Shutdown stsetch 2003-10-23 08:45:32: Report Clear for stsetch

[booth at snf.stanford.edu]

wafer was broken in the etch chamber after the
etch process was over.  Wafer was loaded without
the Aluminum carrier & without being bonded to
a carrier wafer.  There was thick resist on the backside
of the process wafer, so it was glued to the cathode.
When the system tried to lift the wafer from the cathode,
the wafer broke.