Problem stsetch 2003-02-28 05:27:11: Chip in Chamber

[zappe at snf.stanford.edu]

For a through wafer etch I bonded (with photoresist) a wafer to another wafer. At the end of the etch process a chip that was held by 2 mm wide cantilevers suddenly popped up. It seems that air was trapped underneath and in spite of the large bonding area, the bonding force and cantilever stability were too weak.
I didn't expect this at all - sorry for the trouble !
Stefan