[Fwd: RE: Unity material/request for removal from gold contaminated status]

Mary Tang mtang at stanford.edu
Thu Sep 30 11:15:17 PDT 2010

Hi all --

Did I send this before?  Lidia would like an answer -- any thoughts?  It 
strikes me that all these are semiclean B by SNF definition, so should 
be OK for p5000etch and semiclean ALD.  What do you all think?

-------- Original Message --------
Subject: 	RE: Unity material/request for removal from gold contaminated 
Date: 	Fri, 24 Sep 2010 13:30:08 -0700
From: 	Lidia Vereen <lvereen at unitysemi.com>
Reply-To: 	<lvereen at unitysemi.com>
Organization: 	Unity Semiconductor Corporation
To: 	'Mary Tang' <mtang at stanford.edu>
CC: 	<efriend at unitysemi.com>, "'Mary Calarrudo'" <mcalarrudo at unitysemi.com>
References: 	<4C979995.8090105 at stanford.edu> 
<004101cb5c17$59c58070$0d508150$@com> <4C9D0711.8030204 at stanford.edu>


1)  I have not been in contact with any other specmat members.
2)  The P5000 would be implemented for the Via etch and potentially the
hardmask etch.  We currently use the MRC.  The ALD is for the IMO (HfO2 or
ZrO2) deposition.  That is currently done prior to Stanford in our
facilities' deposition tool.
3)  The TXRF data for the oxide etch chambers comes from SVTC and the MxP
system.   We used that facility to do the same flow as we do at SNF.   The
data is from wafers that were processed subsequently to the via etch that
Unity does on their wafers.
4)  The Zr and Co come from the insulating and conduction metal oxides that
we deposit.  When we the do the oxide etches, those films are not exposed.
The only exposed material for the via etch is Pt.
5)  The glue layer is a thin titanium layer.



-----Original Message-----
From: Mary Tang [mailto:mtang at stanford.edu] 
Sent: Friday, September 24, 2010 1:16 PM
To: lvereen at unitysemi.com
Cc: efriend at unitysemi.com; 'Mary Calarrudo'
Subject: Re: Unity material/request for removal from gold contaminated

Hi Lidia --

Thanks for the info.  I take it this is follow up from a previous 
request we had for more detail about the process history of your wafers.

First, have you been in contact with other SpecMat members?  Because I 
may ask you the same questions....

- You mention using ALD and P5000etch.  It's not entirely clear to me at 
which steps in your process you would like to use these tools.  Or is it 
processing subsequent to what you've listed?

- I'm not sure I understand where the TXRF data for the oxide etch comes 
from -- is this from an SNF system or your system?  And how is the 
sample obtained?

- The presence of Zr, Co, Mn, Yttria weren't mentioned in our previous 
discussions.  How are these deposited and will any of these films be 
exposed during any of the proposed processing in non-Gold tools?

- What is the "glue" layer?



Lidia Vereen wrote:
> Mary,
> Please find enclosed the presentation/data/request for Unity to be removed
> from the gold contaminated list.  I do not have the specmat email address
> and am hoping you can forward the email to that distribution.   Please let
> me know if there are questions regarding the material and how long before
> can get resolution.
> Thanks
> Lidia

Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at stanford.edu

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