[Fwd: RE: Contamination control at SNF]

Mary Tang mtang at stanford.edu
Fri Sep 24 11:51:42 PDT 2010


The previous communication with Unity.  I'm not sure how this led into 
what I just forwarded to you all previously....

M

-------- Original Message --------
Subject: 	RE: Contamination control at SNF
Date: 	Tue, 24 Aug 2010 13:18:05 -0700
From: 	Lidia Vereen <lvereen at unitysemi.com>
Reply-To: 	<lvereen at unitysemi.com>
Organization: 	Unity Semiconductor Corporation
To: 	'Mary Tang' <mtang at stanford.edu>, <efriend at unitysemi.com>
CC: 	'Mary Calarrudo' <mcalarrudo at unitysemi.com>
References: 	<4C7423E3.1030904 at stanford.edu>



Mary,

The oxide is deposited in your STS.  I am assuming that we do not need any
TXRF on the STS film.   The films that come outside of SNF are Pt and
conductive and insulating metal oxides.

Thanks

Lidia

-----Original Message-----
From: Mary Tang [mailto:mtang at stanford.edu] 
Sent: Tuesday, August 24, 2010 12:56 PM
To: efriend at unitysemi.com
Cc: lvereen at unitysemi.com
Subject: Contamination control at SNF

Hi Elizabeth --

I just received your voicemail.  Lidia and I spoke this morning about 
your project.  Afterward, Jim McVittie (our etch and device expert) and 
I also spoke.

As I understand it, you have silicon wafers with platinum deposited at 
Unity.  The Pt is etched in the MRC system.  Afterwards, there is oxide 
deposited.  You want to be able to etch vias in this oxide down to the 
Pt below.  Is that correct? 

It would help to know that the Pt is deposited in a gold-free and 
iron-free system.  It is also helpful to know the metal-free quality of 
the deposited oxide (Jim advises this would be even more important to 
know than the Pt.)  A good, relatively easy demonstration would TXRF of 
those films.  But before you start running experiments, it would help to 
understand the process flow at these layers.  The thickness and method 
of deposition of these films would help.  Could we get a brief listing 
of process steps from you?

Thanks,

Mary


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu





-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu

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