wrote:
>Hi again --
>
>OK, OK, I'VE got concerns.  The fluorinated polymer solvent strikes 
>me as being a very good way to cause adhesion problems if it should 
>get out of control.  This is why we do not allow non-mixed PDMS onto 
>the headway (the base is a silicon oil.)
>
>So, I propose that Shifeng does this bit of his process in the 
>wafersaw room, on the Laurell coater that we acquired specifically 
>for this purpose.  I understand that it still needs power and a pump 
>installed and that there is a damaged solenoid, but we've got a 
>replacement.  We've also got a programmable hotplate in that area, 
>so he can set his polymer before bringing his wafers back into the 
>lab for additional processing.  Shifeng says that for his 
>experiments, this should be fine.
>
>Is everyone else OK with this?  If we have an estimated time for the 
>laurell, I'd like to get back to him.
>
>Thanks all --
>
>Mary
>
>Mary Tang wrote:
>>Hi all  --
>>
>>More processing details.  The Cytop is a fluorinated polymer with 
>>good coating/adhesion properties (interesting, isn't it?)  The 
>>dispersing solvent is also a fluorinated polymer.  Shifeng proposes 
>>to spin coat this on the headway2.  Any concerns?
>>
>>Mary
>>
>>
>>
>>
>>-------- Original Message --------
>>Subject: processes on Cytop
>>Date: Wed, 4 Aug 2010 11:56:54 -0700
>>From: Li, Shifeng <mailto:Shifeng.Li at lifetech.com><Shifeng.Li at lifetech.com>
>>To: '<mailto:mtang at stanford.edu>mtang at stanford.edu' 
>><mailto:%27mtang at stanford.edu%27><'mtang at stanford.edu'>
>>CC: James W. Conway 
>><mailto:jwc at snf.stanford.edu><jwc at snf.stanford.edu>, Hennessy, 
>>Kevin <mailto:Kevin.Hennessy at lifetech.com><Kevin.Hennessy at lifetech.com>
>>
>>
>>Hi, Mary,
>>This is  what I am going to do with Cytop
>>
>>1. Spin coat Cytop on the substrates and bake on the hotplates
>>
>>2.  Surface actuation  in DryteK1 or Drytek2
>>
>>3. Spin coating e-beam resist and pattern it
>>
>>4.  metalization and lift off
>>
>>5. O2 plasma dry etching in Drytek1 or DryteK2
>>
>>I consider this process is a gold contanmiated process
>>
>>if you have any questions, please let me know.
>>
>>Best
>>Shifeng
>>
>>
>>--
>>Mary X. Tang, Ph.D.
>>Stanford Nanofabrication Facility
>>CIS Room 136, Mail Code 4070
>>Stanford, CA  94305
>>(650)723-9980
>><mailto:mtang at stanford.edu>mtang at stanford.edu
>>http://snf.stanford.edu
>>
>
>
>
>--
>Mary X. Tang, Ph.D.
>Stanford Nanofabrication Facility
>CIS Room 136, Mail Code 4070
>Stanford, CA  94305
>(650)723-9980
><mailto:mtang at stanford.edu>mtang at stanford.edu
>http://snf.stanford.edu





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