Shutdown stsetch 2003-07-07 19:59:03: Report Clear for stsetch

[booth at snf.stanford.edu]

cleaned out broken wafer of YETAO from etch chamber
and LoadLock.  Wafer appears to have broken during
attempt to unload.  Wafer piece measures ~380 microns
thick, and had been etched on BOTH SIDES.
Perhaps the silicon that was left was too thin to withstand
the Helium pressure & the mechanical clamp fingers?