Problem stsetch 2003-02-28 05:27:11: Chip in Chamber

zappe at zappe at
Fri Feb 28 05:27:12 PST 2003

For a through wafer etch I bonded (with photoresist) a wafer to another wafer. At the end of the etch process a chip that was held by 2 mm wide cantilevers suddenly popped up. It seems that air was trapped underneath and in spite of the large bonding area, the bonding force and cantilever stability were too weak.
I didn't expect this at all - sorry for the trouble !

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