Fwd: HD-3007 polyimide and thinnerT9039
mahnaz at stanford.edu
Fri Jul 30 13:49:16 PDT 2010
Hi Usha ,
This is to let you know that you are confirmed on the use of these
Usha has given me the hard copy of the MSDS which for now I am putting
it in the chemical log binder in my office.
I have asked the mixture get mixed in a small bottle so we can get rid
of it easily.
I have asked and Usha understand the cleaning of back of the wafers is
a must for ASML so after the blue dicing removed still should be
cleaned ( q-tips) quickly before going to hot plate.
Usha Raghuram wrote:
> Hi Mahnaz,
> Below is my plan as to how this polyimide will be processed and
> subsequent processing steps.
> 1. Thin poly imide with thinner and coat in Headway - Need 3 labels,
> one for thinned material, one for thinner (T-9039)and one for
> polyimide (HD-3007).
> 2. Bake and cure - Blue-M and hot plate
> 3. Resist spin, Expose (ASML) and develop - Will use blue tape before
> coating with polyimide to keep the backside clean.
> 4. Etch & clean - Drytek 4 - solvent clean (wbmiscres)
> 5. Coat with resist and expose - ASML
> 6. Innotec metal dep & lift off.
> 7. Attach top wafer - Blue M oven / hot plate bake
> 8. Handle wafer removal - back grind / etch - contaminated tool set or
> outside processing.
> 9. Polyimide coat, cure, resist coat, pattern (contact printing) & etch
> 10. Wafer saw.
> Note: HD-3007 is commonly used in wafer bonding proces. Attached is
> is a reference for that.
> ---------- Forwarded message ----------
> From: *Usha Raghuram* <usharaghuram at gmail.com
> <mailto:usharaghuram at gmail.com>>
> Date: Wed, Jul 28, 2010 at 1:54 PM
> Subject: HD-3007 polyimide and thinnerT9039
> To: specmat at snf.stanford.edu <mailto:specmat at snf.stanford.edu>
> I have ordered HD-3007 and the thinner T-9039 for my experiments and
> would like to get approval for using them. Attached are the process
> guide for these materials.
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