Fwd: XR1541 bonding

Mary Tang mtang at stanford.edu
Mon Aug 15 14:34:04 PDT 2011

Hi all --

Here's a request from J Provine, relating to a process that Jae Hyung 
Lee has apparently been running in the lab.

The questions are:

1.  Is electronics grade HSQ, cured at 400 C, sufficiently clean to be 
processed in wbdiff?

2.  Is it sufficiently clean to be processed in tylans 1/2?

We've approved electronics grade SOG for processing in back-end/low 
temperature tools through SpecMat.  I don't believe we've officially 
approved it for clean/front-end tools.  Should we?

My humble opinion:  Wbdiff is OK -- it's as clean as the chemicals used 
and chemicals will get changed @ 4 hours.  Tylans 1/2 are OK if the 
process has been vetted in tylan3/4.  My concern is wafers debonding and 
flaking stuff everywhere.  However, I suspect that Jae has already been 
doing this and tested the process, if he's got a special slow recipe.


-------- Original Message --------
Subject: 	XR1541 bonding
Date: 	Mon, 15 Aug 2011 14:16:57 -0700
From: 	J Provine <jprovine at stanford.edu>
To: 	Ed Myers <edmyers at stanford.edu>, Mary Tang <mtang at stanford.edu>, 
maurice stevens <maurice at stanford.edu>

hi mary, maurice, and ed,

i've had a chance to talk with mary and ed about using the HSQ based 
ebeam resist XR1541 (a type of spin on glass) to do a moderately high 
temperature bonding of two oxidized wafers.  i'll talk with maurice when 
he returns on wednesday.  this email is to get everyone the same page 
and document the proposal for what i would do.

i would start with two clean oxidized SOI, that have been through clean 
CMP and then decontamination.
1. spin XR1541 (about 150nm) at headway.
2. bake on hot plate at 90C (2 min) -> 150C (2 min) -> 400C (2 hours) 
with weight applied by the litho weights covered in clean new foil and 
the hotplate covered in new foil.
3. clean bonded wafers in wbdiff
4. anneal at 900C for 2-3 hours in tylan1/2 using the recipe slow900a

for step 3 i could go to another, less clean bench if needed, such as 
for step 4 i could go to tylan3/4 if needed for my process, but i would 
like to stay clean and only go contaminated if necessary.

is this ok?  what additional information can i provide to help in the 

attached is a document about XR1541 and its cleanliness.
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