HgCdTe

[Mary Tang]

Hi Matthias --


Our apologies in the delay for an official response.  The SpecMat group 
would really like to support this work, but is also seriously concerned 
about opening up a can of worms since we do not currently have a strict 
set of procedures or mechanism of control over materials that go into 
the MRC.  As you probably remember from the Cleanliness & Contamination 
meeting a few months ago, Eric Perozziello brought up a lot of user 
concerns over control of materials in the MRC. 


So, as far as the MRC is concerned, it sounded like you already had a 
resource on campus (you had mentioned working with EH&S to get etching 
approved for ion milling in another lab?) for etching.  Since we are not 
really set up for handling of toxic materials in the MRC, if you have 
other resources for etching your material, SpecMat would prefer that you 
use them rather than the MRC.  If you have no other etching resources, 
then we should talk about other possible alternatives.  Please let us 
know if you would like to work with us on this.


As for the Raith, these materials are not a problem, since this and 
similar ones are already being used on this system.  Because material is 
not being etched, it is not subjected to high temperatures, and provided 
the vapor pressure is low, a broader range of materials are allowed on 
the Raith.


Mary


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




Matthias Baenninger wrote:
>
> Hello Mary,
>
>  
>
> I sent another email regarding my HgCdTe devices to the specmat list 
> about one and a half months ago. Actually, I sent two, one regarding 
> the Raith and one about the MRC etcher.
>
>  
>
> I am now almost through the training on the Raith and it would be 
> important for me to know if I am actually going to be allowed to do my 
> litho on the Raith. Do you know if there has been any progress in 
> making a decision?
>
>  
>
> Thanks,
>
> Matthias
>
>  
>
>  
>
>  
>
> *From:* Mary Tang [mailto:mtang at stanford.edu]
> *Sent:* Wednesday, April 14, 2010 4:54 PM
> *To:* Matthias Baenninger
> *Subject:* Re: MRC Etcher
>
>  
>
> One more thing....   How much material/how big is your substrate?  And 
> did you say you had EH&S OK to do this on an ion mill elsewhere on 
> campus?  If you have an email from them, that would make things very easy.
>
> Mary
>
> Matthias Baenninger wrote:
>
> Hello Mary,
>
>  
>
> We talked after the meeting this afternoon. It would be great if you 
> could forward me the specmat reply regarding the use of the MRC etcher 
> for CdTe/HgTe.
>
>  
>
> Thanks,
>
> Matthias
>
>  
>
>  
>
>  
>
> -----------------------------------
>
> Matthias Baenninger, PhD
>
> Goldhaber-Gordon Group
>
> Stanford University
>
> McCullough Bldg., Room 224
>
> 476 Lomita Mall
>
> Stanford
>
> CA 94305-4008
>
> USA
>
> Phone: +1 (650) 723-5892
>
> -----------------------------------
>
>  
>
>  
>
>
>
> -- 
> Mary X. Tang, Ph.D.
> Stanford Nanofabrication Facility
> CIS Room 136, Mail Code 4070
> Stanford, CA  94305
> (650)723-9980
> mtang at stanford.edu <mailto:mtang at stanford.edu>
> http://snf.stanford.edu
>
>  
>

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