From mferrier at snf.stanford.edu Mon Mar 8 18:30:27 2010 From: mferrier at snf.stanford.edu (mferrier at snf.stanford.edu) Date: Mon, 8 Mar 2010 18:30:27 -0800 Subject: Problem sts SNF 2010-03-08 18:30:26: can not pump down or purge Message-ID: From jhaydon at snf.stanford.edu Tue Mar 9 08:41:21 2010 From: jhaydon at snf.stanford.edu (jhaydon at snf.stanford.edu) Date: Tue, 9 Mar 2010 08:41:21 -0800 Subject: Problem sts SNF 2010-03-08 18:30:26: can not pump down or purge Message-ID: chip stuck on o-ring From sipark at snf.stanford.edu Tue Mar 9 22:36:50 2010 From: sipark at snf.stanford.edu (sipark at snf.stanford.edu) Date: Tue, 9 Mar 2010 22:36:50 -0800 Subject: Problem sts SNF 2010-03-09 22:36:50: Process tolerance error during warm up stage Message-ID: During warm up state, I got "Process tolerance error" message. I repeated my recipe but it showed the same message. From sipark at snf.stanford.edu Tue Mar 9 23:04:24 2010 From: sipark at snf.stanford.edu (sipark at snf.stanford.edu) Date: Tue, 9 Mar 2010 23:04:24 -0800 Subject: Problem sts SNF 2010-03-09 23:04:23: Con't from the previous one Message-ID: Previous user deposited SiO2, and I tried to deposit SiN but I couldn't. In that situation, did I need to do something? (I just wonder.) Thanks. From chingmei at snf.stanford.edu Wed Mar 10 12:20:18 2010 From: chingmei at snf.stanford.edu (chingmei at snf.stanford.edu) Date: Wed, 10 Mar 2010 12:20:18 -0800 Subject: Shutdown sts SNF 2010-03-10 12:20:17: Cleaning process Message-ID: Accidentally have glove touched the platen. Running a full cleaning cycle.Sorry about the inconvenience From jhaydon at snf.stanford.edu Wed Mar 10 15:51:01 2010 From: jhaydon at snf.stanford.edu (jhaydon at snf.stanford.edu) Date: Wed, 10 Mar 2010 15:51:01 -0800 Subject: Shutdown sts SNF 2010-03-10 12:20:17: Cleaning process Message-ID: STS should be back up around 7PM today From sipark at snf.stanford.edu Wed Mar 10 23:08:11 2010 From: sipark at snf.stanford.edu (sipark at snf.stanford.edu) Date: Wed, 10 Mar 2010 23:08:11 -0800 Subject: Problem sts SNF 2010-03-10 23:08:11: There is some problem in the warm up stage Message-ID: I found there is some problem in the warm up stage. Without the warm up stage, I was able to deposit nitride. But with warm up stage, the recipe didn't allowed me to proceed the next step with error message(it says process tolerance errorr). One more thing, accidently I rebooted the PC. ( I don't know how to get the main menu. ) Sorry for the inconvenience. Thanks. From sipark at snf.stanford.edu Wed Mar 10 23:09:50 2010 From: sipark at snf.stanford.edu (sipark at snf.stanford.edu) Date: Wed, 10 Mar 2010 23:09:50 -0800 Subject: Shutdown sts SNF 2010-03-10 23:09:50: There is some problem in the machine Message-ID: During the warm up stage, the stage was aborted, so I can't proceed the next stage(deposition) From jperez at snf.stanford.edu Thu Mar 11 07:21:24 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Thu, 11 Mar 2010 07:21:24 -0800 Subject: Shutdown sts SNF 2010-03-10 23:09:50: There is some problem in the machine Message-ID: Glad for the information From jperez at snf.stanford.edu Fri Mar 12 06:15:27 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Fri, 12 Mar 2010 06:15:27 -0800 Subject: Problem sts SNF 2010-03-10 23:08:11: There is some problem in the warm up stage Message-ID: The N2 purge flow meter was too high. This flow shouldn't be touchec. The reboot procedure is in the log book behind the blue cleaning procedures. From jperez at snf.stanford.edu Fri Mar 12 06:16:32 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Fri, 12 Mar 2010 06:16:32 -0800 Subject: Problem sts SNF 2010-03-09 22:36:50: Process tolerance error during warm up stage Message-ID: Reset N2 MFC. From jperez at snf.stanford.edu Fri Mar 12 06:16:49 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Fri, 12 Mar 2010 06:16:49 -0800 Subject: Problem sts SNF 2010-03-09 23:04:23: Con't from the previous one Message-ID: Reset N2 MFC. From mdickey at snf.stanford.edu Fri Mar 12 07:42:22 2010 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Fri, 12 Mar 2010 07:42:22 -0800 Subject: Comment sts SNF 2010-03-12 07:42:21: bottle switch Message-ID: Need to switch to bottle B. Currently purging bottle A From jperez at snf.stanford.edu Fri Mar 12 08:09:55 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Fri, 12 Mar 2010 08:09:55 -0800 Subject: Comment sts SNF 2010-03-12 07:42:21: bottle switch Message-ID: Just switched toggles A to B. Test in progress. From jperez at snf.stanford.edu Fri Mar 12 09:24:28 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Fri, 12 Mar 2010 09:24:28 -0800 Subject: Comment sts SNF 2010-02-09 10:48:45: Nitride TW dep. rate is 96.7A/min with replacement quartzware Message-ID: Nitride test after 2% silane bottle change was great! Avg. 982.9A Target 1000A, time 9.8min. Dep rate was 100A/min. Thickness across the wafer was less than 4%. From jperez at snf.stanford.edu Fri Mar 12 09:25:01 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Fri, 12 Mar 2010 09:25:01 -0800 Subject: Comment sts SNF 2010-02-08 16:34:30: New Test Results for Low Frequency Message-ID: New test good, Nitride test. From jperez at snf.stanford.edu Mon Mar 15 14:49:33 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Mon, 15 Mar 2010 14:49:33 -0700 Subject: Problem sts SNF 2010-03-15 14:49:31: Etch back 3 had to be restarted Message-ID: I went to clean the walls with IPA and large flakes of film started floating in the air. You could see film still peeling from the wall area. System may have more film deposited then what was written down on the log sheet. From jperez at snf.stanford.edu Wed Mar 17 08:02:14 2010 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Wed, 17 Mar 2010 08:02:14 -0700 Subject: Problem sts SNF 2010-03-15 14:49:31: Etch back 3 had to be restarted Message-ID: Second etch back 3 cleaned up the remaining film. From ajamo at snf.stanford.edu Sun Mar 28 13:20:02 2010 From: ajamo at snf.stanford.edu (ajamo at snf.stanford.edu) Date: Sun, 28 Mar 2010 13:20:02 -0700 Subject: Comment sts SNF 2010-03-28 13:20:02: Vent - intermittant Message-ID: I did 4 deps in STS. 3 times the chamber did not vent after pushing F3(Vent) and then F1. Screen said it was venting but after 5 min it never showed decompression and didn't open. I went through loading program & pump down to get back to the stand by screen & was able to successfully vent & unload wafers.