[Fwd: FW: Sachem etchant]

Mary Tang mtang at stanford.edu
Wed Mar 17 15:49:52 PDT 2010


Hi all --

For the record, here's Erhan's SpecMat request email which I am not sure 
he actually sent.

Mary

-------- Original Message --------
Subject: 	FW: Sachem etchant
Date: 	Fri, 19 Feb 2010 11:13:51 -0800
From: 	Erhan Ata <erhanata at fortemedia.com>
To: 	'Mary Tang' <mtang at stanford.edu>



Hi Mary,

About a month ago I've send you the following email. Do I need to 
forward the same info to specmat, or do you think you can OK it?

 

Kind regards,

 

Erhan Ata,

Fortemedia, Inc.

 

------------------------------------------------------------------------

*From:* Erhan Ata [mailto:erhanata at fortemedia.com]
*Sent:* Tuesday, January 19, 2010 12:18 PM
*To:* 'Mary Tang'
*Subject:* Sachem etchant

 

Hi Mary,

After discussions with the vendor we've decided that it would be best if 
we could do our own experiments at SNF by using the Sachem SE1140 if 
possible.

I prepared the following information, but before sending it out to 
specmat wanted to get your feedback on this.

Please let me know if you have any comments, questions.

Sincerely,

 

Erhan

  

 

*CONTACT INFO:*

Erhan Ata

Coral ID: eata

Cell: (650) 224 7894

Tel: (408) 716 8021

erhanata at fortemedia.com

Fortemedia, Inc.

*MATERIAL INFO:*

SACHEM SE-1140: Low water HF based oxide etchant. MSDS attached.

Composition by weight: HF (<6%), Water (25-45%), Proprietary Component 
(<80%)

*MANUFACTURER INFO:*

Sachem, Inc.

821 Woodward Street

Austin, Texas 78704

Phone: (512) 421-4900

*REASON FOR REQUEST:*

Highly selective against Silicon Nitride. Especially oxide to PECVD SiN 
etch selectivity in HF/BHF solutions is very poor. SE-1140 offers very 
good selectivity.

*PROCESS FLOW:*

Since this etchant contains HF we're planning to use gold contaminated 
general purpose wet benches (WBGEN, WBGAAS), following procedures 
applicable to HF based etchants unless otherwise recommended by SNF staff.

We plan to test etch rates of thin film materials, such as SiN, PSG, 
TEOS and HDP oxides, and metals such as Al, TiN, and Cu. All of these 
materials will come from a leading CMOS foundry.  Since we're not 
planning to do any further processing in any of SNF tools (except thin 
film metrology and optical inspections) we believe there's no reason for 
SNF to be concerned about contamination from these wafers and materials 
on them.

*AMOUNT AND FORM:*

About a gallon, in liquid form. No mixing or heating required, usage 
similar to BOE.

*STORAGE:*

We are targeting a short storage time, around a week at most. However, 
depending on timing of arrival of etchant and thin film materials, we 
may request an extension of storage.

*DISPOSAL:*

Our company does not handle chemicals; therefore we don't have any 
disposal service set up. We prefer to work with SNF for disposal but if 
required we can outsource it.


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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