From zappe at snf.stanford.edu Wed Jun 15 22:56:07 2005 From: zappe at snf.stanford.edu (zappe at snf.stanford.edu) Date: Wed, 15 Jun 2005 22:56:07 -0700 Subject: Problem stsetch SNF 2005-06-15 22:56:06: Etching of backside Message-ID: The wafer and the sealing ring on the chuck are not centered with respect to each other. With the main flat oriented to the right, there seems to be a gas leak and the backside of the wafer is etched at locations close to sealing ring. Pressure and He flow seem to be normal, though. From cbaxter at snf.stanford.edu Wed Jun 15 23:12:43 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Wed, 15 Jun 2005 23:12:43 -0700 Subject: Problem stsetch SNF 2005-06-15 22:56:06: Etching of backside Message-ID: loaded a dummy wafer and checked clamping, it looks normal and backside he leak 2.1sccm which is good. From eenriquez at snf.stanford.edu Fri Jun 17 09:44:34 2005 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 17 Jun 2005 09:44:34 -0700 Subject: Shutdown stsetch SNF 2005-06-17 09:44:33: System not powering up Message-ID: From eenriquez at snf.stanford.edu Fri Jun 17 10:47:18 2005 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 17 Jun 2005 10:47:18 -0700 Subject: Shutdown stsetch SNF 2005-06-17 09:44:33: System not powering up Message-ID: Reset the isolator switch. Ran 30 minute O2 plasma. From hopcroft at snf.stanford.edu Mon Jun 20 16:01:44 2005 From: hopcroft at snf.stanford.edu (hopcroft at snf.stanford.edu) Date: Mon, 20 Jun 2005 16:01:44 -0700 Subject: Problem stsetch SNF 2005-06-20 16:01:43: software locked up Message-ID: The control software is locked up. Wafer is stuck in chamber. From cbaxter at snf.stanford.edu Mon Jun 20 18:28:48 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mon, 20 Jun 2005 18:28:48 -0700 Subject: Problem stsetch SNF 2005-06-20 16:01:43: software locked up Message-ID: reset pc. From bchui at snf.stanford.edu Mon Jun 20 22:52:53 2005 From: bchui at snf.stanford.edu (bchui at snf.stanford.edu) Date: Mon, 20 Jun 2005 22:52:53 -0700 Subject: Problem stsetch SNF 2005-06-20 22:52:52: silicon etch rate down; resist etch rate up Message-ID: silicon etch rate down more than 50% compared to last night; resist etch rate up substantially as well. From cbaxter at snf.stanford.edu Mon Jun 20 23:49:17 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mon, 20 Jun 2005 23:49:17 -0700 Subject: Problem stsetch SNF 2005-06-20 22:52:52: silicon etch rate down; resist etch rate up Message-ID: chamber leak rate is good @0.78mt per which is good checked chiller is @18C. process pressure is running high (55mt etch/25mt pass, normal is 45mt/18mt). suspect foreline below the turbo has to much depisition. foreline will to be removed and cleaned. From cbaxter at snf.stanford.edu Mon Jun 20 23:52:31 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mon, 20 Jun 2005 23:52:31 -0700 Subject: Problem stsetch SNF 2005-06-20 23:52:30: Etch rates are off Message-ID: Due to high pressure, etch rates are not normal. Users measured a wafer with low exposed area at 5 micron/min, and another user measures 0.5 micron/min with wafer having high exposed area. Will schedule foreline system maintenance for tomorrow (Tuesday eve). From crichter at snf.stanford.edu Tue Jun 21 16:29:37 2005 From: crichter at snf.stanford.edu (crichter at snf.stanford.edu) Date: Tue, 21 Jun 2005 16:29:37 -0700 Subject: Comment stsetch SNF 2005-06-21 16:29:36: Etch rates during run were ok for my feature size Message-ID: My features are about 300 microns by 1mm long. The etch rates were at 1.18-1.4 microns/min. From cbaxter at snf.stanford.edu Tue Jun 21 16:51:14 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Tue, 21 Jun 2005 16:51:14 -0700 Subject: Problem stsetch SNF 2005-06-20 23:52:30: Etch rates are off Message-ID: wiil reserve the tool next week to work on the foreline. From hra at snf.stanford.edu Tue Jun 21 21:37:25 2005 From: hra at snf.stanford.edu (hra at snf.stanford.edu) Date: Tue, 21 Jun 2005 21:37:25 -0700 Subject: Problem stsetch SNF 2005-06-21 21:37:24: wafer stuck in STS chamber 21:30 Message-ID: please help asap From hra at snf.stanford.edu Tue Jun 21 21:57:49 2005 From: hra at snf.stanford.edu (hra at snf.stanford.edu) Date: Tue, 21 Jun 2005 21:57:49 -0700 Subject: Comment stsetch SNF 2005-06-21 21:57:48: problem fixed Message-ID: wafer was successfully retrieved From cbaxter at snf.stanford.edu Tue Jun 21 22:19:24 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Tue, 21 Jun 2005 22:19:24 -0700 Subject: Comment stsetch SNF 2005-06-21 21:57:48: problem fixed Message-ID: From cbaxter at snf.stanford.edu Tue Jun 21 22:19:35 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Tue, 21 Jun 2005 22:19:35 -0700 Subject: Problem stsetch SNF 2005-06-21 21:37:24: wafer stuck in STS chamber 21:30 Message-ID: From eenriquez at snf.stanford.edu Wed Jun 29 16:17:07 2005 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 29 Jun 2005 16:17:07 -0700 Subject: Shutdown stsetch SNF 2005-06-29 16:17:07: Deposition on backside of the wafer Message-ID: Users need to check if the platten power generator is set on the proper range for their process. For example; the Deep recipe calls for 120 watts of platten power, the generator must be on the 300 watt range. The amb_ber1 recipe calls for 10 watts of platten power, the generator needs to be set at the 30 watt range. From cbaxter at snf.stanford.edu Wed Jun 29 17:06:34 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Wed, 29 Jun 2005 17:06:34 -0700 Subject: Shutdown stsetch SNF 2005-06-29 16:17:07: Deposition on backside of the wafer Message-ID: wafer are coming ok, after elmer ran o2 clean plasma. From cbaxter at snf.stanford.edu Wed Jun 29 17:52:28 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Wed, 29 Jun 2005 17:52:28 -0700 Subject: Shutdown stsetch SNF 2005-06-29 17:52:27: still residue mark on back of the wafer Message-ID: From cbaxter at snf.stanford.edu Wed Jun 29 20:43:26 2005 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Wed, 29 Jun 2005 20:43:26 -0700 Subject: Shutdown stsetch SNF 2005-06-29 17:52:27: still residue mark on back of the wafer Message-ID: vented chamber and cleaned lower electrode, ceramic insulator and installed new lip seal oring. also, with eric's help we cleaned the foreline below the turbo and installed new foreline pipe that elmer made. we ran a 30mins o2 clean and checked the back of the wafer and it was clean .