From flannery at stanford.edu  Thu Dec  7 05:37:28 2000
From: flannery at stanford.edu (Anthony Flannery)
Date: Thu, 07 Dec 2000 05:37:28 -0800
Subject: Back to normal
Message-ID: <3A2F9298.7199AC38@stanford.edu>

Hey Gang,
I will be starting the etchback process on carbide today and switching
the gases back to normal. The carbide etchback is a 6 hour process so
the system would be ready for a wipedown and clean later this evening
(Thursday 12/6).  I would continue with the cleaning but I am leaving
town for a couple of days so if you want to use it before I get back,
you'll have to take over from the first wipedown.  

IF THE CHAMBER LOOKS A LITTLE DIRTY - RUN ETCHBACK3 AGAIN!
Look especially on the roof of the chamber (use a blank wafer as a
mirror).  If you see dark streaks, it's not clean.  Do the wipe and then
run another clean.

Also, I looked back through the logbooks. ALmost all of you are
forgetting to include the thickness of the pre-deps in your running
count on the thickness.  The chamber starts with 1.25 um - ALWAYS. 
There should not be any log entries less than this.  The thickest
deposition is 3.25 um - NOT 4.5 um.  Thanks for keeping this straight.

Thanks for all your patience.  I'll be doing this once more before
Christmas shutdown, so if anyone's got a time critical run before that,
e-mail me and we will coordinate. Once I start, it's really prohibitive
to switch back and the standard processes are not compatible.  I'll work
around you, but you have to let me know in advance.

Thanks again,
Tony