Fwd: HD-3007 polyimide and thinnerT9039

[Mahnaz Mansourpour]

Hi Usha ,

This is to let you know that you are confirmed on the use of these 
chemicals.
Usha has given  me the hard copy of the MSDS  which for now I am putting 
it in the chemical log binder in my office.

I have asked the mixture get mixed in a small bottle so we can get rid 
of it easily.
I have asked and Usha understand the cleaning of  back of the wafers is 
a must for ASML  so  after the blue dicing removed still should be 
cleaned ( q-tips)  quickly before going to hot plate.
mahnaz

Usha Raghuram wrote:
> Hi Mahnaz,
>
> Below is my plan as to how this polyimide will be processed and 
> subsequent processing steps.
>
> 1.  Thin poly imide with thinner and coat in Headway - Need 3 labels, 
> one for thinned material, one for thinner (T-9039)and one for 
> polyimide (HD-3007). 
> 2.  Bake and cure - Blue-M and hot plate
> 3.  Resist spin, Expose (ASML) and develop - Will use blue tape before 
> coating with polyimide to keep the backside clean.
> 4.  Etch & clean - Drytek 4 - solvent clean (wbmiscres)
> 5.  Coat with resist and expose - ASML
> 6.  Innotec metal dep & lift off.
> 7.  Attach top wafer - Blue M oven / hot plate bake
> 8. Handle wafer removal - back grind / etch - contaminated tool set or 
> outside processing.
> 9.  Polyimide coat, cure, resist coat, pattern (contact printing) & etch
> 10.  Wafer saw.
>
> Regards,
>
> Usha
>
> Note:  HD-3007 is commonly used in wafer bonding proces.  Attached is 
> is a reference for that.
>
> ---------- Forwarded message ----------
> From: *Usha Raghuram* <usharaghuram at gmail.com 
> <mailto:usharaghuram at gmail.com>>
> Date: Wed, Jul 28, 2010 at 1:54 PM
> Subject: HD-3007 polyimide and thinnerT9039
> To: specmat at snf.stanford.edu <mailto:specmat at snf.stanford.edu>
>
>
> Hello,
>
> I have ordered HD-3007 and the thinner T-9039 for my experiments and 
> would like to get approval for using them.  Attached are the process 
> guide for these materials. 
>
> Regards,
>
> Usha
>