From latta at snf.stanford.edu Tue Sep 1 07:17:56 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 1 Sep 2009 07:17:56 -0700 Subject: Problem stsetch SNF 2009-09-01 07:17:55: Coil ref pw jumpy Message-ID: Seems to happen when plated pwr is on. Goes as high as 130W. From latta at snf.stanford.edu Tue Sep 1 07:19:27 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 1 Sep 2009 07:19:27 -0700 Subject: Problem stsetch SNF 2009-09-01 07:19:27: Check you recipes!!! Message-ID: Someone 'adjusted' the DEEP recipe. Please Do No Do That! And protect yourself by checking the recipe conditions before committing your wafers to the etch. From eenriquez at snf.stanford.edu Wed Sep 2 07:36:54 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 2 Sep 2009 07:36:54 -0700 Subject: Shutdown stsetch SNF 2009-09-02 07:36:53: Performing PM Message-ID: From eenriquez at snf.stanford.edu Wed Sep 2 11:15:33 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 2 Sep 2009 11:15:33 -0700 Subject: Comment stsetch SNF 2009-09-02 11:15:32: Update Message-ID: Completed chamber clean. Replaced upper and lower chamber orings and also the lip seal oring. Now running an O2 plasma. System should be ready for qual by 3 pm From eenriquez at snf.stanford.edu Wed Sep 2 18:43:52 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 2 Sep 2009 18:43:52 -0700 Subject: Shutdown stsetch SNF 2009-09-02 07:36:53: Performing PM Message-ID: Completed the PM. Cleaned all the ceramic parts including the chamber. Rebuilt the clamp assembly. Replaced upper and lower chamber orings and also the lip seal oring. Checked the turbo pump foreline (95% clear). Leak rate before the PM = 0.3 mT/min,: After the PM= 0.5 mT/min Performed He leak test before and after the PM-- found no leak Peformed gas flow verification using a calibrated Mass flow meter. -- C4F8 was about 3% lower than indicated on the screen -- SF6 was about 4-5% lower than indicated on the screen. The SF6 flow also became unstable when I tried to flow more than 150 sccm (most recipes flow 130 sccm) From eenriquez at snf.stanford.edu Wed Sep 2 18:44:03 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 2 Sep 2009 18:44:03 -0700 Subject: Comment stsetch SNF 2009-09-02 11:15:32: Update Message-ID: Archived From eenriquez at snf.stanford.edu Wed Sep 2 18:44:23 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 2 Sep 2009 18:44:23 -0700 Subject: Comment stsetch SNF 2009-07-10 15:07:46: Update system lockup Message-ID: Archived From eenriquez at snf.stanford.edu Wed Sep 2 18:44:54 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 2 Sep 2009 18:44:54 -0700 Subject: Problem stsetch SNF 2009-07-08 03:09:44: standby mode: pumping out Message-ID: Replaced battery backup baterry. From latta at snf.stanford.edu Thu Sep 3 09:59:01 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 3 Sep 2009 09:59:01 -0700 Subject: Comment stsetch SNF 2009-09-03 09:59:01: Quals before and after chamber clean & PM Message-ID: Here are the results of the pre and post chamber clean etches in stsetch; Pre Clean; Wafer 1 avr ER Si = 2.12um/min, avr ER PR = 296A/min, selectivity Si : PR = 72 :1 Wafer 2 avr ER Si = 1.91um/min, avr ER PR = 245A/min, selectivity Si : PR = 80 :1 Post Clean; Wafer 1 avr ER Si = 1.97um/min, avr ER PR = 293A/min, selectivity Si : PR = 67 :1 Wafer 2 avr ER Si = 2.21um/min, avr ER PR = 323A/min, selectivity Si : PR = 68 :1 Uniformity improved somewhat after the clean. All data available, just ask. From quickwin at snf.stanford.edu Fri Sep 4 20:11:02 2009 From: quickwin at snf.stanford.edu (quickwin at snf.stanford.edu) Date: Fri, 4 Sep 2009 20:11:02 -0700 Subject: Problem stsetch SNF 2009-09-04 20:11:02: silicon:oxide selectivity is still bad Message-ID: I did two etches today. I confirm that oxide etch rate is too fast and silicon etch rate is too slow. I need SNF to experiment with the butterfly valve setting so that the processing pressure is selected correctly for this powerful turbo pump - if this is the reason for the problem that I see. For now I have released my process time. From quickwin at snf.stanford.edu Fri Sep 4 22:35:38 2009 From: quickwin at snf.stanford.edu (quickwin at snf.stanford.edu) Date: Fri, 4 Sep 2009 22:35:38 -0700 Subject: Problem stsetch SNF 2009-09-04 22:35:37: maybe the RF sources are out of spec? Message-ID: From ericp at snf.stanford.edu Mon Sep 7 21:45:37 2009 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Mon, 7 Sep 2009 21:45:37 -0700 Subject: Shutdown stsetch SNF 2009-09-07 21:45:37: compressed air failure Message-ID: Compressed air line blew out of connector. I zip-tied the line to stop the leak, but the machine no longer has compressed air to it. From eenriquez at snf.stanford.edu Tue Sep 8 11:21:35 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 8 Sep 2009 11:21:35 -0700 Subject: Shutdown stsetch SNF 2009-09-07 21:45:37: compressed air failure Message-ID: Replaced the defective connector. Unloaded the wafer that was stranded in the chamber. User's wafer is now in the loadlock. From latta at snf.stanford.edu Fri Sep 11 17:23:24 2009 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Fri, 11 Sep 2009 17:23:24 -0700 Subject: Comment stsetch SNF 2009-09-11 17:23:23: Monitor results, before and after capacitor Message-ID: Monitor results befroe and after capacitor in RF box removed; Before; Si ER = 1.94um/min, PR ER = 247A/min, Si:PR = 79:1 After; Si Er = 2.24um/min, PR RER = 240A/min, Si:PR = 93:1 From mtang at snf.stanford.edu Fri Sep 11 18:24:00 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 11 Sep 2009 18:24:00 -0700 Subject: Comment stsetch SNF 2009-09-11 18:24:00: RF update Message-ID: Elmer disconnected a capacitor on the coil that he had repaired at the last major PM. At that time, it was apparent the cap had been broken for some time. However, this also seems to correlate with increased reflected power. He removed the cap this morning and the reflected power controls nicely to zero. Nancy did an etch rate and the process does not seem to be obviously improved. The reflected power, though, behaves very nicely now. Jim and John are troubleshooting the system. A problem was observed with the platen power -- this was traced to the bypass box, which has been removed for now. The system is OK to use, but troubleshooting will continue next week. From mtang at snf.stanford.edu Fri Sep 11 19:50:59 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 11 Sep 2009 19:50:59 -0700 Subject: Comment stsetch SNF 2009-09-11 19:50:58: DEEP recipe Message-ID: Elmer made some changes to the DEEP recipe this morning as well. Nancy's test just reported uses this version of the recipe. The changes are the RF tolerances are now 5% and the RF pretunes for the coil were changed from 50/50 to roughly 40/60 (where it stabilizes.) From mtan at snf.stanford.edu Sat Sep 12 08:44:33 2009 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Sat, 12 Sep 2009 08:44:33 -0700 Subject: Problem stsetch SNF 2009-09-12 08:44:32: coil out of tolerance Message-ID: Wihtin 5 minutes into the run using deep recipe, the system reported back a coil out of tolerance error and terminated the process. From mtan at snf.stanford.edu Sat Sep 12 09:33:28 2009 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Sat, 12 Sep 2009 09:33:28 -0700 Subject: Comment stsetch SNF 2009-09-12 09:33:27: coil out of tolerance Message-ID: Changing the tolerance from 5% to 10% then to 25% didn't seem to prevent this problem. From quickwin at snf.stanford.edu Sat Sep 12 18:13:38 2009 From: quickwin at snf.stanford.edu (quickwin at snf.stanford.edu) Date: Sat, 12 Sep 2009 18:13:38 -0700 Subject: Shutdown stsetch SNF 2009-09-12 18:13:37: no platen power at all Message-ID: From eenriquez at snf.stanford.edu Mon Sep 14 10:18:07 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Sep 2009 10:18:07 -0700 Subject: Shutdown stsetch SNF 2009-09-12 18:13:37: no platen power at all Message-ID: Found the SOI control box was not functioning. Removed the box out the platten power control loop. Ran the Deep recipe with no problems. Gave the SOI box to Gary Y. for safe keeping. From eenriquez at snf.stanford.edu Mon Sep 14 10:18:13 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Sep 2009 10:18:13 -0700 Subject: Comment stsetch SNF 2009-09-12 09:33:27: coil out of tolerance Message-ID: Found the SOI control box was not functioning. Removed the box out the platten power control loop. Ran the Deep recipe with no problems. Gave the SOI box to Gary Y. for safe keeping. From eenriquez at snf.stanford.edu Mon Sep 14 10:18:18 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Sep 2009 10:18:18 -0700 Subject: Problem stsetch SNF 2009-09-12 08:44:32: coil out of tolerance Message-ID: Found the SOI control box was not functioning. Removed the box out the platten power control loop. Ran the Deep recipe with no problems. Gave the SOI box to Gary Y. for safe keeping. From mtan at snf.stanford.edu Tue Sep 15 05:43:21 2009 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Tue, 15 Sep 2009 05:43:21 -0700 Subject: Problem stsetch SNF 2009-09-15 05:43:21: icp not available alarm Message-ID: Trying to start at 5:40 this morning. Got an icp not available alarm. From mtan at snf.stanford.edu Tue Sep 15 05:47:35 2009 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Tue, 15 Sep 2009 05:47:35 -0700 Subject: Problem stsetch SNF 2009-09-15 05:47:35: system was not left in a pumped down state Message-ID: Along with an icp alarm, the system was also found to be left not in a pumped down state. I am trying to restart the program to see if it would re-establish an icp connection. From mtan at snf.stanford.edu Tue Sep 15 07:54:03 2009 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Tue, 15 Sep 2009 07:54:03 -0700 Subject: Shutdown stsetch SNF 2009-09-15 07:54:03: broken wafer inside Message-ID: From eenriquez at snf.stanford.edu Tue Sep 15 09:27:24 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Sep 2009 09:27:24 -0700 Subject: Shutdown stsetch SNF 2009-09-15 07:54:03: broken wafer inside Message-ID: Vented the chamber and recovered the user's wafer piece. Cleaned the electrode and ran an O2 plasma. From eenriquez at snf.stanford.edu Tue Sep 15 09:28:09 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Sep 2009 09:28:09 -0700 Subject: Problem stsetch SNF 2009-09-15 05:43:21: icp not available alarm Message-ID: ICP now available. From eenriquez at snf.stanford.edu Tue Sep 15 09:28:55 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Sep 2009 09:28:55 -0700 Subject: Problem stsetch SNF 2009-09-15 05:47:35: system was not left in a pumped down state Message-ID: User recovered from the error. From shott at snf.stanford.edu Sat Sep 19 06:58:09 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 06:58:09 -0700 Subject: Problem stsetch SNF 2009-05-28 09:23:31: High reflected power on SF6 cycle Message-ID: Work on the phase/mag unit and the presets has largely resolved this problem. John From shott at snf.stanford.edu Sat Sep 19 07:00:02 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 07:00:02 -0700 Subject: Problem stsetch SNF 2009-08-08 15:35:23: bad etch Message-ID: Work on the RF matching, including phase/mag unit, modified presets and tighther tolerances has improved RF performance. Adjustment of throttle valve phase angle has also helped. John From shott at snf.stanford.edu Sat Sep 19 07:00:21 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 07:00:21 -0700 Subject: Comment stsetch SNF 2009-06-06 18:02:01: DEEP recipe coil reflected power high Message-ID: Work on the RF matching, including phase/mag unit, modified presets and tighther tolerances has improved RF performance. Adjustment of throttle valve phase angle has also helped. John From shott at snf.stanford.edu Sat Sep 19 07:00:30 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 07:00:30 -0700 Subject: Comment stsetch SNF 2009-06-07 13:40:08: high reflected coil power on other recipes Message-ID: Work on the RF matching, including phase/mag unit, modified presets and tighther tolerances has improved RF performance. Adjustment of throttle valve phase angle has also helped. John From shott at snf.stanford.edu Sat Sep 19 07:00:38 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 07:00:38 -0700 Subject: Problem stsetch SNF 2009-08-13 10:51:43: bad etch again Message-ID: Work on the RF matching, including phase/mag unit, modified presets and tighther tolerances has improved RF performance. Adjustment of throttle valve phase angle has also helped. John From shott at snf.stanford.edu Sat Sep 19 07:00:53 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 07:00:53 -0700 Subject: Problem stsetch SNF 2009-09-01 07:17:55: Coil ref pw jumpy Message-ID: Work on the RF matching, including phase/mag unit, modified presets and tighther tolerances has improved RF performance. Adjustment of throttle valve phase angle has also helped. John From shott at snf.stanford.edu Sat Sep 19 07:01:18 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 07:01:18 -0700 Subject: Problem stsetch SNF 2009-09-04 22:35:37: maybe the RF sources are out of spec? Message-ID: Work on the RF matching, including phase/mag unit, modified presets and tighther tolerances has improved RF performance. Adjustment of throttle valve phase angle has also helped. John From shott at snf.stanford.edu Sat Sep 19 07:01:38 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sat, 19 Sep 2009 07:01:38 -0700 Subject: Problem stsetch SNF 2009-09-04 20:11:02: silicon:oxide selectivity is still bad Message-ID: Work on the RF matching, including phase/mag unit, modified presets and tighther tolerances has improved RF performance. Adjustment of throttle valve phase angle has also helped. John From quickwin at snf.stanford.edu Sat Sep 19 21:27:34 2009 From: quickwin at snf.stanford.edu (quickwin at snf.stanford.edu) Date: Sat, 19 Sep 2009 21:27:34 -0700 Subject: Problem stsetch SNF 2009-09-19 21:27:33: "interlock tripped" error Message-ID: I did not shut it down in case someone can fix it. From damodei at snf.stanford.edu Mon Sep 21 02:11:59 2009 From: damodei at snf.stanford.edu (damodei at snf.stanford.edu) Date: Mon, 21 Sep 2009 02:11:59 -0700 Subject: Comment stsetch SNF 2009-09-21 02:11:58: Interlock error fixed Message-ID: Cleared error and cycled through the loading and unloading process. Error did not recur on any of several recipes and gases. From quickwin at snf.stanford.edu Sat Sep 26 23:45:41 2009 From: quickwin at snf.stanford.edu (quickwin at snf.stanford.edu) Date: Sat, 26 Sep 2009 23:45:41 -0700 Subject: Shutdown stsetch SNF 2009-09-26 23:45:41: wafer broke inside system Message-ID: During unloading, wafer broke in gate valve? From quickwin at snf.stanford.edu Sun Sep 27 08:47:52 2009 From: quickwin at snf.stanford.edu (quickwin at snf.stanford.edu) Date: Sun, 27 Sep 2009 08:47:52 -0700 Subject: Shutdown stsetch SNF 2009-09-27 08:47:51: please adjust wafer carrier position Message-ID: the 8-sided big aluminum wafer carrier is off to one side, and as a result when wafers go in they are clamped off center. People have been putting the wafers not in the center of the wafer carrier so that when the wafers are centered during etch. This is probably the reason for the broken wafer. So please fix the machine right by fixing the aluminum wafer carrier position. From eenriquez at snf.stanford.edu Mon Sep 28 15:33:56 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 28 Sep 2009 15:33:56 -0700 Subject: Comment stsetch SNF 2009-09-28 15:33:55: Update broken wafer Message-ID: Cleaned chamber and loadlock. Still some wafer pieces around the chamber door. Need to finish cleaning and adjust the wafer hand-off. From eenriquez at snf.stanford.edu Tue Sep 29 15:23:17 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 29 Sep 2009 15:23:17 -0700 Subject: Comment stsetch SNF 2009-09-29 15:23:17: Update Message-ID: Completed cleaning the chamber and load lock. Found out that the chamber door seal is leaking and also the wafer lift pin coupler is broken. Checking for parts availability. From eenriquez at snf.stanford.edu Wed Sep 30 19:08:54 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 30 Sep 2009 19:08:54 -0700 Subject: Shutdown stsetch SNF 2009-09-26 23:45:41: wafer broke inside system Message-ID: Cleaned the chamber and loadlock. Replaced the wafer lift pneumatic coupler. Replaced one ceramic clamp. Cycled wafers and ran an O2 plasma. From eenriquez at snf.stanford.edu Wed Sep 30 19:10:21 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 30 Sep 2009 19:10:21 -0700 Subject: Shutdown stsetch SNF 2009-09-27 08:47:51: please adjust wafer carrier position Message-ID: Cleaned the chamber and loadlock. Replaced the wafer lift pneumatic coupler. Replaced one ceramic clamp. Cycled wafers and ran an O2 plasma. We'll adjust the wafer process position during the next PM. From eenriquez at snf.stanford.edu Wed Sep 30 19:10:54 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 30 Sep 2009 19:10:54 -0700 Subject: Problem stsetch SNF 2009-08-22 18:24:04: Plasma flickering a lot during passivation Message-ID: Unable to duplicate the problem. From eenriquez at snf.stanford.edu Wed Sep 30 19:12:59 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 30 Sep 2009 19:12:59 -0700 Subject: Comment stsetch SNF 2009-09-29 15:23:17: Update Message-ID: Was able to repair the door leak by wiping down the door and oring another 50 times. From eenriquez at snf.stanford.edu Wed Sep 30 19:13:06 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 30 Sep 2009 19:13:06 -0700 Subject: Comment stsetch SNF 2009-09-28 15:33:55: Update broken wafer Message-ID: Archive