From rcordova at snf.stanford.edu Tue Apr 1 14:11:43 2008 From: rcordova at snf.stanford.edu (rcordova at snf.stanford.edu) Date: Tue, 1 Apr 2008 14:11:43 -0700 Subject: Comment sts SNF 2008-04-01 14:11:40: System is in clean. At 4.35 thickness on chamber Message-ID: From jperez at snf.stanford.edu Wed Apr 9 14:34:27 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Wed, 9 Apr 2008 14:34:27 -0700 Subject: Problem sts SNF 2008-04-09 14:34:26: After clean and 2% silane bottle change (A) Message-ID: Seeing huge flakes all over wafer and platen. Most blew off. Will run another test . Uniformity good, dep. rate lower. from ~400 angstroms to 374 angstroms per minute. From jperez at snf.stanford.edu Wed Apr 9 15:17:01 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Wed, 9 Apr 2008 15:17:01 -0700 Subject: Comment sts SNF 2008-04-09 15:17:01: 2nd test much better, 1 flake Message-ID: TW looked clean under the microscope. Dep rate stayed the same (which is good) 376 angstroms per minute. Uniformity 1% across the wafer. Let us know if you see any flakes. From jperez at snf.stanford.edu Wed Apr 9 15:17:27 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Wed, 9 Apr 2008 15:17:27 -0700 Subject: Comment sts SNF 2008-04-01 14:11:40: System is in clean. At 4.35 thickness on chamber Message-ID: This clean completed. From rcordova at snf.stanford.edu Thu Apr 10 09:04:40 2008 From: rcordova at snf.stanford.edu (rcordova at snf.stanford.edu) Date: Thu, 10 Apr 2008 09:04:40 -0700 Subject: Comment sts SNF 2008-04-10 09:04:40: System is back in clean again! Message-ID: Etchback 3 started at 9:00am From jperez at snf.stanford.edu Thu Apr 10 14:53:16 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Thu, 10 Apr 2008 14:53:16 -0700 Subject: Shutdown sts SNF 2008-04-10 14:53:15: After OXPREDEP (clean cycle) flaking off the side walls Message-ID: See ED Myers for more details or Jim Haydon. From emyers at snf.stanford.edu Fri Apr 11 14:28:07 2008 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 11 Apr 2008 14:28:07 -0700 Subject: Problem sts SNF 2008-04-11 14:28:05: Needs Clean Cycle Message-ID: Jim has completed his chamber scrub and the system is back to temperature. The chamber needs a full clean cycle before running any samples. From emyers at snf.stanford.edu Fri Apr 11 14:28:17 2008 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 11 Apr 2008 14:28:17 -0700 Subject: Shutdown sts SNF 2008-04-10 14:53:15: After OXPREDEP (clean cycle) flaking off the side walls Message-ID: Jim has completed his chamber scrub and the system is back to temperature. The chamber needs a full clean cycle before running any samples. From ccwan at snf.stanford.edu Sun Apr 13 11:54:17 2008 From: ccwan at snf.stanford.edu (ccwan at snf.stanford.edu) Date: Sun, 13 Apr 2008 11:54:17 -0700 Subject: Comment sts SNF 2008-04-13 11:54:16: STS Clean Cycle completed Message-ID: From emyers at snf.stanford.edu Mon Apr 14 11:56:24 2008 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Mon, 14 Apr 2008 11:56:24 -0700 Subject: Comment sts SNF 2008-04-13 11:54:16: STS Clean Cycle completed Message-ID: Noted From emyers at snf.stanford.edu Mon Apr 14 11:56:42 2008 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Mon, 14 Apr 2008 11:56:42 -0700 Subject: Problem sts SNF 2008-04-11 14:28:05: Needs Clean Cycle Message-ID: Cycle completed From emyers at snf.stanford.edu Mon Apr 14 11:57:30 2008 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Mon, 14 Apr 2008 11:57:30 -0700 Subject: Comment sts SNF 2008-04-14 11:57:28: Clean Cycle Started Message-ID: User walked away with 4.5um on chamber. I started the clean cycle (Etchback3) From jhaydon at snf.stanford.edu Tue Apr 15 10:26:45 2008 From: jhaydon at snf.stanford.edu (jhaydon at snf.stanford.edu) Date: Tue, 15 Apr 2008 10:26:45 -0700 Subject: Problem sts SNF 2008-04-09 14:34:26: After clean and 2% silane bottle change (A) Message-ID: flakes probably caused by low temp deposit and an lack of cleaning after deposit From jperez at snf.stanford.edu Wed Apr 23 07:26:42 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Wed, 23 Apr 2008 07:26:42 -0700 Subject: Comment sts SNF 2008-04-14 11:57:28: Clean Cycle Started Message-ID: Clean cycle completed From jperez at snf.stanford.edu Wed Apr 23 07:27:01 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Wed, 23 Apr 2008 07:27:01 -0700 Subject: Comment sts SNF 2008-04-10 09:04:40: System is back in clean again! Message-ID: Clean cycle completed From jperez at snf.stanford.edu Wed Apr 23 07:58:52 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Wed, 23 Apr 2008 07:58:52 -0700 Subject: Comment sts SNF 2008-04-09 15:17:01: 2nd test much better, 1 flake Message-ID: Jim Haydon scotch brite the walls and then a full clean cycle was completed. Someone ran a low temp. nitride without an OK. It would seem that low temperature nitrides cannot be ran without prior approval. This incident caused us many hours of testing and (3) full cycles of cleans. From jperez at snf.stanford.edu Tue Apr 29 14:45:19 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Tue, 29 Apr 2008 14:45:19 -0700 Subject: Problem sts SNF 2008-04-29 14:45:18: 2% silane bottle change from A to B Message-ID: test needed From jperez at snf.stanford.edu Tue Apr 29 15:23:44 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Tue, 29 Apr 2008 15:23:44 -0700 Subject: Problem sts SNF 2008-04-29 14:45:18: 2% silane bottle change from A to B Message-ID: Test done; avg. 1043 angstrom per min. dep. rate 417 A per min. uniformity across the wafer less than 1%. Good test.