From mtang at stanford.edu  Fri May 14 11:41:22 2010
From: mtang at stanford.edu (Mary Tang)
Date: Fri, 14 May 2010 11:41:22 -0700
Subject: FW: Ge on Silicon pieces used for XPS and TOF-SIMS surface analysis
In-Reply-To: <88D294E28D20D84C9350E231A79B0E63F2183CE0@orsmsx506.amr.corp.intel.com>
References: <88D294E28D20D84C9350E231A79B0E63F2183CE0@orsmsx506.amr.corp.intel.com>
Message-ID: <4BED9952.2070100@stanford.edu>

Hi all --

Just so you know -- Grace and Oguz are from Intel.

Mary

Elibol, Oguz H wrote:
>
> Hi Nancy,
>
>  
>
> FYI, it looks the oxide grown in Tylan2 has some Ge contamination. 
> Please do not forward or distribute the plot. Thanks to Grace for this 
> information.
>
>  
>
> Oguz
>
>  
>
>  
>
>  
>
>  
>
>  
>
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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From yspark at nano-liquid.com  Wed May 19 16:15:33 2010
From: yspark at nano-liquid.com (Paul Park)
Date: Wed, 19 May 2010 16:15:33 -0700 (PDT)
Subject: ma-N 490 Negative PR and ma-D 330S from MicroResist
Message-ID: <305604.63193.qm@web804.biz.mail.mud.yahoo.com>

Hello,

I'd like to bring in ma-N 490 Negative PR and ma-D 330S from MicroResist.

The PR known to make ~7.5um thick film at 3000rpm and reverse slope when over-developed (for lift-off)

Thanks,

Paul Park (coral yspark)
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From mahnaz at stanford.edu  Thu May 20 08:50:58 2010
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 20 May 2010 08:50:58 -0700
Subject: [POSSIBLE VIRUS:###] [Fwd: Re: spin coater]
Message-ID: <24899_1274370655_4BF55A5F_24899_364583_1_4BF55A62.1020300@stanford.edu>


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From mahnaz at stanford.edu  Fri May 21 11:45:23 2010
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Fri, 21 May 2010 11:45:23 -0700
Subject: ma-N 490 Negative PR and ma-D 330S from MicroResist
In-Reply-To: <305604.63193.qm@web804.biz.mail.mud.yahoo.com>
References: <305604.63193.qm@web804.biz.mail.mud.yahoo.com>
Message-ID: <4BF6D4C3.4040802@stanford.edu>

Hi Paul,

This is to let you know that your chemicals have been approved.

The resist should only be spun up at Headway  please use your own 
plastic cassette to store before bake,  or the LOL2000 cassette,  this 
resist will satin.
Please cover the hotplate with foil and make sure to remove them when done.

The lift off should be done at wbsolvent in the white light area and NOT 
at litho solvent.
Please come by to log in your chemicals and  get the labels from me.  Ed 
and Mary can help with this as well, I will be on vacation next week.
The storage group is L

Your chemical will go in to yellow cabinet all the way in the back of 
furnaces, not sure ask a staff.

mahnaz

Paul Park wrote:
> Hello,
>  
> I'd like to bring in ma-N 490 Negative PR and ma-D 330S from MicroResist.
>  
> The PR known to make ~7.5um thick film at 3000rpm and reverse slope 
> when over-developed (for lift-off)
>  
> Thanks,
>  
> Paul Park (coral yspark)


From yspark at nano-liquid.com  Fri May 21 13:42:19 2010
From: yspark at nano-liquid.com (Paul Park)
Date: Fri, 21 May 2010 13:42:19 -0700
Subject: ma-N 490 Negative PR and ma-D 330S from MicroResist
In-Reply-To: <4BF6D4C3.4040802@stanford.edu>
Message-ID: <731125.37413.qm@smtp112.biz.mail.re2.yahoo.com>

Thanks a lot!

I will bring them on Monday.

Paul

-----Original Message-----
From: Mahnaz Mansourpour [mailto:mahnaz at stanford.edu] 
Sent: Friday, May 21, 2010 11:45 AM
To: Paul Park
Cc: specmat at snf.stanford.edu
Subject: Re: ma-N 490 Negative PR and ma-D 330S from MicroResist

Hi Paul,

This is to let you know that your chemicals have been approved.

The resist should only be spun up at Headway  please use your own 
plastic cassette to store before bake,  or the LOL2000 cassette,  this 
resist will satin.
Please cover the hotplate with foil and make sure to remove them when done.

The lift off should be done at wbsolvent in the white light area and NOT 
at litho solvent.
Please come by to log in your chemicals and  get the labels from me.  Ed 
and Mary can help with this as well, I will be on vacation next week.
The storage group is L

Your chemical will go in to yellow cabinet all the way in the back of 
furnaces, not sure ask a staff.

mahnaz

Paul Park wrote:
> Hello,
>  
> I'd like to bring in ma-N 490 Negative PR and ma-D 330S from MicroResist.
>  
> The PR known to make ~7.5um thick film at 3000rpm and reverse slope 
> when over-developed (for lift-off)
>  
> Thanks,
>  
> Paul Park (coral yspark)



From usharaghuram at gmail.com  Thu May 27 11:07:00 2010
From: usharaghuram at gmail.com (Usha Raghuram)
Date: Thu, 27 May 2010 11:07:00 -0700
Subject: PI-2562 and VM-651
Message-ID: <AANLkTinZFut2_9rFhxhriiaxpYwtQ58dpIjs52BMclM5@mail.gmail.com>

Hi,

I would like to use PI-2562, a polyimide and the adhesion promoter VM-651
both from HD Microsystems for spin coating and filling cavities in quatrz
and SI wafers.  Once spin coated, they will be cured in hot plate and
patterned and etched or CMPed.  We may also be depositing metal on it in
Innotec.  Attached are the data sheets and MSDS for these two materials.
Kindly advise me if I need to provide any additional information for taking
this material into the fab.

Regards,

Usha
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From mtang at stanford.edu  Thu May 27 11:21:09 2010
From: mtang at stanford.edu (Mary Tang)
Date: Thu, 27 May 2010 11:21:09 -0700
Subject: PI-2562 and VM-651
In-Reply-To: <AANLkTinZFut2_9rFhxhriiaxpYwtQ58dpIjs52BMclM5@mail.gmail.com>
References: <AANLkTinZFut2_9rFhxhriiaxpYwtQ58dpIjs52BMclM5@mail.gmail.com>
Message-ID: <4BFEB815.5050309@stanford.edu>

Hi Usha --

Yes, these chemicals have been approved for use at SNF, with certain 
guidelines.

Please include a process runsheet or list of equipment you plan to use.  
Only the headway may be used for spin coating polyimides.  Please check 
on current procedures, as I think there are certain procedures for 
polyimide.  Soft bake can be done on a hotplate, but the substrates 
would need to be transported in an enclosed box to this station and the 
hot plate would need to be covered with foil.  Cure can also be done on 
the hot plate, but only for a limited time and temperature.  Curing to 
create a structural material is typically done in the Blue M oven.  Let 
us know which tool you plan to use for etching.

These would be stored in the personal chemicals storage area of the 
flammables cabinet.  Labels and barcodes would be required as well.

Mary

Usha Raghuram wrote:
> Hi,
>
> I would like to use PI-2562, a polyimide and the adhesion promoter 
> VM-651 both from HD Microsystems for spin coating and filling cavities 
> in quatrz and SI wafers.  Once spin coated, they will be cured in hot 
> plate and patterned and etched or CMPed.  We may also be depositing 
> metal on it in Innotec.  Attached are the data sheets and MSDS for 
> these two materials.  Kindly advise me if I need to provide any 
> additional information for taking this material into the fab.
>
> Regards,
>
> Usha


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu