Shutdown stsetch 2003-10-23 08:45:32: Report Clear for stsetch

booth at snf.stanford.edu booth at snf.stanford.edu
Thu Oct 23 13:55:36 PDT 2003


wafer was broken in the etch chamber after the
etch process was over.  Wafer was loaded without
the Aluminum carrier & without being bonded to
a carrier wafer.  There was thick resist on the backside
of the process wafer, so it was glued to the cathode.
When the system tried to lift the wafer from the cathode,
the wafer broke.




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