From jleu at snf.stanford.edu  Sat Oct 11 02:41:55 2003
From: jleu at snf.stanford.edu (jleu at snf.stanford.edu)
Date: Oct 11, 2003 2:41:55 AM
Subject: Comment stsetch 2003-10-11 02:41:51: Report Comment for stsetch
Message-ID: <mailman.778.1357938647.25867.stsetch-pcs@snf.stanford.edu>

After removing my wafer from the aluminum holder, I observed some resist residue on the o-ring and holder.
jleu



From sigari at snf.stanford.edu  Mon Oct 13 08:16:23 2003
From: sigari at snf.stanford.edu (sigari at snf.stanford.edu)
Date: Oct 13, 2003 8:16:23 AM
Subject: Shutdown stsetch 2003-10-13 08:16:22: Report Shutdown for stsetch
Message-ID: <mailman.779.1357938647.25867.stsetch-pcs@snf.stanford.edu>




From sigari at snf.stanford.edu  Mon Oct 13 08:18:44 2003
From: sigari at snf.stanford.edu (sigari at snf.stanford.edu)
Date: Oct 13, 2003 8:18:44 AM
Subject: Shutdown stsetch 2003-10-13 08:18:43: Report Shutdown for stsetch
Message-ID: <mailman.780.1357938647.25867.stsetch-pcs@snf.stanford.edu>

The load program unloaded the chuck to the main chamber.



From cbaxter at snf.stanford.edu  Mon Oct 13 08:22:24 2003
From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu)
Date: Oct 13, 2003 8:22:24 PM
Subject: Shutdown stsetch 2003-10-13 08:18:43: Report Clear for stsetch
Message-ID: <mailman.781.1357938647.25867.stsetch-pcs@snf.stanford.edu>

problem was fixed by len



From cbaxter at snf.stanford.edu  Mon Oct 13 08:22:39 2003
From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu)
Date: Oct 13, 2003 8:22:39 PM
Subject: Shutdown stsetch 2003-10-13 08:16:22: Report Clear for stsetch
Message-ID: <mailman.782.1357938647.25867.stsetch-pcs@snf.stanford.edu>




From mislam at snf.stanford.edu  Thu Oct 23 08:45:33 2003
From: mislam at snf.stanford.edu (mislam at snf.stanford.edu)
Date: Thu, 23 Oct 2003 08:45:33 -0700
Subject: Shutdown stsetch 2003-10-23 08:45:32: Found broken wafer in chamber
Message-ID: <mailman.783.1357938647.25867.stsetch-pcs@snf.stanford.edu>

A broken piece of wafer is left in the chamber
from  user naiqian's  wafer.



From booth at snf.stanford.edu  Thu Oct 23 13:55:36 2003
From: booth at snf.stanford.edu (booth at snf.stanford.edu)
Date: Thu, 23 Oct 2003 13:55:36 -0700
Subject: Shutdown stsetch 2003-10-23 08:45:32: Report Clear for stsetch
Message-ID: <mailman.784.1357938647.25867.stsetch-pcs@snf.stanford.edu>

wafer was broken in the etch chamber after the
etch process was over.  Wafer was loaded without
the Aluminum carrier & without being bonded to
a carrier wafer.  There was thick resist on the backside
of the process wafer, so it was glued to the cathode.
When the system tried to lift the wafer from the cathode,
the wafer broke.