Shutdown stsetch 2002-07-24 01:49:33: Broken wafer in the chamber

booth at booth at
Wed Jul 24 02:46:03 PDT 2002

cleaned up broken wafer from lwpan.
He etched completely through the 300micron
device wafer, and through the 500 micron carrier
wafer it was bonded to, and into the Helium lip seal
and the chuck (deposited crud).  I disassembled chuck
& scrubbed clean, reassembled it & cleaned LoadLock
of wafer pieces.  Ran 30 min O2 plasma - OK
Helium pressure steady at 9.82 Torr, flow about 2.4 sccm.

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