Problem stsetch SNF 2009-08-08 15:35:23: bad etch

quickwin at snf.stanford.edu quickwin at snf.stanford.edu
Sat Aug 8 15:35:24 PDT 2009


I used my regular DEEP to etch through the wafer.  The wafer came out totally charred.  I noticed that the backside pressure fluctrated from 9.80 to 9.96, which is probably due to teflon buildup on the wafer o-ring.  But this is not the reason for my bad etch.  Something is not right with this machine!




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