From booth at snf.stanford.edu Tue Oct 1 06:55:52 2002 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Oct 1, 2002 6:55:52 AM Subject: Shutdown stsetch 2002-10-01 06:55:51: LoadLock maintenance Message-ID: From booth at snf.stanford.edu Thu Oct 3 02:07:45 2002 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Oct 3, 2002 2:07:45 PM Subject: Shutdown stsetch 2002-10-01 06:55:51: LoadLock maintenance Message-ID: STS has replaced the flakey part that was causing the LoadArm to stall. Cycled the loadarm 15 times with no more failures. Muhammad ran 30 min of the O2 clean recipe. From qtang at snf.stanford.edu Fri Oct 4 01:11:51 2002 From: qtang at snf.stanford.edu (qtang at snf.stanford.edu) Date: Oct 4, 2002 1:11:51 AM Subject: Shutdown stsetch 2002-10-04 01:11:51: wafer piece left inside STS main chamber Message-ID: a piece of wafer peeled off during loading and left inside the STS main chamber. I am terribly sorry about this. This time, I was trying to use SPR220 for wafer bonding instead of 3612 because 3612 didn't work. The reason for the trouble might be that I am using single-side polished wafer which has rough back surface and might be hard for bonding. I was very careful and watched the whole process. Pumping down seems OK, but at the end of the loading, the bonding wafer piece jumped up. I think the reason might be that the cooling He gas deformed the 4" wafer which caused the bonded piece peel off. With 220, the bonding has been much better, but somehow it's too brittle and vulnerable to deformation. I am very sorry about this. But please do not kick me out of the user list. I was just trying to solve the bondng problem. I need the machine very much. Thank you! From booth at snf.stanford.edu Fri Oct 4 08:08:15 2002 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Oct 4, 2002 8:08:15 AM Subject: Shutdown stsetch 2002-10-04 01:11:51: wafer piece left inside STS main chamber Message-ID: opened etch chamber & removed 1/4 wafer that delaminated from carrier wafer. Ran 30 min O2clean recipe. From haniff at snf.stanford.edu Sun Oct 6 10:21:07 2002 From: haniff at snf.stanford.edu (haniff at snf.stanford.edu) Date: Oct 6, 2002 10:21:07 AM Subject: Problem stsetch 2002-10-06 10:21:03: Message-ID: load lock will not vent. (pump down time exceeded) My wafer remains inside. From bchui at snf.stanford.edu Sun Oct 6 09:54:58 2002 From: bchui at snf.stanford.edu (bchui at snf.stanford.edu) Date: Oct 6, 2002 9:54:58 PM Subject: Problem stsetch 2002-10-06 21:54:55: load lock problem, wfr trapped Message-ID: From booth at snf.stanford.edu Mon Oct 7 07:05:21 2002 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Oct 7, 2002 7:05:21 AM Subject: Problem stsetch 2002-10-06 21:54:55: load lock problem, wfr trapped Message-ID: ericp rebooted pc. From booth at snf.stanford.edu Mon Oct 7 07:06:04 2002 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Oct 7, 2002 7:06:04 AM Subject: Problem stsetch 2002-10-06 10:21:03: Message-ID: ericp rebooted pc. From amyers at snf.stanford.edu Mon Oct 7 04:18:18 2002 From: amyers at snf.stanford.edu (amyers at snf.stanford.edu) Date: Oct 7, 2002 4:18:18 PM Subject: Problem stsetch 2002-10-07 16:18:17: sts load lock Message-ID: Will not vent From cbaxter at snf.stanford.edu Mon Oct 7 10:53:46 2002 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Oct 7, 2002 10:53:46 PM Subject: Problem stsetch 2002-10-07 16:18:17: sts load lock Message-ID: was able to vent loadlock From jdas at snf.stanford.edu Tue Oct 8 09:36:37 2002 From: jdas at snf.stanford.edu (jdas at snf.stanford.edu) Date: Oct 8, 2002 9:36:37 AM Subject: Problem stsetch 2002-10-08 09:36:36: Load lock pump down too slow Message-ID: From haniff at snf.stanford.edu Tue Oct 8 09:50:12 2002 From: haniff at snf.stanford.edu (haniff at snf.stanford.edu) Date: Oct 8, 2002 9:50:12 AM Subject: Shutdown stsetch 2002-10-08 09:50:11: excessive load lock pumpdown delay Message-ID: From booth at snf.stanford.edu Tue Oct 8 10:47:49 2002 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Oct 8, 2002 10:47:49 AM Subject: Problem stsetch 2002-10-08 09:36:36: Load lock pump down too slow Message-ID: see shutdown. From booth at snf.stanford.edu Tue Oct 8 10:48:35 2002 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Oct 8, 2002 10:48:35 AM Subject: Shutdown stsetch 2002-10-08 09:50:11: excessive load lock pumpdown delay Message-ID: replaced LoadLock O-ring & installed thrust washer correctly. From xjzhang at snf.stanford.edu Thu Oct 10 08:59:50 2002 From: xjzhang at snf.stanford.edu (xjzhang at snf.stanford.edu) Date: Oct 10, 2002 8:59:50 PM Subject: Comment stsetch 2002-10-10 20:59:49: STS free 0:00am- Message-ID: From xjzhang at snf.stanford.edu Thu Oct 10 09:00:18 2002 From: xjzhang at snf.stanford.edu (xjzhang at snf.stanford.edu) Date: Oct 10, 2002 9:00:18 PM Subject: Comment stsetch 2002-10-10 21:00:18: STS free Fri. 0:00am to 4:30am Message-ID: From lwpan at snf.stanford.edu Wed Oct 23 03:08:35 2002 From: lwpan at snf.stanford.edu (lwpan at snf.stanford.edu) Date: Oct 23, 2002 3:08:35 PM Subject: Shutdown stsetch 2002-10-23 15:08:34: wafer was broken in the chamber Message-ID: Two photoresist bonded wafers exploded in the etching chamber right after loading. No etching was performed. Nancy has been informed about this situation. I apologize for the accident. Li-Wei Pan, liweipan at yahoo.com From cbaxter at snf.stanford.edu Wed Oct 23 05:47:41 2002 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Oct 23, 2002 5:47:41 PM Subject: Shutdown stsetch 2002-10-23 15:08:34: wafer was broken in the chamber Message-ID: cleaned shattered wafer in inside the chamber and load lock, ran 30 mins o2 clean