From mtang at stanford.edu  Tue Nov  1 14:27:44 2011
From: mtang at stanford.edu (Mary Tang)
Date: Tue, 01 Nov 2011 14:27:44 -0700
Subject: Unity request #2 (of 3)
Message-ID: <4EB06450.70503@stanford.edu>

Hi all --

Unity is resubmitting this request to etch CMO and related materials in 
ChB of p5000etch, so I'm sending it around again.  It does not say here, 
and I may be wrong, but a quick Google scholar search shows the 
following abbreviations may apply:

CMO:  cobalt manganese oxide (or calcium molybdenum oxide, but I think 
the first, since her later email mentions Co.)

YSZ:  Yttria stabilized zirconia

YMO:  Yttria manganese oxide

More info in a followin up email.

Mary





-------- Original Message --------
Subject: 	Unity material/request for removal from gold contaminated status
Date: 	Fri, 24 Sep 2010 11:36:05 -0700
From: 	Lidia Vereen <lvereen at unitysemi.com>
Reply-To: 	<lvereen at unitysemi.com>
Organization: 	Unity Semiconductor Corporation
To: 	'Mary Tang' <mtang at stanford.edu>
CC: 	<efriend at unitysemi.com>, "'Mary Calarrudo'" <mcalarrudo at unitysemi.com>



Mary,

Please find enclosed the presentation/data/request for Unity to be removed
from the gold contaminated list.  I do not have the specmat email address
and am hoping you can forward the email to that distribution.   Please let
me know if there are questions regarding the material and how long before we
can get resolution.

Thanks

Lidia



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From mtang at stanford.edu  Tue Nov  1 14:28:21 2011
From: mtang at stanford.edu (Mary Tang)
Date: Tue, 01 Nov 2011 14:28:21 -0700
Subject: Unity Specmat request #3 of 3
Message-ID: <4EB06475.3050503@stanford.edu>



-------- Original Message --------
Subject: 	RE: Unity material/request for removal from gold contaminated 
status
Date: 	Fri, 24 Sep 2010 13:30:08 -0700
From: 	Lidia Vereen <lvereen at unitysemi.com>
Reply-To: 	<lvereen at unitysemi.com>
Organization: 	Unity Semiconductor Corporation
To: 	'Mary Tang' <mtang at stanford.edu>
CC: 	<efriend at unitysemi.com>, "'Mary Calarrudo'" <mcalarrudo at unitysemi.com>



Mary,

1)  I have not been in contact with any other specmat members.
2)  The P5000 would be implemented for the Via etch and potentially the
hardmask etch.  We currently use the MRC.  The ALD is for the IMO (HfO2 or
ZrO2) deposition.  That is currently done prior to Stanford in our
facilities' deposition tool.
3)  The TXRF data for the oxide etch chambers comes from SVTC and the MxP
system.   We used that facility to do the same flow as we do at SNF.   The
data is from wafers that were processed subsequently to the via etch that
Unity does on their wafers.
4)  The Zr and Co come from the insulating and conduction metal oxides that
we deposit.  When we the do the oxide etches, those films are not exposed.
The only exposed material for the via etch is Pt.
5)  The glue layer is a thin titanium layer.

Thanks

Lidia

-----Original Message-----
From: Mary Tang [mailto:mtang at stanford.edu]
Sent: Friday, September 24, 2010 1:16 PM
To: lvereen at unitysemi.com
Cc: efriend at unitysemi.com; 'Mary Calarrudo'
Subject: Re: Unity material/request for removal from gold contaminated
status

Hi Lidia --

Thanks for the info.  I take it this is follow up from a previous
request we had for more detail about the process history of your wafers.

First, have you been in contact with other SpecMat members?  Because I
may ask you the same questions....

- You mention using ALD and P5000etch.  It's not entirely clear to me at
which steps in your process you would like to use these tools.  Or is it
processing subsequent to what you've listed?

- I'm not sure I understand where the TXRF data for the oxide etch comes
from -- is this from an SNF system or your system?  And how is the
sample obtained?

- The presence of Zr, Co, Mn, Yttria weren't mentioned in our previous
discussions.  How are these deposited and will any of these films be
exposed during any of the proposed processing in non-Gold tools?

- What is the "glue" layer?

Thanks,

Mary




Lidia Vereen wrote:
>  Mary,
>
>  Please find enclosed the presentation/data/request for Unity to be removed
>  from the gold contaminated list.  I do not have the specmat email address
>  and am hoping you can forward the email to that distribution.   Please let
>  me know if there are questions regarding the material and how long before
we
>  can get resolution.
>
>  Thanks
>
>  Lidia
>
>


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu




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From mtang at stanford.edu  Thu Nov  3 09:40:42 2011
From: mtang at stanford.edu (Mary Tang)
Date: Thu, 03 Nov 2011 09:40:42 -0700
Subject: Unity request for p5000etch
Message-ID: <4EB2C40A.4080102@stanford.edu>

Hi Lidia --

We've been reviewing your request for etching CMO materials on P5000 
based on the info you'd sent last August.  The sticking point has been 
the Manganese -- but when I spoke with Mary Calarrudo, she said that the 
material to be etched was not Cobalt manganese oxide (which I think we'd 
assumed "CMO" meant).  She says CMO is Complex Metal Oxide.

So, apologies for the delay, but I'm confused.  Could we get a 
definitive description of the elements in the films you would like 
etched in the p5000?  As well as some description of the type of process 
(chemistry and chamber) you'd like to use?  You do not have to disclose 
anything proprietary but part of the agreement of working at SNF is 
sharing info about composition and processes to the degree other 
researchers' work may be affected.  So, specific composition is not 
needed, but certainly the elemental components would be helpful, 
especially if things appear at trace levels.

Thanks,

Mary


From lvereen at unitysemi.com  Thu Nov  3 10:09:05 2011
From: lvereen at unitysemi.com (Lidia Vereen)
Date: Thu, 3 Nov 2011 10:09:05 -0700
Subject: Unity request for p5000etch
In-Reply-To: <4EB2C40A.4080102@stanford.edu>
References: <4EB2C40A.4080102@stanford.edu>
Message-ID: <005d01cc9a4b$4b0b7ad0$e1227070$@com>

Mary,

There are two materials. They are conductive metal oxides.  Their
composition is highly confidential.

The materials have Pr, Co, Mn, La, Sr, Ca.   If Mn is a problem,  we do not
necessarily have to use that composition.  

We would prefer to use a chemical etch ie CF4, CHF3, etc.  I doubt the
chlorine based chemistries would work.  We may have likely have to use a
larger component of sputter etch ie Ar in the etch.  

Given the options open to us, access to the P5000 is very important.
Please let us know your decision as soon as is feasible.

Thanks

Lidia

-----Original Message-----
From: Mary Tang [mailto:mtang at stanford.edu] 
Sent: Thursday, November 03, 2011 9:41 AM
To: lvereen at unitysemi.com
Cc: specmat at snf.stanford.edu; jbumgarner at snf.stanford.edu; maurice stevens
Subject: Unity request for p5000etch

Hi Lidia --

We've been reviewing your request for etching CMO materials on P5000 
based on the info you'd sent last August.  The sticking point has been 
the Manganese -- but when I spoke with Mary Calarrudo, she said that the 
material to be etched was not Cobalt manganese oxide (which I think we'd 
assumed "CMO" meant).  She says CMO is Complex Metal Oxide.

So, apologies for the delay, but I'm confused.  Could we get a 
definitive description of the elements in the films you would like 
etched in the p5000?  As well as some description of the type of process 
(chemistry and chamber) you'd like to use?  You do not have to disclose 
anything proprietary but part of the agreement of working at SNF is 
sharing info about composition and processes to the degree other 
researchers' work may be affected.  So, specific composition is not 
needed, but certainly the elemental components would be helpful, 
especially if things appear at trace levels.

Thanks,

Mary




From edmyers at stanford.edu  Thu Nov  3 10:52:50 2011
From: edmyers at stanford.edu (Ed Myers)
Date: Thu, 03 Nov 2011 10:52:50 -0700
Subject: Unity request for p5000etch
In-Reply-To: <005d01cc9a4b$4b0b7ad0$e1227070$@com>
References: <4EB2C40A.4080102@stanford.edu> <005d01cc9a4b$4b0b7ad0$e1227070$@com>
Message-ID: <4EB2D4F2.4030708@stanford.edu>

All,

Element by element:

Pr ( Praseodymium): Fluoride volatility similar to Y, Sm, Nb, Ce and La 
near -130 kcal/gram-atom.  Not easy to form.
Co: No volatile compound will be formed, hence it will reside in the chamber
Mn: Has similar fluoride volatility as Co and Ni,. Has a similar vapor 
pressure as indium (right on the edge of acceptable)
La: Fluoride volatility similar to Y, Sm, Nb, Ce and La near -130 
kcal/gram-atom.  Not easy to form.
Sr: Below the indium vapor pressure cut-off.  Free energy of formation 
-140 kcal/gram-atom for both Sr and Ca
Ca: Below the indium vapor pressure cut-off.  Free energy of formation 
-140 kcal/gram-atom for both Sr and Ca

Lidia's comment " We may have likely have to use a larger component of 
sputter etch ie Ar in the etch." is very telling.  We will  be approving 
the P5000 to be used as a ion sputter etch tool.  With other options 
available to them, my vote is no.

Ed


On 11/3/2011 10:09 AM, Lidia Vereen wrote:
> Mary,
>
> There are two materials. They are conductive metal oxides.  Their
> composition is highly confidential.
>
> The materials have Pr, Co, Mn, La, Sr, Ca.   If Mn is a problem,  we do not
> necessarily have to use that composition.
>
> We would prefer to use a chemical etch ie CF4, CHF3, etc.  I doubt the
> chlorine based chemistries would work.  We may have likely have to use a
> larger component of sputter etch ie Ar in the etch.
>
> Given the options open to us, access to the P5000 is very important.
> Please let us know your decision as soon as is feasible.
>
> Thanks
>
> Lidia
>
> -----Original Message-----
> From: Mary Tang [mailto:mtang at stanford.edu]
> Sent: Thursday, November 03, 2011 9:41 AM
> To: lvereen at unitysemi.com
> Cc: specmat at snf.stanford.edu; jbumgarner at snf.stanford.edu; maurice stevens
> Subject: Unity request for p5000etch
>
> Hi Lidia --
>
> We've been reviewing your request for etching CMO materials on P5000
> based on the info you'd sent last August.  The sticking point has been
> the Manganese -- but when I spoke with Mary Calarrudo, she said that the
> material to be etched was not Cobalt manganese oxide (which I think we'd
> assumed "CMO" meant).  She says CMO is Complex Metal Oxide.
>
> So, apologies for the delay, but I'm confused.  Could we get a
> definitive description of the elements in the films you would like
> etched in the p5000?  As well as some description of the type of process
> (chemistry and chamber) you'd like to use?  You do not have to disclose
> anything proprietary but part of the agreement of working at SNF is
> sharing info about composition and processes to the degree other
> researchers' work may be affected.  So, specific composition is not
> needed, but certainly the elemental components would be helpful,
> especially if things appear at trace levels.
>
> Thanks,
>
> Mary
>
>
>


From kavehm at ece.ucsb.edu  Fri Nov 11 10:34:29 2011
From: kavehm at ece.ucsb.edu (Kaveh Milaninia)
Date: Fri, 11 Nov 2011 10:34:29 -0800
Subject: samsung wafers in wbmetal
Message-ID: <000401cca0a0$8d87cac0$a8976040$@ece.ucsb.edu>

I'd like to see if I can get permission to clean wafers from an outside
source in wbmetal. The wafers are from Samsung and have the following stack
Si Sub/SiO2/Ti/Al/Ti/TiN. The metals are all semiclean and sputter deposited
in their semiconductor foundry. After deposition, the wafers are polished
and cleaned with a PVA pad and di water. No slurry is used.

 

Kaveh

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From mahnaz at stanford.edu  Fri Nov 11 13:25:52 2011
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Fri, 11 Nov 2011 13:25:52 -0800
Subject: samsung wafers in wbmetal
In-Reply-To: <000401cca0a0$8d87cac0$a8976040$@ece.ucsb.edu>
References: <000401cca0a0$8d87cac0$a8976040$@ece.ucsb.edu>
Message-ID: <4EBD92E0.6010104@stanford.edu>

Hi kaveh,

This is to let you know that  your request is approved.
And if any issue which i do not anticipate one you  can change the 
chemical afterward.

mahnaz

On 11/11/2011 10:34 AM, Kaveh Milaninia wrote:
>
> I'd like to see if I can get permission to clean wafers from an 
> outside source in wbmetal. The wafers are from Samsung and have the 
> following stack Si Sub/SiO2/Ti/Al/Ti/TiN. The metals are all semiclean 
> and sputter deposited in their semiconductor foundry. After 
> deposition, the wafers are polished and cleaned with a PVA pad and di 
> water. No slurry is used.
>
> Kaveh
>
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From shott at stanford.edu  Mon Nov 21 15:57:45 2011
From: shott at stanford.edu (John Shott)
Date: Mon, 21 Nov 2011 15:57:45 -0800
Subject: FW: inquiry about Coral installation
In-Reply-To: <7C82D010CB79F04EB9AFA4DE2E3644A503BD48@EX-MAIL1.ad.caltech.edu>
References: <7C82D010CB79F04EB9AFA4DE2E3644A503BD28@EX-MAIL1.ad.caltech.edu> <7C82D010CB79F04EB9AFA4DE2E3644A503BD48@EX-MAIL1.ad.caltech.edu>
Message-ID: <4ECAE579.4060405@stanford.edu>

Note: I've responded to this inquiry ...

John


On 11/21/2011 3:43 PM, DeRose, Guy A wrote:
>
> My inquiry to coral at Stanford did not seem to go through.
>
> Thank you for distributing to the right party.
>
> Guy
>
> *From:*DeRose, Guy A
> *Sent:* Monday, November 21, 2011 3:41 PM
> *To:* 'coral at snf.stanford.edu'
> *Subject:* inquiry about Coral installation
>
> Hello,
>
> The Kavli Nanoscience Institute at Caltech has been operating a shared 
> cleanroom facility since 2008.  During that time, we have been 
> informally keeping track of the use of our lab equipment.  The Caltech 
> administration is asking us to collect more detailed usage data, as 
> well as billing, going forward and the Coral system at Stanford is the 
> standard that we are looking to.  I would like to talk with someone or 
> receive some further technical information about how to roll this out 
> in my facility here.
>
> Thank you for your assistance,
>
> Guy
>
> Guy DeRose, PhD, Member of the Professional Staff
>
> Associate Director, Kavli Nanoscience Institute, California Institute 
> of Technology
>
> 1200 E California Blvd M/S 107-81 209 Steele Pasadena, CA 91125 USA
>
> Office: +1-626-395-3423 Lab: 626-395-1539 Mobile: 626-676-8529 Fax: 
> 626-744-9908
>
> www.kni.caltech.edu <http://www.kni.caltech.edu/> skype:guy_derose
>

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