From latta at snf.stanford.edu Thu Jan 3 11:49:25 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 3 Jan 2008 11:49:25 -0800 Subject: Comment stsetch SNF 2007-11-01 10:44:09: Whole carrier wafer in chamber Message-ID: From latta at snf.stanford.edu Thu Jan 3 11:49:36 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 3 Jan 2008 11:49:36 -0800 Subject: Comment stsetch SNF 2007-10-30 15:22:24: noticed pink plasma.... Message-ID: From latta at snf.stanford.edu Thu Jan 3 15:12:22 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 3 Jan 2008 15:12:22 -0800 Subject: Shutdown stsetch SNF 2008-01-03 15:12:22: coil generator not turning on Message-ID: judt doing a 30 min DEEP seasoning... Wafer still on chuck. From eenriquez at snf.stanford.edu Fri Jan 4 09:31:58 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 4 Jan 2008 09:31:58 -0800 Subject: Shutdown stsetch SNF 2008-01-03 15:12:22: coil generator not turning on Message-ID: Reset the backside He pressure controller. Lowered in-coming He pressure from 20 psi to 10 psi. Set backside He pressure to 9.0 Torr From eenriquez at snf.stanford.edu Fri Jan 4 09:32:37 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 4 Jan 2008 09:32:37 -0800 Subject: Problem stsetch SNF 2008-01-04 09:32:36: Needs a process qual. Message-ID: From latta at snf.stanford.edu Fri Jan 4 11:30:58 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Fri, 4 Jan 2008 11:30:58 -0800 Subject: Problem stsetch SNF 2008-01-04 09:32:36: Needs a process qual. Message-ID: Qual done. Results to be posted in comments. From xzhuan1 at snf.stanford.edu Sat Jan 5 19:56:40 2008 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Sat, 5 Jan 2008 19:56:40 -0800 Subject: Problem stsetch SNF 2008-01-05 19:56:39: communication error Message-ID: From mislam at snf.stanford.edu Sun Jan 6 12:32:08 2008 From: mislam at snf.stanford.edu (mislam at snf.stanford.edu) Date: Sun, 6 Jan 2008 12:32:08 -0800 Subject: Problem stsetch SNF 2008-01-06 12:32:07: no plasma, coil power tolerance error Message-ID: From eenriquez at snf.stanford.edu Mon Jan 7 11:22:37 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 7 Jan 2008 11:22:37 -0800 Subject: Problem stsetch SNF 2008-01-05 19:56:39: communication error Message-ID: No problem found. System had no faults when I go to the system. From eenriquez at snf.stanford.edu Mon Jan 7 11:38:44 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 7 Jan 2008 11:38:44 -0800 Subject: Problem stsetch SNF 2008-01-06 12:32:07: no plasma, coil power tolerance error Message-ID: Adjusted the backside helium dump valve flow to accomodate the higher leak rate of the wafer carrier. Now able to run with the carrier at the max He pressure set point of 9.84 Torr. I set the pressure back to 9 Torr . Had no problem running a wafer with and without a carrier. From mvikram at snf.stanford.edu Thu Jan 10 18:54:13 2008 From: mvikram at snf.stanford.edu (mvikram at snf.stanford.edu) Date: Thu, 10 Jan 2008 18:54:13 -0800 Subject: Problem stsetch SNF 2008-01-10 18:54:12: "Coil power out of tolerance " error Message-ID: No plasma in mid process. From eenriquez at snf.stanford.edu Fri Jan 11 10:30:16 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 11 Jan 2008 10:30:16 -0800 Subject: Problem stsetch SNF 2008-01-10 18:54:12: "Coil power out of tolerance " error Message-ID: Ran wafer using the carrier with no problems. The backside helium flow at 9 Torr is around 2.5 sccm. The fault limit is > 4 sccm. Also ran at the maximum pressure setting of 9.85 Torr. The flow rate at the max press setting was 2.8 sccm. The most likely cause of the coil out of tolerance fault was that the process broke through the wafer From quickwin at snf.stanford.edu Sat Jan 12 13:13:28 2008 From: quickwin at snf.stanford.edu (quickwin at snf.stanford.edu) Date: Sat, 12 Jan 2008 13:13:28 -0800 Subject: Problem stsetch SNF 2008-01-12 13:13:27: plasma is not always on as it should Message-ID: When using DEEP program, plasma frequently turns off for long time (I counted 23 seconds) before it turned on again. There is also one "power tolerance error". From ericp at snf.stanford.edu Sat Jan 12 18:23:19 2008 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Sat, 12 Jan 2008 18:23:19 -0800 Subject: Problem stsetch SNF 2008-01-12 18:23:18: plasma cut out, and He flow low? Message-ID: In addition to the problem quickwin reports (plasma cut out) I also notice that the He flow is substantially lower than usual (1 sccm versus normal of 2.5-3). The plasma cut out seems to occur when it switches to etch cycle, then plasma is out for varying times, then restrikes. Obviously when the plasma cuts out on a switched process, it wrecks the wafer! From eenriquez at snf.stanford.edu Mon Jan 14 14:53:07 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Jan 2008 14:53:07 -0800 Subject: Problem stsetch SNF 2008-01-12 18:23:18: plasma cut out, and He flow low? Message-ID: Ran the deep process 4x without any problems. The plasma "winked" out for < 1 sec when switching from dep to etch. I think this is normal but I will ask Nancy to run a process qual and compare the result with our process charts. I changed the RF match pre-tune settings to more closely match the tune points during process. One way to eliminate the "winking" out of the plasma is to set coil matching control to Manual instead of Auto. I left both the coil and platten controls on Auto. As far as the backside He flow. I have reduced the amount of He going out the dump valve (goes to vac pump) in order to accomodate the higher leak rate of the wafer carriers. By reducing the dump valve flow, we are able to reliably maintain the total He flow below 4 sccm. When the flow goes over 4 sccm, the controller shuts off the RF power and we get a "coil out of tolerance" alarm. With the lower dump valve flow, we can now run the He pressure to maximum (9.8 Torr) without tripping the alarm. The alarm however will still trip if there is an actual leak. From eenriquez at snf.stanford.edu Mon Jan 14 14:53:18 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Jan 2008 14:53:18 -0800 Subject: Problem stsetch SNF 2008-01-12 13:13:27: plasma is not always on as it should Message-ID: Ran the deep process 4x without any problems. The plasma "winked" out for < 1 sec when switching from dep to etch. I think this is normal but I will ask Nancy to run a process qual and compare the result with our process charts. I changed the RF match pre-tune settings to more closely match the tune points during process. One way to eliminate the "winking" out of the plasma is to set coil matching control to Manual instead of Auto. I left both the coil and platten controls on Auto. As far as the backside He flow. I have reduced the amount of He going out the dump valve (goes to vac pump) in order to accomodate the higher leak rate of the wafer carriers. By reducing the dump valve flow, we are able to reliably maintain the total He flow below 4 sccm. When the flow goes over 4 sccm, the controller shuts off the RF power and we get a "coil out of tolerance" alarm. With the lower dump valve flow, we can now run the He pressure to maximum (9.8 Torr) without tripping the alarm. The alarm however will still trip if there is an actual leak. From eenriquez at snf.stanford.edu Mon Jan 14 14:55:37 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Jan 2008 14:55:37 -0800 Subject: Comment stsetch SNF 2008-01-14 14:55:36: Needs a process qual Message-ID: From eenriquez at snf.stanford.edu Mon Jan 14 14:55:44 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Jan 2008 14:55:44 -0800 Subject: Comment stsetch SNF 2008-01-14 14:55:36: Needs a process qual Message-ID: From eenriquez at snf.stanford.edu Mon Jan 14 14:55:58 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Jan 2008 14:55:58 -0800 Subject: Problem stsetch SNF 2008-01-14 14:55:57: Needs a process qual Message-ID: From ericp at snf.stanford.edu Mon Jan 14 18:44:06 2008 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Mon, 14 Jan 2008 18:44:06 -0800 Subject: Problem stsetch SNF 2008-01-14 18:44:05: THIS IS NOT A SOLUTION! Message-ID: Could we PLEASe quit mickey-mousing the equipment, and actually FIX it. This is the SECOND time someone's expensive wafer has been BURNED by maintenance "fixing" a machine by changing critical process parameters. STOP CHANGING THE MACHINES AND FIX THEM, please! From eenriquez at snf.stanford.edu Tue Jan 15 07:34:22 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Jan 2008 07:34:22 -0800 Subject: Problem stsetch SNF 2008-01-14 18:44:05: THIS IS NOT A SOLUTION! Message-ID: From ericp at snf.stanford.edu Wed Jan 16 00:22:50 2008 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Wed, 16 Jan 2008 00:22:50 -0800 Subject: Problem stsetch SNF 2008-01-16 00:22:49: still observe plasma cutout Message-ID: "coil power out of tolerance". Also, He flow is anomolously low at 1sccm, which has never been observed on this system in >10 years. What was changed ?????? From eenriquez at snf.stanford.edu Thu Jan 17 11:49:00 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Jan 2008 11:49:00 -0800 Subject: Problem stsetch SNF 2008-01-16 00:22:49: still observe plasma cutout Message-ID: Plasma is suppose to cutout if the total He flow is > than 4 sccm. Up until about 2 years ago, the backside He leak interlock had been bypassed. Since then, users have lowered the He pressure setting in order to stay below 4 sccm flow. This practice compromises the wafer because the backside pressure has a larger effect on cooling than does the flow. Now that I have properly adjusted the He dump valve flow, we can now reliably set the backside pressure to 9 Torr without tripping the 4 sccm interlock. Unless the user's wafer is damaged or porous. From eenriquez at snf.stanford.edu Thu Jan 17 11:52:23 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Jan 2008 11:52:23 -0800 Subject: Problem stsetch SNF 2008-01-14 14:55:57: Needs a process qual Message-ID: Nancy ran test without any problems From ericp at snf.stanford.edu Fri Jan 25 22:08:33 2008 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Fri, 25 Jan 2008 22:08:33 -0800 Subject: Problem stsetch SNF 2008-01-25 22:08:32: "Coil power out of tolerance" Message-ID: It's happening again. It seems that it occurs more often with recipes having higher coil power >600W. From mtan at snf.stanford.edu Sat Jan 26 12:21:49 2008 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Sat, 26 Jan 2008 12:21:49 -0800 Subject: Problem stsetch SNF 2008-01-26 12:21:48: No plasma Message-ID: 1) The software showed plasma running, but no plasma showed up in the chamber. 2) Both the pressure and the temperature were out of range oon the nRF generator. From eenriquez at snf.stanford.edu Mon Jan 28 09:36:42 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 28 Jan 2008 09:36:42 -0800 Subject: Problem stsetch SNF 2008-01-26 12:21:48: No plasma Message-ID: Processed 2 wafer w/carrier using the DEEP recipe with no problems. Also had no problems running 2 wafer w/carrier using JAS recipe. I believe that the "No plasma" , "Coil out of tolerance" faults is caused by either a "leaky" wafer or a wafer that is not properly loaded onto the platen. In order to help me troubleshoot this problem, please either save the "bad" wafer for me or run your process when I am here. From eenriquez at snf.stanford.edu Mon Jan 28 09:36:53 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 28 Jan 2008 09:36:53 -0800 Subject: Problem stsetch SNF 2008-01-25 22:08:32: "Coil power out of tolerance" Message-ID: Processed 2 wafer w/carrier using the DEEP recipe with no problems. Also had no problems running 2 wafer w/carrier using JAS recipe. I believe that the "No plasma" , "Coil out of tolerance" faults is caused by either a "leaky" wafer or a wafer that is not properly loaded onto the platen. In order to help me troubleshoot this problem, please either save the "bad" wafer for me or run your process when I am here. From eenriquez at snf.stanford.edu Mon Jan 28 09:37:05 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 28 Jan 2008 09:37:05 -0800 Subject: Comment stsetch SNF 2007-12-21 10:56:53: Wet cleaned chamber. Message-ID: Noted From ericp at snf.stanford.edu Mon Jan 28 21:56:57 2008 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Mon, 28 Jan 2008 21:56:57 -0800 Subject: Comment stsetch SNF 2008-01-28 21:56:56: coil power problem Message-ID: That ain't it. In the cases I observed, the He flow was reading 0.9 - 1.0 during the failure. (Which is, I believe, also a problem (related or not), as we've never seen this low reading in the 11 years we've had the machine.) I am not sure if this reading is the FLOW or the LEAK, but I believe it is FLOW, which is NOT ideally zero. Why was this changed? It's annoying that this problem keeps getting erased and put back to green, because it is RUINING DEVICE WAFERS. Perhaps it's not clear why this intermittent problem has serious consequences even if the plasma only cuts out for a few seconds: this is a switched process, "etch then passivate then etch then passivate". If the plasma drops out for 10 seconds, and goes instead "etch then passivate, then passivate, then etch" or "etch then passivate then etch then etch" then our entire etch profile is wrecked, meaning the wafer is scrapped. The probability of this happening in a typical 1 hour etch is now very high, so the machine is unusable for any fine etching work. Given that we call this a "NANOfabrication Lab", it only makes sense that such a problem needs to be fixed rather than "observed". This problem has been reported for over a month now, and not seriously addressed, while wrecking numerous device wafers. From mislam at snf.stanford.edu Wed Jan 30 21:42:12 2008 From: mislam at snf.stanford.edu (mislam at snf.stanford.edu) Date: Wed, 30 Jan 2008 21:42:12 -0800 Subject: Problem stsetch SNF 2008-01-30 21:42:12: Coil power tolerance error, plasma off/on Message-ID: Plasma shuts off for extended period of time, misses for few cycle and comes back. Somtime process clock keeps running without plasma and no error is dispayed. He flow is around 1.0. Sometime a 'Coil Power Tolerance' comes up. From latta at snf.stanford.edu Thu Jan 31 16:29:49 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 31 Jan 2008 16:29:49 -0800 Subject: Problem stsetch SNF 2008-01-30 21:42:12: Coil power tolerance error, plasma off/on Message-ID: See comment- we have bypassed the He leak interlock. From latta at snf.stanford.edu Thu Jan 31 16:34:53 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 31 Jan 2008 16:34:53 -0800 Subject: Comment stsetch SNF 2008-01-31 16:34:53: He interlock bypassed Message-ID: Folks, In an effort to track down the intermittent 'coil out of tolerance' error we have bypassed the He leak interlock. This should widen the tolerance for leaking before the tool shuts off the RF. Bypassing the interlock is not new to the operation of the tool. We ran for many years. Please report any problems you have and please include which program you were running when the problem occured. Thanks for you patience- Team Stsetch