Shutdown stsetch 2001-05-18 15:23:21: Wafer broke

booth at booth at
Fri May 18 05:49:27 PDT 2001

Cleaned up broken wafer & restarted machine.
Is it a surprise that when you deep etch and leave
only 10 microns of Silicon, with 10 Torr of Helium
pressure on the backside, that the wafer blows up?
If you etch so that there is less than 100 microns of
material left, you are required to bond your process
wafer to a carrier wafer.  If you need an exception to
this rule, consult with SNF staff for alternatives or
special approval.

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